TW202350055A - Air cooling system - Google Patents
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- TW202350055A TW202350055A TW111121334A TW111121334A TW202350055A TW 202350055 A TW202350055 A TW 202350055A TW 111121334 A TW111121334 A TW 111121334A TW 111121334 A TW111121334 A TW 111121334A TW 202350055 A TW202350055 A TW 202350055A
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- 238000001816 cooling Methods 0.000 title claims abstract description 141
- 230000017525 heat dissipation Effects 0.000 claims abstract description 44
- 239000012530 fluid Substances 0.000 claims abstract description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
Description
本揭露是有關於一種氣冷系統,特別是有關於一種用於電子裝置的氣冷系統。The present disclosure relates to an air cooling system, and in particular to an air cooling system for electronic devices.
隨著電子裝置的效能不斷提升,對電子裝置冷卻效率的要求也越來越高,其中以電競式筆記型電腦尤為明顯。在提升處理器效能的同時,為了加強散熱冷卻,電競式筆記型電腦所需的氣冷系統往往結構較複雜且體積較龐大,使得電競式筆記型電腦相對於一般筆記型電腦較厚,重量也較重,因而降低了電競式筆記型電腦的可攜性。As the performance of electronic devices continues to improve, the requirements for cooling efficiency of electronic devices are also getting higher and higher, especially for gaming laptops. While improving processor performance, in order to enhance heat dissipation and cooling, the air-cooling system required for gaming laptops is often more complex and bulky, making gaming laptops thicker than ordinary laptops. It's also heavier, which reduces the portability of gaming laptops.
因此,如何提出一種可解決上述問題的氣冷系統,是目前業界亟欲投入研發資源解決的問題之一。Therefore, how to propose an air cooling system that can solve the above problems is one of the problems that the industry is currently eager to invest in research and development resources to solve.
有鑑於此,本揭露之一目的在於提出一種可有解決上述問題的氣冷系統。In view of this, one purpose of the present disclosure is to provide an air cooling system that can solve the above problems.
本揭露是有關於一種用於電子裝置的氣冷系統包含機體、熱傳導部件以及散熱風扇。機體具有散熱口與進氣口,其中進氣口分別位於機體之第一殼部與第二殼部。第一殼部與第二殼部相對。熱傳導部件設置於機體內,並配置以熱性接觸熱源。散熱風扇設置於機體內,並包含第一軸向入風口、第二軸向入風口以及徑向出風口。第一軸向入風口對應於第一殼部之進氣口之一。第二軸向入風口與第一軸向入風口相對,且對應於第二殼部之進氣口之一。散熱風扇所產生的工作流體由徑向出風口分別沿著不同方向流動至熱傳導部件。The present disclosure relates to an air cooling system for an electronic device including a body, a heat conduction component and a cooling fan. The body has a heat dissipation port and an air inlet, and the air inlets are respectively located at the first shell part and the second shell part of the body. The first shell part is opposite to the second shell part. The thermal conductive component is arranged in the body and configured to thermally contact the heat source. The cooling fan is arranged in the body and includes a first axial air inlet, a second axial air inlet and a radial air outlet. The first axial air inlet corresponds to one of the air inlets of the first shell part. The second axial air inlet is opposite to the first axial air inlet and corresponds to one of the air inlets of the second shell part. The working fluid generated by the cooling fan flows from the radial air outlet to the heat transfer component in different directions.
在一些實施方式中,機體進一步包含側殼部,側殼部連接於第一殼部與第二殼部之間,且散熱口設置於側殼部。In some embodiments, the body further includes a side shell part, the side shell part is connected between the first shell part and the second shell part, and the heat dissipation port is provided in the side shell part.
在一些實施方式中,熱傳導部件完全環繞散熱風扇設置。In some embodiments, the thermally conductive component is completely disposed around the cooling fan.
在一些實施方式中,熱傳導部件部分圍繞散熱風扇設置。In some embodiments, the thermally conductive component is partially disposed around the cooling fan.
在一些實施方式中,熱傳導部件為均熱板、熱導管、石墨片或高傳導金屬。In some embodiments, the thermally conductive component is a vapor chamber, a heat pipe, a graphite sheet, or a highly conductive metal.
在一些實施方式中,機體進一步包含可收放支架銜接於第二殼部遠離第一殼部的一側。In some embodiments, the body further includes a retractable bracket connected to a side of the second shell part away from the first shell part.
