CN114094473B - Liquid cooling device - Google Patents

Liquid cooling device Download PDF

Info

Publication number
CN114094473B
CN114094473B CN202011157971.9A CN202011157971A CN114094473B CN 114094473 B CN114094473 B CN 114094473B CN 202011157971 A CN202011157971 A CN 202011157971A CN 114094473 B CN114094473 B CN 114094473B
Authority
CN
China
Prior art keywords
liquid
cooling
cooled
power supply
box body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202011157971.9A
Other languages
Chinese (zh)
Other versions
CN114094473A (en
Inventor
王世锋
符庆明
陈国峰
孙锐羽
李永伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Jingdong Century Trading Co Ltd
Beijing Jingdong Shangke Information Technology Co Ltd
Original Assignee
Beijing Jingdong Century Trading Co Ltd
Beijing Jingdong Shangke Information Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Jingdong Century Trading Co Ltd, Beijing Jingdong Shangke Information Technology Co Ltd filed Critical Beijing Jingdong Century Trading Co Ltd
Priority to CN202011157971.9A priority Critical patent/CN114094473B/en
Publication of CN114094473A publication Critical patent/CN114094473A/en
Application granted granted Critical
Publication of CN114094473B publication Critical patent/CN114094473B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02BBOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/56Cooling; Ventilation
    • H02B1/565Cooling; Ventilation for cabinets
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02BBOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/20Bus-bar or other wiring layouts, e.g. in cubicles, in switchyards
    • H02B1/202Cable lay-outs

Abstract

The embodiment of the application provides a liquid cooling device, which comprises a box body, a power supply system arranged in the box body, a first cooling liquid and a heat exchanger; the power supply system is used for supplying power to equipment to be cooled, which is arranged in the box body, and the equipment to be cooled generates heat when being electrified; the first cooling liquid is filled in the box body and used for conducting heat emitted by the equipment to be cooled, which is wrapped by the first cooling liquid; the heat exchanger is positioned at the bottom of the box body and immersed in the first cooling liquid and used for cooling the first cooling liquid.

