CN102324444A - Single Photon Detector Packaging Device - Google Patents

Single Photon Detector Packaging Device Download PDF

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CN102324444A
CN102324444A CN201110252925A CN201110252925A CN102324444A CN 102324444 A CN102324444 A CN 102324444A CN 201110252925 A CN201110252925 A CN 201110252925A CN 201110252925 A CN201110252925 A CN 201110252925A CN 102324444 A CN102324444 A CN 102324444A
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photon detector
single photon
hole
top cover
packaging device
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CN102324444B (en
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陈健
赵清源
张蜡宝
康琳
许伟伟
吴培亨
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Nanjing University
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Abstract

The invention discloses an encapsulating device for a single-photon detector, which comprises a top rod, a top cover and a base which are sequentially arranged from the top to the bottom. The top rod and the top cover are fixedly connected; the top cover and the base are also connected fixedly; the top cover is provided with at least two through holes, wherein a first through hole passes through and fixes an optical fiber; a second through hole passes through a cable; a chip of the single-photon detector is fixed at a position corresponding to the optical fiber on the upper surface of the base; a high-frequency circuit board is fixed at a position corresponding to the cable; and the chip of the single-photon detector is electrically connected with the high-frequency circuit board. The encapsulating device for the single-photon detector has a compact structure; the two-channel photoelectric encapsulation can be achieved within an inside diameter of 20 mm; the external light to be detected is coupled by using the optical fiber; the coupling efficiency is more than 95%; furthermore, the interference is small; the chip is connected by using a microstrip line coplanar waveguide and an SMP (symmetrical multi-processing) high-frequency joint; the transmission performance that the chip outputs an electric signal to an external amplifier is improved; by adopting a symmetrical structural design, the combination is convenient; and the repeated service efficiency of the encapsulating device for the single-photon detector is improved.

Description

单光子探测器封装装置Single Photon Detector Packaging Device

技术领域 technical field

本发明涉及一种封装装置,特别涉及一种单光子探测器封装装置。The invention relates to a packaging device, in particular to a single photon detector packaging device.

背景技术 Background technique

近十年来,超导纳米线单光子探测器作为一种新型的单光子探测器被大家广泛关注。探测器的响应区域为用超导氮化铌薄膜制备出的几十纳米宽的蜿蜒线条。这些超导线条被偏置一低于超导临界电流的电流,当线条吸收光子后,吸收处局部温度升高,形成一热岛。热岛的存在使得线条上的电流重新分布,并最终超过超导临界电流从而使得局部区域形成电阻态。同时,由于膜条中声子、电子和衬底这三者间的热交换,形成的电阻态仅能持续很短时间,从而使得膜条在吸收光子,产生响应后重新回到预先的超导偏置状态,进而响应下一个光子。In the past ten years, superconducting nanowire single photon detectors have attracted widespread attention as a new type of single photon detector. The response area of the detector is a meandering line with a width of tens of nanometers prepared from a superconducting niobium nitride film. These superconducting wire strips are biased with a current lower than the superconducting critical current. When the strip absorbs photons, the local temperature at the absorption site rises, forming a heat island. The existence of the heat island redistributes the current on the line, and eventually exceeds the superconducting critical current so that the local area forms a resistive state. At the same time, due to the heat exchange among the phonons, electrons and substrate in the membrane strip, the resistance state formed can only last for a short time, so that the membrane strip absorbs photons and returns to the pre-superconducting state after responding. Bias state, which in turn responds to the next photon.