在一些實施方式中,機體進一步包含擋墊銜接於第二殼部遠離第一殼部的一側,並位於第二殼部之進氣口與散熱口之間。In some embodiments, the body further includes a baffle connected to a side of the second shell part away from the first shell part and located between the air inlet and the heat dissipation port of the second shell part.
在一些實施方式中,氣冷系統進一步包含冷卻風扇,鄰近於熱傳導部件設置,冷卻風扇包含第三軸向入風口、第四軸向入風口以及側向出風口。第三軸向入風口對應於第一殼部之進氣口之一。第四軸向入風口與第三軸向入風口相對,且對應於第二殼部之進氣口之一。In some embodiments, the air cooling system further includes a cooling fan disposed adjacent to the heat conduction component, and the cooling fan includes a third axial air inlet, a fourth axial air inlet, and a lateral air outlet. The third axial air inlet corresponds to one of the air inlets of the first shell part. The fourth axial air inlet is opposite to the third axial air inlet and corresponds to one of the air inlets of the second shell part.
在一些實施方式中,熱傳導部件完全環繞散熱風扇設置。In some embodiments, the thermally conductive component is completely disposed around the cooling fan.
在一些實施方式中,熱傳導部件部分圍繞散熱風扇設置。In some embodiments, the thermally conductive component is partially disposed around the cooling fan.
在一些實施方式中,熱傳導部件為均熱板、熱導管、石墨片或高傳導金屬。In some embodiments, the thermally conductive component is a vapor chamber, a heat pipe, a graphite sheet, or a highly conductive metal.
在一些實施方式中,機體進一步包含可收放支架銜接於第二殼部遠離第一殼部的一側。In some embodiments, the body further includes a retractable bracket connected to a side of the second shell part away from the first shell part.
在一些實施方式中,冷卻風扇之側向出風口朝向散熱口開口。In some embodiments, the lateral air outlet of the cooling fan opens toward the heat dissipation vent.
在一些實施方式中,機體進一步包含擋墊銜接於第二殼部遠離第一殼部的一側,並位於第二殼部之進氣口與散熱口之間。In some embodiments, the body further includes a baffle pad connected to a side of the second shell part away from the first shell part and located between the air inlet and the heat dissipation port of the second shell part.
在一些實施方式中,冷卻風扇之側向出風口遠離散熱口開口,側殼部進一步設置冷卻口對應於側向出風口,熱傳導部件進一步包含導熱元件延伸至側向出風口與冷卻口之間。In some embodiments, the lateral air outlet of the cooling fan is far away from the heat dissipation opening, the side shell further provides a cooling outlet corresponding to the lateral air outlet, and the heat conduction component further includes a thermal conductive element extending between the lateral air outlet and the cooling outlet.
在一些實施方式中,機體進一步包含擋墊銜接於第二殼部遠離第一殼部的一側,並位於第二殼部之進氣口與散熱口或冷卻口之間。In some embodiments, the body further includes a baffle pad connected to a side of the second shell part away from the first shell part and located between the air inlet and the heat dissipation port or cooling port of the second shell part.
在一些實施方式中,冷卻風扇進一步包含殼體以及第一擋體。殼體具有第三軸向入風口、第四軸向入風口以及側向出風口。第一擋體圍繞殼體。In some embodiments, the cooling fan further includes a housing and a first baffle. The housing has a third axial air inlet, a fourth axial air inlet and a lateral air outlet. The first blocking body surrounds the housing.
在一些實施方式中,冷卻風扇進一步包含殼體以及第二擋體。殼體具有第三軸向入風口、第四軸向入風口以及側向出風口。第二擋體設置於殼體上,並位於第三軸向入風口與第四軸向入風口之外緣,且分別抵靠第一殼部與第二殼部。In some embodiments, the cooling fan further includes a housing and a second baffle. The housing has a third axial air inlet, a fourth axial air inlet and a lateral air outlet. The second baffle is disposed on the housing, located at the outer edge of the third axial air inlet and the fourth axial air inlet, and abuts against the first shell part and the second shell part respectively.
