CN111679179A - Semi-packaged detector chip testing device and using method - Google Patents
Semi-packaged detector chip testing device and using method Download PDFInfo
- Publication number
- CN111679179A CN111679179A CN202010545201.5A CN202010545201A CN111679179A CN 111679179 A CN111679179 A CN 111679179A CN 202010545201 A CN202010545201 A CN 202010545201A CN 111679179 A CN111679179 A CN 111679179A
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- 238000012360 testing method Methods 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims description 11
- 239000013307 optical fiber Substances 0.000 claims abstract description 49
- 239000000523 sample Substances 0.000 claims abstract description 19
- 230000003287 optical effect Effects 0.000 claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 230000004044 response Effects 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- 238000005286 illumination Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 abstract description 6
- 238000010168 coupling process Methods 0.000 abstract description 6
- 238000005859 coupling reaction Methods 0.000 abstract description 6
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 230000008054 signal transmission Effects 0.000 abstract description 2
- 230000000007 visual effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 2
- 238000001467 acupuncture Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
A semi-packaged probe chip testing device, comprising: the optical fiber alignment module is fixed on the three-dimensional adjusting frame and used for adjusting the position of an optical field output by the optical fiber to align the optical field with the photosensitive surface of the detector chip; and the chip test carrier is used for fixing the detector chip, loading an external working voltage signal on the detector chip and transmitting a current signal generated by the external working voltage signal to external test equipment. The invention adopts the inclined optical fiber, gets rid of the limitation of a vertical off-plane coupling mode, and is convenient to check the alignment condition of the optical fiber and the photosensitive surface of the detector chip in a visual field. The invention gives the working voltage to the detector and leads out the alternating current signal through the signal transmission line and the radio frequency connector on the circuit board, replaces the use of a radio frequency probe, reduces the testing steps and improves the testing efficiency. The invention adopts a semi-packaging coupling mode, and can repeatedly utilize the device to measure a plurality of samples.
Description
Technical Field
The invention relates to the field of chip testing, in particular to a semi-packaged detector chip testing device and a using method thereof.
Background
For commercial detector chips, the main performance parameters of the detector chips need to be tested when the detector chips are used. Most laboratories adopt the mode of pricking needles by radio frequency probes in the electrical part and coupling needles by out-of-plane optical fibers in the optical part for testing. The method needs probe pricking for each test and each sample, and is complex to operate. And the acupuncture connection mode is greatly influenced by instability of a tested environment, so that the testing difficulty is increased, the high-frequency probe head is easily damaged, and the testing cost is low. The full package is mostly adopted commercially, and the detector chip is subjected TO simple TO package or other package forms, and then the performance parameters of the detector chip are tested. The method needs to package each sample to be tested, and has long preparation time in the early stage of testing and low repeatability.
Disclosure of Invention
In view of the above, the present invention provides a testing apparatus for a semi-packaged probe chip and a method for using the same, which are intended to solve at least one of the above technical problems.
In order to achieve the above object, as an aspect of the present invention, there is provided a semi-packaged probe chip testing apparatus, including:
the optical fiber alignment module is fixed on the three-dimensional adjusting frame and used for adjusting the position of an optical field output by the optical fiber to align the optical field with the photosensitive surface of the detector chip;
and the chip test carrier is used for fixing the detector chip, loading an external working voltage signal on the detector chip and transmitting a current signal generated by the external working voltage signal to external test equipment.
Wherein the optical fiber alignment module comprises:
the optical fiber clamp is fixed with the three-dimensional adjusting frame;
the V-shaped groove is fixed with the optical fiber clamp and used for fixing the optical fiber;
and the inclined optical fiber is fixed on the optical fiber clamp through the V-shaped groove and is used for outputting optical signals.
The chip test carrier comprises a chip substrate, a radio frequency transmission line, a radio frequency connector and a base; wherein,
the chip substrate is used for fixing a detector chip to be detected;
the radio frequency transmission line is fixedly arranged on the base and used for transmitting a working voltage signal required by the chip and a current signal generated by the working voltage signal;
the radio frequency connector is connected with the radio frequency transmission line and is used for transmitting a working voltage signal of the detector and transmitting a current signal generated by the chip to a test instrument connected with the radio frequency connector;
and the base is used for fixing the chip substrate, the radio frequency transmission line and the radio frequency connector in the test carrier.
