CN110398657A - Measured value needle and measuring mechanism - Google Patents
Measured value needle and measuring mechanism Download PDFInfo
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- CN110398657A CN110398657A CN201910767429.6A CN201910767429A CN110398657A CN 110398657 A CN110398657 A CN 110398657A CN 201910767429 A CN201910767429 A CN 201910767429A CN 110398657 A CN110398657 A CN 110398657A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
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Abstract
本发明的实施例提供了一种测值针及测量机构,涉及表面贴装技术领域。一种测值针,用于料带上电子元件的测值,料带上还设有用于封装电子元件的封装膜,测值针包括安装件和呈扁平状的测量件。安装件的一端用于安装于下针机构。测量件包括连接部和测量部,连接部连接于安装件,测量部连接于连接部远离安装件的一侧并用于电子元件的测值,测量部呈楔形,并用于穿透封装膜。连接部的厚度为0.5mm‑1mm。本发明还提供了一种测量机构,其采用了上述的测值针。本发明提供的测值针及测量机构能便于测量,并能提高测量精度和测量稳定性。
Embodiments of the present invention provide a measuring needle and a measuring mechanism, which relate to the field of surface mount technology. The utility model relates to a value measuring needle, which is used for measuring the value of electronic components on a material tape, and an encapsulating film for encapsulating the electronic components is also arranged on the material tape, and the value measuring needle includes a mounting part and a flat measuring part. One end of the mounting piece is used to be mounted on the needle lowering mechanism. The measuring part includes a connecting part and a measuring part. The connecting part is connected to the mounting part. The measuring part is connected to the side of the connecting part away from the mounting part and used for measuring the electronic components. The measuring part is wedge-shaped and used to penetrate the packaging film. The thickness of the connection part is 0.5mm-1mm. The present invention also provides a measuring mechanism, which adopts the above measuring needle. The value measuring needle and the measuring mechanism provided by the invention can facilitate measurement, and can improve measurement accuracy and measurement stability.
Description
技术领域technical field
本发明涉及表面贴装技术领域,具体而言,涉及一种测值针及测量机构。The invention relates to the field of surface mount technology, in particular to a measuring needle and a measuring mechanism.
背景技术Background technique
SMT(表面贴装技术)行业在中国这几年可以说是飞速的发展。而在发展的过程中人们对产品的品质、结构框架要求不断地提高,表面贴装技术正在向无源元件的前进,表面贴装元件越来越小。The SMT (Surface Mount Technology) industry has developed rapidly in China in recent years. In the process of development, people's requirements for product quality and structural framework are constantly improving, and surface mount technology is advancing to passive components, and surface mount components are getting smaller and smaller.
现阶段在SMT行业最为头痛的问题就是,电子元器件越来越多、尺寸越来越小,而品质越来越高,这就要求工厂在来料环节要严格把控质量。目前就大部分SMT工厂而言,需要人工对来料进行检测,具体流程:拿到待测物料盘,撕开封装塑胶模,在放大镜下取出待测料放到特定检测位置,再通过放大镜找准极性测值点,手持电桥测量表笔测值并记录。The most troublesome problem in the SMT industry at this stage is that there are more and more electronic components, the size is getting smaller and the quality is getting higher and higher, which requires the factory to strictly control the quality of the incoming materials. At present, most SMT factories need to manually inspect the incoming materials. The specific process: get the material tray to be tested, tear open the packaging plastic mold, take out the material to be tested under the magnifying glass and put it in a specific detection position, and then find it through the magnifying glass. Quasi-polarity measuring points, hand-held bridge measuring pens to measure and record the value.
发明内容Contents of the invention
本发明的目的包括,例如,提供了一种测值针,其能够便于测量,并能提高测量精度和测量稳定性。Objects of the present invention include, for example, providing a measuring needle which can facilitate measurement and can improve measurement accuracy and measurement stability.
本发明的目的还包括,提供了一种测量机构,其能够便于测量,并能提高测量精度和测量稳定性。The purpose of the present invention is also to provide a measuring mechanism, which can facilitate the measurement, and can improve the measurement accuracy and measurement stability.
本发明的实施例可以这样实现:Embodiments of the present invention can be realized like this:
本发明的实施例提供了一种测值针,用于料带上电子元件的测值,所述料带上还设有封装所述电子元件的封装膜,所述测值针包括安装件和呈扁平状的测量件。An embodiment of the present invention provides a value-measuring needle for measuring the value of electronic components on a material tape, and an encapsulation film for encapsulating the electronic components is provided on the material tape, and the value-measuring needle includes a mounting part and a A flat measuring piece.