綜上所述,於本揭露的氣冷系統中,位於第一殼部與第二殼部之進氣口,透過增加冷空氣之進氣量提升冷卻效率。熱傳導部件藉由散熱風扇所產生之工作流體,平均分散來自熱源之熱量。冷卻風扇進一步加強對流,將熱量導引至散熱口或冷卻口。熱傳導部件延伸出之導熱元件可進一步分散熱傳導部件之熱量,將熱量導引至冷卻風扇之出風口。另外,可收放支架將機體抬高,增加第二殼部之進氣口的冷空氣進氣量,同時擋墊將第二殼部之進氣口與散熱口或冷卻口各自的氣流分隔開,避免熱風回流入系統。相較於目前常見用於電子裝置的氣冷系統更能達到散熱冷卻的效果。To sum up, in the air cooling system of the present disclosure, the air inlets located in the first shell part and the second shell part improve the cooling efficiency by increasing the intake volume of cold air. The heat transfer component uses the working fluid generated by the cooling fan to evenly disperse the heat from the heat source. Cooling fans further enhance convection and direct heat to heat dissipation vents or cooling vents. The heat-conducting element extended from the heat-conducting component can further dissipate the heat of the heat-conducting component and guide the heat to the air outlet of the cooling fan. In addition, the retractable bracket raises the body to increase the amount of cold air intake through the air inlet of the second shell. At the same time, the baffle separates the air flow between the air inlet of the second shell and the heat dissipation or cooling vents. Open to prevent hot air from flowing back into the system. Compared with the air cooling system currently commonly used in electronic devices, it can achieve a better heat dissipation and cooling effect.
本揭露的這些與其他方面通過結合圖式對優選實施例進行以下的描述,本揭露的實施例將變得顯而易見,但在不脫離本揭露的新穎概念的精神和範圍的情況下,可以進行其中的變化和修改。These and other aspects of the present disclosure will become apparent from the following description of preferred embodiments taken in conjunction with the accompanying drawings, but may be made without departing from the spirit and scope of the novel concepts of the present disclosure. changes and modifications.
以下揭露內容現在在此將透過圖式及參考資料被更完整描述,一些示例性的實施例被繪示在圖式中。本揭露可以被以不同形式實施並且不應被以下提及的實施例所限制。但是,這些實施例被提供以幫助更完整的理解本揭露之內容並且向本領域之技術人員充分傳達本發明的範圍。相同的參考標號會貫穿全文指代相似元件。The following disclosure will now be described more fully herein by drawings and references, in which some exemplary embodiments are shown. The present disclosure may be implemented in different forms and should not be limited by the embodiments mentioned below. However, these embodiments are provided to facilitate a more complete understanding of the disclosure and to fully convey the scope of the invention to those skilled in the art. The same reference numbers will be used throughout the text to refer to similar elements.
請參照第1A圖,其繪示了根據本揭露的一些實施方式之機體100之正面立體圖。如第1A圖中所示,機體100具有第一殼部110。第一殼部110具有數個進氣口112-1、112-2。儘管在第1A圖所繪示的實施方式中僅示出三個進氣口112-1、112-2,應當理解,第一殼部110可以包括任意數量、任意大小、任意分布方式的進氣口112-1、112-2,同時保持在本揭露的範圍內。此外,在機體100結合筆記型電腦的實施例中,為配合進氣口112-1的設置,鍵盤與觸控板等輸入介面的配置調整至位於第一殼部110遠離進氣口112-1之一緣。Please refer to FIG. 1A , which illustrates a front perspective view of the
