CN117191358A - Silicon optical chip testing device and testing method thereof - Google Patents
Silicon optical chip testing device and testing method thereof Download PDFInfo
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- CN117191358A CN117191358A CN202311221399.1A CN202311221399A CN117191358A CN 117191358 A CN117191358 A CN 117191358A CN 202311221399 A CN202311221399 A CN 202311221399A CN 117191358 A CN117191358 A CN 117191358A
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- 238000012360 testing method Methods 0.000 title claims abstract description 55
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 230000003287 optical effect Effects 0.000 title claims abstract description 27
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 27
- 239000010703 silicon Substances 0.000 title claims abstract description 27
- 239000000523 sample Substances 0.000 claims abstract description 69
- 239000013307 optical fiber Substances 0.000 claims abstract description 66
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 23
- 230000000007 visual effect Effects 0.000 claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 16
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 12
- 238000010926 purge Methods 0.000 claims abstract description 12
- 238000001514 detection method Methods 0.000 claims description 50
- 238000006073 displacement reaction Methods 0.000 claims description 50
- 238000004140 cleaning Methods 0.000 claims description 16
- 230000007246 mechanism Effects 0.000 claims description 9
- 230000000712 assembly Effects 0.000 claims description 7
- 238000000429 assembly Methods 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000010998 test method Methods 0.000 claims 2
- 238000012544 monitoring process Methods 0.000 abstract description 8
- 238000010168 coupling process Methods 0.000 description 16
- 230000008878 coupling Effects 0.000 description 15
- 238000005859 coupling reaction Methods 0.000 description 15
- 230000005494 condensation Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a silicon optical chip testing device and a testing method thereof, wherein the silicon optical chip testing device comprises a middle carrier assembly for bearing a chip to be detected, and a left side adjusting module, a right side adjusting module, an upper side visual assembly and a probe card adjusting assembly which are arranged on the periphery of the middle carrier assembly; the middle carrier assembly is provided with a chip carrier for bearing the chip to be detected, and the chip carrier is also connected with a water cooling device and a nitrogen purging device; the left side adjusting module and the right side adjusting module both comprise a positioning component which is arranged on the periphery of the middle carrier component in a driving way, the positioning component can move relative to the chip carrier, and the positioning component is provided with an optical fiber head which corresponds to the chip to be detected in a driving way. The invention discloses a silicon optical chip testing device and a testing method thereof, which improve the adjustment stability and accuracy of relative position relation by a mode of combining vision and pressure monitoring, and realize the adjustment of relative position by combining the vision and pressure monitoring with a multi-angle adjusting structure.
Description
Technical Field
The invention relates to the technical field of optical communication testing, in particular to a silicon optical chip testing device and a testing method thereof.
Background
The chip testing device in the prior art can not test the optical fiber coupling state, mainly relates to the following problems, firstly, the position relationship between the chip to be tested and the optical fiber chip is inconvenient to adjust to the coupling state, and particularly in the dynamic testing state, the adjustment difficulty of the relative position relationship is high. Secondly, in the adjustment process of the position relationship, the position relationship is inconvenient to monitor, even if the image acquisition is adopted to display the relationship of the relative positions, the detection is difficult to be carried out at multiple angles, and the fine position relationship is more difficult to directly display the mutual distance by using the images.
For example, patent: CN202010347749.9, optical fiber array fine tuning device, coupling device and method for photon chip test system; the disclosed optical fiber array fine adjustment device of the photon chip testing system comprises a first angle adjustment mechanism and a second angle adjustment mechanism which are vertically arranged, wherein the fine adjustment device can drive an optical fiber array arranged on the fine adjustment device to realize angle fine adjustment in two vertical directions; the optical fiber array coupling device of the photon chip testing system comprises a fine tuning device and a displacement table fixedly connected with the fine tuning device, and the displacement table can realize position adjustment of the probe card in three directions in space. In the prior art, although the optical fiber array coupling method based on the photonic chip test system can well align the optical fiber array to the grating interval of the chip end face, the problem that the adjustment of the position relationship is unstable and the adjustment of the position relationship is not convenient enough exists, and the problem of the follow-up test accuracy is also caused.