所述安装件的一端用于安装于下针机构。One end of the mounting part is used to be mounted on the needle lowering mechanism.
所述测量件包括连接部和测量部,所述连接部连接于所述安装件,所述测量部连接于所述连接部远离所述安装件的一侧并用于所述电子元件的测值,所述测量部呈楔形,并用于穿透所述封装膜。The measuring part includes a connecting part and a measuring part, the connecting part is connected to the mounting part, the measuring part is connected to the side of the connecting part away from the mounting part and used for measuring the electronic components, The measuring portion is wedge-shaped and used to penetrate the packaging film.
所述连接部的厚度为0.5mm-1mm。The thickness of the connecting part is 0.5mm-1mm.
可选择地,所述安装件的宽度大于所述连接部的宽度,所述连接部的宽度等于所述测量部的宽度。Optionally, the mounting part has a width greater than that of the connecting part, and the width of the connecting part is equal to the width of the measuring part.
可选择地,所述测量部的宽度为0.2mm-1mm。Optionally, the measuring portion has a width of 0.2mm-1mm.
可选择地,所述测量部的长度为0.5mm-1.5mm。Optionally, the length of the measuring portion is 0.5mm-1.5mm.
可选择地,所述测量部的长度为1mm或者1.2mm。Optionally, the length of the measuring portion is 1mm or 1.2mm.
可选择地,所述测量部上设置有第一斜面和第二斜面,所述第一斜面和所述第二斜面相连形成楔形,并且所述第一斜面和所述第二斜面之间的角度为20°-60°。Optionally, the measuring portion is provided with a first slope and a second slope, the first slope and the second slope are connected to form a wedge shape, and the angle between the first slope and the second slope is 20°-60°.
可选择地,所述测量件的长度为1.5mm-3mm。Optionally, the measuring piece has a length of 1.5mm-3mm.
可选择地,所述安装件和/或所述测量件采用碳钢、铜或者铁制成。Optionally, the mounting part and/or the measuring part are made of carbon steel, copper or iron.
可选择地,所述测值针还包括隔离层,所述隔离层包覆于所述安装件和/或所述测量件的外侧。Optionally, the measuring needle further includes an isolation layer, and the isolation layer covers the outside of the mounting part and/or the measuring part.
一种测量机构,包括测值针。所述测值针用于料带上电子元件的测值,所述测值针包括安装件和呈扁平状的测量件。所述安装件的一端用于安装于下针机构。所述测量件包括连接部和测量部,所述连接部连接于所述安装件,所述测量部连接于所述连接部远离所述安装件的一侧并用于所述电子元件的测值,所述测量部呈楔形。所述连接部的厚度为0.5mm-1mm。A measuring mechanism includes a measuring needle. The measuring needle is used for measuring the value of the electronic components on the material tape, and the measuring needle includes a mounting part and a flat measuring part. One end of the mounting part is used to be mounted on the needle lowering mechanism. The measuring part includes a connecting part and a measuring part, the connecting part is connected to the mounting part, the measuring part is connected to the side of the connecting part away from the mounting part and used for measuring the electronic components, The measuring portion is wedge-shaped. The thickness of the connecting part is 0.5mm-1mm.
本发明实施例的测值针相对于现有技术的有益效果包括,例如:Compared with the prior art, the beneficial effects of the measuring needle of the embodiment of the present invention include, for example:
本发明提供的测值针能通过呈楔形部的测量部穿透封装膜,直接对封装膜内部的电子元件进行测值,节省了撕下封装膜进行检测并最后再进行封装的成本以及时间,使得对于料带上电子元件的检测效率提高,并且通过将连接部的厚度设置为0.5mm-1mm能针对不同大小的多种电子元件选择适当的连接部厚度,能便于对多种尺寸电子元件的测值,进而实现提高测值针便利性的目的。The measuring needle provided by the present invention can penetrate the encapsulation film through the wedge-shaped measuring part, and directly measure the value of the electronic components inside the encapsulation film, saving the cost and time of tearing off the encapsulation film for detection and finally packaging, The detection efficiency of the electronic components on the tape is improved, and by setting the thickness of the connection part to 0.5mm-1mm, the appropriate thickness of the connection part can be selected for various electronic components of different sizes, which can facilitate the detection of electronic components of various sizes. Measured value, and then achieve the purpose of improving the convenience of the value needle.
本发明提供的测量机构相对于现有技术的有益效果与上述提供的测值针相对于现有技术的有益效果相同,在此不再赘述。The beneficial effect of the measurement mechanism provided by the present invention relative to the prior art is the same as that of the value measuring needle provided above relative to the prior art, and will not be repeated here.
附图说明Description of drawings
为了更清楚地说明本发明实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,应当理解,以下附图仅示出了本发明的某些实施例,因此不应被看作是对范围的限定,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他相关的附图。In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and thus It should be regarded as a limitation on the scope, and those skilled in the art can also obtain other related drawings based on these drawings without creative work.
图1为本发明实施例中提供的测值针进行测值时的结构示意图;Fig. 1 is a schematic structural view of the value measuring needle provided in the embodiment of the present invention when measuring a value;
图2为本发明第一实施例中提供的测值针第一视角的结构示意图;Fig. 2 is a structural schematic diagram of the first viewing angle of the measuring needle provided in the first embodiment of the present invention;
图3为本发明第一实施例中提供的测值针第二视角的结构示意图;Fig. 3 is a structural schematic diagram of the second viewing angle of the measuring needle provided in the first embodiment of the present invention;
图4为本发明第一实施例中提供的测值针第三视角的结构示意图。Fig. 4 is a schematic structural view of the third viewing angle of the measuring needle provided in the first embodiment of the present invention.
图标:1-电子元件;2-封装膜;10-测值针;100-安装件;110-安装侧边;200-测量件;210-连接部;220-测量部;221-第一斜面;222-第二斜面。Icons: 1-electronic component; 2-encapsulation film; 10-measurement needle; 100-installation part; 110-installation side; 200-measurement part; 210-connection part; 220-measurement part; 222 - Second slope.
具体实施方式Detailed ways
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。通常在此处附图中描述和示出的本发明实施例的组件可以以各种不同的配置来布置和设计。In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.
因此,以下对在附图中提供的本发明的实施例的详细描述并非旨在限制要求保护的本发明的范围,而是仅仅表示本发明的选定实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步定义和解释。It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.
在本发明的描述中,需要说明的是,若出现术语“上”、“下”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,或者是该发明产品使用时惯常摆放的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。In the description of the present invention, it should be noted that if the orientation or positional relationship indicated by the terms "upper", "lower", "inner" and "outer" appear, it is based on the orientation or positional relationship shown in the drawings, or It is the orientation or positional relationship that the invention product is usually placed in use, and it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation , and therefore cannot be construed as a limitation of the present invention.
此外,若出现术语“第一”、“第二”等仅用于区分描述,而不能理解为指示或暗示相对重要性。In addition, terms such as "first" and "second" are used only for distinguishing descriptions, and should not be understood as indicating or implying relative importance.
需要说明的是,在不冲突的情况下,本发明的实施例中的特征可以相互结合。It should be noted that, in the case of no conflict, the features in the embodiments of the present invention may be combined with each other.
第一实施例first embodiment
请参阅图1,本实施例中提供了一种测值针10,该测值针10用于料带上电子元件1的测值,并且该测值针10能够便于对电子元件1的测值,并能提高测量精度和测量稳定性。并且,在本实施例中,测值针10用于安装于测量机构(图未示)上,测量机构上设置有下针机构(图未示),测值针10则安装于下针机构上,以通过下针机构带动测值针10移动,并对电子元件1进行测值。Please refer to Fig. 1, a measuring needle 10 is provided in this embodiment, the measuring needle 10 is used for measuring the value of the electronic component 1 on the material tape, and the measuring needle 10 can facilitate the measuring of the electronic component 1 , and can improve measurement accuracy and measurement stability. And, in this embodiment, the measuring pin 10 is used to be installed on the measuring mechanism (not shown), the measuring mechanism is provided with a lower needle mechanism (not shown), and the measuring needle 10 is installed on the lower needle mechanism , so that the measuring needle 10 is driven to move by the needle lowering mechanism, and the electronic component 1 is measured.
其中,料带指代的是,在表面贴装技术(SMT,Surface Mounting Technology)中用于承载待安装的电子元件1的载体,即在表面贴装技术的工艺流程中,需要通过料带作为待安装的电子元件1的载体将电子元件1输送至指定的工位,并通过相应的机构将电子元件1安装在印制电路板的表面。其中,料带上还设置有用于封装电子元件1的封装膜2,封装膜2可以塑料薄膜或者纸质薄膜等用于封装的薄膜。Among them, the material tape refers to the carrier used to carry the electronic component 1 to be mounted in the surface mount technology (SMT, Surface Mounting Technology), that is, in the process flow of the surface mount technology, the material tape needs to be used as a The carrier of the electronic component 1 to be mounted transports the electronic component 1 to a designated station, and mounts the electronic component 1 on the surface of the printed circuit board through a corresponding mechanism. Wherein, an encapsulating film 2 for encapsulating the electronic components 1 is also arranged on the material tape, and the encapsulating film 2 can be a film for encapsulating such as a plastic film or a paper film.
需要说明的是,在本实施例中,测值针10用于检测的电子元件1的尺寸一般为0.2mm*0.4mm。并且,其中,在检测电子元件1时,需要采用两个测值针10对电子元件1进行检测,两个测值针10分别放置于电子元件1的两端,便能对电子元件1进行测值。另外,需要说明的是,测值针10可以与其他测值仪(图未示)连接,以通过测值仪得出检测电子元件1之后的数据,进而判断电子元件1是否合格。其中,测值仪可以是LCR表、万用表、阻抗分析仪、示波器、网络分析仪或者综合测试仪等。It should be noted that, in this embodiment, the size of the electronic component 1 used for detection by the measuring needle 10 is generally 0.2mm*0.4mm. Moreover, when testing the electronic component 1, it is necessary to use two measuring needles 10 to detect the electronic component 1, and the two measuring needles 10 are respectively placed at both ends of the electronic component 1, so that the electronic component 1 can be tested. value. In addition, it should be noted that the measuring needle 10 can be connected with other measuring instruments (not shown in the figure), so as to obtain the data after testing the electronic component 1 through the measuring instrument, and then determine whether the electronic component 1 is qualified. Wherein, the value measuring instrument may be an LCR meter, a multimeter, an impedance analyzer, an oscilloscope, a network analyzer, or a comprehensive tester.
在本实施例中,请参阅图2,测值针10包括安装件100和测量件200。其中,安装件100用于安装于下针机构,测量件200用于接触于电子元件1并对电子元件1进行检测。可选地,安装件100的一端用于安装于下针机构,测量件200连接于安装件100的另一端,此时便能通过下针机构带动安装件100,进而通过安装件100带动测量件200对电子元件1进行测值。In this embodiment, please refer to FIG. 2 , the measuring probe 10 includes a mounting part 100 and a measuring part 200 . Wherein, the mounting part 100 is used to be installed on the needle lowering mechanism, and the measuring part 200 is used to contact the electronic component 1 and detect the electronic component 1 . Optionally, one end of the mounting part 100 is used to be installed on the lower needle mechanism, and the measuring part 200 is connected to the other end of the mounting part 100. At this time, the mounting part 100 can be driven by the needle lowering mechanism, and then the measuring part can be driven by the mounting part 100 200 measures the value of the electronic component 1 .
其中,请结合参阅图1-图3,在本实施例中,测量件200为扁平状,使得测量件200方便穿透封装膜2并伸入至封装膜2内部对电子元件1进行测值。Wherein, please refer to FIGS. 1-3 . In this embodiment, the measuring piece 200 is flat, so that the measuring piece 200 can easily penetrate the packaging film 2 and extend into the packaging film 2 to measure the value of the electronic component 1 .
需要说明的是,在本实施例中,测量件200的厚度与安装件100的厚度相同,并且安装件100上相对设置的两个侧面分别与测量件200上相对设置的两个侧面相平齐,并使得测值针10整体呈扁平状。另外,在本实施例中,安装件100和测量件200采用一体成型的方式相连接。应当理解,在其他实施例中也可以通过卡接或者粘接等方式实现测量件200和安装件100之间的相互连接。It should be noted that, in this embodiment, the thickness of the measuring piece 200 is the same as that of the mounting piece 100, and the two opposite sides of the mounting piece 100 are respectively flush with the two opposite sides of the measuring piece 200 , and make the measuring needle 10 overall flat. In addition, in this embodiment, the mounting part 100 and the measuring part 200 are connected in an integrated manner. It should be understood that, in other embodiments, the mutual connection between the measuring part 200 and the mounting part 100 may also be realized by clamping or bonding.
请结合参阅图2和图4,安装件100用于安装测量件200的一端设置有安装侧边110,测量件200设置于安装侧边110,并且测量件200位于安装侧边110的中部,以使得测值针10在接触于电子元件1时,安装件100和测量件200之间的应力均匀,不易造成测量件200的弯折断裂,进而提高测量件200的稳定性。应当理解,在其他实施例中,测量件200也可以设置于安装侧边110的其他位置,例如,测量件200设置于安装侧边110长度的三分之一对应处等。Please refer to Fig. 2 and Fig. 4 in combination, one end of the mounting part 100 for mounting the measuring part 200 is provided with a mounting side 110, the measuring part 200 is arranged on the mounting side 110, and the measuring part 200 is located in the middle of the mounting side 110, so as to When the measuring needle 10 is in contact with the electronic component 1 , the stress between the mounting part 100 and the measuring part 200 is uniform, and the bending and fracture of the measuring part 200 is not easy to be caused, thereby improving the stability of the measuring part 200 . It should be understood that in other embodiments, the measuring piece 200 may also be arranged at other positions of the installation side 110 , for example, the measuring piece 200 is arranged at a position corresponding to one-third of the length of the installation side 110 .
进一步地,测量件200包括连接部210和测量部220。连接部210连接于安装件100上,测量部220连接于连接部210远离安装件100的一侧,并且测量部220用于接触于电子元件1以实现对电子元件1的测值。需要说明的是,在本实施例中,连接部210和测量部220采用一体成型的方式实现相互连接。Further, the measuring part 200 includes a connecting part 210 and a measuring part 220 . The connecting part 210 is connected to the mounting part 100 , the measuring part 220 is connected to the side of the connecting part 210 away from the mounting part 100 , and the measuring part 220 is used to contact the electronic component 1 to realize the measurement of the electronic component 1 . It should be noted that, in this embodiment, the connecting part 210 and the measuring part 220 are connected to each other in an integrated manner.
可选地,在本实施例中,测量部220呈楔形,以便于在对封装完成的电子元件1进行检测时,能通过楔形的测量部220穿透封装膜2伸入封装膜2的内部,进而通过测量部220接触电子元件1实现对于电子元件1的测值。并且通过楔形的测量部220的设置方式,在两个测量部220共同接触于电子元件1时,能通过两个楔形测量部220的尖端接触电子元件1,避免两个测量部220之间产生相互接触或者相互抵持的情况,能保证通过两个测值针10对电子元件1提供高效稳定的测值效果,提高测值有效性。Optionally, in this embodiment, the measurement portion 220 is wedge-shaped, so that when the packaged electronic component 1 is detected, the wedge-shaped measurement portion 220 can penetrate the packaging film 2 and extend into the interior of the packaging film 2, Furthermore, the measurement of the electronic component 1 is realized by the measuring part 220 contacting the electronic component 1 . And through the setting method of the wedge-shaped measuring part 220, when the two measuring parts 220 are in common contact with the electronic component 1, the tips of the two wedge-shaped measuring parts 220 can contact the electronic component 1, so as to avoid mutual occurrence between the two measuring parts 220. In the case of contact or mutual resistance, it can be ensured that the two measuring needles 10 can provide an efficient and stable measuring effect on the electronic component 1 and improve the validity of the measuring value.
需要说明的是,请结合参阅图1和图2,其中测量部220呈楔形指代的是,测量部220上相对的两侧分别设置有第一斜面221和第二斜面222,并且第一斜面221和第二斜面222在测量部220远离连接部210的一端相连以形成楔形,同时使得测量部220的截面呈三角形。需要说明的是,其中,第一斜面221和第二斜面222相连并形成一个交线,该交线平行于连接部210厚度方向上的侧面。应当理解,在本实施例中,测量部220的截面为等腰三角形,即第一斜面221的长度和第二斜面222的长度相同,同时第一斜面221和第二斜面222的交线对应于连接部210相对设置的两个侧面的中部。应当理解,自其它实施例中,第一斜面221的长度与第二斜面222的长度也可以不同,例如,测量部220的截面呈直角三角形等。It should be noted that, please refer to FIG. 1 and FIG. 2 in conjunction, where the measuring part 220 is wedge-shaped means that the opposite sides of the measuring part 220 are respectively provided with a first inclined surface 221 and a second inclined surface 222, and the first inclined surface 221 and the second inclined surface 222 are connected at the end of the measuring portion 220 away from the connecting portion 210 to form a wedge shape, and meanwhile the cross section of the measuring portion 220 is triangular. It should be noted that, wherein, the first slope 221 and the second slope 222 are connected to form an intersection line, and the intersection line is parallel to the side surface of the connecting portion 210 in the thickness direction. It should be understood that, in this embodiment, the cross section of the measuring portion 220 is an isosceles triangle, that is, the length of the first slope 221 is the same as that of the second slope 222, and the intersection line of the first slope 221 and the second slope 222 corresponds to The connection part 210 is the middle part of the two side faces which are arranged oppositely. It should be understood that, from other embodiments, the length of the first slope 221 and the length of the second slope 222 may also be different, for example, the cross-section of the measurement part 220 is a right triangle.
在本实施例中,请结合参阅图2-图4,连接部210的厚度为0.5mm-1mm。需要说明的是,在本实施例中,测量部220为设置于连接部210的端部的楔形结构,即测量部220的厚度自靠近连接部210的一端至远离连接部210的一端逐渐减小,即在本实施例中,测量部220的厚度小于或等于连接部210的厚度。当连接部210的厚度为0.5mm时,此时用于尺寸较小的电子元件1的测值,当连接部210的厚度为1mm时,此时用于尺寸较大的电子元件1的测值。即,可以将连接部210以及测量部220的厚度尺寸设置为多种规格,以适配于多种规格的电子元件1,以使得在需要对其中一个规格的电子元件1进行测值时,能选用适当厚度的连接部210和测量部220的测值针10对电子元件1进行测值,能提高对于电子元件1测值的精准度以及效率。即,在本实施例中,连接部210的厚度还可以为0.6mm、0.8mm或者0.9mm等。应当理解,在本实施例中,安装件100的厚度与测量件200的厚度相同,即安装件100的厚度与连接部210的厚度相同。In this embodiment, please refer to FIGS. 2-4 in combination, the thickness of the connecting portion 210 is 0.5mm-1mm. It should be noted that, in this embodiment, the measuring part 220 is a wedge-shaped structure disposed at the end of the connecting part 210, that is, the thickness of the measuring part 220 gradually decreases from the end close to the connecting part 210 to the end far away from the connecting part 210. , that is, in this embodiment, the thickness of the measuring portion 220 is less than or equal to the thickness of the connecting portion 210 . When the thickness of the connecting portion 210 is 0.5 mm, it is used for measuring the value of the electronic component 1 with a smaller size at this time; when the thickness of the connecting portion 210 is 1 mm, it is used for the measuring value of the electronic component 1 with a larger size at this time . That is, the thickness dimensions of the connecting portion 210 and the measuring portion 220 can be set to various specifications to adapt to electronic components 1 of various specifications, so that when it is necessary to measure the electronic component 1 of one specification, it can Selecting the measuring needle 10 of the connection part 210 and the measuring part 220 with an appropriate thickness to measure the electronic component 1 can improve the accuracy and efficiency of measuring the electronic component 1 . That is, in this embodiment, the thickness of the connecting portion 210 may also be 0.6 mm, 0.8 mm, or 0.9 mm. It should be understood that, in this embodiment, the thickness of the mounting part 100 is the same as that of the measuring part 200 , that is, the thickness of the mounting part 100 is the same as that of the connection part 210 .
可选地,测量部220的宽度为0.2mm-1mm。以便于提高测量部220穿入封装膜2的穿入能力,以提高测量部220穿入封装膜2的效率,并降低对封装膜2的损坏程度。其中,测量部220的宽度可以为0.2mm、0.5mm或者0.8mm等。Optionally, the width of the measuring portion 220 is 0.2mm-1mm. In order to improve the penetration ability of the measurement part 220 into the packaging film 2 , to improve the penetration efficiency of the measurement part 220 into the packaging film 2 , and to reduce the degree of damage to the packaging film 2 . Wherein, the width of the measurement part 220 may be 0.2 mm, 0.5 mm or 0.8 mm, etc. FIG.
可选地,测量部220的长度为0.5mm-1.5mm。以使得测量部220能在穿透封装膜2之后具有足够的长度接触到电子元件1,并能避免在测量部220接触到电子元件1之后出现安装件100对封装膜2的损坏。同时也可以使得测量部220具有足够的强度,进而避免测量部220容易弯折断裂的情况出现。其中,测量部220的长度可以为1mm、1.2mm、0.8mm或者1.5mm等。需要说明的是,当测量部220的长度取值为1mm或者1.2mm时,此时测量部220具有充分的强度,并能具有足够的长度与电子元件1相接触。Optionally, the length of the measuring portion 220 is 0.5mm-1.5mm. So that the measuring part 220 can have a sufficient length to contact the electronic component 1 after penetrating the packaging film 2 , and avoid damage to the packaging film 2 caused by the mounting part 100 after the measuring part 220 contacts the electronic component 1 . At the same time, the measuring part 220 can be made to have sufficient strength, thereby avoiding the situation that the measuring part 220 is easily bent and broken. Wherein, the length of the measuring part 220 may be 1mm, 1.2mm, 0.8mm or 1.5mm, etc. It should be noted that when the length of the measurement portion 220 is 1 mm or 1.2 mm, the measurement portion 220 has sufficient strength and can have sufficient length to contact the electronic component 1 .
进一步地,整个测量件200的长度为1.5mm-3mm。其中,测量件200的长度等于连接部210的长度加上测量部220的长度。其中,测量件200的长度在1.5mm-3mm之间时,能使得测量件200具有足够的长度以便于接触电子元件1并同时避免测量件200的强度降低,同时能避免当测量件200接触到电子元件1之后安装件100对封装膜2造成损坏。其中,测量件200的长度可以为1.5mm、1.8mm、2mm、2.5mm或者3mm等。Further, the length of the whole measuring piece 200 is 1.5mm-3mm. Wherein, the length of the measuring part 200 is equal to the length of the connecting part 210 plus the length of the measuring part 220 . Wherein, when the length of the measuring piece 200 is between 1.5mm-3mm, it can make the measuring piece 200 have a sufficient length so as to facilitate contact with the electronic component 1 and at the same time avoid the reduction of the strength of the measuring piece 200, and at the same time avoid when the measuring piece 200 comes into contact with The package film 2 is damaged by the mount 100 behind the electronic component 1 . Wherein, the length of the measuring piece 200 may be 1.5mm, 1.8mm, 2mm, 2.5mm or 3mm, etc.
进一步地,第一斜面221和第二斜面222之间的角度为20°-60°,以便于测量部220与电子元件1相接触,提高测量件200与电子元件1相互之间的有效接触,进而提高测值的精准度以及稳定性。Further, the angle between the first slope 221 and the second slope 222 is 20°-60°, so that the measuring part 220 is in contact with the electronic component 1, and the effective contact between the measuring part 200 and the electronic component 1 is improved, Thereby improving the accuracy and stability of the measured value.
可选地,请继续参阅图1,在本实施例中,第一斜面221和第二斜面222之间的角度为36°,此时测量部220能快速地穿入封装膜2,并且能保证测量部220与电子元件1之间良好的接触稳定性。应当理解,在其他实施例中,也可以将第一斜面221和第二斜面222之间的角度设置为其他值,例如,30°、40°或者45°等。如果增大第一斜面221和第二斜面222之间的角度,即使得第一斜面221和第二斜面222之间的角度大于36°,此时会降低测量部220穿入封装膜2的速率,同时对封装膜2的损坏增大;如果减小第一斜面221和第二斜面222之间的角度,即使得第一斜面221和第二斜面222之间的角度小于36°,此时会降低测量部220与电子元件1接触的稳定性,会降低测量部220对电子元件1测值的精准度。Optionally, please continue to refer to FIG. 1. In this embodiment, the angle between the first slope 221 and the second slope 222 is 36°. At this time, the measuring part 220 can quickly penetrate the packaging film 2, and can ensure Good contact stability between the measuring part 220 and the electronic component 1 . It should be understood that in other embodiments, the angle between the first slope 221 and the second slope 222 may also be set to other values, for example, 30°, 40° or 45°. If the angle between the first slope 221 and the second slope 222 is increased, that is, the angle between the first slope 221 and the second slope 222 is greater than 36°, the rate at which the measuring portion 220 penetrates the packaging film 2 will be reduced. , while the damage to the packaging film 2 increases; if the angle between the first slope 221 and the second slope 222 is reduced, that is, the angle between the first slope 221 and the second slope 222 is less than 36°, then it will be Reducing the stability of the contact between the measuring part 220 and the electronic component 1 will reduce the accuracy of the measuring part 220 on the electronic component 1 .
进一步地,安装件100和/或测量件200采用碳钢、铜或者铁制成。可选地,在本实施例中,安装件100和/或测量件200采用中碳钢制成。安装件100和/或测量件200采用中碳钢制成指代的是,安装件100和测量件200的设置方式可以如下:安装件100采用中碳钢制成,测量件200采用其他材料制成;或者,测量件200采用中碳钢制成,安装件100采用其他材料制成;或者,安装件100和测量件200均采用中碳钢制成。可选地,在本实施例中,安装件100和测量件200采用一体成型的方式形成,即安装件100和测量件200均采用中碳钢制成。应当理解,在其他实施例中,安装件100和/或测量件200也可以采用铜或者铁制成,或者安装件100和/或测量件200也可以采用其他的导电材料制成。Further, the mounting part 100 and/or the measuring part 200 are made of carbon steel, copper or iron. Optionally, in this embodiment, the mounting part 100 and/or the measuring part 200 are made of medium carbon steel. The mounting part 100 and/or the measuring part 200 are made of medium carbon steel. It means that the setting method of the mounting part 100 and the measuring part 200 can be as follows: the mounting part 100 is made of medium carbon steel, and the measuring part 200 is made of other materials. Or, the measuring part 200 is made of medium carbon steel, and the mounting part 100 is made of other materials; or, both the mounting part 100 and the measuring part 200 are made of medium carbon steel. Optionally, in this embodiment, the mounting part 100 and the measuring part 200 are integrally formed, that is, the mounting part 100 and the measuring part 200 are both made of medium carbon steel. It should be understood that in other embodiments, the mounting part 100 and/or the measuring part 200 may also be made of copper or iron, or the mounting part 100 and/or the measuring part 200 may also be made of other conductive materials.
进一步地,请结合参阅图2-图4,测值针10还包括隔离层(图未示),隔离层包覆于安装件100和/或测量件200的外侧。即隔离层的设置方式可以为,如下:隔离层仅包覆于安装件100外侧;或者,隔离件仅包覆于测量件200的外侧;或者,隔离层同时包覆于安装件100和测量件200的外侧。在本实施例中,采用隔离层同时包覆于安装件100和测量件200外侧的方式。需要说明的是,在本实施例中,隔离层能进行导电,以便于测量件200对电子元件1进行检测。可选地,在本实施例中隔离层为包覆于整个测值针10外侧的镀金层,由于镀金层的化学性质较稳定,并且导电能力强,能大幅度延长测值针10的使用寿命,并保证测值针10测值的稳定性。应当理解,在其他实施例中,隔离层也可以使用镀银层等。Further, please refer to FIG. 2-FIG. 4 in conjunction, the measuring needle 10 further includes an isolation layer (not shown in the figure), and the isolation layer covers the outside of the mounting part 100 and/or the measuring part 200 . That is, the arrangement of the isolation layer can be as follows: the isolation layer is only coated on the outside of the mounting part 100; or, the isolation layer is only coated on the outside of the measuring part 200; or, the insulating layer is coated on the mounting part 100 and the measuring part at the same time 200 outside. In this embodiment, an isolation layer is adopted to cover the outer sides of the mounting part 100 and the measuring part 200 at the same time. It should be noted that, in this embodiment, the isolation layer can conduct electricity, so that the measuring part 200 can detect the electronic component 1 . Optionally, in this embodiment, the isolation layer is a gold-plated layer coated on the outside of the entire measuring needle 10. Since the chemical properties of the gold-plated layer are relatively stable and have strong electrical conductivity, the service life of the measuring needle 10 can be greatly extended. , and ensure the stability of the measured value of the measuring needle 10. It should be understood that in other embodiments, the isolation layer may also use a silver plating layer or the like.
综上所述,本实施例中提供的测值针10能通过呈楔形部的测量部220穿透封装膜2,直接对封装膜2内部的料带上的电子元件1进行测值,节省了撕下封装膜2进行检测并最后再进行封装的成本以及时间,使得对于料带上电子元件1的检测效率提高,并且通过将连接部210的厚度设置为0.5mm-1mm能针对不同大小的多种电子元件1选择适当的连接部210厚度,能便于对多种尺寸电子元件1的测值,进而实现提高测值针10便利性的目的。In summary, the measuring needle 10 provided in this embodiment can penetrate the packaging film 2 through the measuring portion 220 in the shape of a wedge, and directly measure the electronic component 1 on the material tape inside the packaging film 2, saving The cost and time of tearing off the packaging film 2 for inspection and finally packaging can improve the inspection efficiency of the electronic component 1 on the tape, and by setting the thickness of the connecting part 210 to 0.5mm-1mm, it can be used for multiple components of different sizes. Selecting an appropriate thickness of the connecting portion 210 for various electronic components 1 can facilitate the measurement of electronic components 1 of various sizes, thereby achieving the purpose of improving the convenience of the measuring needle 10 .
第二实施例second embodiment
本实施例中提供了一种测量机构(图未示),其能用于料带上电子元件1的测值,其采用了第一实施例中提供的测值针10。其中,该测量机构包括下针机构和测值针10,测值针10安装于下针机构上,以便于通过下针机构的移动带动测值针10对电子元件1进行测值。该测量机构能便于测量,并能提高测量精度和测量稳定性。This embodiment provides a measuring mechanism (not shown in the figure), which can be used to measure the value of the electronic component 1 on the material tape, which uses the measuring needle 10 provided in the first embodiment. Wherein, the measuring mechanism includes a lower needle mechanism and a measuring needle 10, and the measuring needle 10 is installed on the lower needle mechanism, so that the movement of the lower needle mechanism drives the measuring needle 10 to measure the value of the electronic component 1. The measuring mechanism can facilitate measurement, and can improve measurement accuracy and measurement stability.
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到的变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以所述权利要求的保护范围为准。The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. All should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.
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| CN111260819A (en) * | 2020-01-16 | 2020-06-09 | 深圳市蓝眼科技有限公司 | Electronic component detection method and apparatus, and computer-readable storage medium |
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| CN111182780B (en) * | 2020-01-16 | 2021-06-22 | 深圳市蓝眼博科科技有限公司 | Material belt splicing machine |
| CN111260819B (en) * | 2020-01-16 | 2021-06-25 | 深圳市蓝眼科技有限公司 | Electronic component detection method and apparatus, and computer-readable storage medium |
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Application publication date: 20191101 |