請參照第1B圖,其繪示了根據本揭露的一些實施方式之機體100之背面立體圖。如第1B圖中所示,機體100具有第二殼部120,第二殼部120與第一殼部110相對。第二殼部120具有數個進氣口122-1、122-2。儘管在第1B圖所繪示的實施方式中僅示出三個進氣口122-1、122-2,應當理解,第二殼部120可以包括任意數量、任意大小、任意分布的進氣口122-1、122-2,同時保持在本揭露的範圍內。機體100進一步具有側殼部130。側殼部130連接於第一殼部110與第二殼部120之間。如第1B圖中所示,側殼部130具有散熱口101。Please refer to FIG. 1B , which illustrates a back perspective view of the
請參照第1C圖,其繪示了根據本揭露的一些實施方式之機體100內部之熱傳導部件102與散熱風扇103之立體配置圖。如第1C圖中所示,熱傳導部件102完全環繞散熱風扇103設置。在一些實施方式中,熱傳導部件102部分圍繞散熱風扇103設置(參照第2A圖)。Please refer to FIG. 1C , which illustrates a three-dimensional configuration diagram of the
熱傳導部件102配置以熱性接觸電子裝置之熱源。熱源的數目不限於一個。若電子裝置具有兩個熱源,則設置於散熱風扇103之相對的兩側,以分散熱源,減少兩個熱源產生之熱能疊加。同樣地,若電子裝置具有三個以上之熱源,則共同圍繞散熱風扇103設置。在本揭露的實施方式中,電子裝置可為但不限於筆記型電腦、掌上型電腦等可攜式電子裝置。Thermal
熱傳導部件102可以是均熱板(vapor chamber)、熱導管、石墨片或高傳導金屬等可以將熱源吸收並分散至熱傳導部件102上之元件。應當理解,熱傳導部件102可以配合散熱風扇103或其他散熱冷卻裝置的配置而具有不同的形狀與配置方式。The thermal
請參照第1D圖與第1E圖,其分別繪示了根據本揭露的一些實施方式之散熱風扇103之立體圖與側視圖。如第1D圖與第1E圖中所示,散熱風扇103包含第一軸向入風口104、第二軸向入風口106以及數個徑向出風口105。第一軸向入風口104對應於第一殼部110之進氣口112-1、122-2之一,例如第1A圖中所示,位於第一殼部110中央之進氣口112-1。第二軸向入風口106與第一軸向入風口104相對,且對應於第二殼部120之進氣口122-1、122-2之一,例如第1B圖中所示,位於第二殼部120中央之進氣口122-1。散熱風扇103自系統外部進氣,所引入之冷空氣由徑向出風口105分別沿著不同方向輻射式地吹往熱傳導部件102。Please refer to FIG. 1D and FIG. 1E , which respectively illustrate a perspective view and a side view of the cooling
如第1C圖中所示,散熱風扇103被熱傳導部件102所環繞,其產生之冷空氣可以加速熱傳導部件102將來自熱源之熱量平均分散至熱傳導部件102各處,提升熱傳導部件102的散熱效率。冷空氣吸收熱量後所產生之熱空氣再由散熱口101排至機體100外部。As shown in Figure 1C, the cooling
請參照第1F圖,其繪示了根據本揭露的一些實施方式之機體100內部之熱傳導部件102、散熱風扇103以及熱交換器107之立體配置圖。如第1F圖中所示,熱交換器107(例如散熱鰭片)位於熱傳導部件102之一邊緣,且對應於側殼部130之散熱口101處(如第1B圖中所示),配置以增加熱對流與熱輻射面積,提升散熱效率。Please refer to Figure 1F, which illustrates a three-dimensional configuration diagram of the
請參照第1G圖,其繪示了根據本揭露的一些實施方式之機體100之背面立體圖。在一些實施方式中,機體100進一步包含可收放支架108。在第1A圖中,可收放支架108為收起之狀態,在第1G圖中,可收放支架108為展開之狀態。如第1A圖與第1G圖中所示,可收放支架108銜接於第二殼部120遠離第一殼部110的一側。可收放支架108藉由將機體100從地面抬高,增加第二殼部120之進氣口122-1、122-2之冷空氣進氣量。儘管在第1A圖與第1G圖所繪示的實施方式中僅示出一個可收放支架108,應當理解,機體100可以依照進氣需求,包括任意數量的可收放支架108,同時保持在本揭露的範圍內。Please refer to Figure 1G, which illustrates a back perspective view of the
在一些實施方式中,可收放支架108可調整為實心片狀結構,如第1A圖與第1G圖中所示,在收起或展開之狀態下皆可進一步作為擋墊,其沿著第二殼部120之側邊方向橫跨設置於第二殼部120之進氣口122-1與散熱口101之間,可以防止自散熱口101排出之熱空氣重新藉由進氣口122-1進入系統,降低整體散熱效率。In some embodiments, the
請參照第2A圖,其繪示了根據本揭露的一些實施方式之機體100內部之熱傳導部件102、散熱風扇103以及兩個冷卻風扇201之俯視配置圖。如第2A圖中所示,冷卻風扇201鄰近於熱傳導部件102設置,配置以增加冷空氣進氣量。儘管在第2A圖所繪示的實施方式中僅示出兩個冷卻風扇201,應當理解,機體100可以包括任意數量的冷卻風扇201,同時保持在本揭露的範圍內。Please refer to FIG. 2A , which illustrates a top view of the
