CN213092261U

CN213092261U - Multiple heat radiation structure of computer chip

Info

Publication number: CN213092261U
Application number: CN202021600846.6U
Authority: CN
Inventors: 缪荣增; 王胜虎
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-08-05
Filing date: 2020-08-05
Publication date: 2021-04-30
Anticipated expiration: 2030-08-05

Abstract

The utility model discloses a multiple heat radiation structure of computer chip, include the base and install the installation base on the base, install the chip in the installation base, the top of base is violently provided with the roof, both ends symmetry is fixed to be inserted with two stocks about the roof, and two the lower extreme of stock all runs through the base setting, two the nut has been cup jointed to the equal screw thread of end of stock, the bottom of roof install with chip assorted multiple radiating part, multiple radiating part comprises forced air cooling radiator unit and liquid cooling radiator unit jointly, forced air cooling radiator unit is including fixing the heat transfer fin at the roof top. The utility model discloses an air-cooling and liquid cooling subassembly that heat transfer fin set gradually outward can realize the excellent radiating effect to the chip, guarantees multicore, easy high temperature CPU's normal operating in the at utmost, ensures that user's data and even economic utensil is not impaired.

Description

Multiple heat radiation structure of computer chip

Technical Field

The utility model relates to a chip heat dissipation technical field especially relates to a multiple heat radiation structure of computer chip.

Background

Chips, precisely silicon wafers, are also called integrated circuits. It is the main product of microelectronics technology. The term "microelectronics" refers to the concept of "strong current" or "weak current", which means that the electronic signals processed by the microelectronics are extremely tiny, and the microelectronics are the basis of modern information technology. The computer chip is a thin sheet made of silicon material and has a size of only half of a fingernail. A chip is connected by hundreds of microcircuits, and the microcircuits for generating pulse current are distributed on the chip. The computer chip can perform operations required for controlling a computer, an automation device, and other various devices using the minute electric current. The circuits in a computer chip are small and the currents used by it are also small, so the chip is also called a microelectronic device. The main chips in the microcomputer include a microprocessor chip, an interface chip, and a memory chip.

Most of the current computer chips adopt simple fans for heat dissipation, the heat dissipation effect is poor, the simple heat dissipation fans which generate heat during operation cannot play a role in the case of CPUs with dozens of cores and many cores, and the CPU is easily damaged by high temperature, so that user data and even economic loss are caused.

SUMMERY OF THE UTILITY MODEL

The purpose of the utility model is to solve the shortcoming that exists among the prior art, if: the existing computer chip mostly adopts a simple fan to dissipate heat, the heat dissipation effect is not good, the simple fan cannot play a role in heat generated by the operation of a CPU with dozens of cores at a lot of cores, the CPU is easily damaged at high temperature, and user data and even economic loss are caused, so that the multiple heat dissipation structure of the computer chip is provided.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a multiple heat radiation structure of computer chip, includes the base and installs the installation base on the base, install the chip in the installation base, the top of base is violently provided with the roof, two stocks have been inserted to both ends symmetry fixed the installation about the roof, and two the lower extreme of stock all runs through the base setting, two the terminal equal screw thread of stock has cup jointed the nut, the bottom of roof install with the multiple radiating part of chip assorted, multiple radiating part comprises forced air cooling radiator unit and liquid cooling radiator unit jointly.

Preferably, the air-cooled heat dissipation assembly comprises heat exchange fins fixed to the top of the top plate, heat exchange plates are fixed to the bottoms of the heat exchange fins, and a layer of silicone grease used for heat dissipation is coated between each heat exchange plate and the corresponding chip.

Preferably, two cooling fans are symmetrically installed on the left side and the right side of the heat exchange fin, and the two cooling fans are installed outside the heat exchange fin in a detachable mode.

Preferably, the liquid cooling heat dissipation assembly comprises two heat exchange fin plates symmetrically arranged on the front side and the rear side of each heat exchange fin, and a circulating system matched with the two heat exchange fin plates is arranged between the anchor rods respectively.

Preferably, the circulating system comprises a liquid pipe connected with the heat exchange fin plate, two micro pumps are correspondingly arranged outside the liquid pipe, two liquid storage tanks communicated with the liquid pipe are symmetrically arranged between the anchor rods, and liquid exchange valves are installed at the tops of the liquid storage tanks.

The utility model has the advantages that: the air cooling and liquid cooling components which are sequentially arranged outside the heat exchange fins can realize the excellent heat dissipation effect on the chip, ensure the normal operation of the multi-core and high-temperature-prone CPU to the maximum extent, and ensure that the data of a user and even an economic appliance are not damaged.

Drawings

Fig. 1 is a schematic structural diagram of a multiple heat dissipation structure of a computer chip according to the present invention;

fig. 2 is a top view of the heat exchanging fins, the heat dissipating fan and the heat exchanging fin plate of the present invention.

