CN112285846A

CN112285846A - Optical transceiving submodule and optical module

Info

Publication number: CN112285846A
Application number: CN201910662464.1A
Authority: CN
Inventors: 刘维伟; 吴涛; 唐永正; 邵乾
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2019-07-22
Filing date: 2019-07-22
Publication date: 2021-01-29
Anticipated expiration: 2039-07-22
Also published as: CN112285846B

Abstract

The application provides an optical transceiving submodule and an optical module, which comprise a round square tube body, a double-chip optical transmitter, a double-chip optical receiver and an optical component; the round and square tube body is provided with a first tube orifice and a second tube orifice, the double-chip optical transmitter is embedded into the first tube orifice, and the double-chip optical receiver is embedded into the second tube orifice; the double-chip optical transmitter is a laser transmitter with double LD chips, and the double-chip optical receiver is a laser receiver with double PD chips; the optical assembly is arranged in the inner cavity of the round and square tube body and comprises an optical multiplexer, a first filtering reflector and a second filtering reflector; two beams of laser emitted by the double-chip light emitter are combined into one beam of laser through the optical multiplexer, and then the laser is emitted through the first filtering reflector and the second filtering reflector in sequence; the light beams received by the double-chip light receiver are respectively reflected to the double-chip light receiver through the first filtering reflector and the second filtering reflector. The optical module is beneficial to realizing the emission of the double-optical-path optical signals and the receiving of the double-optical-path optical signals.

Description

Optical transceiving submodule and optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical transceiving submodule and an optical module.

Background

A Passive Optical Network (PON) is a system for providing network access in the last mile. Among other things, PON transceivers may employ a bidirectional optical sub-assembly (BOSA) to optically couple outgoing light emitted from a transmitter with a single fiber and to couple incoming light from the single fiber to a receiver. BOSA is made by packaging separate Transmitter Optical Subassembly (TOSA) packages and Receiver Optical Subassembly (ROSA) packages together in a metal housing. Conventional BOSA is mostly a combination of TOSA and ROSA into a single Transistor Outline (TO) package in an attempt TO reduce the outline factor and cost.

At present, in order TO fully utilize the advantages and technical characteristics of the TO package, further reduce the cost, improve the competitive advantage and development potential of the BOSA, and realize the high integration of the CPON, the BOSA gradually appears in a dual-optical-path structural form. To implement the BOSA dual optical path structure, another two TOSAs and two ROSAs are usually used. However, in a specific application, each TOSA and ROSA requires one flexible circuit board, so that at least 4 flexible circuit boards are required for the installation and use of the TOSA in the two optical path structure forms, which increases the assembly difficulty.

Disclosure of Invention

The application provides a light transceiving submodule and an optical module, which are used for realizing the purpose that the optical module emits light signals in double light paths and receives the light signals in the double light paths.

In a first aspect, the present application provides an optical transceiver sub-module, which includes a round-square tube, a dual-chip optical transmitter, a dual-chip optical receiver, and an optical assembly; wherein:

the round and square tube body is provided with a first tube orifice and a second tube orifice, the double-chip optical transmitter is embedded into the first tube orifice, and the double-chip optical receiver is embedded into the second tube orifice;

the double-chip optical transmitter is a Laser transmitter with a double LD (Laser Diode) chip, and the double-chip optical receiver is a Laser receiver with a double PD (Photo-Diode) chip;

the optical assembly is arranged in the inner cavity of the round and square tube body and comprises a wave combiner, a first filtering reflector and a second filtering reflector which are sequentially arranged;

two beams of laser emitted by the double-chip light emitter are combined into one beam of laser through the optical multiplexer, and then are emitted through the first filter reflector and the second filter reflector in sequence;

one of the light beams received by the dual-chip light receiver penetrates through the second filtering reflector and then is reflected to the dual-chip light receiver through the first filtering reflector, and the other light beam is reflected to the dual-chip light receiver through the second filtering reflector.

In a second aspect, the present application provides an optical module comprising any one of the above optical sub-assemblies.

In the light transceiver secondary module and optical module that this application provided, light transceiver secondary module includes circle square body, two chip phototransmitters and two chip photoreceivers, and two chip phototransmitters and two chip photoreceivers inlay on the circle square body through the first mouth of pipe and the second mouth of pipe that set up on the circle square body. The double-chip light emitter is a laser emitter with double LD chips, namely, one emitter can emit two paths of laser with different wavelengths; the double-chip optical receiver is a laser receiver with double PD chips, namely, one receiver can receive two paths of laser with different wavelengths. In the application, a double-chip optical transmitter and a double-chip optical receiver are matched with an optical component arranged in a round tube, two beams of laser emitted by the double-chip optical transmitter are combined into a beam of laser through an optical combiner, and then the beam of laser passes through a first filtering reflector and a second filtering reflector in sequence to emit light to a light receiving and transmitting secondary module; one of the light beams received by the double-chip light receiver passes through the second filtering reflector and then is reflected to the double-chip light receiver through the first filtering reflector, and the other light beam is reflected to the double-chip light receiver through the second filtering reflector. The dual-optical-path optical signal transmitting and receiving device realizes the transmission of dual-optical-path optical signals through the dual-chip optical transmitter and the receiving of the dual-optical-path optical signals through the dual-chip optical receiver, namely realizes the transmission and the receiving of the dual-optical-path optical signals of the optical transceiving sub-module through one transmitter and one receiver, and further realizes the transmission of the dual-optical-path optical signals and the receiving of the dual-optical-path optical signals of the optical module.