請參照第2B圖與第2C圖,其分別繪示了根據本揭露的一些實施方式之冷卻風扇201之立體圖與側視圖。如第2B圖與第2C圖中所示,冷卻風扇201包含第三軸向入風口202、第四軸向入風口204以及側向出風口203。第三軸向入風口202對應於第一殼部110之進氣口112-1、112-2之一,例如第一殼部110兩側之進氣口112-2。第四軸向入風口204與第三軸向入風口202相對,且對應於第二殼部120之進氣口122-1、122-2之一,例如第二殼部120兩側之進氣口122-2。Please refer to FIG. 2B and FIG. 2C, which respectively illustrate a perspective view and a side view of the cooling
在第2A圖所對應的實施方式中,冷卻風扇201之側向出風口203朝向散熱口101開口。冷卻風扇201自系統外部進氣,所引入之冷空氣由側向出風口203吹往散熱口101。冷空氣與熱傳導部件102熱交換,吸收熱量後所產生之熱空氣再由散熱口101排至機體100外部,同時加速機體100內部的空氣對流,減少在流場死角(dead zone)的熱堆積。In the embodiment corresponding to FIG. 2A , the lateral air outlet 203 of the cooling
如第2B圖與第2C圖中所示,在一些實施方式中,冷卻風扇201進一步包含殼體205、第一擋體207以及第二擋體206。殼體205具有第三軸向入風口202、第四軸向入風口204以及側向出風口203。第一擋體207圍繞殼體205,配置以防止熱傳導部件102鄰近於冷卻風扇201的部位所帶有的熱量加熱冷卻風扇201,導致冷卻風扇201引入之冷空氣被加熱,從而降低冷卻效率。第二擋體206設置於殼體205上,分別位於第三軸向入風口202與第四軸向入風口204之外緣,同時分別抵靠第一殼部110與第二殼部120,其目的在於確保第三軸向入風口202與第四軸向入風口204所引入之空氣皆來自系統外部,而非來自在機殼內循環之較高溫之空氣。As shown in Figures 2B and 2C, in some embodiments, the cooling
請參照第2D圖,其繪示了根據本揭露的另一些實施方式之機體200內部之熱傳導部件102、散熱風扇103以及兩個冷卻風扇201之俯視配置圖。如第2D圖中所示,冷卻風扇201鄰近於熱傳導部件102設置。儘管在第2D圖所繪示的實施方式中僅示出兩個冷卻風扇201,應當理解,機體200可以包括任意數量的冷卻風扇201,同時保持在本揭露的範圍內。Please refer to Figure 2D, which illustrates a top view of the
在一些實施方式中,冷卻風扇201之側向出風口203遠離散熱口101開口。舉例來說,如第2D圖中所示,冷卻風扇201之側向出風口203之開口方向垂直於散熱口101之開口方向,且兩個冷卻風扇201之開口方向彼此相反。對應於兩個冷卻風扇201之側向出風口203,側殼部130進一步設置兩個冷卻口210(參照第2E圖)。熱傳導部件102進一步包含導熱元件208,配置以將熱傳導部件102之熱量導引至特定位置散熱。如第2D圖中所示,兩個導熱元件208分別延伸至兩個冷卻風扇201之側向出風口203與兩個冷卻口210之間。In some embodiments, the lateral air outlet 203 of the cooling
在一些實施方式中,如第2D圖中所示,進一步設置熱交換器209(例如散熱鰭片)以增加熱對流與熱輻射面積。熱交換器209之一側位於冷卻風扇201之側向出風口203前,熱交換器209之另一側則對應於側殼部130之冷卻口210(參照第2E圖)。In some embodiments, as shown in Figure 2D, a heat exchanger 209 (such as a heat dissipation fin) is further provided to increase the heat convection and heat radiation area. One side of the heat exchanger 209 is located in front of the lateral air outlet 203 of the cooling
具體來說,散熱風扇103自系統外部進氣,所引入之冷空氣由徑向出風口105分別沿著不同方向輻射式地吹往熱傳導部件102,加速熱傳導部件102將來自熱源之熱量平均分散,其中部分熱量透過導熱元件208導引至冷卻風扇201之側向出風口203,而散熱風扇103所引入之冷空氣吸收熱量後所產生之熱空氣再由散熱口101排至機體200(參照第2E圖)外部。同時,冷卻風扇201也自系統外部進氣,所引入之冷空氣經由側向出風口203吹出,與熱交換器209進行熱交換,冷空氣吸收熱量後所產生之熱空氣再由冷卻口210(參照第2E圖)排至機體200外部。Specifically, the cooling
如第2B圖與第2C圖中所示,冷卻風扇201所包含之殼體205與第一擋體207在第2D圖所對應的實施方式中,使散熱風扇103與兩個冷卻風扇201各自具有獨立(熱)流場,防止機體200內熱風回流造成不必要之熱傳發生。As shown in Figures 2B and 2C, the casing 205 and the first baffle 207 included in the cooling
請參照第2E圖,其繪示了根據本揭露的另一些實施方式之機體200之背面立體圖。如第2E圖中所示,在一些實施方式中,除了可同時作為擋墊之可收放支架108外,機體200進一步在第二殼部120遠離第一殼部110的一側設置兩個擋墊211。擋墊211沿著第二殼部120之側邊方向橫跨設置於第二殼部120之進氣口122-2與冷卻口210之間,防止自冷卻口210排出之熱空氣重新藉由進氣口122-2進入系統,降低冷卻效率。Please refer to FIG. 2E , which illustrates a back perspective view of the body 200 according to other embodiments of the present disclosure. As shown in Figure 2E, in some embodiments, in addition to the