Wherein, the V groove is fixed with the optical fiber clamp in an adhesive mode.
The radio frequency transmission line is fixed on the base in a welding mode.
The working bandwidth of the radio frequency transmission line and the radio frequency connector is larger than that of the detector chip to be detected, so that the frequency response of the detector chip is not influenced by the radio frequency transmission line and the radio frequency connector.
As another aspect of the present invention, there is provided a use method using the above test apparatus, including the steps of:
the detector chip to be detected is fixed on the chip substrate through conductive silver adhesive;
the chip substrate is fixed on the base of the chip test carrier in an adhesive manner;
connecting the electrode of the detector chip and the radio frequency transmission line through gold wire bonding;
fixing the optical fiber alignment module on the three-dimensional adjusting frame through screws;
connecting the optical fiber input end in the optical fiber alignment module with external optical input equipment;
connecting the chip test carrier with external test equipment through a radio frequency connecting wire;
the alignment of the optical fiber and the chip of the detector to be tested is realized by adjusting the three-dimensional adjusting frame, and a test result can be obtained on an external test instrument.
After the chip substrate is tested, the chip substrate can be peeled from the base through the scalpel, and the chip test carrier can be reused.
The detector chip to be detected is a vertical irradiation type detector chip.
Based on the technical scheme, compared with the prior art, the semi-packaged detector chip testing device has at least one of the following beneficial effects:
1. the invention adopts the inclined optical fiber, gets rid of the limitation of a vertical off-plane coupling mode, and is convenient to check the alignment condition of the optical fiber and the photosensitive surface of the detector chip in a visual field.
2. The invention gives the working voltage to the detector and leads out the alternating current signal through the signal transmission line and the radio frequency connector on the circuit board, replaces the use of a radio frequency probe, reduces the testing steps and improves the testing efficiency.
3. The invention adopts a semi-packaging coupling mode, and can repeatedly utilize the device to measure a plurality of samples.
Drawings
FIG. 1 is a schematic structural diagram of a semi-packaged detector chip testing apparatus according to an embodiment of the present invention;
FIG. 2 is a flow chart illustrating steps of a method for using a semi-encapsulated probe chip test apparatus according to an embodiment of the present invention;
fig. 3 is a schematic diagram of the structure of fig. 2 of the present invention when the optical fiber is aligned with the chip.
In the above figures, the reference numerals have the following meanings:
1. an optical fiber clamp; 2. a V-shaped groove; 3. an optical fiber with an inclined plane; 4. a base; 5. a chip substrate;
6. a radio frequency transmission line; 7. a radio frequency connector; 8. and (5) a detector chip to be tested.
Detailed Description
The invention discloses a semi-packaged detector chip testing device, which comprises: the optical fiber alignment module is fixed on the three-dimensional adjusting frame and used for adjusting the position of an optical field output by the optical fiber to align the optical field with the photosensitive surface of the detector chip; and the chip test carrier is used for fixing the detector chip, loading an external working voltage signal on the detector chip and transmitting a current signal generated by the external working voltage signal to external test equipment. The device is free from the modes of optical fiber vertical off-plane coupling and radio frequency probe needle insertion during testing, can be repeatedly used, shortens the chip testing time and increases the chip testing efficiency.
In order that the objects, technical solutions and advantages of the present invention will become more apparent, the present invention will be further described in detail with reference to the accompanying drawings in conjunction with the following specific embodiments.
Fig. 1 is a schematic structural diagram of a semi-packaged detector chip testing apparatus according to an embodiment of the present invention, and as shown in fig. 1, the optical fiber alignment module includes: the optical fiber clamp 1 is fixed with the three-dimensional adjusting frame and used for adjusting the position of an optical fiber alignment module output optical field; the V-shaped groove 2 is fixed with the optical fiber clamp in an adhesive mode and used for fixing the optical fiber; the inclined optical fiber 3 is fixed on the optical fiber clamp through a V-shaped groove and is used for outputting optical signals;
the chip test carrier comprises: the base 4 is used for fixing the chip substrate, the radio frequency transmission line and the radio frequency connector in the test carrier; a chip substrate 5 for fixing the detector chip; the radio frequency transmission line 6 is fixed on the base in a welding mode and is used for transmitting a working voltage signal required by the chip and a current signal generated by the working voltage signal; and the radio frequency connector 7 is connected with the radio frequency transmission line and is used for transmitting the working voltage signal of the detector and transmitting the current signal generated by the chip to a test instrument connected with the radio frequency connector.