Compared with the prior art in which the two transmitters and the two receivers are used for transmitting and receiving the optical signals of the two optical paths, the number of the flexible circuit boards used for installing the transmitters and the receivers is reduced, and the problem that the assembly difficulty is increased due to the fact that the number of the flexible circuit boards is large in the BOSA module multi-optical-path structural form in the prior art is solved. Meanwhile, the occupied space for installing the transmitter and the receiver is saved, the space utilization rate of BOSA is improved, and the high integration of CPON is realized conveniently.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present application;

fig. 4 is an exploded structural schematic diagram of an optical module provided in an embodiment of the present application;

fig. 5 is a perspective view of an optical transceiver sub-assembly provided in an embodiment of the present application;

fig. 6 is an exploded view of an optical sub-transceiver module provided in an embodiment of the present application;

fig. 7 is a front view of an optical transceiver sub-assembly provided in an embodiment of the present application;

fig. 8 is a cross-sectional view of an optical transceiver sub-assembly provided in an embodiment of the present application;

fig. 9 is a schematic structural view of an optical transceiver sub-module provided in this embodiment of the present application with a round and square tube removed;

FIG. 10 is an optical diagram of an optical ROSA provided in an embodiment of the present application;

FIG. 11 is an exploded view of a dual chip light emitter provided in an embodiment of the present application;

FIG. 12 is an exploded internal view of a dual chip light emitter provided in an embodiment of the present application;

FIG. 13 is a schematic partial structure view of FIG. 12;

FIG. 14 is a first schematic diagram illustrating a structure of a dual-chip light emitter inner stem provided in an embodiment of the present application;

FIG. 15 is a second schematic structural diagram of an inner stem of a dual-chip light emitter provided in an embodiment of the present application;

FIG. 16 is a first schematic diagram illustrating a heat sink structure in a dual-chip light emitter provided in an embodiment of the present application;

fig. 17 is a schematic structural diagram ii of a heat sink in a dual-chip light emitter provided in an embodiment of the present application;

fig. 18 is a schematic structural diagram of a dual-chip optical receiver provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

One of the core elements of fiber optic communications is the conversion of optical to electrical signals. The optical fiber communication uses the optical signal carrying information to transmit in the optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of the light in the optical fiber. The information processing devices such as computers use electrical signals, which require the interconversion between electrical signals and optical signals during the signal transmission process.

The optical module realizes the photoelectric conversion function in the technical field of optical fiber communication, and the interconversion of optical signals and electric signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on a circuit board, main electrical connections comprise power supply, I2C signals, data signal transmission, grounding and the like, the electrical connection mode realized by the golden finger becomes a standard mode of the optical module industry, and on the basis, the circuit board is a necessary technical characteristic in most optical modules.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber is connected with the far-end server, one end of the network cable is connected with the local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber and the network cable; and the connection between the optical fiber and the network cable is completed by an optical network unit with an optical module.

An optical port of the optical module 200 is connected with the optical fiber 101 and establishes bidirectional optical signal connection with the optical fiber; the electrical port of the optical module 200 is accessed into the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the connection between the optical fiber and the optical network unit; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and information is not changed in the photoelectric conversion process.

The optical network unit is provided with an optical module interface 102, which is used for accessing an optical module and establishing bidirectional electric signal connection with the optical module; the optical network unit is provided with a network cable interface 104 for accessing a network cable and establishing bidirectional electric signal connection with the network cable; the optical module is connected with the network cable through the optical network unit, specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit is used as an upper computer of the optical module to monitor the work of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network unit and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into an optical network unit, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected with the optical fiber 101.

The cage 106 is positioned on the circuit board, enclosing the electrical connectors on the circuit board in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module 200 according to an embodiment of the present disclosure, and fig. 4 is an exploded structural diagram of the optical module 200 according to an embodiment of the present disclosure. As shown in fig. 3 and 4, the optical module 200 provided in the embodiment of the present application includes an optical transceiver sub-assembly 300, and further includes an upper housing 201, a lower housing 202, an unlocking handle 203, and a circuit board 204.

The upper shell 201 and the lower shell 202 form a package cavity with two openings, specifically, two ends of the package cavity are opened (205, 206) in the same direction, or two openings in different directions are opened; one of the openings is an electrical port 205 for inserting into an upper computer such as an optical network unit, the other opening is an optical port 206 for accessing an external optical fiber to connect an internal optical fiber, and the photoelectric devices such as the circuit board 204 are positioned in the packaging cavity.

The upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realizing electromagnetic shielding and heat dissipation; the assembly mode that upper housing 201 and lower housing 202 combine is adopted, be convenient for install devices such as circuit board 204 in the casing, generally can not make the casing of optical module into an organic whole structure, like this when devices such as assembly circuit board, locating component, heat dissipation and electromagnetic shield structure can't install, also do not do benefit to production automation yet.

The unlocking handle 203 is positioned on the outer wall of the packaging cavity/lower shell 202, and the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; when the optical module is inserted into the host computer, the optical module is fixed in the cage of the host computer by the unlocking handle 203, and the optical module can be pulled out from the cage of the host computer by pulling the unlocking handle 203 to release the engagement relation between the optical module and the host computer.

The optical transceiver sub-module 300 provided in the embodiment of the present application is configured to emit two laser beams with different wavelengths and receive two laser beams with different wavelengths, so as to implement dual optical path emission and dual optical path receiving of optical signals by the optical module 200.

Fig. 5 is a perspective view of an optical sub-transceiver module 300 according to an embodiment of the present disclosure, and fig. 6 is an exploded view of the optical sub-transceiver module 300 according to the embodiment of the present disclosure. As shown in fig. 5 and 6, the optical sub-transceiver module 300 provided by the embodiment of the present application includes a circular-square tube 400, a dual-chip optical transmitter 500, a dual-chip optical receiver 600, and an optical assembly 800.

As shown in fig. 6, the round and square tube 400 is used to carry and fix the dual-chip optical transmitter 500, the dual-chip optical receiver 600 and the optical assembly 800. In the embodiment of the present application, the round and square tube 400 is generally made of a metal material, which is beneficial to implementing electromagnetic shielding and heat dissipation. The round and square tube 400 is provided with a first nozzle 401 and a second nozzle 402. Generally, the first nozzle 401 and the second nozzle 402 are respectively disposed on adjacent sidewalls of the round and square tube body 400. Preferably, the first nozzle 401 is disposed on a side wall of the round and square tube 400 in the length direction, and the second nozzle 402 is disposed on a side wall of the round and square tube 400 in the width direction.