以上對於本揭露之具體實施方式之詳述,可以明顯地看出,於本揭露的氣冷系統中,位於第一殼部與第二殼部之進氣口,透過增加冷空氣之進氣量提升冷卻效率。熱傳導部件藉由散熱風扇所產生之工作流體,平均分散來自熱源之熱量。冷卻風扇進一步加強對流,將熱量導引至散熱口或冷卻口。熱傳導部件延伸出之導熱元件可進一步分散熱傳導部件之熱量,將熱量導引至冷卻風扇之出風口。另外,可收放支架將機體抬高,增加第二殼部之進氣口的冷空氣進氣量,同時擋墊將第二殼部之進氣口與散熱口或冷卻口各自的氣流分隔開,避免熱風回流入系統。相較於目前常見用於電子裝置的氣冷系統更能達到散熱冷卻的效果。From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the air cooling system of the present disclosure, the air inlets located in the first shell part and the second shell part increase the intake volume of cold air. Improve cooling efficiency. The heat transfer component uses the working fluid generated by the cooling fan to evenly disperse the heat from the heat source. Cooling fans further enhance convection and direct heat to heat dissipation vents or cooling vents. The heat-conducting element extended from the heat-conducting component can further dissipate the heat of the heat-conducting component and guide the heat to the air outlet of the cooling fan. In addition, the retractable bracket raises the body to increase the amount of cold air intake through the air inlet of the second shell. At the same time, the baffle separates the air flow between the air inlet of the second shell and the heat dissipation or cooling vents. Open to prevent hot air from flowing back into the system. Compared with the air cooling system currently commonly used in electronic devices, it can achieve a better heat dissipation and cooling effect.
前面描述內容僅對於本揭露之示例性實施例給予說明和描述,並無意窮舉或限制本揭露所公開之發明的精確形式。以上教示可以被修改或者進行變化。The foregoing description is merely illustrative and descriptive of exemplary embodiments of the present disclosure, and is not intended to be exhaustive or to limit the precise forms of the invention disclosed in the present disclosure. The above teachings may be modified or varied.
被選擇並說明的實施例是用以解釋本揭露之內容以及他們的實際應用從而激發本領域之其他技術人員利用本揭露及各種實施例,並且進行各種修改以符合預期的特定用途。在不脫離本揭露之精神和範圍的前提下,替代性實施例將對於本揭露所屬領域之技術人員來說為顯而易見者。因此,本揭露的範圍是根據所附申請專利範圍而定,而不是被前述說明書和其中所描述之示例性實施例所限定。The embodiments were chosen and described in order to explain the contents of the present disclosure and their practical applications to thereby inspire others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will be apparent to those skilled in the art to which this disclosure belongs without departing from the spirit and scope of this disclosure. Therefore, the scope of the present disclosure is determined by the appended claims rather than by the foregoing specification and the exemplary embodiments described therein.