In an exemplary embodiment of the present invention, the operating bandwidth of the rf transmission line and the rf connector is greater than the measured probe chip, so that the frequency response of the probe chip is not affected by the rf transmission line and the rf connector.
The invention also discloses a using method for realizing the detector chip test by applying the device, as shown in figure 2, the steps are as follows:
the detector chip 8 to be detected is fixed on the chip substrate 5 through conductive silver adhesive;
the chip substrate 5 is fixed on the base 4 of the chip test carrier in an adhesive way;
the electrode of the detector chip and the radio frequency transmission line 6 are connected through gold wire bonding;
fixing the optical fiber alignment module on the three-dimensional adjusting frame through screws;
connecting the optical fiber input end in the optical fiber alignment module with external optical input equipment;
connecting the chip test carrier with external test equipment through a radio frequency connecting wire;
the alignment of the optical fiber and the detector chip to be tested is realized by adjusting the three-dimensional adjusting frame, and as shown in fig. 3, a test result can be obtained on an external test instrument.
In the embodiment of the invention, after the chip substrate is tested, the chip substrate can be peeled from the base through the scalpel, so that the chip test carrier can be reused.
In an embodiment of the present invention, the detector chip to be tested is a vertical irradiation type detector chip.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A semi-packaged detector chip testing device is characterized by comprising:
the optical fiber alignment module is fixed on the three-dimensional adjusting frame and used for adjusting the position of an optical field output by the optical fiber to align the optical field with the photosensitive surface of the detector chip;
and the chip test carrier is used for fixing the detector chip, loading an external working voltage signal on the detector chip and transmitting a current signal generated by the external working voltage signal to external test equipment.
2. The semi-encapsulated probe chip testing device of claim 1, wherein the fiber alignment module comprises:
the optical fiber clamp is fixed with the three-dimensional adjusting frame;
the V-shaped groove is fixed with the optical fiber clamp and used for fixing the optical fiber;
and the inclined optical fiber is fixed on the optical fiber clamp through the V-shaped groove and is used for outputting optical signals.
3. The semi-packaged probe chip test device of claim 1, wherein the chip test carrier comprises a chip substrate, a radio frequency transmission line, a radio frequency connector and a base; wherein,
the chip substrate is used for fixing a detector chip to be detected;
the radio frequency transmission line is fixedly arranged on the base and used for transmitting a working voltage signal required by the chip and a current signal generated by the working voltage signal;
the radio frequency connector is connected with the radio frequency transmission line and is used for transmitting a working voltage signal of the detector and transmitting a current signal generated by the chip to a test instrument connected with the radio frequency connector;
and the base is used for fixing the chip substrate, the radio frequency transmission line and the radio frequency connector in the test carrier.
4. The device for testing the semi-encapsulated probe chip of claim 2, wherein the V-groove is fixed with the optical fiber clamp by means of gluing.
5. The apparatus of claim 3, wherein the RF transmission line is fixed on the base by soldering.
6. The device of claim 3, wherein the RF transmission line and the RF connector have a larger bandwidth than the probe chip to be tested, such that the frequency response of the probe chip is not affected by the RF transmission line and the RF connector.
7. Use of the device according to any of claims 1-6 for testing a detector chip, comprising the steps of:
the detector chip to be detected is fixed on the chip substrate through conductive silver adhesive;
the chip substrate is fixed on the base of the chip test carrier in an adhesive manner;
connecting the electrode of the detector chip and the radio frequency transmission line through gold wire bonding;
fixing the optical fiber alignment module on the three-dimensional adjusting frame through screws;
connecting the optical fiber input end in the optical fiber alignment module with external optical input equipment;
connecting the chip test carrier with external test equipment through a radio frequency connecting wire;
the alignment of the optical fiber and the chip of the detector to be tested is realized by adjusting the three-dimensional adjusting frame, and a test result can be obtained on an external test instrument.