超导纳米线单光子探测器的制备和使用融合了超导材料、薄膜技术、微纳加工、微波测量等尖端技术并表现出优异的性能。首先,超导纳米线单光子探测器具有100MHz的重复频率和50ps的时间抖动,相比于半导体单光子探测器中常用的雪崩二极管和光电倍增管,在重复率上增加了约一个量级,在时间抖动上减少了一个量级。其次,半导体材料由于能带的限制,对于近红外波段的探测效率具有明显的截止波长,而超导材料由于能隙非常小,对于近红外波段的探测效率理论上可以远高于半导体材料。另外,由于探测器工作温度仅为几个K,超导纳米线探测器具有极低的暗计数,同时不需要像半导体探测器那样使用盖革(Ginger)模式工作,可以进行持续的探测。再者,相比于超导转换边界传感器(transition edge sensor)和超导隧道结探测器来说,超导纳米线探测器的重复速率依然比他们高很多,同时对于工作温度也没有那么低的要求,检测电路也相对简单。The preparation and use of superconducting nanowire single-photon detectors integrate cutting-edge technologies such as superconducting materials, thin-film technology, micro-nano processing, and microwave measurement, and show excellent performance. First, the superconducting nanowire single photon detector has a repetition rate of 100MHz and a time jitter of 50ps, which increases the repetition rate by about an order of magnitude compared with the commonly used avalanche diodes and photomultiplier tubes in semiconductor single photon detectors. An order of magnitude reduction in timing jitter. Secondly, due to the limitation of the energy band, semiconductor materials have an obvious cut-off wavelength for the detection efficiency in the near-infrared band, while superconducting materials have a very small energy gap, and the detection efficiency for the near-infrared band can theoretically be much higher than that of semiconductor materials. In addition, since the working temperature of the detector is only a few K, the superconducting nanowire detector has an extremely low dark count, and it does not need to work in the Ginger mode like a semiconductor detector, so it can perform continuous detection. Furthermore, compared with superconducting transition edge sensors and superconducting tunnel junction detectors, the repetition rate of superconducting nanowire detectors is still much higher than them, and the operating temperature is not so low. Requirements, the detection circuit is relatively simple.

基于超导纳米线单光子探测器突出的性能,近几年来,它被应用于量子保密通讯、集成电路检测、生物荧光检测、单光子源标定、时间相关单光子计数等领域。尤其是在量子保密通讯中,使用超导纳米线单光子探测器后,通信的速度和距离都得到了显著的提升。对于这些应用来说,需要克服以下几个问题。首先,为用户提供一套低温环境。通常,液氦是最容易获得的制冷媒介,但如果仅将芯片浸置于液氦中,其工作温度也只能达到4.2K。使用循环制冷机可以降低器件的工作温度并且持续工作,但其体积庞大,费用高且不易移动。再者,由于芯片工作于低温环境,而待检测光信号又非常微弱,因此光信号的耦合程度直接影响系统的检测效率和暗计数。最后,芯片的响应信号微弱,同时芯片处于低温环境,无法在芯片近端进行放大,因此芯片至常温放大这一段,电路上的连接必须保证信号的完整性。Based on the outstanding performance of superconducting nanowire single-photon detectors, in recent years, it has been used in quantum secure communication, integrated circuit detection, bioluminescence detection, single-photon source calibration, time-correlated single-photon counting and other fields. Especially in quantum secure communication, the speed and distance of communication have been significantly improved after using superconducting nanowire single photon detectors. For these applications, the following problems need to be overcome. First, provide users with a low-temperature environment. Usually, liquid helium is the most readily available cooling medium, but if the chip is only immersed in liquid helium, its working temperature can only reach 4.2K. Using a recirculating refrigerator can reduce the operating temperature of the device and continue to work, but it is bulky, expensive and difficult to move. Furthermore, since the chip works in a low-temperature environment and the optical signal to be detected is very weak, the coupling degree of the optical signal directly affects the detection efficiency and dark count of the system. Finally, the response signal of the chip is weak, and the chip is in a low-temperature environment, so it cannot be amplified at the near end of the chip. Therefore, the connection between the chip and the room temperature amplification must ensure the integrity of the signal.