100,200:機體 101:散熱口 102:熱傳導部件 103:散熱風扇 104:第一軸向入風口 105:徑向出風口 106:第二軸向入風口 107,209:熱交換器 108:可收放支架 110:第一殼部 112-1,112-2,122-1,122-2:進氣口 120:第二殼部 130:側殼部 201:冷卻風扇 202:第三軸向入風口 203:側向出風口 204:第四軸向入風口 205:殼體 206:第二擋體 207:第一擋體 208:導熱元件 210:冷卻口 211:擋墊 100,200:Machine 101:Heat dissipation vent 102:Thermal conductive components 103: Cooling fan 104: First axial air inlet 105: Radial air outlet 106: Second axial air inlet 107,209:Heat exchanger 108: Retractable stand 110:First Shell Department 112-1,112-2,122-1,122-2: Air inlet 120:Second shell part 130: Side shell part 201: Cooling fan 202:Third axial air inlet 203: Side air outlet 204: The fourth axial air inlet 205: Shell 206:Second blocking body 207:First blocking body 208: Thermal conductive element 210: Cooling port 211:Block pad
圖式繪示了本揭露的一或多個實施例,並且與書面描述一起用於解釋本揭露之原理。在所有圖式中,儘可能使用相同的圖式標記指代實施例的相似或相同元件,其中: 第1A圖為繪示了根據本揭露的一些實施方式之機體之正面立體圖。 第1B圖為繪示了根據本揭露的一些實施方式之機體之背面立體圖。 第1C圖為繪示了根據本揭露的一些實施方式之機體內部之熱傳導部件與散熱風扇之立體配置圖。 第1D圖為繪示了根據本揭露的一些實施方式之散熱風扇之立體圖。 第1E圖為繪示了根據本揭露的一些實施方式之散熱風扇之側視圖。 第1F圖為繪示了根據本揭露的一些實施方式之機體內部之熱傳導部件、散熱風扇以及熱交換器之立體配置圖。 第1G圖為繪示了根據本揭露的一些實施方式之機體之背面立體圖。 第2A圖為繪示了根據本揭露的一些實施方式之機體內部之熱傳導部件、散熱風扇以及冷卻風扇之俯視配置圖。 第2B圖為繪示了根據本揭露的一些實施方式之冷卻風扇之立體圖。 第2C圖為繪示了根據本揭露的一些實施方式之冷卻風扇之側視圖。 第2D圖為繪示了根據本揭露的另一些實施方式之機體內部之熱傳導部件、散熱風扇以及冷卻風扇之俯視配置圖。 第2E圖為繪示了根據本揭露的另一些實施方式之機體之背面立體圖。 The drawings illustrate one or more embodiments of the disclosure and, together with the written description, serve to explain principles of the disclosure. Wherever possible, the same drawing numbers will be used throughout the drawings to refer to similar or identical elements of the embodiments, where: Figure 1A is a front perspective view of a body according to some embodiments of the present disclosure. Figure 1B is a back perspective view of a body according to some embodiments of the present disclosure. Figure 1C is a three-dimensional configuration diagram illustrating the heat conduction components and cooling fans inside the machine body according to some embodiments of the present disclosure. Figure 1D is a perspective view of a cooling fan according to some embodiments of the present disclosure. Figure 1E is a side view of a cooling fan according to some embodiments of the present disclosure. Figure 1F is a three-dimensional configuration diagram illustrating the heat conduction components, cooling fans and heat exchangers inside the body according to some embodiments of the present disclosure. Figure 1G is a back perspective view of a body according to some embodiments of the present disclosure. Figure 2A is a top view illustrating the arrangement of heat conduction components, heat dissipation fans and cooling fans inside the machine body according to some embodiments of the present disclosure. Figure 2B is a perspective view of a cooling fan according to some embodiments of the present disclosure. Figure 2C is a side view of a cooling fan according to some embodiments of the present disclosure. Figure 2D is a top plan view illustrating the heat conduction components, heat dissipation fans and cooling fans inside the machine body according to other embodiments of the present disclosure. Figure 2E is a back perspective view of a body according to other embodiments of the present disclosure.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without
100:機體 100: Body
110:第一殼部 110:First Shell Department
112-1,112-2:進氣口 112-1,112-2: Air inlet
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