Description

Liquid cooling device
Technical Field
The application relates to the technical field of heat dissipation, and relates to a liquid cooling device.
Background
Currently, most servers and internet data centers (Internet Data Center, IDC) on the market use air cooling to dissipate heat. With the rapid development of technologies such as 5G, artificial intelligence, virtual reality, etc., demands for computing power are increasing, and therefore, power consumption of chips is also increasing. The power consumption of the Intel new generation central processing unit (Central Processing Unit, CPU) is already 300W, approaches the limit of air cooling and fever reduction, and the air cooling and fever reduction can not be realized along with the appearance of chips with higher power consumption in the future. In addition, country, local and industry are going out of the energy policy successively, strict requirements are put on power utilization efficiency (Power Usage Effectiveness, PUE) of the internet data center, and with the rapid increase of CPU power consumption, PUE values of the air-cooled machine room are hard to reach country and local regulations, so that a technology for relieving heat for chips with higher power consumption in the future, which meets the PUE, needs to be studied.
Disclosure of Invention
In view of this, embodiments of the present application provide a liquid cooling device.
The technical scheme of the application is realized as follows:
the embodiment of the application provides a liquid cooling device, including: the device comprises a box body, a power supply system, a first cooling liquid and a heat exchanger, wherein the power supply system, the first cooling liquid and the heat exchanger are arranged in the box body;
the power supply system is used for supplying power to equipment to be cooled, which is arranged in the box body, and the equipment to be cooled generates heat when being electrified;
the first cooling liquid is filled in the box body and used for conducting heat emitted by the equipment to be cooled, which is wrapped by the first cooling liquid;
the heat exchanger is positioned at the bottom of the box body and immersed in the first cooling liquid and used for cooling the first cooling liquid.
In some embodiments, the power supply system includes: a power supply busbar and a centralized power management system;
the power supply busbar is respectively connected with the heat exchanger and the centralized power supply management system;
the power supply busbar and the centralized power management system are used for providing strong current and weak current required by the operation of the equipment to be cooled, wherein a connecting cable of the strong current is positioned at the bottom of the equipment to be cooled; the connection cable of weak current is located at the top of the device to be cooled.
In some embodiments, the liquid cooling apparatus further comprises: a fixed structure;
the equipment to be cooled is fixedly connected or detachably connected to the inside of the box body through the fixing structure.
In some embodiments, the liquid cooling apparatus further comprises: a wire arranging frame;
the wire arranging frame is provided with a cavity, and at least one side surface of the wire arranging frame is of a porous structure;
the wire arranging frame is fixed at the top of at least one side face of the box body, and the weak current connecting cable passes through the porous structure and is arranged in the cavity so as to realize management of the weak current connecting cable through the porous structure and the cavity.
In some embodiments, the liquid cooling apparatus further comprises: at least one weak current interface;
the at least one weak current interface is positioned at the top of the side surface of the box body, the position of the at least one weak current interface corresponds to one end of the wire arranging frame, and the weak current interface is used for realizing weak current connection between the equipment to be cooled and external equipment.
In some embodiments, the liquid cooling apparatus further comprises: at least one set of power supply cables;
the power supply cable is located on the side face of the box body and used for supplying power to the centralized power supply management system.
In some embodiments, the first cooling liquid is an insulating liquid, the first cooling liquid comprising: a fluorinated liquid; the liquid cooling device further includes: a fluid supplementing port;
the liquid supplementing port is positioned at the top of the side surface of the box body and is used for supplementing liquid to the liquid cooling device when the liquid level of the fluorinated liquid is lower than a threshold value.
In some embodiments, the liquid cooling apparatus further comprises: a display screen;
the display screen is positioned on the outer surface of the box body and is used for displaying the state of the equipment to be cooled in the liquid cooling device.
In some embodiments, the liquid cooling apparatus further comprises: the cooling tower and the cooling liquid distribution unit are positioned outside the box body;
the cooling tower with cold liquid distribution unit passes through first pipeline connection, cold liquid distribution unit with heat exchanger in the box passes through the second pipeline connection, wherein, first pipeline includes: first inlet tube and first wet return, the second pipeline includes: the second water inlet pipe and the second water return pipe are internally filled with a second cooling liquid;
the second cooling liquid is returned to the cold liquid distribution unit through the second water return pipe, and is returned to the cooling tower through the first water return pipe, so that the second cooling liquid is cooled;
and conveying the cooled second cooling liquid to the cold liquid distribution unit through the first water inlet pipe, adjusting the temperature of the cooled second cooling liquid to be a preset temperature through the cold liquid distribution unit, and conveying the second cooling liquid with the preset temperature to the heat exchanger through the second water inlet pipe so as to realize cooling treatment of the first cooling liquid through the second cooling liquid with the preset temperature.
In some embodiments, the liquid cooling apparatus further comprises: a control unit;
the control unit is respectively connected with the cold liquid distribution unit and the cold tower, and is used for controlling the working states of the cold liquid distribution unit and the cold tower according to the temperature of the second cooling liquid at the current moment acquired by the acquisition unit.
The liquid cooling device that this embodiment provided, because the inside heat exchanger and the first coolant that have of liquid cooling device, and the heat exchanger submergence is in first coolant for carry out the cooling to first coolant and handle, so, can improve the heat exchange efficiency of heat exchanger and the cooling efficiency of liquid cooling device, and saved the use amount of first coolant.
Drawings
In the drawings (which are not necessarily drawn to scale), like numerals may describe similar components in different views. Like reference numerals having different letter suffixes may represent different instances of similar components. The drawings illustrate generally, by way of example and not by way of limitation, various embodiments discussed herein.
