WO2022127072A1

WO2022127072A1 - Optical module

Info

Publication number: WO2022127072A1
Application number: PCT/CN2021/103116
Authority: WO
Inventors: 张晓磊; 刘学儒; 唐毅
Original assignee: 青岛海信宽带多媒体技术有限公司
Priority date: 2020-12-16
Filing date: 2021-06-29
Publication date: 2022-06-23

Abstract

An optical module (200), comprising a first transmitting assembly and a second transmitting assembly. The first transmitting assembly comprises a first heat sink (510), a first lens (520), and a first laser assembly, and the second transmitting assembly comprises a second heat sink (550), a second lens (560), and a second laser assembly, wherein the first lens (520) and the first laser assembly are disposed on the first heat sink (510), and the second lens (560) and the second laser assembly are disposed on the second heat sink (550); the first transmitting assembly and the second transmitting assembly respectively comprise the first heat sink (510) and the second heat sink (550) independent of each other, an independent heat dissipation system can ensure a stable heat dissipation capability, and the normal temperature work of the second laser assembly is not affected on the premise of ensuring that the first laser assembly works at a constant temperature; the first transmitting assembly and the second transmitting assembly are disposed in parallel. By means of the structure having double built-in transmitting assemblies, transmission of signals of double optical paths can be achieved, the space utilization rate of BOSA is facilitated to improve, and the high integration of CPON is facilitated to achieve.

Description

an optical module

This disclosure requires that it be submitted to the China Patent Office on December 16, 2020, with the application number 202011488412.6, and the patent name is "an optical module", and submitted to the China Patent Office on December 16, 2020, with the application number 202011488471.3, and the patent name is "An optical module", submitted to the Chinese Patent Office on December 16, 2020, application number 202011488466.2, patent name "an optical module", submitted to the Chinese Patent Office on December 16, 2020, application number 202023043144.5 , the patent titled "An Optical Module", the entire contents of which are incorporated by reference in this disclosure.

technical field

The present disclosure relates to the technical field of optical communication, and in particular, to an optical module.

Background technique

A PON transceiver may employ a bidirectional optical submodule (BOSA) to optically couple outgoing light from a transmitter to a single fiber and incoming light from a single fiber to a receiver. BOSA is made by encapsulating a separate optical emission submodule (TOSA) package and optical reception submodule (ROSA) together in a metal case.

SUMMARY OF THE INVENTION

In a first aspect, an optical module provided by an embodiment of the present disclosure includes: a circuit board; a light emitting device electrically connected to the circuit board for converting an electrical signal into an optical signal; wherein the light emitting device includes : a tube seat with a plurality of pins on the surface; a first emitting component, arranged on the surface of the tube seat, including a first heat sink, a first lens and a first laser component, the first heat sink has a first side surface and The second side, the first lens is arranged on the first side, the first laser component is arranged on the second side; the second emitting component is arranged on the surface of the tube seat, including a second heat A sink, a second lens and a second laser assembly, the second heat sink has a third side and a fourth side, the second lens is arranged on the third side, and the second laser assembly is arranged on the On the fourth side surface; an adapter post is arranged on the surface of the tube seat and is used to electrically connect the first laser assembly and the second laser assembly to the pins on the tube seat respectively.

In a second aspect, an optical module provided by an embodiment of the present disclosure includes: a circuit board; a light emitting device electrically connected to the circuit board for converting an electrical signal into an optical signal; wherein the light emitting device includes : a tube seat, with a plurality of pins on the surface; TEC, arranged on the surface of the tube seat, including an upper substrate and an electrode column, the upper substrate surface has a heat conduction area and a thermal insulation area, and the thermal insulation area is provided with a TEC positive electrode and a TEC A negative electrode, the TEC positive electrode and the TEC negative electrode are electrically connected to the upper end of the electrode column; the emission component is arranged on the heat conduction area of the TEC surface, including a heat sink, a lens and a laser component, and the heat sink has a first side surface and On the second side, the lens is arranged on the first side, and the laser assembly is arranged on the second side; an adapter post is arranged on the surface of the tube seat and is used for connecting the first laser assembly The pins on the socket are electrically connected.

In a third aspect, an optical module provided by an embodiment of the present disclosure includes: a circuit board; a light emitting device electrically connected to the circuit board for converting an electrical signal into an optical signal; wherein the light emitting device includes: a tube a seat with a plurality of pins on the surface; a TEC, arranged on the surface of the tube seat; a first emitting component, arranged on the surface of the TEC, including a first heat sink, a first lens and a first laser component, the first The heat sink has a first side and a second side, the first lens is arranged on the first side, the first laser component is arranged on the second side; the second emitting component is arranged on the TEC The side includes a second heat sink, a second lens and a second laser assembly, the second heat sink has a third side and a fourth side, the second lens is arranged on the third side, the second The laser assembly is arranged on the fourth side surface; the adapter column is arranged on the surface of the tube seat and is used to electrically connect the first laser assembly and the second laser assembly to the pins on the tube seat respectively , including a first metal layer, a second metal layer and a third metal layer, the first metal layer includes a first metal area, a second metal area and a third metal area that are connected to each other and are arranged on different planes of the transfer post area, the second metal layer includes a fourth metal area, a fifth metal area and a sixth metal area that are connected to each other and are arranged on different planes of the transfer post, and the first metal layer is used to connect the first metal area The laser component and the corresponding pins on the tube seat, the second metal layer is used for connecting the second laser component and the corresponding pins on the tube seat, and the third metal layer is used for connecting the the thermistor and the corresponding pins on the socket.

In a fourth aspect, an optical module provided by an embodiment of the present disclosure includes: a circuit board; a light emitting device electrically connected to the circuit board for converting an electrical signal into an optical signal; wherein the light emitting device includes: a tube The seat has a plurality of pins on the surface and a positioning column protruding on the side surface, the plane where the extension end of the positioning column is located is located on the lower surface of the tube seat, and the positioning column is used for positioning the tube seat, the first lens and the second The lens provides a reference plane; the first emitting component is arranged on the upper surface of the tube base, and includes a first heat sink, the first lens and a first laser component, and the first heat sink has a first side surface and a second side surface , the first lens is arranged on the first side, the first laser component is arranged on the second side; the second emitting component is arranged on the upper surface of the tube seat, including a second heat sink, The second lens and the second laser assembly, the second heat sink has a third side and a fourth side, the second lens is arranged on the third side, and the second laser assembly is arranged on the On the fourth side surface; an adapter post is arranged on the surface of the tube seat and is used to electrically connect the first laser assembly and the second laser assembly to the pins on the tube seat respectively.

Description of drawings

In order to illustrate the technical solutions of the present disclosure more clearly, the accompanying drawings that need to be used in the embodiments will be briefly introduced below. Other drawings can also be obtained from these drawings.

Fig. 1 is a schematic diagram of the connection relationship of optical communication terminals;

Fig. 2 is a schematic diagram of the structure of an optical network unit;

FIG. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present disclosure;

4 is a schematic diagram of an exploded structure of an optical module provided in an embodiment of the present disclosure;

FIG. 5 is a schematic diagram of the appearance structure of a light emitting device 500 according to an embodiment of the present disclosure;

6 is a schematic diagram of an internal structure of a laser device provided by an embodiment of the present disclosure;

FIG. 7 is an exploded schematic diagram of an internal structure of a laser device provided by an embodiment of the present disclosure;

FIG. 8 is a schematic structural diagram of a relative positional relationship between a dual-emitting component and a TEC from a viewing angle according to an embodiment of the present disclosure;

FIG. 9 is a schematic structural diagram of the relative positional relationship between the dual emission component and the TEC from another perspective provided by an embodiment of the present disclosure;

FIG. 10 is a schematic structural diagram of a first light emitting component according to an embodiment of the present disclosure;

FIG. 11 is a schematic structural diagram of a first heat sink in a first light emitting assembly according to an embodiment of the present disclosure;

FIG. 12 is a schematic structural diagram of a second light emitting component according to an embodiment of the present disclosure;

FIG. 13 is a schematic structural diagram of a second heat sink in a second light emitting assembly according to an embodiment of the present disclosure;

14 is a schematic structural diagram of a TEC in a light emitting device provided in an embodiment of the present disclosure;

FIG. 15 is a schematic structural diagram of an adapter column of a light emitting device provided in an embodiment of the present disclosure;

FIG. 16 is one of the schematic diagrams of wire bonding of each structure of the light emitting device provided by the embodiment of the present disclosure;

FIG. 17 is the second schematic diagram of wire bonding of each structure of the light emitting device provided by the embodiment of the present disclosure;

FIG. 18 is a schematic structural diagram of a socket of a light emitting device according to an embodiment of the present disclosure.

Detailed ways

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, but not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present disclosure.

One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers/optical waveguides. The passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost, low-loss information transmission; while computers and other information processing equipment Electrical signals are used. In order to establish an information connection between information transmission equipment such as optical fibers/optical waveguides and information processing equipment such as computers, it is necessary to realize the mutual conversion of electrical signals and optical signals.

The optical module realizes the mutual conversion function of the above-mentioned optical and electrical signals in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module. The optical module realizes the electrical connection with the external host computer through the gold finger on its internal circuit board. The main electrical connections include power supply, I2C signal, data signal and grounding, etc. The electrical connection method realized by the gold finger has become the optical module. The mainstream connection method of the industry, based on this, the definition of pins on the gold finger has formed a variety of industry protocols/norms.

FIG. 1 is a schematic diagram of a connection relationship of an optical communication terminal. As shown in FIG. 1 , the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by The optical network terminal 100 with the optical module 200 is completed.

The optical port of the optical module 200 is externally connected to the optical fiber 101, and a two-way optical signal connection is established with the optical fiber 101; the electrical port of the optical module 200 is externally connected to the optical network terminal 100, and a two-way electrical signal connection is established with the optical network terminal 100; The optical module realizes mutual conversion between optical signals and electrical signals, so as to establish an information connection between the optical fiber and the optical network terminal; in some embodiments of the present disclosure, after the optical signal from the optical fiber is converted into an electrical signal by the optical module Input to the optical network terminal 100, the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber.

The optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a two-way electrical signal connection with the optical module 200; Signal connection; a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. In some embodiments of the present disclosure, the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical network. The optical network terminal acts as the host computer of the optical module to monitor the work of the optical module.

So far, the remote server has established a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network terminals and network cables.

Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network terminal is the host computer of the optical module, providing data signals to the optical module and receiving data signals from the optical module. Common optical module host computers and optical lines terminal etc.

FIG. 2 is a schematic structural diagram of an optical network terminal. As shown in FIG. 2 , the optical network terminal 100 has a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is provided inside the cage 106 for connecting to an optical module electrical port such as a golden finger; The cage 106 is provided with a radiator 107 , and the radiator 107 has raised portions such as fins that increase the heat dissipation area.

The optical module 200 is inserted into the optical network terminal. In some embodiments of the present disclosure, the electrical port of the optical module is inserted into the electrical connector inside the cage 106 , and the optical port of the optical module is connected to the optical fiber 101 .

The cage 106 is located on the circuit board, and the electrical connectors on the circuit board are wrapped in the cage, so that the interior of the cage is provided with electrical connectors; the optical module is inserted into the cage, the optical module is fixed by the cage, and the heat generated by the optical module is conducted to the cage. 106 and then diffuse through a heat sink 107 on the cage.

FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure, and FIG. 4 is a schematic structural diagram of an exploded structure of the optical module. The optical module in the optical communication terminal of the foregoing embodiment will be described below with reference to FIG. 3 and FIG. 4 ; as shown in FIG. 3 and FIG. The unlocking part 203 , the circuit board 300 and the optical transceiver assembly 400 .

The upper casing 201 is covered with the lower casing 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity generally presents a square body. In some embodiments of the present disclosure, the lower case 202 includes a main board and two side plates located on both sides of the main board and perpendicular to the main board; the upper case includes a cover plate, and the cover plate covers the two side plates of the upper case. the side plate to form a wrapping cavity; the upper shell can also include two side walls located on both sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize the upper shell 201 is closed on the lower case 202 .

One of the two openings is an electrical port 204, and the gold fingers of the circuit board protrude from the electrical port 204 and are inserted into a host computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect optical fibers. The optical transceiver assembly 400 inside the module; the circuit board 300, the optical transceiver assembly 400 and other optoelectronic devices are located in the package cavity.

The combination of the upper casing and the lower casing is adopted to facilitate the installation of the circuit board 300, the optical transceiver assembly 400 and other devices into the casing, and the upper casing and the lower casing form the outermost encapsulation protection casing of the module; The upper casing and the lower casing are generally made of metal materials, which are used to achieve electromagnetic shielding and heat dissipation. Generally, the casing of the optical module is not made into an integral part, so that when assembling circuit boards and other devices, positioning parts, heat dissipation and electromagnetic shielding parts It cannot be installed and is not conducive to production automation.

The unlocking part 203 is located on the outer wall of the enclosing cavity/lower casing 202, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.

The unlocking part 203 has an engaging part matched with the cage of the upper computer; pulling the end of the unlocking part can make the unlocking part move relatively on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is moved by the engaging part of the unlocking part. It is fixed in the cage of the upper computer; by pulling the unlocking part, the engaging part of the unlocking part moves with it, thereby changing the connection relationship between the engaging part and the upper computer, so as to release the engaging relationship between the optical module and the upper computer, so that the The optical module is pulled out from the cage of the host computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, MOS tubes) and chips (such as MCU, laser driver chip, amplitude limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip) DSP), etc.

The circuit board 300 connects the electrical components in the optical module together according to the circuit design through circuit wiring, so as to realize electrical functions such as power supply, electrical signal transmission, and grounding.

The circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry the chip smoothly; when the optical transceiver components are located on the circuit board, the rigid circuit board can also provide Stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage. In some embodiments of the present disclosure, metal pins/gold fingers are formed on the end surface of one side of the rigid circuit board for connecting with the electrical connector. Connector connections; these are inconvenient to implement with flexible circuit boards.

Flexible circuit boards are also used in some optical modules as a supplement to rigid circuit boards; flexible circuit boards are generally used in conjunction with rigid circuit boards. For example, flexible circuit boards can be used to connect the rigid circuit boards and optical transceiver components.

The optical transceiver assembly 400 includes two parts, an optical transmitting device and an optical receiving device, which are respectively used for transmitting and receiving optical signals. The emission sub-module generally includes a light emitter, a lens and a light detector, and the lens and the light detector are located on different sides of the light emitter. The front and back sides of the light emitter emit light beams respectively. The lens is used to converge the front of the light emitter. The emitted light beam makes the light beam emitted by the light transmitter a convergent light so as to be easily coupled to an external optical fiber; the light detector is used to receive the light beam emitted from the reverse side of the light transmitter to detect the optical power of the light transmitter. In some embodiments of the present disclosure, the light emitted by the optical transmitter enters the optical fiber after being condensed by the lens, and the light detector detects the luminous power of the optical transmitter to ensure the constancy of the emitted optical power of the optical transmitter. The optical transceiver assembly 400 will be described in detail below.

The optical transceiver assembly 400 includes two parts, an optical transmitting device 500 and an optical receiving device, which are respectively used for transmitting and receiving optical signals. The light emitting device 500 generally includes a light emitter, a lens and a light detector, and the lens and the light detector are located on different sides of the light emitter, respectively, the front and back sides of the light emitter emit light beams, and the lens is used for converging the light emitter. The light beam emitted from the front side makes the light beam emitted by the light transmitter a convergent light to facilitate coupling to an external optical fiber; the light detector is used to receive the light beam emitted from the reverse side of the light transmitter to detect the optical power of the light transmitter. In some embodiments of the present disclosure, the light emitted by the optical transmitter enters the optical fiber after being condensed by the lens, and the light detector detects the luminous power of the optical transmitter to ensure the constancy of the emitted optical power of the optical transmitter.

Passive Optical Network (PON) is a system used to provide network access in the last mile. Among others, a PON transceiver may employ a bidirectional optical submodule (BOSA) to optically couple outgoing light from a transmitter to a single fiber and couple incoming light from a single fiber to a receiver. BOSA is made by encapsulating a separate Optical Transmitting Submodule (TOSA) package and Optical Receiving Submodule (ROSA) together in a metal case. Traditional BOSAs combine TOSA and ROSA into a single transistor outline (TO) package in an attempt to reduce form factor and cost.

In order to make full use of the advantages and technical characteristics of TO packaging, further reduce the cost, enhance the competitive advantage and development potential of BOSA, and realize the high integration of CPON, BOSA gradually appears in the form of dual optical path structure. In order to realize the BOSA dual optical path structure, two other TOSAs and two ROSAs are usually used. However, in specific use, each TOSA and ROSA requires a flexible circuit board, so in order to meet the two optical path structure forms of BOSA, at least 4 flexible circuit boards are required for installation and use, which will increase the difficulty of assembly and increase the optical module. Space is not conducive to the miniaturization and high integration of optical modules.

5 is a schematic diagram of the appearance structure of a light emitting device 500 provided by an embodiment of the present disclosure; as shown in FIG. 6 , the light emitting device 500 includes a tube base 501 and a tube cap 502, the tube cap 502 is covered on the tube base 501, and the tube The cap 502 is provided with a light-transmitting light window for transmitting the light beam. The light window is provided with a flat window glass, and the tube base 501 and the tube cap 502 are capacitively welded to achieve hermetic packaging, which meets the reliability requirements of the laser. A sealed cavity is formed between the tube base 501 and the tube cap 502, and optoelectronic devices such as lasers are packaged in the sealed cavity.

FIG. 6 is a schematic diagram of the internal structure of the laser device provided by the embodiment of the present disclosure, and FIG. 7 is an exploded schematic diagram of the internal structure of the laser device provided by the embodiment of the present disclosure. As shown in FIG. 6 and FIG. The first heat sink 510 , the first lens 520 , the first laser assembly, the TEC 540 , the second heat sink 550 , the second lens 560 , the second laser assembly, the transfer post 580 and the ceramic substrate 590 . In certain embodiments of the present disclosure, the first heat sink 510, the first lens 520, the first laser assembly, the TEC 540, the second heat sink 550, the second lens 560, the second laser assembly, the interposer 580, and the ceramic The substrate 590 is disposed in the sealed cavity formed between the tube seat 501 and the tube cap 502 and is carried by the tube seat 501; the first heat sink 510 and the second heat sink 550 can be both tungsten copper heat dissipation block structures; the first heat sink 510 has a carrying surface for carrying the first lens 520 and the first laser assembly respectively, and the second heat sink 550 has a carrying surface for carrying the second lens 560 and the second laser assembly respectively. Both the first laser assembly and the second laser assembly include a laser chip and a chip carrier, the laser chip is welded on the chip carrier by gold-tin solder, and the chip carrier is adhered to the first heat sink 510 and the second heat sink respectively using silver glue The side of the 550. In some embodiments of the present disclosure, the first laser assembly includes a first laser chip 530 and a first carrier 516, the second laser assembly includes a second laser chip 570 and a second carrier 556, and the first laser chip 530 may It is an EML laser. The EML laser is an integrated device of the laser DFB and the electro-absorption modulator EA. The laser DFB converts the electrical signal into an optical signal, and the electro-absorption modulator EA encodes and modulates the optical signal and outputs it, so that the output optical signal carries Information; the second laser chip 570 may be a DFB laser. In a possible implementation manner, both the first laser chip 530 and the second laser chip 570 are EML lasers. The positive and negative electrodes of the first laser chip 530 and the second laser chip 570 need to be electrically connected to the corresponding pins through gold wires, so as to realize separate electrical connection between the positive and negative electrodes and the outside. It can be seen from the above content that the light emitting device in the present disclosure has two sets of heat sinks, lenses and lasers. For the convenience of description, the two sets of heat sinks, lenses and lasers can be described as built-in dual emission components. A emitting component includes a first heat sink 510, a first lens 520, a first laser chip 530, a second emitting component includes a second heat sink 550, a second lens 560, a second laser chip 570, a first emitting component and a second laser chip 570 The launching assemblies are arranged in parallel, the first launching assembly and the second launching assembly are both disposed on the surface of the tube base, wherein the first launching assembly is indirectly disposed on the surface of the tube base through the TEC, and the second launching assembly is directly disposed on the surface of the tube base. At the same time, the structure of built-in dual emission components can realize the transmission of dual optical path signals, that is, two emission components are integrated in one TOSA, which reduces the number of flexible circuit boards used to install the transmitter, and solves the problem of realizing the multi-optical path structure of BOSA modules in the prior art. The form increases the difficulty of assembly due to the large number of flexible circuit boards. At the same time, the space occupied by the installation of the transmitter will be saved, which will help to improve the space utilization rate of BOSA and facilitate the realization of high integration of CPON.

Each of the first emitting component and the second emitting component includes an independent first heat sink and a second heat sink. The independent heat dissipation system can ensure stable heat dissipation capacity, and will not affect the second laser on the premise of ensuring the constant temperature of the first laser. The laser works at room temperature.

The central axis of the first lens 520 is coincident with the central axis of the first laser chip 530 , and the first lens 520 is used for condensing the signal beam emitted by the first laser chip 530 , such as the signal beam directly emitted by the first laser chip 530 Convergence is performed, and the converged light beam is coupled into the external optical fiber through the optical window of the tube cap 502; the central axis of the second lens 560 coincides with the central axis of the second laser chip 570, and the second lens 560 is used for the second laser chip. The signal beam emitted by 570 is converged, for example, the signal beam emitted by the second laser chip 570 is directly converged, and the converged beam is coupled into an external optical fiber through the optical window of the cap 502 . In the traditional coaxial TO package, the lens is usually integrated in the TO cap, and the emitted light from the laser is converted into condensed light through the lens on the TO cap, and the laser is coupled into the optical fiber or other optical devices. However, in this coaxial TO packaging method, when the TO tube cap is welded to the TO tube base, the precision of the welding machine is generally only 30-50um, the lens in the TO tube cap and the laser in the TO tube base There is offset after welding, and it cannot be guaranteed that the lens and the laser are coaxial, which will affect the coupling efficiency of the optical path.

In the present disclosure, the first lens 520 and the second lens 560 are built-in, which are arranged above the laser, and the lens can be precisely positioned according to the emission optical path of the laser, so as to realize the optical high-precision alignment of the lens relative to the laser without being affected by the TO tube cap. The influence of sealing welding accuracy avoids the optical path offset caused by the offset of the lens in the traditional TO tube cap and the laser welding offset in the TO tube base, and improves the optical path coupling efficiency.

In the present disclosure, the lens originally arranged on the TO tube cap 502 is built into the TO tube base 501. In order to ensure that the laser is hermetically sealed, a flat glass is arranged at the light window of the TO tube cap 502, and the flat glass is connected to the TO tube cap 502. The light window is fixed by glass solder, so as to realize the hermetic packaging of the TO tube cap 502 and the TO tube base 501 . In addition, the flat glass will not condense the signal beam, that is, the light beams emitted by the first lens 520 and the second lens 560 directly pass through the flat glass and will not condense the light beam.

In the example, the first lens 520 and the second lens 560 are built into the TO socket 501, which reduces the distance between the first lens 520 and the second lens 560 and the corresponding lasers, so that the first lens 520 and the second lens 560 can be reduced. Optical parameters such as the focal length of the second lens 560. Since the size of the laser spot increases linearly with the focal length of the lens, when the focal length of the first lens 520 and the second lens 560 decreases, the laser spot passing through the first lens 520 and the second lens 560 also shrinks, and the energy is more concentrated, Thus, the laser coupling efficiency is improved.

In some embodiments of the present disclosure, when the first lens 520 and the second lens 560 are fixed on the corresponding heat sinks, the positions of the first lens 520 and the second lens 560 need to be determined, and the first lens 520 and the second lens 560 need to be determined. The position of the lens 560 can be determined by the optical parameters of the lens such as the focal length and the positions of the first laser chip 530 and the second laser chip 570. For example, the distance between the lens and the corresponding laser light-emitting surface can be the focal length of the lens, which can be determined according to the focal length of the lens. The position of the corresponding lens is determined with the position of the corresponding laser, so that the lens is fixed above the corresponding laser.

When fixing the first lens 520 and the second lens 560, the lenses can be fixed on the corresponding heat sinks by passive means, that is, using a high-precision mounter, or the relative positions of the lenses and the corresponding lasers can be aligned by means of active coupling. to achieve optical high-precision alignment of the lens with respect to the corresponding laser.

The first lens 520 and the first heat sink 510 and the second lens 560 and the second heat sink 550 are fixed with glue, and the central axes of the first lens 520 and the second lens 560 are guaranteed to be respectively aligned with the first laser chip 530 Coinciding with the central axis of the second laser chip 570 , the signal beams emitted by the first laser chip 530 and the second laser chip 570 all enter the first lens 520 and the second lens 560 . In an example, the glue includes, but is not limited to, silver glue, UV glue, epoxy glue, UV epoxy glue, and the like.

The first lens 520 and the second lens 560 can both be point-to-point converging lenses, and the first laser chip 530 and the second laser chip 570 emit signal beams that are consistent with the light transmission direction of the tube cap 502 , for example, the main optical axis of the emission is perpendicular to the tube base 501 . The signal beam is converted into condensed light through a point-to-point condensing lens, and the condensed light is coupled into an external optical fiber through a flat window, realizing the purpose of coupling the laser to the optical fiber.

The first lens 520 and the second lens 560 can also be both collimating lenses, and the first laser chip 530 and the second laser chip 570 emit a signal beam that is consistent with the light transmission direction of the tube cap 502, for example, the main optical axis of the emission is perpendicular to the tube seat. The signal beam of 501 is converted into a collimated beam through a collimating lens, and the collimated beam is emitted through a flat window. A corresponding condensing lens can be arranged between the cap 502 and the external optical fiber, and the collimated light beam is converted into a condensing light beam through the condensing lens, and the condensed light beam is coupled into the external optical fiber, so as to realize the purpose of coupling the laser light to the optical fiber.

In an example, the materials of the first lens 520 and the second lens 560 mainly include glass, silicon, and plastic PEI (Polyetherimide, polyetherimide).

FIG. 8 and FIG. 9 are partial structural schematic diagrams of the light emitting device provided by the embodiments of the present disclosure, respectively. In some embodiments of the present disclosure, FIG. 8 is a view of the dual-emitting component and the TEC provided by the embodiments of the present disclosure. A schematic structural diagram of the relative positional relationship, FIG. 9 is a schematic structural schematic diagram of the relative positional relationship between the dual-emitting component and the TEC provided by the embodiment of the present disclosure from another perspective, and it can be clearly shown from FIGS. 8 and 9 that the first heat sink 510 is arranged on the surface of a heat exchange surface of the TEC540, the second heat sink 550 is arranged on the side of the TEC540, the first heat sink 510 is in direct contact with a heat exchange surface of the TEC540, and there is a certain distance between the second heat sink 550 and the side of the TEC540. distance, the heat of the first heat sink 510 and the second heat sink 550 is dissipated through the TEC 540 .

FIG. 10 is a schematic structural diagram of a first light emitting assembly according to an embodiment of the present disclosure, and FIG. 11 is a structural schematic diagram of a first heat sink in the first light emitting assembly according to an embodiment of the present disclosure. As can be seen from FIG. 11 , the first heat sink 510 in the present disclosure includes a first stepped surface 511 , a second stepped surface 512 , a third stepped surface 513 , and is located between the first stepped surface 511 and the second stepped surface 512 The first side 514 and the second side 515 located between the second step surface 512 and the third step surface 513, the first step surface 511, the second step surface 512 and the third step surface 513 are arranged in a stepped shape, the first The height of the stepped surface 511 is greater than the heights of the second stepped surface 512 and the third stepped surface 513 , and the height of the second stepped surface 512 is greater than the height of the third stepped surface 513 . The first stepped surface 511 , the second stepped surface 512 , and the third stepped surface 513 are parallel to the upper surface of the TEC 540 . As shown in FIG. 10 , the first side 514 is used to carry the first lens 520 , the first lens 520 is pasted on the first side 514 by glue, and the second side 515 is used to carry the first laser chip 530 . In some embodiments, the first carrier board 516 has a certain thickness, which is adhered to the second side 515 by glue, and the first laser chip 530 is adhered to the bearing surface of the first carrier board 516 by glue. The glue can be UV glue, epoxy glue, etc., which has a certain fluidity. After the first lens 520 is pasted with glue, the flowing glue will overflow, and the first carrier plate 516 with a certain thickness can carry a certain amount of overflow. glue to avoid contamination of the light path.

FIG. 12 is a schematic structural diagram of a second light emitting assembly according to an embodiment of the present disclosure, and FIG. 13 is a structural schematic diagram of a second heat sink in the second light emitting assembly according to an embodiment of the present disclosure. As can be seen from FIG. 13 , the second heat sink 550 in the present disclosure includes a fourth stepped surface 551 , a fifth stepped surface 552 , a sixth stepped surface 553 , and a space between the fourth stepped surface 551 and the fifth stepped surface 552 . The third side 554 and the fourth side 555 located between the fifth step surface 552 and the sixth step surface 553, the fourth step surface 551, the fifth step surface 552, and the sixth step surface 553 are arranged in a step shape, and the fourth step surface The height of the surface 551 is greater than the height of the fifth stepped surface 552 and the height of the sixth stepped surface 553 The height of the fifth stepped surface 552 is greater than that of the sixth stepped surface 553 . As shown in FIG. 12 , the third side 554 is used to carry the second lens 560 , the second lens 560 is pasted on the third side 554 by glue, and the fourth side 555 is used to carry the second laser chip 570 . In some embodiments, there is a second carrier 556 between the second laser chip 570 and the fourth side 555, which is pasted on the fourth side 555 by glue, and the second laser chip 570 is pasted on the second carrier 556 by glue. on the bearing surface. The glue can be UV glue, epoxy glue, etc. In some embodiments of the present disclosure, in addition to the structure of the fourth step surface 551 , the fifth step surface 552 , the sixth step surface 553 , the third side surface 554 and the fourth side surface 555 , the second heat sink is formed on the third side surface 554 . There is a groove 556 between the fifth step surface 552, the groove 556 connects the third side surface 554 and the fifth step surface 552, and the groove 556 is arranged to carry the glue overflowed for pasting the second lens 560 to avoid contamination of the optical path. .

It should be noted that, in the embodiment of the present disclosure, the first heat sink 510 does not have a groove for carrying the overflowing glue, and the second heat sink 550 has a groove for carrying the overflowing glue, which is based on the first load in the first heat sink 510 The thickness of the board is greater than the thickness of the second carrier board in the second heat sink 550, the first carrier board in the first heat sink 510 can carry a certain amount of overflowing glue, and the second heat sink 550 carries a certain amount of overflowing glue through the groove. glue. Of course, in order to better carry the glue and avoid light path pollution, the first heat sink 510 can also be provided with grooves. Therefore, whether the first heat sink 510 is provided with a groove for carrying the overflowing glue or not and the second heat sink 550 is provided with a groove for carrying the overflowing glue. Whether or not the slot is not belongs to the protection scope of the embodiments of the present disclosure. In some embodiments, both the first heat sink 510 and the second heat sink 550 may be provided with grooves, and in some embodiments, both the first heat sink 510 and the second heat sink 550 may not be provided with grooves, in some embodiments The first heat sink 510 may be provided with grooves, and the second heat sink 550 may not be provided with grooves.

FIG. 14 is a schematic structural diagram of a TEC in a light emitting device provided in an embodiment of the present disclosure. On the one hand, the light-emitting device is prone to generate heat when it emits light signals, and the heat generated in the process of emitting light signals can be absorbed and exported through a TEC (Thermoelectric Cooler). On the other hand, in some embodiments, when the first laser chip 530 is an EML laser and the second laser chip 570 is a DFB laser, since the center wavelength and output power of the EML laser are affected by the operating temperature, it is necessary to maintain the EML To stabilize the laser center wavelength and output power, the temperature of the EML laser needs to be controlled. Therefore, the EML laser requires higher temperature control than the DFB laser. Therefore, the lower surface of the first laser chip 530 is directly placed on the upper surface of the TEC. The upper surface of the TEC is a heat exchange surface; and at the same time, a thermistor 517 is arranged at the attachment of the first laser chip 530. When the temperature of the first laser chip 530 changes, the thermistor 517 can feedback the temperature change to the TEC driver. In the above, the TEC 540 is controlled by the TEC driver to perform cooling or heating, so that the temperature of the first laser chip 530 is kept constant, thereby realizing precise temperature control of the first laser chip 530 on a microscopic level. The specific process is: obtaining the current resistance value of the thermistor 517, obtaining the thermistor temperature corresponding to the current resistance value according to the pre-stored thermistor temperature-resistance value mapping relationship, and comparing the thermistor temperature with the preset temperature The target temperature is compared, and when the thermistor temperature is higher than the target temperature, a signal is sent to the TEC driver to cool the TEC540, thereby reducing the temperature of the first laser chip 530; when the thermistor temperature is lower than the target temperature, it sends a signal to the TEC driver. Send a signal to make the TEC 540 heat up, thereby increasing the temperature of the first laser chip 530 and ensuring the stability of the lower temperature of the first laser chip 530 .

It should be noted that when the second laser chip 570 in the present disclosure is a DFB laser, since the DFB laser does not have high requirements for temperature control, there is no corresponding thermistor near the second laser chip 570 in the implementation of the present disclosure. Disposing a corresponding thermistor near the laser chip 570 also falls within the protection scope of the embodiments of the present disclosure.

In the embodiment of the present disclosure, when the obtained sampling temperature of the thermistor 517 is higher than the target temperature, a temperature adjustment signal represented by a positive level is generated to make the TEC 540 absorb heat; when the obtained sampling temperature of the thermistor 517 is low At the target temperature, a temperature adjustment signal marked with a negative level is generated to make the TEC 540 emit heat; when the obtained sampling temperature of the thermistor 517 is equal to the target temperature, a temperature adjustment signal marked with a zero level is generated to keep the TEC in the current state. Signal. The TEC driver converts each of the above temperature adjustment signals into voltage signals that control the flow of current. When the temperature adjustment signal is represented by a positive level, the TEC540 outputs a forward bias voltage signal whose current flow is positive; when the temperature adjustment signal is represented by a negative level, the TEC540 outputs a reverse bias voltage signal whose current flow is negative . When the temperature adjustment signal is at zero level, the TEC540 outputs a stable voltage signal that maintains the current current flow.

When the received voltage signal is a forward bias voltage signal, the current of the TEC540 flows in the forward direction, and cooling is performed to cool the first laser chip 530 and the thermistor 517 to reduce the voltage of the first laser chip 530 and the thermistor 517 temperature; when the received voltage signal is a reverse bias voltage, the current flow of the TEC540 is reversed, heating is performed, the first laser chip 530 and the thermistor 517 are heated, and the first laser chip 530 and the thermal resistance are increased. The temperature of the sensitive resistor 517; when the received voltage signal is a stable voltage signal, the TEC540 maintains the current current flow.

In the embodiment of the present disclosure, as shown in FIG. 14 , the TEC in the present disclosure includes an upper substrate and an electrode column, the surface of the upper substrate has a thermally conductive area and a thermal insulation area, and the surface of the thermal insulation area is provided with a TEC positive electrode 541 and a TEC negative electrode 542 , and the TEC positive electrode 541 and the TEC negative electrode 542 are electrically connected to the upper end of the electrode column. In the present disclosure, the TEC electrode originally set by adding a wire-bonding column is adjusted to be arranged on the surface of the upper substrate of the TEC. Increase the size of the TEC; on the other hand, setting the TEC electrode on the surface of the upper substrate makes it easier to perform gold wire bonding, especially for optical modules with deep cavity structures.

Due to the high requirements for TEC gold wire bonding, the traditional method is to increase the wire-bonding column, and set the positive and negative electrodes of the TEC on the additional substrate. However, this method must increase the size of the TEC. In this disclosure, the original setting will be The TEC anode and cathode on the additional substrate are arranged on the upper surface of the TEC540, which can reduce the TEC volume, increase the TEC integration, and make gold wire bonding easier, especially for optical modules with deep cavity structures.

Meanwhile, the positive electrode of the TEC and the negative electrode of the TEC are arranged in the adiabatic area, which can prevent the heat of the substrate on the TEC from being conducted to the socket through the gold wire or thermally conducting with the electrodes of the circuit board. Therefore, the optical module provided by the embodiments of the present disclosure can reduce the size of the TEC to increase the integration of the TEC, and at the same time facilitate gold wire bonding.

FIG. 15 is a schematic structural diagram of an adapter column of a light emitting device provided in an embodiment of the present disclosure. In the present disclosure, an adapter post 580 and a ceramic substrate 590 are provided to achieve electrical connection. Refer to FIG. 15 for the structure of the transfer post, and refer to FIG. 7 for the structure of the ceramic substrate 590 . The transfer post 580 is a metal transfer post, and the overall structure of the transfer post 580 is a conductor; the ceramic substrate 590 is made of a ceramic material. As shown in FIG. 15 , the via post 580 includes a first metal layer 581 , a second metal layer 582 and a third metal layer 583 . The first metal layer 581 is used to realize the electrical connection between the first laser chip 530 and the corresponding pins on the socket 501 , and the second metal layer 582 is used to realize the electrical connection between the second laser chip 570 and the corresponding pins on the socket 501 . For connection, the third metal layer 583 is used to realize the electrical connection between the thermistor 517 and the corresponding pins on the socket 501 .

The first metal layer 581 includes a first metal region 5811 , a second metal region 5812 and a third metal region 5813 , two ends of the first metal region 5811 are connected to the second metal region 5812 and the third metal region 5813 , and the second metal region 5812 , the first metal region 5811 and the third metal region 5813 are sequentially connected to form the first metal layer 581, the second metal region 5812, the first metal region 5811 and the third metal region 5813 are directly connected to each other; the first metal region 5811, The second metal region 5812 and the third metal region 5813 are located on different planes of the via post 580 , that is, the first metal region 5811 , the second metal region 5812 and the third metal region 5813 are located in different dimensions of the via post 580 , increasing Flexibility and selectivity of wire bonding for each device.

The second metal layer 582 includes a fourth metal region 5821, a fifth metal region 5822 and a sixth metal region 5823. Two ends of the fourth metal region 5821 are connected to the fifth metal region 5822 and the sixth metal region 5823. The fifth metal region 5822 , the fourth metal region 5821 and the sixth metal region 5823 are sequentially connected to form the second metal layer 582, and the fifth metal region 5822, the fourth metal region 5821 and the sixth metal region 5823 are directly connected to each other; the fourth metal region 5821, The fifth metal region 5822 and the sixth metal region 5823 are located on different planes of the via post 580 , that is, the fourth metal region 5821 , the fifth metal region 5822 and the sixth metal region 5823 are located in different dimensions of the via post 580 , increasing Flexibility and selectivity of wire bonding for each device.

The third metal layer 583 may be obtained by laying a metal layer on the top surface of the transfer post 580 .

The transfer post 580 in the embodiment of the present disclosure can realize the wire bonding transfer of the first laser, the second laser and the thermistor at the same time, the first metal layer 581 and the second metal layer 582 are folded and arranged, the third metal layer The 583 is arranged on the top surface to obtain a three-dimensional structure of the transfer column, which can save space, do not need to occupy a large space, has high integration, and at the same time can increase the flexibility and selectivity of wiring of each device.

The first metal region 5811, the second metal region 5812 and the third metal region 5813, the fourth metal region 5821, the fifth metal region 5822 and the sixth metal region 5823, and the third metal layer 583 may be the first laying gold layer, respectively , second laying gold layer, third laying gold layer, fourth laying gold layer, fifth laying gold layer, sixth laying gold layer and seventh laying gold layer, first laying gold layer, second laying gold layer, third laying gold layer The surfaces of the third gold layer, the fourth gold layer, the fifth gold layer, the sixth gold layer and the seventh gold layer are etched with functional circuits; and the first metal area 5811, the second metal area 5812 and the The three metal regions 5813, the fourth metal region 5821, the fifth metal region 5822 and the sixth metal region 5823, and the insulating layers are all provided between the third metal layer 583 and the transfer post 580, the first metal region 5811, the second metal The regions 5812, the third metal region 5813, the fourth metal region 5821, the fifth metal region 5822 and the sixth metal region 5823 are in contact with the via post 580 and have a first insulating layer, a second insulating layer, and a third insulating layer, respectively. layer, fourth insulating layer, fifth insulating layer, sixth insulating layer and seventh insulating layer, first insulating layer, second insulating layer, third insulating layer, fourth insulating layer, fifth insulating layer, sixth insulating layer The layer and the seventh insulating layer may be ceramic regions attached to the corresponding metal regions for insulation.

In some embodiments of the present disclosure, the transfer column 580 in the present disclosure is a three-dimensional transfer column. Since the height and depth of the first heat sink and the second heat sink are different on the surface of the tube base, the transfer column 580 can be To realize the wire-bonding connection of optoelectronic devices with different directions and dimensions, the arrangement of the transfer post 580 can realize that the wire-bonding length is short and the bonding wires do not cross each other.

The surface of the socket 501 has different types of pins to realize the electrical connection of the optoelectronic device. Referring to FIG. 7, as shown in FIG. 7, the surface of the socket 501 is provided with a first laser pin 5011, a second laser pin 5012, Thermistor pin 5013, TEC positive pin 5014, TEC negative pin 5015, the positive electrode of the first laser chip 530 is connected to the first laser pin 5011 through the transfer wire of the first metal layer 581, and the second laser chip The positive electrode of 570 is connected to the second laser pin 5012 through the transfer wire of the second metal layer 582, the thermistor 517 is connected to the thermistor pin 5013 through the transfer wire of the third metal layer 583, and the TEC positive electrode 541 The TEC negative terminal 542 and the TEC negative terminal 542 can be directly wired to the TEC positive terminal 5014 and the TEC negative terminal 5015. 7 also shows that the surface of the tube base 501 has a support column 5016, and the support column 5016 and the tube base 501 are integrally formed. On the one hand, the support column 5016 can support the ceramic substrate 590 and increase the stability of the ceramic substrate 590; In one aspect, since the support column 5016 is integrally formed with the socket 501, the support column 5016 can also realize the ground connection of the optoelectronic device.

FIG. 16 is one of the schematic diagrams of wire bonding of each structure of the light emitting device provided by the embodiment of the present disclosure; FIG. 17 is the second schematic diagram of the wire bonding of each structure of the light emitting device provided by the embodiment of the present disclosure; FIG. 16 is the perspective of FIG. 6 Fig. 17 is the top view of each structure in the perspective of Fig. 6; the following is a detailed description of the implementation of wire bonding between the devices with reference to Fig. 16 and Fig. 17 . In order to reduce the difficulty of wire bonding and shorten the wire bonding length, in the embodiment of the present disclosure, the surface of the first carrier board 516 has a first pad 5161 , the surface of the second carrier board 556 has a second pad 5561 , and the first metal region 5811 , second metal region 5812 and third metal region 5813, fourth metal region 5821, fifth metal region 5822 and sixth metal region 5823, and third metal layer 583, and first pad 5161, and second pad Make a wire connection between 5561. Next, combine the first metal region 5811, the second metal region 5812 and the third metal region 5813, the fourth metal region 5821, the fifth metal region 5822 and the sixth metal region 5823, the third metal layer 583, and the first pad 5161, and the second pad 5561 specifically describe the wire connection method.

It should be noted that the wire-bonding method in the present disclosure is based on the existing wire-bonding process, and the wire-bonding method is comprehensively selected under the requirements that the wire-bonding difficulty is not too high, the wire-bonding length is short, and the wire-bonding does not cross each other. Way.

In some embodiments, the anode of the first laser chip 530 is first connected to the first pad 5161 by wire bonding, the first pad 5161 is connected to the first metal region 5811 of the transfer post 580 by wire bonding, and the second The metal region 5812 is connected to the first laser pin 5011 by wire bonding; the positive electrode of the second laser chip 570 is connected to the second pad 5561 by wire bonding, and the second pad 5561 is connected to the second pad 5561 by wire bonding. Four metal regions 5821, the fifth metal region 5822 is connected to the second laser pin 5012 by wire bonding; the thermistor 517 is connected to the third metal layer 583 by wire bonding, and the third metal layer 583 is connected to the thermal sensor by wire bonding The resistance pin 5013; the TEC positive electrode 541 and the TEC negative electrode 542 can be directly connected to the TEC positive electrode pin 5014 and the TEC negative electrode pin 5015 by wire bonding.

In some embodiments, based on the plane where the second laser assembly is closer to the first metal region of the transfer post than the first laser assembly, that is, the depths of the first laser assembly and the second laser assembly on the surface of the tube seat are different, the first laser assembly is The position of the second laser assembly is further forward relative to the first laser assembly. In order to shorten the wire bonding distance, the positive electrode of the first laser chip 530 is first connected to the first pad 5161 by wire bonding, and the first pad 5161 is connected to the first pad 5161 by wire bonding. The third metal area 5813 of the transfer post 580 is connected to the first laser pin 5011 by the second metal area 5812 by wire bonding; the positive electrode of the second laser chip 570 is connected to the second pad 5561 by wire bonding, and is connected by the second The pad 5561 is connected to the fourth metal area 5821 of the transfer post 580 by wire bonding, and the fifth metal area 5822 is connected to the second laser pin 5012 by wire bonding; the thermistor 517 is connected to the third metal layer by wire bonding 583, the third metal layer 583 is connected to the thermistor pin 5013 by wire bonding; the TEC positive electrode 541 and the TEC negative electrode 542 can be directly connected to the TEC positive electrode pin 5014 and the TEC negative electrode pin 5015 by wire bonding.

In the present disclosure, the thermistor 517 and the first laser chip 530 share the first carrier board 516. The thermistor 517 is wired to the transfer post 580 first, and the transfer post 580 is ensured to be connected to the thermal The thermistor pin 5013 avoids the temperature of the thermistor 517 being directly connected to the heat dissipation surface, resulting in the temperature of the thermistor 517 being slightly lower than the actual temperature due to heat dissipation, which can ensure the accuracy of the thermistor monitoring temperature.

The above content can realize the electrical connection between each device and the corresponding pin. The following describes the ground connection of each device.

The surface of the first carrier board 516 has a first ground pad 5162 and a second ground pad 5163, the surface of the second carrier board 556 has a third ground pad 5562, and the surface of the ceramic substrate 590 has a fourth ground pad 591 and The fifth ground pad 592, the fourth ground pad 591 and the fifth ground pad 592 are used for ground connection of the optoelectronic devices on the first carrier board 516 and the second carrier board 556, respectively, in certain embodiments of the present disclosure , the first laser chip 530 is wired to the first ground pad 5162, the first ground pad is wired to the fourth ground pad 591, the surface of the fourth ground pad 591 has a first through hole, and the fourth ground pad The pad 591 is connected to the support column 5016 through the first through hole by wire bonding. As mentioned above, the support column 5016 and the socket 501 are integrally formed. Therefore, the first laser chip 530 is connected to the support column 5016 by wire bonding. The ground connection of the first laser chip 530; the thermistor 517 is wired to the second ground pad 5163, the second ground pad 5163 is wired to the fifth ground pad 592, and the surface of the fifth ground pad 592 There is a second through hole, and the fifth ground pad 592 is connected to the support column 5016 through the second through hole by wire bonding. As mentioned above, the support column 5016 and the socket 501 are integrally formed, so the thermistor 517 is wired to connect to the support column 5016. On the support column 5016, the ground connection of the thermistor 517 can be realized; the second laser chip 570 is wired to the third ground pad 5562, the third ground pad 5562 is wired to the fifth ground pad 592, and the second laser chip 570 is wired to the third ground pad 5562. The surface of the fifth grounding pad 592 has a second through hole, and the fifth grounding pad 592 is connected to the support column 5016 through the second through hole by bonding wires. As mentioned above, the support column 5016 and the socket 501 are integrally formed, so the first The two laser chips 570 are connected to the support column 5016 by wire bonding, so that the ground connection of the second laser chip 570 can be realized.

FIG. 18 is a schematic structural diagram of a socket of a light emitting device according to an embodiment of the present disclosure. As shown in FIG. 18 , the side surface of the tube base 501 has a protruding positioning column 5017 , and the positioning column 5017 is perpendicular to the surface of the tube base 501 . In the actual package, the socket 501 and each pin set on the socket 501 need to be placed on the fixture horizontally, and the positioning column 5017 can provide a reference plane for the horizontal installation of the socket 501 and each pin set on the socket 501, When the positioning column 5017 is horizontal, it means that the position of each pin set on the tube seat 501 and the tube seat 501 is correct on the fixture, thereby ensuring the levelness of the tube seat 501 and each pin set on the tube seat 501; On the basis of the levelness of the seat 501, the verticality of the first heat sink and the second heat sink can be ensured; and when the positioning column 5017 is horizontal, the coupling level of the first lens 520 and the second lens 560 can be ensured at the same time, that is, the positioning column 5017 Parallel to the first lens 520 and the second lens 560, the parallelism between the positioning column 5017 and the first lens 520 and the second lens 560 can be collected by an instrument.

The positioning column 5017 can be used as a datum reference plane for adjusting the levelness of the tube base and the surface pins of the tube base. The positioning column 5017 can ensure the levelness of the tube base and the surface pins of the tube base, and can also ensure the levelness of the lens coupling, and While the levelness of the tube base and the pins on the surface of the tube base is guaranteed, the levelness of the lens coupling can be further ensured. The positioning column 5017 provides a reference plane for positioning the tube base, the first lens and the second lens to realize the side surface of the tube base, The plane where the light-emitting direction of the first lens is located and the plane where the light-emitting direction of the second lens is located are parallel to each other. Therefore, the socket in the present disclosure has a horizontal positioning function.

In some embodiments of the present disclosure, the positioning post 5017 includes a groove and a protruding part, the groove is provided on the side of the socket, and the protruding part extends along the groove.

The positioning column 5017 is a protruding structure of the tube base 501 , which can increase the size of the tube base 501 , thereby increasing the heat dissipation capability of the tube base.

It is to be understood that the present disclosure is not limited to the precise structures described above and illustrated in the accompanying drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

An optical module, characterized in that it includes:

circuit board;

a light emitting device, electrically connected to the circuit board, for converting an electrical signal into an optical signal;

Wherein, the light emitting device includes:

A socket with a plurality of pins on the surface;

The first emitting component is arranged on the surface of the tube base, and includes a first heat sink, a first lens and a first laser component, the first heat sink has a first side surface and a second side surface, and the first lens is arranged on the On the first side, the first laser assembly is disposed on the second side;

A second emitting component, disposed on the surface of the tube base, includes a second heat sink, a second lens and a second laser component, the second heat sink has a third side surface and a fourth side surface, and the second lens is disposed on the On the third side, the second laser assembly is arranged on the fourth side;

An adapter column is arranged on the surface of the tube seat, and is used to electrically connect the first laser assembly and the second laser assembly to the pins on the tube seat respectively.
The optical module according to claim 1, wherein the first heat sink comprises a first stepped surface, a second stepped surface and a third stepped surface, and the first side surface is connected to the first stepped surface and the third stepped surface. The second step surface, the second side surface is connected to the second step surface and the third step surface, the first lens is attached to the first side surface, and the first laser component is attached to the on the second side;

The second heat sink includes a fourth step surface, a fifth step surface and a sixth step surface, the third side surface connects the fourth step surface and the fifth step surface, and the fourth side surface connects the the fifth step surface and the sixth step surface, the second lens is attached to the third side surface, and the second laser component is attached to the fourth side surface;

There is a groove between the third side surface and the fifth step surface, and the groove is used for receiving the glue overflowing when the second lens is pasted.
The optical module according to claim 1, wherein the first laser assembly comprises a first laser chip and a first carrier, the second laser assembly comprises a second laser chip and a second carrier, and the The central axis of the first lens coincides with the central axis of the first laser chip, and the central axis of the second lens coincides with the central axis of the second laser chip.
The optical module according to claim 3, wherein the distance between the first lens and the light-emitting surface of the first laser chip is the focal length of the first lens, and the second lens and the second laser The distance from the light-emitting surface of the chip is the focal length of the second lens.
The optical module according to claim 1, wherein the light emitting device further comprises:

a tube cap, which is covered on the tube base, and a light-transmitting light window is arranged on the tube cap for transmitting the light beam;

The light window is provided with a flat glass, and the light beams emitted by the first lens and the second lens directly pass through the flat glass.
The optical module according to claim 3, wherein the first lens is a collimating lens for converting the signal beam emitted by the first laser chip into a collimating beam; the second lens is a collimating lens; The collimating lens is used for converting the signal beam emitted by the second laser chip into a collimated beam.
The optical module according to claim 3, wherein a thermistor is provided on the first carrier board adjacent to the first laser chip for monitoring the operating temperature of the first laser chip.
The optical module according to claim 1, characterized in that, a support column is provided on the surface of the tube base for realizing the ground connection of the first laser assembly and the second laser assembly.
The optical module according to claim 7, wherein the surface of the socket has a first laser pin, a second laser pin, a thermistor pin and a TEC pin;

The positive electrode of the first laser chip is connected to the first laser pin through the transfer post, and the positive electrode of the second laser chip is connected to the second laser tube through the transfer post. pin, the thermistor pin is connected to the thermistor pin through the connecting post, and the TEC pin is connected to the TEC pin.
The optical module according to claim 9, wherein the surface of the first carrier has a first pad, the surface of the second carrier has a second pad, and the surface of the socket is further provided with a ceramic substrate ;

There is a first bonding wire between the positive electrode of the first laser chip and the first pad, a second bonding wire between the first bonding pad and the transfer post, and the transfer post and the first bonding pad. There is a third bonding wire between the pins of a laser;

There is a fourth bonding wire between the positive electrode of the second laser chip and the second pad, and a fifth bonding wire between the second bonding pad and the transfer post, and the transfer post is connected to the first wire. There is a sixth wire between the two laser pins;

The surface of the first carrier has a first ground pad and the second ground pad, the second carrier has a third ground pad, and the surface of the ceramic substrate has a fourth ground pad and a fifth ground pad ground pad;

A seventh bonding wire is arranged between the negative electrode of the first laser chip and the first ground pad, and an eighth bonding wire is arranged between the first ground pad and the fourth ground pad;

A ninth bonding wire is arranged between the thermistor and the second ground pad, and a tenth bonding wire is arranged between the second ground pad and the fifth ground pad;

An eleventh bonding wire is formed between the negative electrode of the second laser chip and the third grounding pad, and a twelfth bonding wire is formed between the third grounding pad and the fifth grounding pad.
An optical module, characterized in that it includes:

circuit board;

a light emitting device, electrically connected to the circuit board, for converting an electrical signal into an optical signal;

Wherein, the light emitting device includes:

A socket with a plurality of pins on the surface;

The TEC is arranged on the surface of the tube base, including an upper substrate and an electrode column, the surface of the upper substrate has a thermally conductive area and a thermal insulation area, the thermal insulation area is provided with a TEC positive electrode and a TEC negative electrode, and the TEC positive electrode and the TEC negative electrode are connected to the TEC negative electrode. the upper end of the electrode column is electrically connected;

The emission component is arranged on the heat conduction area of the surface of the TEC, and includes a heat sink, a lens and a laser component, the heat sink has a first side surface and a second side surface, the lens is arranged on the first side surface, and the laser an assembly is arranged on the second side surface;

An adapter post is arranged on the surface of the tube seat and is used to electrically connect the pins on the tube seat of the first laser assembly.
The optical module according to claim 11, wherein the TEC positive electrode and the TEC negative electrode are electrically connected to the bottom surface of the upper substrate along the top surface and the side surface of the upper substrate, and the bottom surface of the upper substrate is connected to the bottom surface of the upper substrate. The upper ends of the electrode columns are in contact.
The optical module according to claim 11, wherein the surface of the tube base has a TEC positive electrode pin and a TEC negative electrode pin, the TEC positive electrode is connected to the TEC positive electrode pin, and the TEC negative electrode is connected to the TEC positive electrode pin. wire to the TEC negative pin.
The optical module according to claim 11, wherein the first laser assembly includes a first laser chip and a first carrier board, the second laser assembly includes a second laser chip and a second carrier board, and the The surface of the header has a ceramic substrate, the surface of the first carrier has a first pad, and the surface of the second carrier has a second pad;

There is a first bonding wire between the anode of the first laser chip and the first pad, and a second bonding wire between the first bonding pad and the transfer post, and the transfer post and the first laser There is a third wire between the pins;

A fourth wire is formed between the anode of the second laser chip and the second pad, and a fifth wire is formed between the second pad and the transfer post, and the transfer post and the second laser There is a sixth wire between the pins;

The surface of the first carrier board has a first ground pad and the second ground pad, the second carrier board has a third ground pad, and the surface of the ceramic substrate has a fourth ground pad and a fifth ground pad ground pad;

A seventh bonding wire is arranged between the negative electrode of the first laser chip and the first ground pad, and an eighth bonding wire is arranged between the first ground pad and the fourth ground pad;

A ninth bonding wire is arranged between the thermistor and the second ground pad, and a tenth bonding wire is arranged between the second ground pad and the fifth ground pad;

An eleventh bonding wire is formed between the negative electrode of the second laser chip and the third grounding pad, and a twelfth bonding wire is formed between the third grounding pad and the fifth grounding pad.
The optical module according to claim 14, wherein the central axis of the first lens is coincident with the central axis of the first laser chip, and the central axis of the second lens is coincident with the central axis of the second laser chip. The central axes coincide.
The optical module according to claim 14, wherein the distance between the first lens and the light-emitting surface of the first laser chip is the focal length of the first lens, and the second lens and the second laser The distance from the light-emitting surface of the chip is the focal length of the second lens.
The optical module according to claim 11, wherein the light emitting device further comprises:

a tube cap, which is covered on the tube base, and a light-transmitting light window is arranged on the tube cap for transmitting the light beam;

The light window is provided with a flat glass, and the light beams emitted by the first lens and the second lens directly pass through the flat glass.
The optical module according to claim 11, wherein the first lens is a collimating lens for converting the signal beam emitted by the first laser chip into a collimating beam; the second lens is a collimating lens; The collimating lens is used for converting the signal beam emitted by the second laser chip into a collimated beam.
An optical module, characterized in that it includes:

circuit board;

a light emitting device, electrically connected to the circuit board, for converting an electrical signal into an optical signal;

Wherein, the light emitting device includes:

A socket with a plurality of pins on the surface;

TEC, arranged on the surface of the socket;

A first emitting component, arranged on the surface of the TEC, includes a first heat sink, a first lens and a first laser component, the first heat sink has a first side surface and a second side surface, and the first lens is arranged on the On the first side, the first laser assembly is arranged on the second side;

A second emitting component, disposed on the side of the TEC, includes a second heat sink, a second lens, and a second laser component, the second heat sink has a third side and a fourth side, and the second lens is disposed on the On the third side, the second laser assembly is arranged on the fourth side;

An adapter post, arranged on the surface of the tube seat, is used to electrically connect the first laser assembly and the second laser assembly to the pins on the tube seat respectively, including a first metal layer and a second metal layer and a third metal layer, the first metal layer includes a first metal area, a second metal area and a third metal area that are connected to each other and are arranged on different planes of the transfer post, the second metal layer includes and are arranged on the fourth metal area, the fifth metal area and the sixth metal area on different planes of the transfer post, and the first metal layer is used to connect the first laser component and the corresponding tube on the tube seat The second metal layer is used for connecting the second laser component and the corresponding pins on the socket.
The optical module according to claim 19, wherein the first laser assembly includes a first laser chip and a first carrier, and the second laser assembly includes a second laser chip and a second carrier.
The optical module according to claim 20, wherein the surface of the first carrier has a first pad, and the surface of the second carrier has a second pad;

The positive electrode of the first laser chip is connected to the first pad, the first pad is connected to the first metal region, and the second metal region is connected to the first laser on the pin;

The positive electrode of the second laser chip is connected to the second pad, the second pad is connected to the fourth metal region, and the fifth metal region is connected to the second laser on the pin;

The surface of the first carrier board has a first ground pad and the second ground pad, the second carrier board has a third ground pad, and the surface of the ceramic substrate has a fourth ground pad and a fifth ground pad plate;

The negative electrode of the first laser chip is connected to the first ground pad, and the first ground pad is connected to the fourth ground pad;

The negative electrode of the second laser chip is connected to the third ground pad by wire bonding, and the third ground pad is connected to the fifth ground pad by wire bonding.
The optical module according to claim 20, wherein the surface of the first carrier has a first pad, the surface of the second carrier has a second pad, and the second laser assembly is opposite to the the first laser assembly is closer to the plane where the first metal region of the transfer post is located;

The positive electrode of the first laser chip is connected to the first pad, the first pad is connected to the third metal region, and the second metal region is connected to the first laser on the pin;

The positive electrode of the second laser chip is connected to the second pad, the second pad is connected to the fourth metal region, and the fifth metal region is connected to the second laser on the pin;

The surface of the first carrier board has a first ground pad and the second ground pad, the second carrier board has a third ground pad, and the surface of the ceramic substrate has a fourth ground pad and a fifth ground pad plate;

The negative electrode of the first laser chip is connected to the first ground pad, and the first ground pad is connected to the fourth ground pad;

The negative electrode of the second laser chip is connected to the third ground pad by wire bonding, and the third ground pad is connected to the fifth ground pad by wire bonding.
The optical module according to claim 20, wherein the central axis of the first lens is coincident with the central axis of the first laser chip, and the central axis of the second lens is coincident with the central axis of the second laser chip. The central axes coincide.
The optical module according to claim 20, wherein the distance between the first lens and the light-emitting surface of the first laser chip is the focal length of the first lens, and the second lens and the second laser The distance from the light-emitting surface of the chip is the focal length of the second lens.
The optical module according to claim 19, wherein the light emitting device further comprises: a tube cap, which is covered on the tube base, and a light-transmitting light window is provided on the tube cap, which is used for For transmitting the light beam, the light window is provided with a flat glass, and the light beams emitted by the first lens and the second lens directly pass through the flat glass.
The optical module according to claim 19, wherein the first lens is a collimating lens for converting the signal beam emitted by the first laser component into a collimating beam; the second lens is a collimating lens; The collimating lens is used for converting the signal beam emitted by the second laser assembly into a collimated beam.
An optical module, characterized in that it includes:

circuit board;

a light emitting device, electrically connected to the circuit board, for converting an electrical signal into an optical signal;

Wherein, the light emitting device includes:

The tube seat has a plurality of pins on the surface and a positioning column protruding on the side surface, the plane where the extension end of the positioning column is located is located on the lower surface of the tube seat, and the positioning column is used for positioning the tube seat, the first lens and the first lens. The second lens provides a reference plane to realize that the side surface of the tube seat, the plane where the light-emitting direction of the first lens is located, and the plane where the light-emitting direction of the second lens is located are parallel to each other;

A first emitting component, disposed on the upper surface of the tube base, includes a first heat sink, the first lens and a first laser component, the first heat sink has a first side surface and a second side surface, the first The lens is arranged on the first side surface, and the first laser component is arranged on the second side surface;

A second emitting component, disposed on the upper surface of the tube base, includes a second heat sink, the second lens and a second laser component, the second heat sink has a third side and a fourth side, the second The lens is arranged on the third side, and the second laser assembly is arranged on the fourth side;

An adapter column is arranged on the surface of the tube seat, and is used to electrically connect the first laser assembly and the second laser assembly to the pins on the tube seat respectively.
The optical module according to claim 27, wherein the positioning column comprises a groove and a protruding part, the groove is provided on the side surface of the socket, and the protruding part extends along the groove.
The optical module of claim 27, wherein the first laser assembly includes a first laser chip, and the second laser assembly includes a second laser chip.
The optical module according to claim 29, wherein the central axis of the first lens is coincident with the central axis of the first laser chip, and the central axis of the second lens is coincident with the central axis of the second laser chip. The center axis coincides;

The distance between the first lens and the light-emitting surface of the first laser chip is the focal length of the first lens, and the distance between the second lens and the light-emitting surface of the second laser chip is the focal length of the second lens.
The optical module according to claim 27, wherein the light emitting device further comprises:

a tube cap, which is covered on the tube base, and a light-transmitting light window is arranged on the tube cap for transmitting the light beam;

The light window is provided with a flat glass, and the light beams emitted by the first lens and the second lens directly pass through the flat glass.
The optical module according to claim 29, wherein the first lens is a collimating lens for converting the signal beam emitted by the first laser chip into a collimating beam; the second lens is a collimating lens; The collimating lens is used for converting the signal beam emitted by the second laser chip into a collimated beam.