In the figure: the heat exchange device comprises a base 1, an installation base 2, silicone grease 3, heat exchange plates 4, a liquid pipe 5, a liquid storage tank 6, a heat dissipation fan 7, a liquid exchange valve 8, a micro pump 9, heat exchange fins 10, a top plate 11, an anchor rod 12, heat exchange fin plates 13 and nuts 14.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1-2, a multiple heat dissipation structure of a computer chip comprises a base 1 and an installation base 2 installed on the base 1, wherein the chip is installed in the installation base 2, a top plate 11 is transversely and vertically arranged above the base 1, two anchor rods 12 are symmetrically and fixedly inserted into the left end and the right end of the top plate 11, the lower ends of the two anchor rods 12 penetrate through the base 1, nuts 14 are sleeved at the tail ends of the two anchor rods 12 in a threaded manner, multiple heat dissipation components matched with the chip are installed at the bottom of the top plate 11, and the multiple heat dissipation components are composed of an air cooling heat dissipation component and a liquid cooling heat dissipation component;

the air-cooled heat dissipation assembly comprises heat exchange fins 10 fixed on the top of a top plate 11, heat exchange plates 4 are fixed at the bottoms of the heat exchange fins 10, a layer of silicone grease 3 for heat dissipation is coated between each heat exchange plate 4 and a chip, two heat dissipation fans 7 are symmetrically installed on the left side and the right side of each heat exchange fin 10, and the two heat dissipation fans 7 are installed outside the heat exchange fins 10 in a detachable mode;

the liquid cooling radiator unit includes that the symmetry sets up two heat transfer fin 13 in heat transfer fin 10 front and back both sides, be provided with respectively between two stock 12 with two heat transfer fin 13 assorted circulation systems, the circulation system includes liquid pipe 5 that is connected with heat transfer fin 13, liquid pipe 5 is provided with two micro-pump machines 9 outward correspondingly, and the symmetry is provided with two liquid reserve tanks 6 that are linked together with liquid pipe 5 between two stock 12, the filling has the coolant liquid in the liquid reserve tank 6, the liquid change valve 8 is all installed at the top of two liquid reserve tanks 6.

In the multiple heat dissipation structure of the computer chip provided by the utility model, the chip is arranged on the mounting base 2, and the heat exchange plate 4 arranged at the bottom of the heat exchange fin 10 is contacted with the top of the chip through silicone grease, thereby providing excellent heat dissipation effect; furthermore, the air cooling and liquid cooling components sequentially arranged outside the heat exchange fins 10 can realize excellent heat dissipation effect on the chip, guarantee the normal operation of the multi-core and high-temperature-prone CPU to the greatest extent, and ensure that the data of users and even the economic appliance are not damaged.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a multiple heat radiation structure of computer chip, includes base (1) and installs installation base (2) on base (1), its characterized in that, install the chip in installation base (2), the top of base (1) is violently provided with roof (11), both ends symmetry is fixed to be inserted two stock (12) about roof (11), and two the lower extreme of stock (12) all runs through base (1) and sets up, two the equal screw thread in end of stock (12) has cup jointed nut (14), the bottom of roof (11) install with the multiple radiating part of chip assorted, multiple radiating part comprises air-cooled radiating component and liquid cooling radiating component jointly.

2. The multiple heat dissipation structure of a computer chip according to claim 1, wherein the air-cooled heat dissipation assembly comprises heat exchange fins (10) fixed on the top of a top plate (11), a heat exchange plate (4) is fixed on the bottom of each heat exchange fin (10), and a layer of silicone grease (3) for heat dissipation is coated between each heat exchange plate (4) and the chip.

3. The multiple heat dissipation structure of a computer chip according to claim 2, wherein two heat dissipation fans (7) are symmetrically installed on the left and right sides of the heat exchange fin (10), and both of the heat dissipation fans (7) are detachably installed outside the heat exchange fin (10).

4. The multiple heat dissipation structure of a computer chip according to claim 2, wherein the liquid-cooled heat dissipation assembly comprises two heat exchange fin plates (13) symmetrically arranged at the front and rear sides of the heat exchange fin (10), and a circulation system matched with the two heat exchange fin plates (13) is respectively arranged between the two anchor rods (12).

5. The multiple heat dissipation structure of a computer chip according to claim 4, wherein the circulation system comprises a liquid pipe (5) connected with the heat exchange fin plate (13), two micro pumps (9) are correspondingly arranged outside the liquid pipe (5), two liquid storage tanks (6) communicated with the liquid pipe (5) are symmetrically arranged between the two anchor rods (12), and the liquid exchange valves (8) are mounted at the tops of the two liquid storage tanks (6).