FIG. 1 is a schematic diagram of an alternative configuration of a liquid cooling apparatus according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of an alternative configuration of a liquid cooling apparatus according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of an alternative configuration of a liquid cooling apparatus according to an embodiment of the present disclosure;
FIG. 4A is a schematic diagram of a related art liquid cooling tank;
fig. 4B is a schematic overall structure of an immersion liquid cooling Tank according to an embodiment of the present disclosure;
FIG. 4C is a top view of an immersion liquid cooled Tank provided in an embodiment of the present application;
fig. 4D is a schematic diagram of the overall structure of the hidden submerged liquid cooling Tank in the Tank and the rear liquid cooling Tank with the upper cover according to the embodiment of the present application.
Detailed Description
For the purposes, technical solutions and advantages of the embodiments of the present application to be more apparent, the following detailed description of the specific technical solutions of the present invention will be further described with reference to the accompanying drawings in the embodiments of the present application. The following examples are illustrative of the present application, but are not intended to limit the scope of the present application.
In the following description, suffixes such as "module" or "unit" for representing elements are used only for facilitating the description of the present application, and have no specific meaning per se. Thus, "module" or "unit" may be used in a hybrid.
In the related art, when the power consumption of the central processing unit is greater than 300W, the air cooling and heat dissipation mode cannot meet the heat dissipation requirement, the air cooling and heat dissipation mode of the internet data center cannot meet the PUE requirement specified in the place, and the heat dissipation cost is relatively high.
Based on the above-mentioned problems existing in the related art, the embodiment of the application provides a liquid cooling device, which can meet the heat dissipation of a CPU with high power consumption in the future, and can enable the power supply use efficiency of a newly built internet data center machine room to meet the national and local regulations.
Example 1
Fig. 1 is a schematic diagram of an alternative structure of a liquid cooling device according to an embodiment of the present application, as shown in fig. 1, the liquid cooling device 10 includes: the power supply system 102, the first cooling liquid 103 and the heat exchanger 104 are arranged in the box body 101.
The tank 101 has a cavity therein for accommodating various other components and a specific volume of the first cooling liquid, and has good sealing performance.
The power supply system 102 is configured to supply power to the equipment to be cooled 105 built in the box 101, and the equipment to be cooled 105 generates heat when powered on.
Here, the power supply system 102 may be a centralized power management system, and the device to be cooled may be any type of internet device, for example, a server.
Here, the power supply system 102 is located inside the box 101 of the liquid cooling device, and the power supply system 102 is connected to the equipment 105 to be cooled, which is built in the box 101, and is used for supplying power to the equipment 105 to be cooled, and the equipment 105 to be cooled generates heat when powered on.
The first cooling liquid 103 is filled in the box 101, and is used for conducting heat emitted by the equipment to be cooled 105 wrapped by the first cooling liquid 103.
The first cooling fluid 103 may be any insulating, non-flammable, inert fluid, such as a fluorinated fluid.
The first cooling liquid 103 is filled in the box 101, the first cooling liquid 103 completely submerges the equipment to be cooled 105, and the first cooling liquid 103 is used for conducting heat emitted by the equipment to be cooled 105 when the equipment to be cooled is powered on.
The heat exchanger 104 is located at the bottom of the tank 101 and immersed in the first cooling liquid 103, and is configured to perform cooling treatment on the first cooling liquid 103.
The heat exchanger 104 may be a dividing wall heat exchanger or other types of heat exchangers. The heat exchanger is immersed in the first cooling liquid, and the first cooling liquid in the box is cooled by heat exchange between the second cooling liquid in the heat exchanger and the first cooling liquid in the box, so that heat emitted by the equipment to be cooled is conducted out through the first cooling liquid and the second cooling liquid.
The liquid cooling device that this embodiment provided because the liquid cooling device is inside to have heat exchanger and first coolant liquid, and the heat exchanger submergence is in first coolant liquid for cool down the processing to first coolant liquid, so, can improve the heat exchange efficiency of heat exchanger and the cooling efficiency of liquid cooling device, saved the quantity of first coolant liquid.
Example two
Fig. 2 is a schematic structural diagram of an alternative liquid cooling device provided in an embodiment of the present application, as shown in fig. 2, the liquid cooling device 20 includes: the tank 201, a power supply system built in the tank, the first cooling liquid 203 and the heat exchanger 204.
The power supply system is configured to supply power to the device to be cooled 205 built in the box 201, and the device to be cooled 205 generates heat during power-up operation.
In this embodiment of the present application, the power supply system at least includes: the power strip 221 and the centralized power management system 222.
The power bus bar 221 is fixed on the heat exchanger 204, where the power bus bar 221 may be a copper bar, and in other embodiments, the power bus bar may be an aluminum bar.
The power supply busbar 221 is connected to the heat exchanger 204 and the centralized power management system 222, respectively. The power bus 221 and the centralized power management system 222 are used together to provide strong and weak electricity required for the operation of the to-be-cooled device 205, where the connection cable of the strong electricity may be located at the bottom of the to-be-cooled device 205; the weak current connection cable may be located on top of the device to be cooled 205.
Here, the device to be cooled 205 is buckled with the power supply busbar 221 through a power-on clamp, the strong electricity is a power source for operating the device to be cooled, and the weak electricity is signal electricity between the device to be cooled and other devices.
In this embodiment of the application, through centralized power management system 222 realizes the separation between strong current and the weak current, because the connecting cable of strong current is located wait to cool off the bottom of equipment, the connecting cable of weak current is located wait to cool off the top of equipment, so when fortune dimension personnel operates, can not touch dangerous strong current, improved the security of operation greatly. Further, the adoption of a centralized power management system also greatly reduces the cost.
In some embodiments, the liquid cooling apparatus 20 further comprises: the fixation structure 206 (only a portion of the fixation structure is shown in fig. 2); the device to be cooled 205 is fixedly connected or detachably connected to the inside of the case 201 through the fixing structure 206.