Therefore, there is an urgent need to develop a semi-automatic coupling platform type silicon optical chip testing apparatus capable of reducing the dependency on operators and improving the efficiency of chip coupling test.
Disclosure of Invention
The invention overcomes the defects of the prior art, and provides the silicon optical chip testing device and the testing method thereof, which improve the stability and accuracy of the adjustment of the relative position relationship in a mode of combining vision and pressure monitoring, and realize the adjustment of the relative position by combining the vision and pressure monitoring with a multi-angle adjusting structure.
In order to achieve the above purpose, the invention adopts the following technical scheme: the silicon optical chip testing device comprises a middle carrier assembly for bearing a chip to be tested, and a left side adjusting module, a right side adjusting module, an upper side viewing module and a probe card adjusting module which are arranged on the periphery of the middle carrier assembly; the middle carrier assembly is provided with a chip carrier for bearing the chip to be detected, and the chip carrier is also connected with a water cooling device and a nitrogen purging device; the left side adjusting module and the right side adjusting module both comprise a positioning component which is arranged on the periphery of the middle carrier component in a driving way, the positioning component can move relative to the chip carrier, and the positioning component is provided with an optical fiber head which corresponds to the chip to be detected in a driving way.
In a preferred scheme of the invention, a carrier adjusting seat is arranged on the middle carrier assembly, a water cooling device is arranged on the carrier adjusting seat in a driving way, a chip carrier is arranged on the water cooling device, a nitrogen purging device corresponding to the chip carrier is arranged on the periphery of the chip carrier, and a plurality of suction holes for adsorbing chips to be detected are also arranged on the chip carrier.
In a preferred scheme of the invention, the two sides of the chip carrier are also provided with an inclined detection mirror and a vertical comparison mirror.
In a preferred scheme of the invention, the upper side visual assembly comprises a visual adjustment seat arranged at the periphery of the middle carrier assembly, and a visual detection head corresponding to the middle carrier assembly is arranged on the visual adjustment seat in a driving manner.
In a preferred scheme of the invention, the left side adjusting module and the right side adjusting module both comprise optical fiber head adjusting seats arranged on the periphery of the middle carrier assembly, and the optical fiber head adjusting seats are provided with positioning assemblies and tail fiber clamping assemblies corresponding to the positioning assemblies in a driving manner.
In a preferred scheme of the invention, the optical fiber head adjusting seat is in driving connection with the positioning assembly through the elastic displacement seat, and the elastic displacement seat is also provided with a pressure sensor for detecting displacement distance.
In a preferred scheme of the invention, the elastic displacement seat comprises a pushing displacement seat which is arranged on the optical fiber head adjusting seat in a driving way, a displacement sliding block is arranged on the pushing displacement seat in a driving way, a mounting plate is arranged on the displacement sliding block in a driving way, a positioning assembly is arranged on the mounting plate, and the mounting plate and the pushing displacement seat are in driving connection through a driving mechanism.
In a preferred scheme of the invention, the probe card adjusting assembly comprises a probe card adjusting seat arranged at the periphery of the middle carrier assembly, wherein an installation seat is arranged on the probe card adjusting seat in a driving way, and a probe card is arranged on the installation seat; or/and, one side of the chip carrier is also provided with a probe tip cleaning component, the probe tip cleaning component comprises a cleaning groove arranged on one side of the chip carrier, and a frosted sheet layer is arranged in the cleaning groove.
In a preferred scheme of the invention, the testing method of the silicon optical chip testing device comprises the following steps:
placing a chip to be detected on a chip carrier of the intermediate carrier assembly; driving a probe card in the probe card adjusting assembly to move to a chip to be detected, and electrically contacting the probe card with a detection point of the chip to be detected; driving the optical fiber heads respectively arranged on the left side adjusting module and the right side adjusting module to relatively shift to the detection position of the chip to be detected; the relative positions of the optical fiber head and the chip to be detected are driven and adjusted through the left adjusting module and the right adjusting module; the position of the chip to be detected and the position relation of the optical fiber head acquire a position image through a visual detection head in the upper visual detection assembly.
In a preferred scheme of the invention, when the relative position of the optical fiber head and the chip to be detected is adjusted, the position state of the chip to be detected on the chip carrier is obtained through the cooperation of the upper side view component, the inclined detection mirror and the vertical comparison mirror, and the position of the chip to be detected on the chip carrier is calibrated;
driving the left side adjusting module and the right side adjusting module to respectively drive the optical fiber head to move to one side of the chip to be detected, and carrying out preliminary position adjustment through the cooperation of the upper side view component, the inclined detection mirror and the vertical comparison mirror;
the optical fiber heads on the left adjusting module and the right adjusting module are driven to move to abut against the corresponding positions of the detection positions of the chips to be detected, the pressure sensor detects the contact pressure, and the left adjusting module and the right adjusting module are driven to drive the optical fiber heads to slowly retreat until the pressure sensor cannot detect the pressure value, and the optical fiber heads are the optimal detection positions of the chips to be detected.
The invention solves the defects existing in the background technology:
according to the silicon optical chip testing device and the testing method thereof, the adjustment stability and accuracy of the relative position relation are improved in a mode of combining vision and pressure monitoring, and the vision and pressure monitoring is matched with a multi-angle adjustment structure to realize adjustment of the relative position.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a left side elevational schematic of a preferred embodiment of the present invention;
FIG. 2 is a right side elevational schematic of the preferred embodiment of the present invention;
FIG. 3 is a schematic top view of a preferred embodiment of the present invention;
FIG. 4 is a left side view of the left adjustment module in a preferred embodiment of the present invention;
FIG. 5 is a right side view of the left side adjustment module in accordance with the preferred embodiment of the present invention;
FIG. 6 is a schematic front view of the left side adjustment module in accordance with the preferred embodiment of the present invention;
FIG. 7 is a right side view of the right side adjustment module in accordance with the preferred embodiment of the present invention;
FIG. 8 is a left side view of the right side adjustment module in a preferred embodiment of the present invention;
FIG. 9 is a schematic front view of the right adjustment module in accordance with the preferred embodiment of the present invention;
FIG. 10 is a right side axial schematic view of the intermediate stage assembly in a preferred embodiment of the present invention;
FIG. 11 is a left side elevational schematic view of the intermediate stage assembly in a preferred embodiment of the invention;
FIG. 12 is a schematic elevational view of the intermediate stage assembly in a preferred embodiment of the present invention;
FIG. 13 is an isometric view of a probe card adjustment assembly in accordance with a preferred embodiment of the invention;
FIG. 14 is a schematic elevational view of the probe card adjustment assembly of the preferred embodiment of the present invention;
FIG. 15 is an isometric view of a top vision assembly in a preferred embodiment of the invention;
in the figure, a 1-operation table, a 2-middle stage assembly, a 21-stage adjusting seat, a 22-water cooling device, a 23-nitrogen purging device, a 24-chip stage, a 25-probe tip cleaning assembly, a 3-left side adjusting module, a 31-optical fiber head adjusting seat, a 311-X axis displacement seat, a 312-Y axis displacement seat, a 313-Z axis displacement seat, a 314-rotating seat I, a 315-swinging seat I, a 316-elastic displacement seat, a 317-swinging seat II, a 32-positioning assembly, a 34-pigtail clamping assembly, a 35-pressure sensor, a 4-right side adjusting module, a 5-upper side visual assembly, a 51-visual adjusting seat, a 52-visual detection head, a 53-inclined detection mirror, a 54-vertical comparison mirror, a 6-probe card adjusting assembly, a 61-probe card adjusting seat, a 62-installation seat, a 63-probe card, a 7-optical fiber head and an 8-chip to be detected.
Detailed Description
The invention will now be described in further detail with reference to the drawings and examples, which are simplified schematic illustrations of the basic structure of the invention, which are presented only by way of illustration, and thus show only the structures that are relevant to the invention.
Example 1
As shown in fig. 1-15, a silicon optical chip testing device includes a middle stage assembly 2 for receiving a chip 8 to be tested, and a left side adjusting module 3, a right side adjusting module 4, an upper side vision assembly 5, and a probe card adjusting assembly 6 disposed at the periphery of the middle stage assembly 2.
Specifically, as shown in fig. 10 to 12, the middle stage assembly 2 includes a stage adjustment seat 21 disposed on the console 1, and the stage adjustment seat 21 is a five-axis adjustment seat, and includes a planar displacement mechanism formed by combining an X-axis adjustment seat and a Y-axis adjustment seat, and two sets of swing adjustment seats and one set of rotation angle tables disposed on the planar displacement mechanism in a driving manner. The horizontal displacement of the plane displacement mechanism formed by the X-axis adjusting seat and the Y-axis adjusting seat is realized by two groups of swing adjusting seats, the longitudinal swing angles of the X-axis and the Y-axis directions on the horizontal plane are adjusted, and the rotation adjustment by taking the Z-axis as the rotation center is realized by one group of rotation angle tables. The water cooling device 22 is arranged on the carrier adjusting seat 21 in a driving mode, a chip carrier 24 for bearing the chip 8 to be detected is arranged on the water cooling device 22, a nitrogen purging device 23 corresponding to the chip carrier 24 is arranged on the periphery of the chip carrier 24, and a plurality of suction holes for adsorbing the chip 8 to be detected are also formed in the chip carrier 24. The chip carrier 24 is also provided with an inclined detection mirror 53 and a vertical reference mirror 54 on opposite sides thereof. That is, the tilt detection mirror 53 and the vertical reference mirror 54 are divided into two sides of the chip 8 to be detected that is received on the chip stage 24. The mirror surface of the inclined detection mirror 53 and the plane of the chip carrier 24 form an outer included angle of 40-85 degrees or an inner included angle of 140-95 degrees. The angle between the mirror surface of the tilt detector mirror 53 and the plane of the chip carrier 24 in the preferred embodiment of the present invention is 45 deg.. The mirror surface of the vertical reference mirror 54 is arranged vertically at 90 ° to the plane of the chip stage 24. Namely, an extended line between the inclined detecting mirror 53 and the vertical face of the vertical contrast mirror 54 forms an included angle of 45 degrees. The arrangement of the pair of inclined detection mirrors 53 and the vertical comparison mirror 54 is convenient for realizing multi-angle visual detection by matching with the visual detection head 52 in the peripheral upper visual component 5, and can acquire the position images of different sides between the optical fiber head 7 and the chip 8 to be detected on the chip carrier 24 under the same lens, and acquire the angles and the position forms of the relative positions of the optical fiber head 7 between different sides of the chip 8 to be detected. That is, the position of the chip 8 to be detected between the optical fiber head 7 or the chip carrier 24 and the side surface of the inclined detection mirror 53 may be obtained in the inclined detection mirror 53, or the position of the chip 8 to be detected between the optical fiber head 7 or the chip carrier 24 and the side surface of the vertical reference mirror 54 corresponding to the inclined detection mirror 53 and the side surface of the vertical reference mirror 54 may be obtained in the image of the inclined detection mirror 53.
Further, a chip carrier 24 is disposed on the intermediate carrier assembly 2, and the chip carrier 24 is further connected with a water cooling device 22 and a TEC temperature control element contacting with the chip carrier 24 for adjusting the temperature of the chip carrier 24. When the temperature control device is used, the temperature of the temperature control table of the chip carrier 24 is adjusted through the matching of the water cooling device 22 and the TEC chips in the TEC temperature control. The temperature of the temperature control table is adjusted by introducing condensed water or condensate into a condensation pipeline of the temperature control table, so that the state test of the chip 8 to be detected on the chip carrier 24 at different test temperatures in the range of-5 ℃ to 95 ℃ is satisfied. The semiconductor refrigerating sheet is adopted in the embodiment; one end of the chip carrier 24 which is contacted during refrigeration is a cold surface, and the other end is a hot surface, so that the hot surface is adhered by a water cooling plate and is matched with a water cooling machine to take away heat with high efficiency. However, the present invention is not limited thereto, and in other embodiments, the combination of the water cooling device 22 and the TEC temperature control member may be used to achieve temperature regulation of the temperature control stage of the chip stage 24.
Furthermore, in the low-temperature test environment, due to the water molecules in the air, the chip carrier 24 is made of a metal material which is convenient for temperature conduction, which easily causes condensation on the surface of the chip 8 to be tested. Therefore, the nitrogen purging device 23 is arranged on the periphery of the chip carrier 24, the nitrogen purging device 23 adopts a groove-shaped semi-surrounding structure arranged on the periphery of the chip carrier 24, and a plurality of air blowing holes are formed in one side close to the chip carrier 24, and the air blowing holes introduce nitrogen to purge the chip to be detected 8 carried by the chip carrier 24 and the upper part thereof, so that the chip to be detected 8 is ensured not to be inaccurate in detection result or damage the chip to be detected 8 due to the phenomenon of condensation caused by the change of detection temperature.
More specifically, a probe tip cleaning assembly 25 is further disposed on one side of the chip carrier 24, and the probe tip cleaning assembly 25 includes a cleaning groove disposed on one side of the chip carrier 24, and a frosted sheet layer is disposed in the cleaning groove. Sand paper can be selected as the sand polishing sheet layer; since the number of probes on the probe card 53 is large, the positions of the probe cards 63 need to be calibrated, pins of all the probe cards 63 are connected to a circuit through a switching control board, and levelness of the probe cards 63 is adjusted by the connection. The abrasive sheet layer is used to polish the tips of the probes of the probe card 63 to make the front ends of the probes consistent without affecting power and data transmission.
Specifically, as shown in fig. 1-9, the left side adjusting module 3 and the right side adjusting module 4 both include an optical fiber head adjusting seat 31 disposed at the periphery of the middle stage assembly 2, the optical fiber head adjusting seat 31 adopts six axis adjusting seats, including an X axis displacement seat 311 disposed on the console 1, a Y axis displacement seat 312 disposed on the X axis displacement seat 311 is driven to cooperate with the Y axis displacement seat 312 to implement plane displacement adjustment, a Z axis displacement seat 313 is driven to be disposed on the Y axis displacement seat 312, a rotary seat first 314 is driven to be disposed on the Z axis displacement seat 313, a swing seat first 315 is driven to be disposed on the rotary seat first 314, a swing seat second 317 is driven to be disposed on the swing seat first 315, and swing center axes of the rotary seat first 314, the swing seat first 315 and the swing seat second 317 are mutually perpendicular. The first swing seat 315 of the optical fiber head adjusting seat 31 is provided with a mounting block in a driving manner, and the mounting block is provided with a positioning component 32 and a tail fiber clamping component 34 corresponding to the positioning component 32. And the optical fiber head adjusting seat 31 is in driving connection with the positioning component 32 through an elastic displacement seat 316, and a pressure sensor 35 for detecting displacement distance is further arranged on the elastic displacement seat 316. Further, the elastic displacement seat 316 includes a pushing displacement seat driven on the optical fiber head adjusting seat 31, a displacement sliding block is driven on the pushing displacement seat, a mounting plate is driven on the displacement sliding block, and a positioning component 32 is arranged on the mounting plate. The mounting plate is connected with the pushing displacement seat through driving of the driving mechanism, and the displacement sliding block is driven to displace on the pushing displacement seat relative to the chip 8 to be detected through the driving mechanism.
Further, as shown in fig. 1-9, the tail fiber clamping assemblies 34 of the left side adjusting module 3 and the right side adjusting module 4 comprise fixing seats and turning clamping blocks pivotally connected to the fixing seats, and the turning clamping blocks are opened and closed relative to the fixing seats to realize limiting clamping of the tail optical fibers of the optical fiber heads 7 and are used for positioning the optical fibers.
Specifically, the upper visual component 5 includes a visual adjustment seat 51 disposed at the periphery of the middle stage component 2, and the visual adjustment seat 51 is a combined adjustment seat of an X-axis displacement seat, a Y-axis displacement seat, and a Z-axis displacement seat in the prior art. The vision adjustment base 51 is provided with a vision detection head 52 corresponding to the intermediate stage assembly 2.
Specifically, as shown in fig. 13 and 14, the probe card adjusting assembly 6 includes a probe card adjusting seat 61 provided on the periphery of the intermediate stage assembly 2, a mounting seat 62 is provided on the probe card adjusting seat 61 in a driving manner, and a probe card 63 is provided on the mounting seat 62. The arrangement of the probe card 63 corresponds to the arrangement of the contact points of the chip 8 to be detected. Further, the probe card adjusting seat 61 comprises a probe lifting seat arranged at the periphery of the chip carrier 24, a probe lifting table is arranged on the probe lifting seat in a driving manner, a probe turntable is arranged on the probe lifting table, and a probe card 63 is arranged on the probe turntable in a driving manner. The probe card 63 in this embodiment is arranged in a three-sided surrounding structure as shown in fig. 13. The probe card adjusting assembly 6 cooperates with the frosted sheet layer arranged in the cleaning groove of the probe tip cleaning assembly 25 to clean the end part of the probe card 63, and when in use, the probe lifting seat of the probe card adjusting seat 61 drives the probe card 63 to longitudinally lift and shake the probe of the probe card 63 to shake on the frosted sheet layer arranged in the cleaning groove to contact and rub off pollutants at the end part, so that the electrical contact performance of the probe card 63 is improved.
Example two
On the basis of the first embodiment, as shown in fig. 1 to 15, a testing method of a silicon optical chip testing device is adopted, and the testing method implemented by the silicon optical chip testing device comprises the following steps:
placing the chip 8 to be inspected on the chip stage 24 of the intermediate stage assembly 2; the probe card 63 in the probe card adjusting assembly 6 is driven to move to the position of the chip 8 to be detected, and the probe card 63 is driven to be in electrical contact with the detection point of the chip 8 to be detected.
The optical fiber heads 7 respectively arranged on the left adjusting module 3 and the right adjusting module 4 are driven to relatively move to the detection position of the chip 8 to be detected. Specifically, the relative positions of the optical fiber head 7 and the chip 8 to be detected are driven and adjusted through the left adjusting module 3 and the right adjusting module 4. The position of the chip 8 to be detected and the positional relationship of the optical fiber head 7 acquire a positional image through the vision detection head 52 in the upper vision module 5.
The more specific position adjustment method comprises the following steps:
when the relative position of the optical fiber head 7 and the chip 8 to be detected is adjusted, the position state of the chip 8 to be detected on the chip carrier 24 is obtained through the cooperation of the upper visual component 5, the inclined detection mirror 53 and the vertical contrast mirror 54, and the position of the chip 8 to be detected on the chip carrier 24 is calibrated.
The left side adjusting module 3 and the right side adjusting module 4 are driven to drive the optical fiber head 7 to move to one side of the chip 8 to be detected, and preliminary position adjustment is carried out through the cooperation of the upper side view component 5, the inclined detection mirror 53 and the vertical comparison mirror 54.
And then the optical fiber heads 7 on the left adjusting module 3 and the right adjusting module 4 are driven to move to abut against the corresponding positions of the detection positions of the chips 8 to be detected, the pressure sensor 35 detects the contact pressure, and then the left adjusting module 3 and the right adjusting module 4 are driven to drive the optical fiber heads 7 to slowly retreat until the pressure value of the pressure sensor 35 disappears, and the optimal detection positions of the chips 8 to be detected are obtained at the moment.
Working principle:
as shown in fig. 1 to 15, according to the silicon optical chip testing device and the testing method thereof disclosed by the invention, the stability and accuracy of the adjustment of the relative position relationship are improved in a mode of combining vision and pressure monitoring, and the vision and pressure monitoring are matched with a multi-angle adjusting structure to realize the adjustment of the relative position.
When in use, the utility model is characterized in that: placing the chip 8 to be inspected on the chip stage 24 of the intermediate stage assembly 2; the probe card 63 in the probe card adjusting assembly 6 is driven to move to the position of the chip 8 to be detected, and the probe card 63 is driven to be in electrical contact with the detection point of the chip 8 to be detected. The position of the chip 8 to be detected and the positional relationship of the optical fiber head 7 acquire a positional image through the vision detection head 52 in the upper vision module 5.
The optical fiber heads 7 respectively arranged on the left adjusting module 3 and the right adjusting module 4 are driven to relatively move to the detection position of the chip 8 to be detected. The relative positions of the optical fiber head 7 and the chip 8 to be detected are driven and adjusted through the left adjusting module 3 and the right adjusting module 4.
The upper vision component 5, the inclined detection mirror 53 and the vertical comparison mirror 54 are matched to obtain the position state of the chip 8 to be detected on the chip carrier 24, and the position of the chip 8 to be detected on the chip carrier 24 is calibrated. The left side adjusting module 3 and the right side adjusting module 4 are driven to drive the optical fiber head 7 to move to one side of the chip 8 to be detected, and preliminary position adjustment is carried out through the cooperation of the upper side view component 5, the inclined detection mirror 53 and the vertical comparison mirror 54. And then the optical fiber heads 7 on the left adjusting module 3 and the right adjusting module 4 are driven to move to abut against the corresponding positions of the detection positions of the chips 8 to be detected, the pressure sensor 35 detects the contact pressure, and then the left adjusting module 3 and the right adjusting module 4 are driven to drive the optical fiber heads 7 to slowly retreat until the pressure value of the pressure sensor 35 disappears, and the optimal detection positions of the chips 8 to be detected are obtained at the moment.
During testing, the water cooling device 22 is used for adjusting the testing temperature of the chip 8 to be tested on the chip carrier 24, the nitrogen purging device 23 is used for introducing nitrogen to purge the chip 8 to be tested received by the chip carrier 24 and the upper part of the chip carrier 24, and the silicon optical chip coupling test is performed on the chip 8 to be tested.
Specifically, the chip 8 to be detected is placed on the chip carrier 24 and correction of the position and the deflection angle is completed; the optoelectronic chip is fixed, and the probe card 63 arranged in a three-sided surrounding manner is loaded and forms good contact. The chip 8 to be detected is a photoelectric chip, and feedback current is provided for supplying power to the chip 8 to be detected when active coupling is adopted, and the laser emits light. The optical fiber head 7 of the left adjusting module 3 enters a coupling adjusting state, and the coupling alignment of 8 channels is completed by taking photocurrent of 1-4 channels as feedback; and (3) coupling reference standards, such as maximum value allowed by four-channel difference, reasonable maximum current and minimum current of each channel, and alarming when the maximum current and the minimum current are out of range. The optical fiber head 7 of the right adjusting module 4 enters a coupling adjusting state, and 2-channel coupling alignment is completed by taking photocurrent of 1-2 channels as feedback; and (3) coupling reference standards, such as maximum value allowed by four-channel difference, reasonable maximum current and minimum current of each channel, and alarming when the maximum current and the minimum current are out of range. When the optical fiber heads 7 of the left adjusting module 3 and the right adjusting module 4 reach the optimal coupling positions, the optical fiber heads 7 of the left adjusting module 3 and the right adjusting module 4 are kept stable in position and matched with a peripheral testing system to perform performance test on the photoelectric chip.
From the foregoing, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (10)
1. A silicon optical chip testing device is characterized in that: the device comprises a middle carrier assembly (2) for bearing a chip (8) to be detected, and a left side adjusting module (3), a right side adjusting module (4), an upper side viewing module (5) and a probe card adjusting module (6) which are arranged on the periphery of the middle carrier assembly (2);
a chip carrier (24) for bearing the chip (8) to be detected is arranged on the middle carrier assembly (2), and the chip carrier (24) is also connected with a water cooling device (22) and a nitrogen purging device (23);
the left side adjusting module (3) and the right side adjusting module (4) both comprise a positioning component (32) which is arranged on the periphery of the middle carrying platform component (2) in a driving mode, the positioning component (32) can move relative to the chip carrying platform (24), and an optical fiber head (7) corresponding to the chip (8) to be detected is arranged on the positioning component (32) in a driving mode.
2. The silicon optical chip testing device according to claim 1, wherein: the middle carrier assembly (2) is provided with a carrier adjusting seat (21), the carrier adjusting seat (21) is provided with a water cooling device (22) in a driving mode, the water cooling device (22) is provided with a chip carrier (24), the periphery of the chip carrier (24) is provided with a nitrogen purging device (23) corresponding to the chip carrier (24), and the chip carrier (24) is further provided with a plurality of suction holes for adsorbing the chip (8) to be detected.
3. The silicon optical chip testing device according to claim 2, wherein: and the two sides of the chip carrier (24) are also provided with an inclined detection mirror (53) and a vertical comparison mirror (54) relatively.
