CN102324444A - Encapsulating device for single-photon detector - Google Patents
Encapsulating device for single-photon detector Download PDFInfo
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- CN102324444A CN102324444A CN201110252925A CN201110252925A CN102324444A CN 102324444 A CN102324444 A CN 102324444A CN 201110252925 A CN201110252925 A CN 201110252925A CN 201110252925 A CN201110252925 A CN 201110252925A CN 102324444 A CN102324444 A CN 102324444A
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- 239000013307 optical fiber Substances 0.000 claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 claims description 17
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- 229920006324 polyoxymethylene Polymers 0.000 claims description 3
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- 238000005538 encapsulation Methods 0.000 abstract description 6
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- CFJRGWXELQQLSA-UHFFFAOYSA-N azanylidyneniobium Chemical compound [Nb]#N CFJRGWXELQQLSA-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention discloses an encapsulating device for a single-photon detector, which comprises a top rod, a top cover and a base which are sequentially arranged from the top to the bottom. The top rod and the top cover are fixedly connected; the top cover and the base are also connected fixedly; the top cover is provided with at least two through holes, wherein a first through hole passes through and fixes an optical fiber; a second through hole passes through a cable; a chip of the single-photon detector is fixed at a position corresponding to the optical fiber on the upper surface of the base; a high-frequency circuit board is fixed at a position corresponding to the cable; and the chip of the single-photon detector is electrically connected with the high-frequency circuit board. The encapsulating device for the single-photon detector has a compact structure; the two-channel photoelectric encapsulation can be achieved within an inside diameter of 20 mm; the external light to be detected is coupled by using the optical fiber; the coupling efficiency is more than 95%; furthermore, the interference is small; the chip is connected by using a microstrip line coplanar waveguide and an SMP (symmetrical multi-processing) high-frequency joint; the transmission performance that the chip outputs an electric signal to an external amplifier is improved; by adopting a symmetrical structural design, the combination is convenient; and the repeated service efficiency of the encapsulating device for the single-photon detector is improved.
Description
Technical field
The present invention relates to a kind of packaging system, particularly a kind of single-photon detector packaging system.
Background technology
Over past ten years, the superconducting nano-wire single-photon detector as a kind of novel single-photon detector by everybody extensive concern.The tens nanometers wide sinuous lines of the response region of detector for going out with the film preparation of superconduction niobium nitride.These superconduction lines be biased one be lower than superconduction critical electric current electric current, after lines absorbed photon, absorption place local temperature raise, and forms a heat island.The existence of heat island makes the electric current on the lines redistribute, thereby and finally makes regional area form Resistance states above superconduction critical electric current.Simultaneously, because phonon, electronics and this triangular heat exchange of substrate in the film bar, the Resistance states of formation only can continue very short time, thereby makes the film bar after absorbing photon, producing response, come back to superconduction bias state in advance, and then responds next photon.
The preparation of superconducting nano-wire single-photon detector and use have been merged sophisticated technology such as superconductor, thin film technique, micro-nano processing, microwave measurement and have been shown excellent performance.At first; The superconducting nano-wire single-photon detector has the repetition rate of 100MHz and the time jitter of 50ps; Avalanche diode and photomultiplier commonly used in the semiconductor single-photon detector increased an about magnitude on repetition rate, on time jitter, reduced by a magnitude.Secondly, semi-conducting material is because the restriction that can be with, have tangible cut-off wavelength for the detection efficient of near infrared band, and superconductor is very little owing to energy gap, in theory can be far above semi-conducting material for the detection efficient of near infrared band.In addition, because the detector working temperature is merely several K, the superconducting nano line detector has extremely low dark counts, need as semiconductor detector, not use the work of Geiger (Ginger) pattern, the detection that can continue simultaneously.Moreover; Transducer than the superconduction transform boundary (transition edge sensor) and superconducting tunnel junction detector; The repetition rate of superconducting nano line detector is still high a lot of than them, and simultaneously for the also so not low requirement of working temperature, testing circuit is also simple relatively.
The performance that based superconductive nano wire single-photon detector is outstanding, in recent years, it was applied to fields such as quantum secure communication, integrated circuit detection, bioluminescence detection, single-photon source demarcation, time correlation single photon counting.Especially in the quantum secure communication, behind the use superconducting nano-wire single-photon detector, the speed of communication and distance have all obtained significant lifting.Use for these, need overcome following problem.At first, for the user one cover low temperature environment is provided.Usually, liquid helium is the refrigeration media that obtains the most easily, if but only chip is soaked and place liquid helium, its working temperature also can only reach 4.2K.Use circularly cooling machine can reduce the working temperature and the continuous firing of device, but it is bulky, and expense is high and be difficult for mobile.Moreover because chip operation is in low temperature environment, and light signal to be detected is very faint, so the degree of coupling of light signal directly influences the detection efficiency and the dark counts of system.At last, the response signal of chip is faint, and chip is in low temperature environment simultaneously, can't amplify at the chip near-end, so this section of chip to normal temperature amplification, the connection on the circuit must guarantee the integrality of signal.
The employed transistor package of normal light electric explorer (TO) encapsulation, butterfly encapsulation are difficult to realize high-precision optical fiber align and high-frequency signal transmission, and in addition, these encapsulation spininess can't be applicable to vacuum low-temperature environment to the normal temperature device.
Summary of the invention
Goal of the invention: the problem and shortage to above-mentioned existing existence the purpose of this invention is to provide a kind of single-photon detector packaging system that is applicable to vacuum low-temperature environment.
Technical scheme: for realizing the foregoing invention purpose, the technical scheme that the present invention adopts is a kind of single-photon detector packaging system, comprises the push rod, top cover and the base that set gradually from top to bottom; Said push rod is fixedly connected with top cover, and top cover also is fixedly connected with base; Said top cover is provided with at least two through holes, and wherein first through hole passes and fixed fiber, and second through hole passes cable; The fixed-site single-photon detector chip (hereinafter to be referred as chip) of the corresponding optical fiber of the upper surface of said base, the fixed-site high-frequency circuit board of corresponding cable, this superconducting nano-wire single-photon detector chip is electrically connected with high-frequency circuit board.
Said top cover and base can be the circular configuration that two concentric semicircles structures are formed respectively.
Said first through hole can be circular hole, and second through hole can be square hole.
The top of said push rod can be cylinder, and the bottom can be two parallel prongs; The upper surface of said top cover can be provided with connecting rod, and this connecting rod stretches between two said prongs and with said prong and is fixedly connected.
The material of said push rod can be polyformaldehyde, and it is terminal with the liquid helium Dewar internal layer reference test bar of bleeding to be used for connecting cold head part (top cover and base all are immersed in liquid helium, are called cold head), and isolated cold head is with the heat transmission between the reference test bar, the low temperature of maintenance cold head.
Can be fixed with ceramic ring in the said circular hole, this ceramic ring is fixed said optical fiber.Can use the epoxy Instant cement to fix said ceramic ring in the said circular hole.
Said base can be provided with third through-hole corresponding to the following of said circular hole position, is used for microscopic optical fiber inner core and explorer response zone relative position; The side of said base can be provided with fourth hole, according to microscopical observed result, uses the metal fine needle to stretch into this through hole moving chip, realizes the aligning of optical fiber and chip.
Said high-frequency circuit board can be provided with first high frequency connectors, and an end of said cable can be provided with second high frequency connectors, and these first high frequency connectors connect second high frequency connectors.
The side of the upper cylinder of said push rod can be provided with a groove, and said cable can be by stretching out in this groove.
Beneficial effect: the present invention is applicable to the encapsulation of single-photon detector, is specially adapted to the superconducting nano-wire single-photon detector and under liquid helium is bled Dewar, uses.Compact conformation can be realized the dual channel optoelectronic encapsulation in the 20mm internal diameter; Use the optical fiber coupling outside by detection light, coupling efficiency is greater than 95% and disturb little; Use the microstrip line co-planar waveguide to be connected chip, improved the transmission performance of the chip output signal of telecommunication to external amplifier with the SMP high-frequency joint; The design of employing symmetrical structure, convenient combination improves it and reuses efficient.
Description of drawings
Fig. 1 is a single-photon detector packaging system structural representation;
Fig. 2 looks sketch map for the master of push rod;
Fig. 3 looks sketch map for the left side of push rod;
Fig. 4 is the schematic top plan view of push rod;
Fig. 5 is the schematic top plan view of top cover;
Fig. 6 looks sketch map for the master of top cover;
Fig. 7 looks sketch map for the master of base;
Fig. 8 is the schematic top plan view of base;
Fig. 9 for microscopically take to light effect figure;
Figure 10 is the test result figure of cable S21 parameter;
Figure 11 is the detection efficiency of use superconducting nano-wire single-photon detector of the present invention and the test result figure of dark counts.
In the accompanying drawing, 1: the first through hole; 2: prong; 3: the first screws; 4: the first grooves (being the groove of claim and specification summary of the invention); 5: square hole (being first through hole of claim and specification summary of the invention); 6: circular hole (being second through hole of claim and specification summary of the invention); 7: the second through holes; 8: third through-hole; 9: fourth hole; 10: the second grooves; 11: the three grooves; 12: fifth hole (being the third through-hole of claim and specification summary of the invention); 13: the second screws; 14: connecting rod.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment; Further illustrate the present invention; Should understand these embodiment only be used to the present invention is described and be not used in the restriction scope of the present invention; After having read the present invention, those skilled in the art all fall within the application's accompanying claims institute restricted portion to the modification of the various equivalent form of values of the present invention.
Comprise four parts in the implementation process of the present invention, optical fiber fixing, high-frequency circuit board fixing and signal is drawn, chip is fixed and to light, installation.
Optical fiber one end need be fixed in the top cover circular hole 6, and is as shown in Figure 5.In order to reach not only fixed fiber but also to be convenient to move up and down the purpose of optical fiber connector with vertical range between the chip; Use the epoxy Instant cement to fix an internal diameter 2.5mm standard ceramic ring (not shown) in the top cover circular hole 6 in advance; Subsequently, optical fiber being peelled off tail optical fiber behind the becket slowly inserts in the ceramic ring and gets final product.Other end optical fiber need an internal diameter be 2.5mm on the inboard pad of FC becket, and diameter of section is the O type circle of 1mm, receives the liquid helium Dewar external interface place (not shown) of bleeding then.
Use the epoxy Instant cement to be fixed in the 3rd groove 11 places on the base high-frequency circuit board (not shown) that designs; Guarantee that SMP radio-frequency joint (not shown) is under top cover square hole 5; To make things convenient for semi-flexible cable (being the cable of claim and specification summary of the invention) correctly to be connected, as shown in Figure 7.Semi-flexible cable one end is corresponding SMP joint, is used for connecting the SMP joint on the high-frequency circuit board, and the other end is the SMA seal nipple, is connected to the bleed interface (not shown) of Dewar of liquid helium.
The chip (not shown) uses low temperature glue to be fixed on second groove, 10 places on the base, needs to guarantee that the nano wire region on the chip is in circular hole place shown in Figure 5.Subsequently, use screw to fixedly mount the top cover and the base that installs high-frequency circuit board of ceramic ring through second through hole 7 shown in Figure 5 and second screw 13 shown in Figure 8.To the light time, earlier optical fiber pigtail is slowly inserted ceramic ring, and the vertical range of controlling itself and chip surface is greater than 1mm; Another termination one visible light lasing light emitter, what use in this instance is green glow, as shown in Figure 9; In the frame of broken lines is nano wire region, and the bright spot in the frame of broken lines is the optical fiber inner core.Through the fifth hole 12 of base, use the relative position of microscopic optical fiber inner core with nano wire region, use the fourth hole 9 of metal fine needle through base side moving chip gently, as shown in Figure 8.Behind the aligned position, again tail optical fiber is slowly inserted, make its end face chip surface of trying one's best.Effect behind the aligning is as shown in Figure 9.
Chip behind the aligning need leave standstill a period of time, makes the low temperature adhesive curing.With two top covers that fix and the synthetic circle of footstock, and, use screw to fix through first screw 3 shown in Figure 3 and third through-hole 8 shown in Figure 6 with in the prong 2 of the 14 insertion polyformaldehyde push rods of the connecting rod on the top cover (as shown in Figure 2).Cable is by stretching out (as shown in Figure 4) in the push rod lateral grooves 4.Push rod is slowly inserted (as shown in Figure 1) in the reference test bar, and the adjustment longitudinal separation connects the high-frequency circuit board on semi-flexible cable and the base.Use screw to pass through through hole (not shown) fixed mandril and reference test bar on first through hole 1 and the reference test bar on the push rod subsequently.Last moulding figure is as shown in Figure 1.
Figure 10 explain at the circuit of inside to connect for the bleed S21 parameter of the inner semi-flexible cable of Dewar of the liquid helium that uses the network analyzer test, does not produce resonance point and breakpoint, and attenuation also matches with the attenuation coefficient of the semi-flexible cable of use.Figure 11 is the detection efficient and the dark counts of the superconducting nano line detector of these packaging and testing of use, has reacted the intrinsic property of chip preferably, has reached the standard of using.