Here, the fixing structure 206 may be fixedly coupled to the inside of the case 201, for example, welded to the inside of the case. The securing structure 206 may also be removably attached to the interior of the housing, for example, by a snap, screw, or hinge.
In some embodiments, the device to be cooled 205 may be fixed to the fixing structure 206 in the case 201 by welding, and the device to be cooled may be connected to the fixing structure 206 in the case 201 by a buckle, a screw, or a hinge.
In some embodiments, the liquid cooling apparatus 20 further comprises: a wire management frame 207; the wire management frame 207 has a cavity, and at least one side of the wire management frame has a porous structure 2071. The wire management frame 207 is fixed to the top of at least one side of the case 201, and the weak current connection cable passes through the porous structure 2071 and is placed in the cavity, so as to manage the weak current connection cable through the porous structure and the cavity.
Here, the wire management frame may be fixed to the top of at least one inner surface of the case by welding or by screws. When the wire arranging frame is positioned at the top of the two inner surfaces of the box body, the two inner surfaces are oppositely arranged. The wire management frame is positioned on part of the fixing structure.
In this embodiment of the application, one end of the connecting cable of the device to be cooled is connected with the device to be cooled, and the other end of the device to be cooled penetrates through the porous structure and the cavity of the wire arranging frame and is connected with another device. The arrangement of the weak current connecting cables can be realized through the wire arranging frame, and the operation and maintenance work are convenient.
In some embodiments, the liquid cooling apparatus 20 further comprises: at least one weak current interface 208; the at least one weak current interface is located at the top of the side surface of the box body, the position of the at least one weak current interface corresponds to one end of the wire management frame, and the weak current interface 208 is used for realizing weak current connection between the equipment to be cooled and external equipment.
In some embodiments, the liquid cooling apparatus 20 further comprises: at least one set of power supply cables 209; the power supply cable 209 is located at a side of the box for supplying power to the centralized power management system 222.
In this embodiment, the power supply cable 209 may be located at the bottom of the side of the box, where the position of the power supply cable 209 corresponds to the position where one end of the power supply busbar 221 is located. In other embodiments, the power supply cable 20 may be located at any position on the side of the box.
The first cooling liquid 203 is filled in the box 201, and is used for conducting heat emitted by the equipment to be cooled 205 wrapped by the first cooling liquid 203.
Here, the first cooling liquid 203 is an insulating liquid, and the first cooling liquid may be: and (3) a fluoridation liquid.
In some embodiments, the liquid cooling apparatus 20 further comprises: and an upper cover (not shown) having a transparent window for observing the operation of the components inside the liquid cooling tank through the transparent window. The upper cover and the side face of the box body can be buckled to form a complete sealing and cooling device.
In some embodiments, the liquid cooling apparatus 20 further comprises: a display screen (not shown); the display screen is located on the outer surface of the box body, and is used for displaying the state of the equipment to be cooled 205 inside the liquid cooling device. Here, the display screen may be a liquid crystal display screen.
The heat exchanger 204 is located at the bottom of the tank and immersed in the first cooling liquid 203, and is configured to cool the first cooling liquid.
The heat exchanger is immersed in the first cooling liquid, and the first cooling liquid is cooled by heat exchange between the second cooling liquid in the heat exchanger and the first cooling liquid in the box body, so that heat emitted by the equipment to be cooled is conducted out through the first cooling liquid and the second cooling liquid.
In some embodiments, the liquid cooling apparatus 20 further comprises: a fluid refill port 210; the fluid supplementing port is located at the top of the side surface of the box 201, and is configured to supplement the fluid cooling device when the level of the first cooling fluid (fluorinated fluid) is lower than a threshold value, where the threshold value is a parameter related to the height of the device to be cooled.
In this embodiment of the present application, because at the in-process of fortune dimension, can lead to the first coolant liquid to have certain degree loss, works as when the liquid level of first coolant liquid is less than the threshold value, first coolant liquid will not wrap up completely wait to cool off equipment, at this moment, liquid cooling device will not satisfy the cooling demand of treating cooling off equipment, needs to supplement sufficient first coolant liquid.
The liquid cooling device provided by the embodiment of the application has the advantages that the strong current and the weak current required by equipment to be cooled can be separated due to the centralized power management system, so that the cost is saved, and meanwhile, the work of operation and maintenance personnel is facilitated; and the inside heat exchanger and the first coolant that have of liquid cooling device, the heat exchanger submerges in first coolant for carry out the cooling treatment to first coolant, so, can improve the heat exchange efficiency of heat exchanger and the cooling efficiency of liquid cooling device, saved the quantity of use of first coolant.
Example III
Fig. 3 is a schematic structural diagram of an alternative liquid cooling device provided in an embodiment of the present application, as shown in fig. 3, the liquid cooling device 30 includes: the box 301 and the power supply system, the first cooling liquid 303 and the heat exchanger 304 which are arranged in the box.
The power supply system is used for supplying power to the equipment to be cooled 305 arranged in the box body, and the equipment to be cooled 305 generates heat during power-on operation.
In some embodiments, the power supply system includes: a power bus 3021 and a centralized power management system 3022; the power supply busbar 3021 is connected 3022 to the heat exchanger 304 and the centralized power management system, respectively; the power supply busbar 3021 and the centralized power management system 3022 are used together to provide strong electricity and weak electricity required by the operation of the to-be-cooled device 305, where the connection cable of the strong electricity is located at the bottom of the to-be-cooled device; the connection cable of weak current is located at the top of the device to be cooled.
In some embodiments, the liquid cooling apparatus 30 further comprises: a fixed structure 305; the equipment to be cooled is fixedly connected or detachably connected to the inside of the box body through the fixing structure.