The dual-chip light emitter 500 is embedded into the first pipe orifice 401, and the dual-chip light emitter 500 is in heat conduction contact with the round and square pipe body 400 through the first pipe orifice 401; the dual-chip optical receiver 600 is embedded in the second pipe 402, and is in heat-conducting contact with the round-square pipe 400 through the second pipe 402. Optionally, the dual-chip optical transmitter 500 and the dual-chip optical receiver 600 are directly press-fitted into the circular-square tube 400, and the circular-square tube 400 is in contact with the dual-chip optical transmitter 500 and the dual-chip optical receiver 600 directly or through a heat conducting medium. So the round square tube 400 can be used for the heat dissipation of the dual-chip optical transmitter 500 and the dual-chip optical receiver 600, and the heat dissipation effect of the dual-chip optical transmitter 500 and the dual-chip optical receiver 600 is ensured.

In the embodiment of the present application, the dual-chip optical transmitter 500 is a laser transmitter with dual LD chips, specifically a Tx TOCAN (coaxial package transmitter); the dual-chip optical receiver 600 is a laser receiver with dual PD chips, specifically, an Rx TOCAN (coaxial package receiver). Therefore, the dual-chip optical transmitter 500 is configured to transmit two laser beams with different wavelengths, and the dual-chip optical receiver 600 is configured to receive two laser beams with different wavelengths, that is, the dual-chip optical transmitter 500 and the dual-chip optical receiver 600 accommodate optical signals of two optical paths in a single TOCAN (coaxial package). However, the conventional coaxial TO package method can only accommodate one LD chip, and when the TOSA and ROSA packaged by the conventional coaxial TO package method are used TO implement a multiple optical path structure of the BOSA module, the problem of convergence of light beams generated by the TOSA and the ROSA is generally solved. The embodiment of the application adopts the double-chip optical transmitter 500 and the double-chip optical receiver 600, and the optical components are arranged outside the TO head, so that the optical path arrangement and combination can be flexibly and conveniently carried out, and the optical coupling is realized.

As shown in fig. 5 and 6, in the embodiment of the present application, an optical assembly 800 is disposed in the inner cavity of the circular-square tube 400, and the optical assembly 800 is used for adjusting the laser light emitted from the dual-chip optical transmitter 500 and adjusting the laser light incident on the dual-chip/chip optical receiver 600. In the embodiment of the present application, the optical assembly 800 generally includes optical lenses (such as a light collimating lens and a light coupling lens), a multiplexer/demultiplexer, and the like, and is used for collimating and adjusting the optical path, optimizing the coupling state of the optical fiber, and improving the coupling efficiency.

Fig. 7 is a front view of an optical sub-transceiver module 300 according to an embodiment of the present disclosure, fig. 8 is a cross-sectional view of the optical sub-transceiver module 300 according to the embodiment of the present disclosure, and fig. 9 is a schematic structural view of the optical sub-transceiver module 300 according to the embodiment of the present disclosure with a round-square tube removed. As shown in fig. 7, 8 and 9, in the embodiment of the present application, the optical assembly 800 includes an optical combiner 801, a first filtering mirror 803 and a second filtering mirror 804, which are sequentially arranged, and the optical combiner 801, the first filtering mirror 803 and the second filtering mirror 804 are used for adjusting the light beam emitted by the dual-chip optical transmitter 500 and the light beam received by the dual-chip optical receiver 600. Specifically, the method comprises the following steps: when a laser is emitted. The double-chip light emitter 500 emits two beams of laser through the LD chip thereon, the two beams of laser enter the light combiner 801 from different positions of the light combiner 801, enter the light combiner 801 under the action of the light combiner 801 to be combined into one beam of laser, and are emitted from the same position of the light combiner 801, and the combined beam of laser sequentially passes through the first filtering reflector 803 and the second filtering reflector 804 to be emitted out of the light transceiving submodule; when receiving laser light, the light transmitted into the optical transceiver sub-module is a beam of light, and the light received by the optical receiver sub-module is two beams of light, wherein one beam of laser light is incident on the surface of the first filter reflector 803 after passing through the second filter reflector 804, and is reflected to the dual-chip optical receiver 600 through the first filter reflector 803, and the other beam of laser light is directly reflected to the dual-chip optical receiver 600 through the second filter reflector 804, and the PD chip in the dual-chip optical receiver 600 correspondingly receives the laser beams reflected by the first filter reflector 803 and the second filter reflector 804.

In the embodiment of the application, the optical multiplexer 801 adopts a transmission type optical multiplexer, and the light paths of the two laser beams are insensitive to the incident angle of the optical multiplexer, so that the reliability of the device is improved. The first 803 and second 804 filter mirrors have selective reflectivity for the wavelength of the light beam for reflecting light of a particular wavelength. If the two PD chips of the dual-chip optical receiver 600 are respectively used for receiving laser light with wavelengths of 1310nm and 1270nm, the first filter mirror 803 is used for reflecting laser light with a wavelength of 1310nm, and the second filter mirror 804 is used for reflecting laser light with a wavelength of 1270 nm. When the optical sub-transceiver module 300 receives laser light with wavelengths of 1310nm and 1270nm, the laser light with wavelengths of 1310nm and 1270nm is transmitted to the inside of the optical sub-transceiver module through an optical fiber, the laser light with wavelengths of 1310nm passes through the second filtering reflector 804 and then is reflected to the PD chip receiving the laser light with wavelengths of 1310nm through the first filtering reflector 803, and the laser light with wavelengths of 1270nm is reflected to the PD chip receiving the laser light with wavelengths of 1270nm through the second filtering reflector 804.