Claims (10)
1. a single-photon detector packaging system comprises the push rod, top cover and the base that set gradually from top to bottom; Said push rod is fixedly connected with top cover, and top cover also is fixedly connected with base; Said top cover is provided with at least two through holes, and wherein first through hole passes and fixed fiber, and second through hole passes cable; The fixed-site single-photon detector chip of the corresponding optical fiber of the upper surface of said base, the fixed-site high-frequency circuit board of corresponding cable, this single-photon detector chip is electrically connected with high-frequency circuit board.
2. according to the said single-photon detector packaging system of claim 1, it is characterized in that: said top cover and base are respectively the circular configuration that two concentric semicircles structures are formed.
3. according to the said single-photon detector packaging system of claim 1, it is characterized in that: said first through hole is a circular hole, and second through hole is a square hole.
4. according to the said single-photon detector packaging system of claim 1, it is characterized in that: the top of said push rod is cylinder, and the bottom is two parallel prongs; The upper surface of said top cover is provided with connecting rod, and this connecting rod stretches between two said prongs and with said prong and is fixedly connected.
5. according to the said single-photon detector packaging system of claim 1, it is characterized in that: the material of said push rod is a polyformaldehyde.
6. according to the said single-photon detector packaging system of claim 3, it is characterized in that: said circular hole internal fixation has ceramic ring, and this ceramic ring is fixed said optical fiber.
7. according to the said single-photon detector packaging system of claim 6, it is characterized in that: use the fixing said ceramic ring of epoxy Instant cement in the said circular hole.
8. according to the said single-photon detector packaging system of claim 3, it is characterized in that: said base is provided with third through-hole corresponding to the below of said circular hole position, and the side of said base is provided with fourth hole.
9. according to the said single-photon detector packaging system of claim 1, it is characterized in that: said high-frequency circuit board is provided with first high frequency connectors, and an end of said cable is provided with second high frequency connectors, and these first high frequency connectors connect second high frequency connectors.
10. according to the said single-photon detector packaging system of claim 4, it is characterized in that: the side of the upper cylinder of said push rod is provided with a groove, and said cable is by stretching out in this groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110252925.1A CN102324444B (en) | 2011-08-30 | 2011-08-30 | Encapsulating device for single-photon detector |
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| CN201110252925.1A CN102324444B (en) | 2011-08-30 | 2011-08-30 | Encapsulating device for single-photon detector |
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| CN102324444A true CN102324444A (en) | 2012-01-18 |
| CN102324444B CN102324444B (en) | 2013-03-20 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103245424A (en) * | 2012-02-03 | 2013-08-14 | 中国科学院上海微系统与信息技术研究所 | Method and device for improving electrical interference resistance of SNSPD (Superconducting Nanowire Single Photon Detector) system |
| CN108333696A (en) * | 2018-04-13 | 2018-07-27 | 南京大学 | A kind of superconducting single-photon detector casing fill-in light alignment package device |
| CN111679179A (en) * | 2020-06-15 | 2020-09-18 | 中国科学院半导体研究所 | Semi-packaged detector chip testing device and using method |
| CN115101601A (en) * | 2022-07-26 | 2022-09-23 | 中国电子科技集团公司第四十三研究所 | Single photon detector packaging structure |
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2011
- 2011-08-30 CN CN201110252925.1A patent/CN102324444B/en not_active Expired - Fee Related
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| US20050051726A1 (en) * | 2000-07-28 | 2005-03-10 | Credence Systems Corporation | Superconducting single photon detector |
| US20070152684A1 (en) * | 2005-12-31 | 2007-07-05 | Samsung Electronics Co., Ltd. | Apparatus and method for analyzing photo-emission |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103245424A (en) * | 2012-02-03 | 2013-08-14 | 中国科学院上海微系统与信息技术研究所 | Method and device for improving electrical interference resistance of SNSPD (Superconducting Nanowire Single Photon Detector) system |
| CN103245424B (en) * | 2012-02-03 | 2015-02-11 | 中国科学院上海微系统与信息技术研究所 | Method and device for improving electrical interference resistance of SNSPD (Superconducting Nanowire Single Photon Detector) system |
| CN108333696A (en) * | 2018-04-13 | 2018-07-27 | 南京大学 | A kind of superconducting single-photon detector casing fill-in light alignment package device |
| CN111679179A (en) * | 2020-06-15 | 2020-09-18 | 中国科学院半导体研究所 | Semi-packaged detector chip testing device and using method |
| CN115101601A (en) * | 2022-07-26 | 2022-09-23 | 中国电子科技集团公司第四十三研究所 | Single photon detector packaging structure |
| CN115101601B (en) * | 2022-07-26 | 2024-04-09 | 中国电子科技集团公司第四十三研究所 | Packaging structure of single photon detector |
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