In some embodiments, the liquid cooling apparatus 30 further comprises: a wire management frame 306; the wire arranging frame is provided with a cavity, and at least one side surface of the wire arranging frame is of a porous structure 3061; the wire arranging frame is fixed at the top of at least one side face of the box body, and the weak current connecting cable passes through the porous structure and is arranged in the cavity so as to realize management of the weak current connecting cable through the porous structure and the cavity.
In some embodiments, the liquid cooling apparatus 30 further comprises: at least one weak current interface 307; the at least one weak current interface 307 is located at the top of the side surface of the box, and the position of the at least one weak current interface corresponds to one end of the wire management frame 306, and the weak current interface is used for realizing weak current connection between the equipment to be cooled and external equipment.
In some embodiments, the liquid cooling apparatus 30 further comprises: at least one set of power supply cables 308; the power supply cable 308 is located at a side of the box and is used to supply power to the centralized power management system 3022.
The first cooling liquid 303 is filled in the box body, and is used for conducting heat emitted by the device to be cooled 305 wrapped by the first cooling liquid.
In some embodiments, the liquid cooling apparatus 30 further comprises: a display screen (not shown); the display screen is located on the outer surface of the box 301, and is used for displaying the state of the equipment to be cooled 305 inside the liquid cooling device.
The heat exchanger 304 is located at the bottom of the tank and immersed in the first cooling liquid 303, and is configured to cool the first cooling liquid 303.
In some embodiments, the liquid cooling apparatus 30 further comprises: a cooling tower 309 and a cooling liquid distribution unit 311 located outside the tank.
The cooling tower 309 is connected to the cooling liquid distribution unit 311 through a first pipe 310, and the cooling liquid distribution unit 311 is connected to the heat exchanger 304 in the tank through a second pipe 312, where the first pipe 310 includes: a first water inlet pipe 3101 and a first water return pipe 3102, the second pipe 312 includes: a second water inlet pipe 3121 and a second water return pipe 3122, the heat exchanger 304 being filled with a second cooling liquid.
Here, the first line 310 is a cold tower-CDU line; the second conduit 312 is a CDU-liquid cooling unit conduit. The tank 301 of the liquid cooling device is connected to the cold liquid distribution unit 311 through the second pipeline 312, and the cold liquid distribution unit 311 is connected to the cooling tower 309 through the first pipeline 310, so as to jointly form the liquid cooling device. The second cooling liquid may be water or deionized water.
The second cooling liquid is returned to the cooling liquid distribution unit 311 through the second water return pipe 3122, and is returned to the cooling tower 309 through the first water return pipe 3102, and is subjected to cooling treatment.
In some embodiments, the cooling tower 309 is effectively an evaporative cooling tower, a combination of a cooler for cooling the fluid and a wet cooling tower for absorbing heat from the fluid for discharge to the atmosphere. In this embodiment of the present application, the second cooling liquid flows through the pipe, and the air flows outside the pipe, and the two do not contact each other, and the temperature of the second cooling liquid is reduced by heat exchange between the circulated air and the circulated second cooling liquid.
The cooled second cooling liquid is delivered to the cooling liquid distribution unit 311 through the first water inlet pipe 3101, the temperature of the cooled second cooling liquid is adjusted to be a preset temperature through the cooling liquid distribution unit 311, and the second cooling liquid with the preset temperature is delivered to the heat exchanger 304 through the second water inlet pipe 3121, so that the cooling treatment of the first cooling liquid by the second cooling liquid with the preset temperature is realized.
Here, the cold liquid distribution unit may adjust the temperature and cleanliness of the second cooling liquid, and in this embodiment of the present application, the temperature of the second cooling liquid is mainly adjusted to a preset temperature by the cold liquid distribution unit, where the preset temperature may be 5 ℃, or may be other preset temperatures.
In this embodiment of the application, the cooling tower with the cold liquid distribution unit is in circulation operating condition always, constantly right second coolant liquid in the heat exchanger carries out the cooling treatment, in order to realize through cooling back second coolant liquid right first coolant liquid carries out the real-time cooling treatment.
In some embodiments, the liquid cooling apparatus further comprises: a control unit 313; the control unit is respectively connected with the cold liquid distribution unit 311 and the cold tower 309, and is configured to control working states of the cold liquid distribution unit 311 and the cold tower 309 according to the temperature of the second cooling liquid at the current moment acquired by the acquisition unit 314.
In this embodiment, the liquid cooling device may further include a control unit 313 and an acquisition unit 314, where the acquisition unit 314 is located inside the heat exchanger 304, and the acquisition unit 314 is configured to acquire a temperature of the second cooling liquid in the heat exchanger by using a preset sampling period, and send the temperature of the second cooling liquid acquired in real time to the control unit 313. Here, the acquisition unit may be a temperature detection sensor.
The control unit judges by acquiring the temperature of the second cooling liquid sent by the acquisition unit, and when the temperature of the second cooling liquid is greater than or equal to a temperature threshold value, the control unit controls the cold liquid distribution unit and the cold tower to enter a working state so as to cool the second cooling liquid; when the temperature of the second cooling liquid is smaller than the temperature threshold value, the control unit controls the cold liquid distribution unit and the cold tower to be in a non-working state so as to save energy.
In some embodiments, the liquid cooling device 30 may not include the collecting unit and the control unit, and the cooling process of the second cooling liquid may be implemented by autonomous and uninterrupted circulation of the cooling tower and the cooling liquid distribution unit.
The embodiment of the application provides a liquid cooling device, because the liquid cooling device includes cooling tower and cold liquid distribution unit, can be located the heat exchanger in the box and carry out cooling treatment to the second coolant liquid to carry out cooling treatment to the temperature of the first coolant liquid in the box through the temperature of second coolant liquid, so, can improve the heat exchange efficiency of heat exchanger and the cooling efficiency of liquid cooling device, saved the quantity of first coolant liquid.
Example IV