4. A silicon photonics chip testing apparatus in accordance with claim 3 in which: the upper visual assembly (5) comprises a visual adjustment seat (51) arranged on the periphery of the middle carrier assembly (2), and a visual detection head (52) corresponding to the middle carrier assembly (2) is arranged on the visual adjustment seat (51) in a driving mode.
5. The silicon optical chip testing device according to claim 4, wherein: the optical fiber head adjusting device is characterized in that the left adjusting module (3) and the right adjusting module (4) comprise optical fiber head adjusting seats (31) arranged on the periphery of the middle carrying platform assembly (2), and the optical fiber head adjusting seats (31) are provided with positioning assemblies (32) and tail fiber clamping assemblies (34) corresponding to the positioning assemblies (32) in a driving mode.
6. The silicon optical chip testing device according to claim 5, wherein: the optical fiber head adjusting seat (31) is connected with the positioning assembly (32) through an elastic displacement seat (316) in a driving mode, and a pressure sensor (35) for detecting displacement distance is further arranged on the elastic displacement seat (316).
7. The silicon optical chip testing device according to claim 6, wherein: the elastic displacement seat (316) comprises a pushing displacement seat which is arranged on the optical fiber head adjusting seat (31) in a driving mode, a displacement sliding block is arranged on the pushing displacement seat in a driving mode, a mounting plate is arranged on the displacement sliding block in a driving mode, the positioning assembly (32) is arranged on the mounting plate, and the mounting plate is connected with the pushing displacement seat in a driving mode through a driving mechanism.
8. The silicon optical chip testing device according to claim 1, wherein: the probe card adjusting assembly (6) comprises a probe card adjusting seat (61) arranged on the periphery of the middle carrier assembly (2), an installation seat (62) is arranged on the probe card adjusting seat (61) in a driving mode, and a probe card (63) is arranged on the installation seat (62);
or/and, one side of the chip carrier (24) is further provided with a probe tip cleaning assembly (25), the probe tip cleaning assembly (25) comprises a cleaning groove arranged on one side of the chip carrier (24), and a frosted sheet layer is arranged in the cleaning groove.
9. A test method of a silicon optical chip test device, characterized in that the test method implemented by the silicon optical chip test device according to any one of claims 1 to 8 comprises the steps of:
placing a chip (8) to be detected on a chip carrier (24) of the intermediate carrier assembly (2); driving a probe card (63) in the probe card adjusting assembly (6) to move to a position of a chip (8) to be detected, and electrically contacting the probe card (63) with a detection point of the chip (8) to be detected;
driving optical fiber heads (7) respectively arranged on the left side adjusting module (3) and the right side adjusting module (4) to relatively shift to detection positions of the chip (8) to be detected;
the relative positions of the optical fiber head (7) and the chip (8) to be detected are driven and adjusted through the left adjusting module (3) and the right adjusting module (4);
the position of the chip (8) to be detected and the position relation of the optical fiber head (7) are used for acquiring a position image through a visual detection head (52) in the upper visual detection assembly (5).
10. The method for testing a silicon optical chip testing device according to claim 9, wherein: when the relative position of the optical fiber head (7) and the chip (8) to be detected is adjusted, the position state of the chip (8) to be detected on the chip carrier (24) is obtained through the cooperation of the upper side view component (5), the inclined detection mirror (53) and the vertical comparison mirror (54), and the position of the chip (8) to be detected on the chip carrier (24) is calibrated;
the left side adjusting module (3) and the right side adjusting module (4) are driven to respectively drive the optical fiber head (7) to move to one side of the chip (8) to be detected, and preliminary position adjustment is carried out through the cooperation of the upper side view component (5), the inclined detection mirror (53) and the vertical comparison mirror (54);
the optical fiber heads (7) on the left adjusting module (3) and the right adjusting module (4) are driven to move to abut against the corresponding positions of the detection positions of the chips (8) to be detected, the pressure sensor (35) detects the contact pressure, and the optical fiber heads (7) are driven to slowly retreat by the left adjusting module (3) and the right adjusting module (4) until the pressure sensor (35) cannot detect the pressure value, so that the optimal detection positions of the chips (8) to be detected are obtained.
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