In the embodiment of the present application, the optical transceiver sub-module is preferably a fiber adapter to connect optical fibers, that is, the fiber adapter 700 is embedded on the round-square tube 400 and is used for connecting optical fibers with the optical transceiver sub-module. Specifically, the round and square tube 400 is provided with a third tube opening 403 into which the optical fiber adapter 700 is inserted, the optical fiber adapter 700 is inserted into the third tube opening 403, the dual-chip optical transmitter 500 and the dual-chip optical receiver 600 respectively establish optical connection with the optical fiber adapter 700, light emitted and received in the optical transceiver sub-module are transmitted through the same optical fiber in the optical fiber adapter, that is, the same optical fiber in the optical fiber adapter is a transmission channel for light entering and exiting from the optical transceiver sub-module, and the optical transceiver sub-module realizes a single-fiber bidirectional optical transmission mode. As shown in fig. 6. The optical assembly 800 is disposed on the optical path of the dual-chip optical transmitter 500 and the dual-chip optical receiver 600 in optical communication with the fiber optic adapter 700.

In the present embodiment, the third nozzle 403 is disposed on the sidewall of the round tube 400. Preferably, the third nozzle 403 is disposed on the side wall of the round and square tube 400 in the length direction, and the third nozzle 403 is coaxial with the first nozzle 401, as shown in fig. 6.

In the embodiment of the present application, the first filter mirror 803 and the second filter mirror 804 are preferably 45 ° filter mirrors, and when the filter mirror is installed for use, the first filter mirror 803 and the second filter mirror 804 are installed along a direction of 45 ° or nearly 45 ° with the synthetic laser light of the optical combiner 801. Preferably, the first filter mirror 803 and the second filter mirror 804 are respectively located on the axis of the chip of the dual-chip optical receiver 600.

Further, as shown in fig. 7-9, in the embodiment of the present application, the optical assembly 800 further includes an optical isolator 802 and an optical path adjusting device 805. The optical isolator 802 is disposed between the optical multiplexer 801 and the first filter mirror 803, and a laser beam synthesized by the optical multiplexer 801 passes through the optical isolator 802 and enters the first filter mirror 803. The optical isolator 802 allows the laser light to pass through in one direction, i.e., in the direction from the dual-chip optical transmitter 500 to the fiber adapter 700, and prevents some laser light in the opposite direction from passing through, e.g., the laser light reflected by the first filter mirror 803, which helps to ensure the quality of the light emission. The optical path adjusting device 805 is disposed on the reflective side of the reflective sheet of the second filter reflector 804, and the optical path adjusting device 805 adjusts the laser beam emitted or incident to the optical transceiver sub-module 300. The optical path adjusting device 805 deflects light up and down by refraction, adjusts the transmitted light beam to an optimal position, and adjusts the laser beam passing through the optical isolator 802, the first filter mirror 803, and the second filter mirror 804 to be coaxial with the fiber adapter 700. The optical path adjusting device 805 is preferably an optical path adjusting glass.

Specifically, as shown in fig. 10: when the optical transceiver sub-module 300 emits two laser signals with different wavelengths, the dual-chip optical transmitter 500 can generate two laser beams with different wavelengths through the first LD chip 504 and the second LD chip 505, the two laser beams are combined into one laser beam through the optical combiner 801, and then enter the optical fiber adapter 700 through the optical isolator 802, the first filter reflector 803, the second filter reflector 804 and the optical path adjusting device 805 in sequence, and then enter the optical fiber; when the optical sub-transceiver module 300 receives two laser signals with different wavelengths, the laser to be received is transmitted to the optical fiber adapter through an optical fiber, then passes through the optical path adjusting device 805, the second filtering reflector 804 and the first filtering reflector 803 in sequence, and reflects the two different wavelength signals to the second PD chip 605 and the first PD chip 604 of the dual-chip optical receiver 600 through the second filtering reflector 804 and the first filtering reflector 803.

As shown in fig. 7-9, in the optical sub-assembly 300 provided in the embodiment of the present application, the optical assembly 800 further includes a first collimating lens 806 and a second collimating lens 807. The first collimating lens 806 and the second collimating lens 807 are disposed between the head end of the dual-chip light emitter 500 and the optical combiner 801. Preferably, the optical axis of the first collimating lens 806 and the optical axis of the second collimating lens 807 are respectively coaxial with the chip of the dual-chip light emitter 500, and the first collimating lens 806 and the second collimating lens 807 are used for collimating the laser light emitted by the dual-chip light emitter 500. Specifically, as shown in fig. 10, an optical axis of the first collimating lens 806 is coaxial with the first LD chip 504, and the first collimating lens 806 is used for collimating the laser light emitted by the first LD chip 504; the second collimating lens 807 is coaxial with the second LD chip 505, and the second collimating lens 807 is used to collimate the laser light emitted by the second LD chip 505.

As shown in fig. 7 to 9, in the optical sub-transceiver module 300 provided in the embodiments of the present application, the optical assembly 800 further includes a first coupling lens 808 and a second coupling lens 809. A first coupling lens 808 is disposed between the head end of the dual-chip optical receiver 600 and the first filter reflector 803, and the laser beam reflected by the first filter reflector 803 passes through the first coupling lens 808 and enters the dual-chip optical receiver 600; the second coupling lens 809 is disposed between the head end of the dual-chip optical receiver 600 and the second filter mirror 804, and the laser beam reflected by the second filter mirror 804 passes through the second coupling lens 809 and enters the dual-chip optical receiver 500. Preferably, the optical axis of the first coupling lens 808 and the optical axis of the second coupling lens 809 are respectively coaxial with the chip of the dual-chip optical receiver 600. Specifically, as shown in fig. 10, an optical axis of the first coupling lens 808 is coaxial with the first PD chip 604, and the first coupling lens 808 is configured to couple laser light entering the first PD chip 604; the optical axis of the second coupling lens 809 is coaxial with the second PD chip 605, and the second coupling lens 809 is used to couple laser light entering the second PD chip 605.

As shown in fig. 9 and 10, in the optical sub-assembly 300 provided in the embodiment of the present application, the optical assembly 800 further includes an optical assembly base plate 811. The optical device in the optical module 800 is fixedly disposed on the optical module base plate 811, and the optical module base plate 811 is disposed in the inner cavity of the round-square tube 400. In the present embodiment, the optical device mounting in the optical module 800 is facilitated by providing the optical module mounting plate 811.

In the embodiment of the present application, as shown in fig. 9 and 10, the optical component base plate 811 is mainly used for fixedly mounting the optical combiner 801, the optical isolator 802, the first filter mirror 803, the second filter mirror 804, and the optical path adjusting device 805. Optionally, the optical component bottom plate 811 is provided with fixing seats corresponding to the optical multiplexer 801, the optical isolator 802, the first filter reflector 803, the second filter reflector 804 and the optical path adjusting device 805, and when the optical multiplexer 801, the optical isolator 802, the first filter reflector 803, the second filter reflector 804 and the optical path adjusting device 805 are installed, the optical multiplexer 801, the optical isolator 802, the first filter reflector 803, the second filter reflector 804 and the optical path adjusting device 805 are installed on the corresponding fixing seats correspondingly, so that the optical multiplexer 801, the optical isolator 802, the first filter reflector 803, the second filter reflector 804 and the optical path adjusting device 805 can be installed conveniently.

In the embodiment of the present application, generally, the optical axis positions of the first collimating lens 806, the second collimating lens 807, the first coupling lens 808, the second coupling lens 809 and the third coupling lens 810 are relatively high, and by disposing the optical combiner 801, the optical isolator 802, the first filtering mirror 803, the second filtering mirror 804 and the optical path adjusting device 805 on the optical component base plate 811, the optical axis relative positions of the optical combiner 801, the optical isolator 802, the first filtering mirror 803, the second filtering mirror 804 and the optical path adjusting device 805 can be integrally adjusted.

Meanwhile, the optical combiner 801, the optical isolator 802, the first filter reflector 803, the second filter reflector 804 and the optical path adjusting device 805 are installed into the round and square tube 400 through the optical component bottom plate 811, so that the optical combiner 801, the optical isolator 802, the first filter reflector 803, the second filter reflector 804 and the optical path adjusting device 805 are guaranteed to be affected in the round and square tube 400. For example, the optical component base plate 811 is thermally expanded to affect the optical axes of the optical combiner 801, the optical isolator 802, the first filter mirror 803, the second filter mirror 804, and the optical path adjusting device 805 to the same extent.

In this embodiment, the optical combiner 801, the optical isolator 802, the first filter reflector 803, the second filter reflector 804, and the optical path adjusting device 805 are fixed on the optical component base plate 811, and then the optical component base plate 811 is mounted in the inner cavity of the round-square tube 400. Therefore, the installation efficiency of the optical combiner 801, the optical isolator 802, the first filtering reflector 803, the second filtering reflector 804 and the optical path adjusting device 805 can be improved, and the accuracy of the installation positions of the optical combiner 801, the optical isolator 802, the first filtering reflector 803, the second filtering reflector 804 and the optical path adjusting device 805 can be ensured.

In the embodiment of the present application, after the round-square tube 400, the dual-chip optical transmitter 500, the dual-chip optical receiver 600, and the optical module base plate 811 are mounted, the first collimating lens 806, the second collimating lens 807, the first coupling lens 808, the second coupling lens 809, and the third coupling lens 810 are mounted. When the first collimating lens 806, the second collimating lens 807, the first coupling lens 808, the second coupling lens 809 and the third coupling lens 810 are installed, the first collimating lens 806 and the second collimating lens 807 are adjusted to collimate two paths of laser of the dual-chip optical transmitter 500, the third coupling lens 810 is adjusted to maximize coupling efficiency, and the first collimating lens 806, the second collimating lens 807 and the third coupling lens 810 are fixed; two optical signals with correct wavelengths are input from the end of the optical fiber adapter, the first coupling lens 808 and the second coupling lens 809 are adjusted to maximize the direct current response of the dual-chip optical receiver 600, and the first coupling lens 808 and the second coupling lens 809 are fixed.

Fig. 11 is an exploded view of a dual-chip light emitter 500 according to an embodiment of the present disclosure, fig. 12 is an exploded view of an interior of the dual-chip light emitter 500 according to an embodiment of the present disclosure, and fig. 13 is a partial structural diagram of fig. 12. As shown in fig. 11 to 13, a dual-chip optical transmitter 500 provided in the embodiments of the present application includes a first stem 501, a plurality of pins, a heat sink 503, a first LD chip 504, a second LD chip 505, and a cap.

The first stem 501 is used for fixing and supporting each structure or device in the dual-chip light emitter 500. In the present embodiment, the first socket 501 has a cylindrical shape and includes a bottom surface and a top surface, and fig. 14 and 15 are schematic structural views of the socket, see fig. 14 and 15. As shown in fig. 14 and 15, the first socket 501 is provided with a plurality of pin through holes for pins to pass through, such as pins 502 inserted into the pin through holes and penetrating from the bottom surface of the first socket 501 to the top surface of the first socket 501. The pins 502 are inserted into the pin through holes and fixed to the first socket 501 by soldering. The pins include a common ground, a dc pin of the first LD chip 504, a dc pin of the second LD chip 505, a radio frequency pin of the first LD chip 504, a radio frequency pin of the second LD chip 505, and the like, and the number of the pins is determined according to the requirements of the electronic devices in the dual-chip optical transmitter 500. In the embodiment of the application, the pins are electrically connected with the corresponding electric devices through the conducting wires. Optionally, the pins are electrically connected to the corresponding electrical devices through gold wires.

The heat sink 503 is disposed on the top surface of the first stem 501, and the heat sink 503 may be directly fixed on the top surface of the first stem 501, or may be indirectly fixed on the top surface of the first stem 501 through other devices. The heat sink 503 may be made of an alloy, such as a copper alloy, a nickel alloy, or the like, and mainly plays a role of heat dissipation and carrying, such as for carrying the first LD chip 504 and the second LD chip 505 and assisting the first LD chip 504 and the second LD chip 505 in heat dissipation. To facilitate the use and fabrication of the tosa provided by the embodiments of the present application, the heat sink 503 is generally disposed at the center of the top surface of the first stem 501, and the first LD chip 504 and the second LD chip 505 are disposed on the heat sink 503 in axial symmetry with respect to the first stem 501.