Before describing the immersion liquid cooling Tank (Tank) provided in the embodiments of the present application in detail, a liquid cooling Tank in the related art will be briefly described, as shown in fig. 4A, which is a schematic structural diagram of the liquid cooling Tank in the related art. As can be seen, the liquid cooling tank in the related art includes: an upper cover 401, a transparent Polycarbonate (PC) window 402, an airtight sealing adhesive tape 403, an upper cover lock 404, a door panel 405, an MPO (Multi-fiber Push On) optical fiber adapter bracket 406, a front lining plate 407, a cooling water channel water inlet 408, a weak cable outlet 409, a strong cable outlet 410, a cooling water channel water outlet 411, a fluid supplementing port 412, an airtight cable clamp 413, a pneumatic rod 414, an upper cover handle 415, and a power distribution unit (not shown in the figure) which is located at the back of the liquid cooling box. As can be seen from fig. 4A, the liquid cooling tank in the prior art does not include a centralized power management system and does not include a heat exchanger.
Fig. 4B is a schematic overall structure of an immersion liquid cooling Tank provided in an embodiment of the present application, fig. 4C is a top view of the immersion liquid cooling Tank provided in an embodiment of the present application, fig. 4D is a schematic overall structure of a hidden immersion liquid cooling Tank provided in an embodiment of the present application, and in combination with fig. 4B, 4C and fig. 4D, in an embodiment of the present application, an internet technology (Internet Technology, IT) device is placed in the immersion liquid cooling Tank (corresponding to the liquid cooling device in the embodiment), then a fluorinated liquid (corresponding to the first cooling liquid in the embodiment) is injected into the liquid cooling Tank, and heat is exchanged by directly contacting a heating element in the IT device (corresponding to the device to be cooled in the embodiment) with the fluorinated liquid, so that the heating element is maintained in a working temperature range. The temperature of the fluorinated liquid is connected to the cold liquid distribution unit 416 (The Chill Water Distribution Unit, CDU) via a closed outdoor cooling tower 418 via a tower-CDU line 417, and the CDU 416 is connected to the heat exchanger 428 at the bottom of the immersion liquid cooling Tank via a CDU-liquid cooling Tank line 415, so that the temperature of the fluorinated liquid in the liquid cooling Tank can be controlled within a suitable range via the closed outdoor cooling tower 418 and the CDU 416. Here, the upper diagram in fig. 4B is a schematic diagram of the structure in the closed state of the immersion liquid cooling Tank upper cover, and the lower diagram in fig. 4B is a schematic diagram of the structure in the open state of the immersion liquid cooling Tank upper cover.
In this embodiment, the immersion liquid cooling Tank is composed of an upper cover 411 and a Tank 412, wherein two groups of power supply cables 414, a liquid supplementing port 413 and a weak current interface 422 are reserved at the side edge of the Tank 412, and a liquid crystal display 420 is reserved on the surface of the liquid cooling Tank, so that the state of IT equipment (servers 425-1 to 425-8) in the whole Tank can be displayed. The upper cover 411 has a transparent window 420 therein for observing the operation of the device in the liquid cooling Tank. The bottom inside the box is provided with a heat exchanger 428, a power busbar 427 (i.e. a power busbar) is fixed on the heat exchanger, IT equipment fixing structures 423 are arranged around the box, wire arranging frames 419 are arranged on the front side and the rear side of the top of the box, two rows of IT equipment can be placed in front of and behind the brand-new immersed liquid cooling Tank, 64 server nodes are all arranged, 4 switches 426-1 to 426-4 and two centralized power supplies 424-1 and 424-2 (corresponding to the centralized power management system in the embodiment), weak current connecting cables between the IT equipment nodes are all led out from the top, and therefore interconnection between each server node and the switch is facilitated, and operation and maintenance are also more convenient and quick. The weak electric cable of the server node is interconnected with the exchanger in the area through the wire arranging frame, and then, after 4 exchangers are interconnected, the weak electric cable is interconnected with a main exchanger of a machine room to realize interconnection between IT equipment in the whole liquid cooling Tank and the outside.
In this embodiment, two sets of external cables 414 are connected to the centralized power supply to supply power to the centralized power supplies 424-1 and 424-2, the centralized power supply is connected to the power supply busbar 427, and each server node is buckled with the power supply busbar through the node power-on clamp 429 to take power. Switches 426-1 through 426-4 draw power from the centralized power supply via cables.
The brand new immersion liquid cooling Tank provided by the embodiment of the application can simultaneously put two rows of IT equipment, and more IT equipment can be placed in a limited space; the liquid cooling Tank provided by the embodiment of the application adopts a centralized power management system, so that the separation of strong current and weak current is realized, the cost is saved, and the operation and maintenance are convenient; and the heat exchanger is placed in the liquid cooling Tank, so that the heat exchange efficiency can be improved, and the consumption of fluorinated liquid in the Tank can be saved.
In the several embodiments provided in this application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above described device embodiments are only illustrative, e.g. the division of the units is only one logical function division, and there may be other divisions in practice, such as: multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed. In addition, the various components shown or discussed may be coupled or directly coupled or communicatively coupled to each other via some interface, whether indirectly coupled or communicatively coupled to devices or units, whether electrically, mechanically, or otherwise.
The units described as separate units may or may not be physically separate, and units displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units; some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in each embodiment of the present invention may be integrated in one processing module, or each unit may be separately used as one unit, or two or more units may be integrated in one unit; the integrated units may be implemented in hardware or in hardware plus software functional units. Those of ordinary skill in the art will appreciate that: all or part of the steps for implementing the above method embodiments may be implemented by hardware associated with program instructions, where the foregoing program may be stored in a computer readable storage medium, and when executed, the program performs steps including the above method embodiments; and the aforementioned storage medium includes: a mobile storage device, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk or an optical disk, or the like, which can store program codes.
The methods disclosed in the several method embodiments provided in the present application may be arbitrarily combined without collision to obtain a new method embodiment.
The features disclosed in the several product embodiments provided in the present application may be combined arbitrarily without conflict to obtain new product embodiments.
The features disclosed in the several method or apparatus embodiments provided in the present application may be arbitrarily combined without conflict to obtain new method embodiments or apparatus embodiments.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (9)