通常光电探测器所使用的晶体管外壳(TO)封装、蝶形封装难以实现高精度的光纤对准和高频信号传输,另外,这些封装多针对常温器件,无法适用于真空低温环境。Usually, the transistor case (TO) package and butterfly package used in photodetectors are difficult to achieve high-precision fiber alignment and high-frequency signal transmission. In addition, these packages are mostly aimed at room temperature devices and cannot be used in vacuum and low temperature environments.

发明内容 Contents of the invention

发明目的:针对上述现有存在的问题和不足,本发明的目的是提供一种适用于真空低温环境的单光子探测器封装装置。Purpose of the invention: In view of the above-mentioned existing problems and deficiencies, the purpose of the present invention is to provide a single-photon detector packaging device suitable for a vacuum and low-temperature environment.

技术方案:为实现上述发明目的,本发明采用的技术方案为一种单光子探测器封装装置,包括由上到下依次设置的顶杆、顶盖和底座;所述顶杆和顶盖固定连接,顶盖和底座也固定连接;所述顶盖上设有至少两个通孔,其中第一通孔穿过并固定光纤,第二通孔穿过电缆;所述底座的上表面对应光纤的位置固定单光子探测器芯片(以下简称芯片),对应电缆的位置固定高频电路板,该超导纳米线单光子探测器芯片与高频电路板电连接。Technical solution: In order to achieve the purpose of the above invention, the technical solution adopted in the present invention is a single photon detector packaging device, which includes a top rod, a top cover and a base arranged in sequence from top to bottom; the top rod and the top cover are fixedly connected , the top cover and the base are also fixedly connected; the top cover is provided with at least two through holes, wherein the first through hole passes through and fixes the optical fiber, and the second through hole passes through the cable; the upper surface of the base corresponds to the optical fiber The single-photon detector chip (hereinafter referred to as chip) is fixed in position, and the high-frequency circuit board is fixed in position corresponding to the cable, and the superconducting nanowire single-photon detector chip is electrically connected to the high-frequency circuit board.

所述顶盖和底座分别可为两个同心半圆结构组成的圆形结构。The top cover and the base can respectively be circular structures composed of two concentric semicircular structures.

所述第一通孔可为圆孔,第二通孔可为方孔。The first through hole may be a round hole, and the second through hole may be a square hole.

所述顶杆的上部可为圆柱体,下部可为两个平行的叉齿;所述顶盖的上表面可设有连接杆,该连接杆伸入两个所述叉齿之间并与所述叉齿固定连接。The upper part of the push rod can be a cylinder, and the lower part can be two parallel forks; the upper surface of the top cover can be provided with a connecting rod, and the connecting rod extends between the two forks and connects with the forks. The fork teeth are fixedly connected.

所述顶杆的材料可为聚甲醛,用于连接冷头部分(顶盖和底座均浸渍在液氦中,称为冷头)同液氦抽气杜瓦内层测试杆末端,并隔绝冷头同测试杆之间的热传递,保持冷头的低温。The material of the push rod can be polyoxymethylene, which is used to connect the cold head part (the top cover and the base are all immersed in liquid helium, called the cold head) with the end of the liquid helium pumping Dewar inner layer test rod, and isolate the cold head. The heat transfer between the head and the test rod keeps the cold head at a low temperature.

所述圆孔内可固定有陶瓷环,该陶瓷环固定所述光纤。所述圆孔内可使用环氧快干胶固定所述陶瓷环。A ceramic ring can be fixed in the circular hole, and the ceramic ring fixes the optical fiber. Epoxy quick-drying glue can be used to fix the ceramic ring in the circular hole.

所述底座对应于所述圆孔位置的下方可设有第三通孔,用于显微镜观测光纤内芯与探测器响应区域相对位置;所述底座的侧面可设有第四通孔,根据显微镜的观测结果,使用金属细针伸入该通孔移动芯片,实现光纤和芯片的对准。The bottom of the base corresponding to the position of the round hole can be provided with a third through hole for microscopic observation of the relative position between the inner core of the optical fiber and the detector response area; the side of the base can be provided with a fourth through hole, according to the microscope According to the observation results, a thin metal needle is inserted into the through hole to move the chip to achieve the alignment of the optical fiber and the chip.

所述高频电路板可设有第一高频连接器,所述电缆的一端可设有第二高频连接器,该第一高频连接器连接第二高频连接器。The high-frequency circuit board may be provided with a first high-frequency connector, and one end of the cable may be provided with a second high-frequency connector, and the first high-frequency connector is connected to the second high-frequency connector.

所述顶杆的上部圆柱体的侧面可设有一凹槽,所述电缆可由该凹槽内伸出。A groove can be provided on the side of the upper cylinder of the push rod, and the cable can protrude from the groove.

有益效果:本发明适用于单光子探测器的封装,特别适用于超导纳米线单光子探测器在液氦抽气杜瓦下使用。结构紧凑,能够在20mm内径内实现双通道光电封装;使用光纤耦合外部被探测光,耦合效率大于95%并且干扰小;使用微带线共面波导和SMP高频接头连接芯片,提高了芯片输出电信号至外部放大器的传输性能;采用对称结构设计,方便组合,提高其重复使用效率。Beneficial effects: the invention is suitable for the packaging of single photon detectors, and is especially suitable for the use of superconducting nanowire single photon detectors under liquid helium pumping Dewar. Compact structure, capable of dual-channel photoelectric packaging within 20mm inner diameter; using optical fiber to couple external detected light, the coupling efficiency is greater than 95% and the interference is small; using microstrip line coplanar waveguide and SMP high-frequency connector to connect the chip, which improves the chip output The transmission performance of the electrical signal to the external amplifier; the symmetrical structure design is adopted, which is convenient for combination and improves its reuse efficiency.

附图说明 Description of drawings

图1为单光子探测器封装装置结构示意图;Fig. 1 is a schematic structural diagram of a single photon detector packaging device;

图2为顶杆的主视示意图;Fig. 2 is the schematic diagram of front view of ejector pin;

图3为顶杆的左视示意图;Fig. 3 is the schematic left view of ejector pin;

图4为顶杆的俯视示意图;Fig. 4 is the top view schematic diagram of push rod;

图5为顶盖的俯视示意图;Figure 5 is a schematic top view of the top cover;

图6为顶盖的主视示意图;Figure 6 is a schematic front view of the top cover;

图7为底座的主视示意图;Figure 7 is a schematic front view of the base;

图8为底座的俯视示意图;Figure 8 is a schematic top view of the base;

图9为显微镜下拍摄的对光效果图;Figure 9 is a light effect diagram taken under a microscope;

图10为电缆S21参数的测试结果图;Fig. 10 is the test result figure of cable S21 parameter;

图11为使用本发明的超导纳米线单光子探测器的检测效率和暗计数的测试结果图。Fig. 11 is a test result graph of detection efficiency and dark count using the superconducting nanowire single photon detector of the present invention.

附图中,1:第一通孔;2:叉齿;3:第一螺孔;4:第一凹槽(即为权利要求和说明书发明内容的凹槽);5:方孔(即为权利要求和说明书发明内容的第一通孔);6:圆孔(即为权利要求和说明书发明内容的第二通孔);7:第二通孔;8:第三通孔;9:第四通孔;10:第二凹槽;11:第三凹槽;12:第五通孔(即为权利要求和说明书发明内容的第三通孔);13:第二螺孔;14:连接杆。In the drawings, 1: the first through hole; 2: the fork; 3: the first screw hole; 4: the first groove (that is, the groove of the claim and the content of the invention in the specification); 5: the square hole (that is, the the first through hole of the content of the invention in the claims and description); 6: round hole (that is, the second through hole in the content of the invention in the claim and description); 7: the second through hole; 8: the third through hole; 9: the first Four through holes; 10: the second groove; 11: the third groove; 12: the fifth through hole (that is, the third through hole of the claim and the invention content of the description); 13: the second screw hole; 14: connection pole.

具体实施方式 Detailed ways

下面结合附图和具体实施例,进一步阐明本发明,应理解这些实施例仅用于说明本发明而不用于限制本发明的范围,在阅读了本发明之后,本领域技术人员对本发明的各种等价形式的修改均落于本申请所附权利要求所限定的范围。Below in conjunction with accompanying drawing and specific embodiment, further illustrate the present invention, should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand various aspects of the present invention Modifications in equivalent forms all fall within the scope defined by the appended claims of this application.

本发明实施过程中包含四个部分,光纤的固定、高频电路板固定及信号引出、芯片固定和对光、安装。The implementation process of the present invention includes four parts, the fixing of the optical fiber, the fixing of the high-frequency circuit board and the signal extraction, the fixing of the chip and the light alignment, and the installation.

光纤一端需要固定在顶盖圆孔6内,如图5所示。为了达到既固定光纤又便于上下移动光纤末端同芯片之间垂直距离的目的,顶盖圆孔6内预先使用环氧快干胶固定一内径2.5mm标准陶瓷环(图中未示出),随后,将光纤剥去金属环后的尾纤缓缓插入陶瓷环内即可。另一端光纤,需要在FC金属环内侧垫上一内径为2.5mm,截面直径为1mm的O型圈,然后接到液氦抽气杜瓦外部接口处(图中未示出)。One end of the optical fiber needs to be fixed in the round hole 6 of the top cover, as shown in FIG. 5 . In order to achieve the purpose of fixing the optical fiber and moving up and down the vertical distance between the end of the optical fiber and the chip, a standard ceramic ring with an inner diameter of 2.5mm (not shown in the figure) is fixed in the round hole 6 of the top cover in advance (not shown in the figure). , Insert the pigtail of the optical fiber after stripping the metal ring into the ceramic ring slowly. For the optical fiber at the other end, an O-ring with an inner diameter of 2.5 mm and a cross-sectional diameter of 1 mm needs to be placed on the inner side of the FC metal ring, and then connected to the external interface of the liquid helium pumping Dewar (not shown in the figure).

将设计好的高频电路板(图中未示出)使用环氧快干胶固定于底座上的第三凹槽11处,确保SMP射频接头(图中未示出)在顶盖方孔5的正下方,以方便半柔电缆(即为权利要求和说明书发明内容的电缆)正确连接,如图7所示。半柔电缆一端为相应的SMP接头,用来连接高频电路板上的SMP接头,另一端为SMA密封接头,连接至液氦抽气杜瓦的接口处(图中未示出)。Fix the designed high-frequency circuit board (not shown in the figure) to the third groove 11 on the base with epoxy quick-drying glue, and ensure that the SMP RF connector (not shown in the figure) is in the square hole 5 of the top cover. directly below, to facilitate the correct connection of the semi-flexible cable (that is, the cable that is the content of the invention in the claims and description), as shown in Figure 7. One end of the semi-flexible cable is a corresponding SMP connector, which is used to connect to the SMP connector on the high-frequency circuit board, and the other end is a SMA sealing connector, which is connected to the interface of the liquid helium pumping Dewar (not shown in the figure).

芯片(图中未示出)使用低温胶固定在底座上的第二凹槽10处,需保证芯片上的纳米线区域处于图5所示的圆孔处。随后,使用螺钉通过图5所示的第二通孔7和图8所示的第二螺孔13固定安装好陶瓷环的顶盖和安装好高频电路板的底座。对光时,先将光纤尾纤缓缓插入陶瓷环,并控制其与芯片表面的垂直距离大于1mm,另一端接一可见光激光源,本实例中使用的是绿光,如图9所示,虚线框内为纳米线区域,虚线框内的亮点为光纤内芯。通过底座的第五通孔12,使用显微镜观测光纤内芯同纳米线区域的相对位置,使用金属细针通过底座侧面的第四通孔9轻轻移动芯片,如图8所示。对准位置后,再将尾纤缓缓插入,使其端面尽量贴近芯片表面。对准后的效果如图9所示。The chip (not shown in the figure) is fixed on the second groove 10 on the base with low-temperature glue, and it is necessary to ensure that the nanowire area on the chip is at the circular hole shown in FIG. 5 . Subsequently, screws are used to fix the top cover with the ceramic ring installed and the base with the high-frequency circuit board installed through the second through hole 7 shown in FIG. 5 and the second screw hole 13 shown in FIG. 8 . When facing the light, first slowly insert the fiber pigtail into the ceramic ring, and control the vertical distance between it and the chip surface to be greater than 1mm, and connect a visible light laser source to the other end. In this example, green light is used, as shown in Figure 9. The nanowire area is inside the dotted box, and the bright spot in the dotted box is the inner core of the fiber. Through the fifth through hole 12 of the base, use a microscope to observe the relative position of the inner core of the fiber and the nanowire region, and use a metal needle to gently move the chip through the fourth through hole 9 on the side of the base, as shown in FIG. 8 . After aligning the position, insert the pigtail slowly so that the end face is as close as possible to the chip surface. The effect after alignment is shown in Figure 9.

对准后的芯片需要静置一段时间,使低温胶固化。将两块固定好的顶盖和顶座合成一个圆形,并将顶盖上的连接杆14插入聚甲醛顶杆的叉齿2内(如图2所示),使用螺钉通过图3所示的第一螺孔3和图6所示的第三通孔8固定。电缆由顶杆侧面凹槽4内伸出(如图4所示)。将顶杆缓缓插入测试杆内(如图1所示),调整前后距离,连接半柔电缆与底座上的高频电路板。随后使用螺钉通过顶杆上的第一通孔1和测试杆上的通孔(图中未示出)固定顶杆和测试杆。最后的成型图如图1所示。The aligned chips need to stand for a period of time to allow the low-temperature glue to cure. Combine the two fixed top covers and the top seat into a circle, and insert the connecting rod 14 on the top cover into the fork 2 of the POM mandrel (as shown in Figure 2), and use the screws to pass through as shown in Figure 3 The first screw hole 3 and the third through hole 8 shown in FIG. 6 are fixed. The cable protrudes from the groove 4 on the side of the push rod (as shown in Figure 4). Slowly insert the ejector rod into the test rod (as shown in Figure 1), adjust the front and rear distance, and connect the semi-flexible cable to the high-frequency circuit board on the base. Then screw is used to fix the push rod and the test rod through the first through hole 1 on the push rod and the through hole (not shown in the figure) on the test rod. The final shape is shown in Figure 1.

图10为使用网络分析仪测试的液氦抽气杜瓦内部半柔电缆的S21参数,说明在内部的电路连接上,并没有产生谐振点和断点,衰减情况也同使用的半柔电缆的衰减系数相吻合。图11为使用此封装测试的超导纳米线探测器的探测效率和暗计数,较好的反应了芯片的本征特性,达到了应用的标准。Figure 10 is the S21 parameter of the semi-flexible cable inside the liquid helium pumping Dewar tested by a network analyzer, which shows that there are no resonance points and breakpoints in the internal circuit connection, and the attenuation is also the same as that of the semi-flexible cable used Attenuation coefficients match. Figure 11 shows the detection efficiency and dark count of the superconducting nanowire detector tested using this package, which better reflects the intrinsic characteristics of the chip and meets the application standard.

Claims (10)

1.一种单光子探测器封装装置,包括由上到下依次设置的顶杆、顶盖和底座;所述顶杆和顶盖固定连接,顶盖和底座也固定连接;所述顶盖上设有至少两个通孔,其中第一通孔穿过并固定光纤,第二通孔穿过电缆;所述底座的上表面对应光纤的位置固定单光子探测器芯片,对应电缆的位置固定高频电路板,该单光子探测器芯片与高频电路板电连接。1. A single photon detector packaging device, comprising a push rod, a top cover and a base that are arranged sequentially from top to bottom; the push rod and the top cover are fixedly connected, and the top cover and the base are also fixedly connected; on the top cover There are at least two through holes, wherein the first through hole passes through and fixes the optical fiber, and the second through hole passes through the cable; the upper surface of the base corresponds to the position of the optical fiber to fix the single photon detector chip, and the position corresponding to the cable fixes the height A high frequency circuit board, the single photon detector chip is electrically connected with the high frequency circuit board. 2.根据权利要求1所述单光子探测器封装装置,其特征在于:所述顶盖和底座分别为两个同心半圆结构组成的圆形结构。2 . The single photon detector packaging device according to claim 1 , wherein the top cover and the base are respectively circular structures composed of two concentric semicircular structures. 3 . 3.根据权利要求1所述单光子探测器封装装置,其特征在于:所述第一通孔为圆孔,第二通孔为方孔。3 . The single photon detector packaging device according to claim 1 , wherein the first through hole is a round hole, and the second through hole is a square hole. 4 . 4.根据权利要求1所述单光子探测器封装装置,其特征在于:所述顶杆的上部为圆柱体,下部为两个平行的叉齿;所述顶盖的上表面设有连接杆,该连接杆伸入两个所述叉齿之间并与所述叉齿固定连接。4. The single photon detector packaging device according to claim 1, characterized in that: the upper part of the ejector rod is a cylinder, and the lower part is two parallel forks; the upper surface of the top cover is provided with a connecting rod, The connecting rod extends between the two tines and is fixedly connected with the tines. 5.根据权利要求1所述单光子探测器封装装置,其特征在于:所述顶杆的材料为聚甲醛。5 . The single photon detector packaging device according to claim 1 , wherein the ejector pin is made of polyoxymethylene. 6.根据权利要求3所述单光子探测器封装装置,其特征在于:所述圆孔内固定有陶瓷环,该陶瓷环固定所述光纤。6 . The single photon detector packaging device according to claim 3 , wherein a ceramic ring is fixed in the circular hole, and the ceramic ring fixes the optical fiber. 7.根据权利要求6所述单光子探测器封装装置,其特征在于:所述圆孔内使用环氧快干胶固定所述陶瓷环。7 . The single photon detector packaging device according to claim 6 , wherein the ceramic ring is fixed with epoxy quick-drying glue in the circular hole. 7 . 8.根据权利要求3所述单光子探测器封装装置,其特征在于:所述底座对应于所述圆孔位置的下方设有第三通孔,所述底座的侧面设有第四通孔。8 . The packaging device for a single photon detector according to claim 3 , wherein a third through hole is provided under the base corresponding to the position of the round hole, and a fourth through hole is provided on a side of the base. 9 . 9.根据权利要求1所述单光子探测器封装装置,其特征在于:所述高频电路板设有第一高频连接器,所述电缆的一端设有第二高频连接器,该第一高频连接器连接第二高频连接器。9. The single photon detector packaging device according to claim 1, wherein the high-frequency circuit board is provided with a first high-frequency connector, one end of the cable is provided with a second high-frequency connector, and the first high-frequency connector is provided with a second high-frequency connector. A high frequency connector is connected to the second high frequency connector. 10.根据权利要求4所述单光子探测器封装装置,其特征在于:所述顶杆的上部圆柱体的侧面设有一凹槽,所述电缆由该凹槽内伸出。10 . The single photon detector packaging device according to claim 4 , wherein a groove is formed on the side of the upper cylinder of the ejector rod, and the cable protrudes from the groove. 11 .
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