8. The method of claim 7, wherein the chip substrate can be peeled from the base by a scalpel after the test is completed, thereby realizing the reuse of the chip test carrier.
9. The method of claim 7, wherein the detector chip to be tested is a vertical illumination type detector chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010545201.5A CN111679179A (en) | 2020-06-15 | 2020-06-15 | Semi-packaged detector chip testing device and using method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010545201.5A CN111679179A (en) | 2020-06-15 | 2020-06-15 | Semi-packaged detector chip testing device and using method |
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| Publication Number | Publication Date |
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| CN111679179A true CN111679179A (en) | 2020-09-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010545201.5A Pending CN111679179A (en) | 2020-06-15 | 2020-06-15 | Semi-packaged detector chip testing device and using method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113865827A (en) * | 2021-09-07 | 2021-12-31 | 武汉光谷信息光电子创新中心有限公司 | Test system and method for photoelectric detection chip |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11125579A (en) * | 1997-08-22 | 1999-05-11 | Seiwa Electric Mfg Co Ltd | Device for measuring characteristics of led chip |
| CN102324444A (en) * | 2011-08-30 | 2012-01-18 | 南京大学 | Encapsulating device for single-photon detector |
| CN103454569A (en) * | 2013-09-23 | 2013-12-18 | 镇江艾科半导体有限公司 | Semiconductor chip test board |
| CN107065085A (en) * | 2017-05-25 | 2017-08-18 | 中国科学院半导体研究所 | Photoelectric conversion device |
| CN108535552A (en) * | 2018-05-10 | 2018-09-14 | 环旭电子股份有限公司 | Test device |
| CN109683082A (en) * | 2018-12-26 | 2019-04-26 | 上海先方半导体有限公司 | A kind of test macro and test method for optical chip |
| CN109738785A (en) * | 2018-12-24 | 2019-05-10 | 贵州航天计量测试技术研究所 | A kind of device and method for microwave chip detection calibration |
| CN110542958A (en) * | 2019-09-10 | 2019-12-06 | 中国电子科技集团公司第四十四研究所 | High-temperature-resistant photoelectric conversion module for data communication |
| CN210401745U (en) * | 2019-07-31 | 2020-04-24 | 浙江光尖电子技术有限公司 | Novel optical chip is optical fiber coupling module for coupled system |
-
2020
- 2020-06-15 CN CN202010545201.5A patent/CN111679179A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11125579A (en) * | 1997-08-22 | 1999-05-11 | Seiwa Electric Mfg Co Ltd | Device for measuring characteristics of led chip |
| CN102324444A (en) * | 2011-08-30 | 2012-01-18 | 南京大学 | Encapsulating device for single-photon detector |
| CN103454569A (en) * | 2013-09-23 | 2013-12-18 | 镇江艾科半导体有限公司 | Semiconductor chip test board |
| CN107065085A (en) * | 2017-05-25 | 2017-08-18 | 中国科学院半导体研究所 | Photoelectric conversion device |
| CN108535552A (en) * | 2018-05-10 | 2018-09-14 | 环旭电子股份有限公司 | Test device |
| CN109738785A (en) * | 2018-12-24 | 2019-05-10 | 贵州航天计量测试技术研究所 | A kind of device and method for microwave chip detection calibration |
| CN109683082A (en) * | 2018-12-26 | 2019-04-26 | 上海先方半导体有限公司 | A kind of test macro and test method for optical chip |
| CN210401745U (en) * | 2019-07-31 | 2020-04-24 | 浙江光尖电子技术有限公司 | Novel optical chip is optical fiber coupling module for coupled system |
| CN110542958A (en) * | 2019-09-10 | 2019-12-06 | 中国电子科技集团公司第四十四研究所 | High-temperature-resistant photoelectric conversion module for data communication |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113865827A (en) * | 2021-09-07 | 2021-12-31 | 武汉光谷信息光电子创新中心有限公司 | Test system and method for photoelectric detection chip |
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