1. The liquid cooling device is characterized by comprising a box body, a power supply system, a first cooling liquid and a heat exchanger, wherein the power supply system, the first cooling liquid and the heat exchanger are arranged in the box body;
the power supply system is used for supplying power to equipment to be cooled, which is arranged in the box body, and the equipment to be cooled generates heat when being electrified;
the first cooling liquid is filled in the box body and used for conducting heat emitted by the equipment to be cooled, which is wrapped by the first cooling liquid;
the heat exchanger is positioned at the bottom of the box body and immersed in the first cooling liquid and used for cooling the first cooling liquid; wherein,
the power supply system includes: a power supply busbar and a centralized power management system;
the power supply busbar is respectively connected with the heat exchanger and the centralized power supply management system;
the power supply busbar and the centralized power supply management system are used for providing strong current and weak current required by the operation of the equipment to be cooled, and the separation between the strong current and the weak current is realized through the centralized power supply management system, wherein the connecting cable of the strong current is positioned at the bottom of the equipment to be cooled; the connection cable of weak current is located at the top of the device to be cooled.
2. The liquid cooling apparatus according to claim 1, further comprising: a fixed structure;
the equipment to be cooled is fixedly connected or detachably connected to the inside of the box body through the fixing structure.
3. The liquid cooling apparatus according to claim 1, further comprising: a wire arranging frame;
the wire arranging frame is provided with a cavity, and at least one side surface of the wire arranging frame is of a porous structure;
the wire arranging frame is fixed at the top of at least one side face of the box body, and the weak current connecting cable passes through the porous structure and is arranged in the cavity so as to realize management of the weak current connecting cable through the porous structure and the cavity.
4. The liquid cooling apparatus according to claim 3, further comprising: at least one weak current interface;
the at least one weak current interface is positioned at the top of the side surface of the box body, the position of the at least one weak current interface corresponds to one end of the wire arranging frame, and the weak current interface is used for realizing weak current connection between the equipment to be cooled and external equipment.
5. The liquid cooling apparatus according to claim 1, further comprising: at least one set of power supply cables;
the power supply cable is located on the side face of the box body and used for supplying power to the centralized power supply management system.
6. The liquid cooling apparatus according to claim 1, wherein the first cooling liquid is an insulating liquid, and the first cooling liquid includes: a fluorinated liquid; the liquid cooling device further includes: a fluid supplementing port;
the liquid supplementing port is positioned at the top of the side surface of the box body and is used for supplementing liquid to the liquid cooling device when the liquid level of the fluorinated liquid is lower than a threshold value.
7. The liquid cooling apparatus according to claim 1, further comprising: a display screen;
the display screen is positioned on the outer surface of the box body and is used for displaying the state of the equipment to be cooled in the liquid cooling device.
8. The liquid cooling apparatus according to claim 1, further comprising: the cooling tower and the cooling liquid distribution unit are positioned outside the box body;
the cooling tower with cold liquid distribution unit passes through first pipeline connection, cold liquid distribution unit with heat exchanger in the box passes through the second pipeline connection, wherein, first pipeline includes: first inlet tube and first wet return, the second pipeline includes: the second water inlet pipe and the second water return pipe are internally filled with a second cooling liquid;
the second cooling liquid is returned to the cold liquid distribution unit through the second water return pipe, and is returned to the cooling tower through the first water return pipe, so that the second cooling liquid is cooled;
and conveying the cooled second cooling liquid to the cold liquid distribution unit through the first water inlet pipe, adjusting the temperature of the cooled second cooling liquid to be a preset temperature through the cold liquid distribution unit, and conveying the second cooling liquid with the preset temperature to the heat exchanger through the second water inlet pipe so as to realize cooling treatment of the first cooling liquid through the second cooling liquid with the preset temperature.
9. The liquid cooling apparatus according to claim 8, further comprising: a control unit;
the control unit is respectively connected with the cold liquid distribution unit and the cold tower, and is used for controlling the working states of the cold liquid distribution unit and the cold tower according to the temperature of the second cooling liquid at the current moment acquired by the acquisition unit.
CN202011157971.9A 2020-10-26 2020-10-26 Liquid cooling device Active CN114094473B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011157971.9A CN114094473B (en) 2020-10-26 2020-10-26 Liquid cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011157971.9A CN114094473B (en) 2020-10-26 2020-10-26 Liquid cooling device