In the embodiment of the present application, the optional first LD chip 504 and the second LD chip 505 are respectively fixed on the heat sink 503 by ceramic substrates having metal layers on the surfaces thereof. Specifically, the functional circuit of the LD chip is engraved on the metal layer of the ceramic substrate, and the LD chip is attached to the ceramic substrate. The bottom surface of the LD chip is a cathode and is attached to the metal layer of the ceramic substrate, and the surface of the LD chip is an anode and is linked with the metal layer in a routing mode. The ceramic substrate and the heat sink 503 can be fixed by soldering with glass solder. The ceramic substrate can be made of ceramic materials such as aluminum nitride, aluminum oxide and the like.

The cap is fixedly covered on the top surface of the first stem 501, and surrounds the heat sink 503, the first LD chip 504, and the second LD chip 505 in a sealed space surrounded by the cap and the first stem 501. The cap is provided with a light-transmitting body for transmitting the laser light emitted from the first LD chip 504 and the second LD chip 505. The light-transmitting body can be a convergent lens or a flat window glass. In the embodiment of the application, in combination with the optical assembly 800 disposed in the round tube 400, the cap is preferably a flat glass cap 506, i.e., the top end of the cap is provided with a flat glass.

The dual-chip optical transmitter 500 provided by the embodiment of the present application includes a first LD chip 504 and a second LD chip 505, and two LD chips are packaged in a laser transmitter at the same time. Therefore, the dual-chip optical transmitter 500 provided by the embodiment of the application solves the problem that the conventional coaxial TO package manner can only accommodate a single LD chip. So, when realizing many light path structural style of BOSA module, can reduce the quantity that is used for the flexible circuit board that TOSA installation was used twice, solved among the prior art TOSA be used for realizing many light path structural style of BOSA module because the problem of the many increase assembly difficulty of flexible circuit board quantity. Simultaneously, the double-chip light emitter 500 that this application provided can hold the signal of two light paths in the single TOCAN, compares with the signal that can only hold a light path in the single TOCAN, when realizing the many light path structural style of BOSA module, reduces TOSA shared space, helps promoting BOSA's space utilization.

Fig. 16 is a first structural schematic diagram of the heat sink 503 provided in the embodiment of the present application, and fig. 17 is a second structural schematic diagram of the heat sink 503 provided in the embodiment of the present application. As shown in fig. 16 and 17, the heat sink 503 provided by the embodiments of the present application includes a first surface 503-1, a second surface 503-2, and a third surface 503-3. In the embodiment of the present application, the first surface 503-1 and the second surface 503-2 are located on the front surface of the heat sink 503, the first surface 503-1 and the second surface 503-2 are opposite and intersect, the third surface 503-3 is located on the back surface of the heat sink 503, and the first surface 503-1 and the third surface 503-3 are opposite. Specifically, when the heat sink 503-is disposed on the first header 501, the first surface 503-1 is perpendicular to the top surface of the first header 501, and the second surface 503-2 is approximately parallel to the top surface of the first header 501.

The first surface 503-1, the second surface 503-2 and the third surface 503-3 of the heat sink 503 are the main bearing surfaces of the heat sink 503, and the first surface 503-1, the second surface 503-2 and the third surface 503-3 of the heat sink 503 are used for bearing the first LD chip 504 and the second LD chip 505. Specifically, the first LD chip 504 and the second LD chip 505 are disposed on the first surface 503-1 of the heat sink 503, so that the laser beams generated by the first LD chip 504 and the second LD chip 505 are transmitted in a direction perpendicular to the top surface of the first stem 501 and away from the second surface 503-2.

As shown in fig. 11-13, in this application, the dual-chip light emitter 500 further includes a first backlight detector (MPD)507 and a second backlight detector (MPD)508, and the first backlight detector 507 and the second backlight detector 508 are fixed on the surface of the heat sink 503. Further, a first backlight detector 507 is disposed at a backlight end of the first LD chip 504, and is configured to perform backlight collection and feedback of the laser beam generated by the first LD chip 505; the second backlight detector 508 is disposed at a backlight end of the second LD chip 505, and is configured to perform backlight collection and feedback of the laser beam generated by the second LD chip 505. Specifically, a first backlight detector 507 and a second backlight detector 508 are affixed to the second surface 503-2 of the heat sink 503.

As shown in fig. 11, 12 and 17, in the embodiment of the present application, the dual-chip light emitter 500 further includes a thermistor 509 and a TEC (thermoelectric cooler) 510. The thermistor 509 is disposed on the heat sink 503, and is configured to acquire the temperature of the heat sink 503 to monitor the operating temperatures of the first LD chip 504 and the second LD chip 505. The TEC510 is fixed to the top surface of the first header 501 and the TEC510 supports the heat sink 503, i.e., the heat sink 503 is fixed to the first header 501 by the TEC 510. In the embodiment of the present application, one heat exchange surface of the TEC510 is directly attached to the first header 501, and the other heat exchange surface of the TEC510 is used for directly attaching the heat sink 503, so that efficient heat transfer between the first LD chip 504 and the second LD chip 505 and the TEC510 is ensured. Specifically, the temperature of the heat sink 503 is acquired by the thermistor 509, and the operation of the TEC510 is controlled according to the temperature of the heat sink 503, so that the temperatures of the first LD chip 504 and the second LD chip 505 are controlled within a range of target temperatures. In the present embodiment, in order to accurately monitor the temperature of the first LD chip 504 and the second LD chip 505, the thermistor 509 is disposed on the third surface 503-3 of the heat sink 503. Preferably, between the projections of the first LD chip 504 and the second LD chip 505 on the third surface 503-3. In the embodiment of the present application, in order to facilitate connection between each electronic device and the corresponding pin, the pins on the first tube seat 501 are uniformly distributed around the TEC 510.

In the present implementation, as shown in fig. 11-13, the dual-chip optical transmitter 500 further includes a first high-frequency carrier 511 and a second high-frequency carrier 512, and the first high-frequency carrier 511 and the second high-frequency carrier 512 are disposed on the top surface of the first stem 501. The first high-frequency carrier 511 and the second high-frequency carrier 512 are provided with metal layers, respectively, which are engraved to form circuits for transmission of high-frequency signals. Specifically, the method comprises the following steps: a first high-frequency carrier 511 is provided with a first high-frequency signal line, the first high-frequency carrier 511 serving as a carrier of the first high-frequency signal line; a second high-frequency carrier is provided with a second high-frequency signal line, and the second high-frequency carrier serves as a carrier of the second high-frequency signal line. The circuits on the first high-frequency carrier 511 and the second high-frequency carrier 512 are respectively connected with the circuits on the ceramic substrates on the first LD chip 504 and the second LD chip 505 and the radio-frequency pins of the first LD chip 504 and the second LD chip 505. The first high-frequency carrier 511 and the second high-frequency carrier 512 are preferably ceramic carriers such as alumina ceramics, aluminum nitride ceramics, or the like.

In the dual-chip optical transmitter 500 provided in the present embodiment, in order to facilitate the mounting and fixing of the first high-frequency carrier 511 and the second high-frequency carrier 512, the first stem 501 has a top surface provided with a first fixing base 501-1 and a second fixing base 501-2, the first fixing base 501-1 fixedly supports the first high-frequency carrier 511, and the second fixing base 501-2 fixedly supports the second high-frequency carrier 512. The first and second holders 501-1 and 501-2 are also used for grounding of the grounding circuit on the first and second high-

frequency carriers

511 and 512. In the dual-chip light emitter 500 provided by the embodiment of the present application, the diameter of the first stem 501 is usually about 6mm, so that the area for mounting each device is very limited, but the mounting firmness of each device is ensured. In the embodiment of the present application, the first fixing seat 501-1 and the second fixing seat 501-2 are provided on the top surface of the first stem 501, so that the first high-frequency carrier 511 and the second high-frequency carrier 512 are in contact with the first stem 501 with the smallest cross section, which not only reduces the mounting occupied area of the first high-frequency carrier 511 and the second high-frequency carrier 512, but also ensures the mounting firmness of the first high-frequency carrier 511 and the second high-frequency carrier 512, and also realizes the grounding of the grounding circuit thereon.

As shown in fig. 11 to 13, in this embodiment, the tosa further includes a first filter capacitor 513 and a second filter capacitor 514, and the first filter capacitor 513 and the second filter capacitor 514 are fixed on the surface of the heat sink 503. Specifically, the first filter capacitor 513 and the second filter capacitor 514 are fixed to the first surface 503-1 of the heat sink 503. The first filter capacitor 513 and the second filter capacitor 514 are electrically connected to corresponding pins, so that the first filter capacitor 513 and the second filter capacitor 514 are connected in parallel to the first LD chip 504 and the second LD chip 505, respectively, for filtering the input signals of the first LD chip 504 and the second LD chip 505.

In the embodiment of the present application, the pins include not only the common ground, the dc pin of the first LD chip 504, the dc pin of the second LD chip 505, the rf pin of the first LD chip 504, and the rf pin of the second LD chip 505, but also the thermistor pin and the TEC pin for providing sufficient current connection for the thermistor 509 and the TEC 510.

In the present embodiment, the flat glass cap 506 includes a cap base 506-1 and a flat glass 506-2. The top end of the pipe cap seat 506-1 is provided with a light through hole, the flat window glass 506-2 is installed in the light through hole, and when the flat window glass cap 506 is covered, the pipe cap seat 506-1 is fixed on the first pipe seat 501.

The embodiment of the application further provides a preparation process of the dual-chip light emitter 500, wherein the first LD chip 504, the second LD chip 505, the thermistor 509, the first filter capacitor 513 and the second filter capacitor 514 are pasted on the heat sink 503 by using a chip mounter to form a laser and heat sink assembly; bonding the first high-frequency carrier 511, the second high-frequency carrier 512 and the TEC510 to the first stem 501 by a mounter; after the first high-frequency carrier 511, the second high-frequency carrier 512 and the TEC510 are bonded and cured with the first tube seat 501, a laser and a heat sink assembly are attached to the TEC510 by using a chip mounter; routing, namely connecting the electronic components on the light emission submodule and corresponding pins through metal wires, wherein the metal wires can be gold wires; the cover of the flat glass cap 506 is performed, and the flat glass cap 506 is placed on the top surface of the first stem 501.

The dual-chip optical transmitter 500 provided by the embodiment of the application can be used in an optical transmitter subassembly to transmit optical signals on another two optical paths.

Fig. 18 is a schematic structural diagram of a dual-chip optical receiver 600 according to an embodiment of the present disclosure. As shown in fig. 18, a dual-chip optical receiver 600 provided in the embodiment of the present application includes a second header 601, several pins, a dual-channel TIA (transimpedance amplifier) 603, a first PD chip 604, a second PD chip 605, and a cap.

The second stem 601 is used for fixing and supporting each structure or device in the dual chip optical receiver 600. In the present embodiment, the second socket 601 has a cylindrical shape including a bottom surface and a top surface. The second socket 601 has a plurality of pin through holes for pins to pass through. For example, the pins 602 are inserted into the pin through holes and penetrate from the bottom surface of the second header 601 to the top surface of the second header 601. The pins 602 are inserted into the pin through holes and fixed to the second socket 601 by soldering. The pins include a common ground, a feedback pin of the first PD chip 604 and a feedback pin of the second PD chip 605, a dual channel TIA instruction feedback pin, etc. The number of pins 602 is determined by the requirements of the electronics in the dual-chip optical receiver 600. In the present embodiment, the pins 602 are electrically connected to the corresponding electrical devices by wires. Alternatively, the pins 602 are electrically connected to the corresponding electrical devices by gold wires.

In the dual-chip optical receiver 600 provided by the embodiment of the application, the dual-channel TIA603 is fixed on the top surface of the second header 601, and the first PD chip 604 and the second PD chip 605 are fixed on the top surface of the dual-channel TIA 603. Optionally, the first PD chip 604 and the second PD chip 605 are respectively fixed on the dual-channel TIA603 by a ceramic substrate having a metal layer on a surface thereof. Specifically, a functional circuit of a PD chip is carved on a metal layer of the ceramic substrate, and the PD chip is attached to the ceramic substrate. The bottom surface of the PD chip is a cathode and is attached to a metal layer of the ceramic substrate, and the surface of the PD chip is an anode and is connected with the metal layer in a routing mode. The first and

second PD chips

604 and 605 are connected in series with a dual-channel TIA603, respectively. The pins 602 are electrically connected to corresponding electrical devices in the dual-chip optical receiver 600 by wires. Alternatively, the pins 602 are electrically connected to the corresponding electrical devices by gold wires.

The cap is fixedly covered on the top surface of the second socket 601, and surrounds the dual-channel TIA603, the first PD chip 604 and the second PD chip 605 in a closed space surrounded by the cap and the first socket 501. The cap is provided with a light-transmitting body for transmitting laser light emitted from the first PD chip 604 and the second PD chip 605. The light-transmitting body can be a convergent lens or a flat window glass. In the embodiment, in combination with the optical assembly 800 disposed in the round tube 400, the cap is preferably a flat glass cap 606, i.e., the top end of the cap is provided with a flat glass. The structure of the flat glass cap 606 can be referred to as the flat glass cap 506, and is not described herein.

The optical transceiver sub-module 300 provided in the embodiment of the present application realizes the emission of the dual optical path optical signal through the dual chip optical transmitter and realizes the reception of the dual optical path optical signal through the dual chip optical receiver, and realizes the emission and the reception of the dual optical path optical signal of the optical transceiver sub-module through one emitter and one receiver, thereby realizing the emission of the dual optical path optical signal and the reception of the dual optical path optical signal of the optical module. Compared with the prior art in which the dual-optical-path optical signals are realized by two transmitters and two receivers, one transmitter and one receiver are saved, so that the occupied space for installing the transmitters and the receivers is saved, the size and the length of the optical transceiver subassembly 300 are reduced, the space utilization rate of the BOSA is improved, and the high integration of the CPON is realized conveniently. Meanwhile, the optical transceiver subassembly 300 provided by the application reduces the number of flexible circuit boards used for installing the transmitter and the receiver, and solves the problem that the assembly difficulty is increased due to the fact that the number of the flexible circuit boards is large in the BOSA module multi-light-path structural form in the prior art.

All the embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments, and the relevant points may be referred to the part of the description of the method embodiment. It is noted that other embodiments of the present invention will become readily apparent to those skilled in the art from consideration of the specification and practice of the invention herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims

1. An optical transceiver sub-module is characterized by comprising a round square tube body, a double-chip optical transmitter, a double-chip optical receiver and an optical component; wherein:

the double-chip optical transmitter is a laser transmitter with double LD chips, and the double-chip optical receiver is a laser receiver with double PD chips;

two beams of laser emitted by the double-chip light emitter are combined into one beam of laser through the optical multiplexer, and then the laser is emitted through the first filter reflector and the second filter reflector in sequence;

one of the light beams received by the double-chip light receiver penetrates through the second filtering reflector and then is reflected to the double-chip light receiver through the first filtering reflector; and the other beam is reflected to the double-chip optical receiver through the second filter reflector.

2. The rosa of claim 1, wherein the cap of the dual-chip optical transmitter is a flat-window glass cap, the optical assembly further comprising a first collimating lens and a second collimating lens;

the first collimating lens and the second collimating lens are arranged between the flat window glass tube cap and the optical multiplexer, and two laser beams emitted by the double-chip light emitter respectively penetrate through the flat window glass tube cap to be incident to the first collimating lens or the second collimating lens and then to be incident to the optical multiplexer.

3. The rosa of claim 1, wherein the cap of the dual-chip optical receiver is a flat-window glass cap, the optical assembly further comprising a first coupling lens and a second coupling lens;

the first coupling lens is arranged between the flat window glass tube cap and the first filtering reflector, and the laser beam reflected by the first filtering reflector sequentially penetrates through the first coupling lens and the flat window glass tube cap to enter the double-chip optical receiver; the second coupling lens is arranged between the flat window glass tube cap and the second filtering reflector, and laser beams reflected by the second filtering reflector sequentially penetrate through the second coupling lens and the flat window glass tube cap to enter the double-chip optical receiver.

4. The rosa of claim 1, wherein the optical component further comprises an optical isolator; the optical isolator is arranged between the optical multiplexer and the first filter reflector, and the optical multiplexer synthesizes a laser beam to penetrate through the optical isolator to be incident on the first filter reflector.

5. The rosa of claim 1, further comprising a fiber optic adapter, wherein a third nozzle is disposed on the round tube for inserting the fiber optic adapter;

and the double-chip optical transmitter and the double-chip optical receiver are respectively connected with the optical fiber adapter in an optical mode.

6. The rosa of claim 5, wherein the optical assembly further includes an optical path adjustment device;

the optical path adjusting device is arranged on the reflection side of the second filtering reflector and adjusts the propagation direction of light entering the optical fiber adapter.

7. The rosa of claim 5, wherein the optical assembly further comprises a third coupling lens disposed on an optical path from the duplechip optical transmitter to the fiber optic adapter, the third coupling lens being located at an end of the fiber optic adapter.

8. The rosa of claim 1, further comprising an optical assembly backplane, wherein the optical assembly is disposed on the optical assembly backplane, and wherein the optical assembly backplane is disposed within the interior cavity of the round-square tube.

9. The rosa of claim 6, wherein the first and third nozzles are disposed at two ends of the round tube body in the length direction.

10. An optical module comprising the optical transceiver subassembly of any one of claims 1-9.