Publications (2)

Publication Number Publication Date
CN114094473A CN114094473A (en) 2022-02-25
CN114094473B true CN114094473B (en) 2024-04-05

Family

ID=80295872

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011157971.9A Active CN114094473B (en) 2020-10-26 2020-10-26 Liquid cooling device

Country Status (1)

Country Link
CN (1) CN114094473B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158803A (en) * 2007-12-27 2009-07-16 Toshiba Corp Liquid-cooled housing cooling device
CN107743354A (en) * 2017-10-25 2018-02-27 北京百度网讯科技有限公司 The refrigeration system of data center machine room and data center
CN107809894A (en) * 2017-12-05 2018-03-16 北京百度网讯科技有限公司 A kind of cooling device of data center's rack
CN109195424A (en) * 2018-11-06 2019-01-11 北京中热信息科技有限公司 A kind of heat pipe exchanging type electronic equipment liquid cooling system
CN209314194U (en) * 2018-10-12 2019-08-27 北京丰联奥睿科技有限公司 A kind of cooling system of liquid dipping machine cabinet
CN209472923U (en) * 2018-08-15 2019-10-08 南京佳力图机房环境技术股份有限公司 A kind of cooling immersion liquid cooling combination unit of server
CN211745074U (en) * 2020-01-15 2020-10-23 许昌许继晶锐科技有限公司 Server cabinet and heat exchange equipment cabinet for server

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158803A (en) * 2007-12-27 2009-07-16 Toshiba Corp Liquid-cooled housing cooling device
CN107743354A (en) * 2017-10-25 2018-02-27 北京百度网讯科技有限公司 The refrigeration system of data center machine room and data center
CN107809894A (en) * 2017-12-05 2018-03-16 北京百度网讯科技有限公司 A kind of cooling device of data center's rack
CN209472923U (en) * 2018-08-15 2019-10-08 南京佳力图机房环境技术股份有限公司 A kind of cooling immersion liquid cooling combination unit of server
CN209314194U (en) * 2018-10-12 2019-08-27 北京丰联奥睿科技有限公司 A kind of cooling system of liquid dipping machine cabinet
CN109195424A (en) * 2018-11-06 2019-01-11 北京中热信息科技有限公司 A kind of heat pipe exchanging type electronic equipment liquid cooling system
CN211745074U (en) * 2020-01-15 2020-10-23 许昌许继晶锐科技有限公司 Server cabinet and heat exchange equipment cabinet for server

Also Published As

Publication number Publication date
CN114094473A (en) 2022-02-25

Similar Documents

Publication Publication Date Title
EP3471524B1 (en) Optimal controller for hybrid liquid-air cooling system of electronic racks of a data center
CN107979955B (en) Modularized liquid cooling server case
CN110447315B (en) Liquid cooling design for electronics racks in data centers that liquid cool IT components
CN103729328A (en) Data center module and data center formed by micro-modules
CN207589404U (en) A kind of electronic equipment liquid cold cabinet
CN107896475A (en) A kind of electronic equipment liquid cold cabinet
CN114094473B (en) Liquid cooling device
CN116092743A (en) High-power charging and cooling device and charging and cooling method
CN114035666A (en) Immersion type liquid cooling device and immersion type liquid cooling system
CN112259852A (en) Frame design for battery module
CN211481646U (en) Cabinet and data center
CN218274889U (en) Battery energy storage container
CN109588018B (en) Full-immersion type data center architecture
CN216450023U (en) Immersed liquid cooling device and immersed liquid cooling system
CN206610248U (en) A kind of computer efficient radiating apparatus
CN215474538U (en) Vehicle charging control device
CN217217304U (en) Power supply device, formation cabinet and capacity grading cabinet
CN218567978U (en) Efficient water-cooling type cooling fan for CPU
NL2027460B1 (en) Hybrid datacentre module
CN215069025U (en) Combined LED display screen with temperature control system
CN220750520U (en) Water-electricity isolation container cold station
CN220342564U (en) Control box of closed channel system
CN217213630U (en) Liquid cooling equipment shell, liquid cooling equipment and liquid cooling system
CN217532606U (en) Battery replacing cabinet
CN212910444U (en) Data exchange supervision and control device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant