CN215815850U

CN215815850U - Be suitable for extensive electronic chip radiator

Info

Publication number: CN215815850U
Application number: CN202121920073.4U
Authority: CN
Inventors: 王国军; 王超; 唐刚
Original assignee: Zhejiang Xipu Detection Technology Co ltd
Current assignee: Zhejiang Xipu Detection Technology Co ltd
Priority date: 2021-08-17
Filing date: 2021-08-17
Publication date: 2022-02-11
Anticipated expiration: 2031-08-17

Abstract

The utility model discloses a radiator applicable to a wide range of electronic chips, which comprises a shell, wherein a placing cavity and two radiating cavities are arranged in the shell, an electronic chip is arranged in the placing cavity, through grooves are arranged on two sides of the placing cavity, a partition plate is arranged in each through groove, a plurality of heat exchange fins are arranged on one side, located in the placing cavity, of each partition plate, a plurality of radiating fins are arranged on one side, located in the radiating cavities, of each partition plate, an opening is arranged at one end, far away from the placing cavity, of each radiating cavity, a radiating device is connected to each opening, a plurality of rubber supporting blocks are evenly distributed at the bottom of the shell, a plurality of supporting devices are evenly distributed at the bottom of the shell, the radiating surface of the radiator can be expanded through the radiating devices, the radiator can be cooled more quickly, and the radiator can be further radiated by other cooling devices, the placing cavity is cooled more quickly, and the placing cavity is simple in structure, convenient to operate and suitable for popularization.

Description

Be suitable for extensive electronic chip radiator

Technical Field

The utility model relates to an electronic chip radiator with wide application.

Background

Chips, also known as microcircuits (microcircuits), microchips (microchips), and Integrated Circuits (ICs). Refers to a silicon chip containing integrated circuits, which is small in size and is often part of a computer or other electronic device.

However, the electronic chip generates a large amount of heat during operation, if the heat cannot be dissipated in time, the working performance and efficiency of the electronic chip are affected, and the chip is burnt even if the temperature is too high, so that the service life of the electronic chip is seriously affected.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem of providing an electronic chip radiator which is widely applicable.

The utility model is realized by the following technical scheme:

the utility model provides a be suitable for extensive electronic chip radiator, includes a casing the casing is inside to be provided with one and places chamber and two heat dissipation chambeies place the intracavity and be provided with electronic chip place the both sides of placing the chamber and be provided with logical groove it is provided with a baffle to lead to the inslot the baffle is located place that one side in chamber is provided with the polylith heat exchanger fin the baffle is located that one side in heat dissipation chamber is provided with the multi-disc fin the heat dissipation chamber is kept away from place that one end in chamber is provided with the opening part is connected with heat abstractor, heat abstractor connects the fin the bottom equipartition on the casing has polylith rubber support block the bottom equipartition of casing has a plurality of strutting arrangement.

Preferably, heat abstractor includes a setting and is in the end plate of opening part the end plate is close to that one end in heat dissipation chamber is provided with the first fin of multi-disc, a slice the fin corresponds a slice first fin one side of fin is provided with a T type spout one side of first fin is provided with the cooperation the T type slider of T type spout both ends all transversely are provided with two ladder grooves around the casing the end plate is close to that one end of casing is provided with two locating levers, the locating lever inserts the ladder inslot the locating lever is kept away from that one end veneer of end plate is fixed with a stopper the outside screw fixation in ladder groove has the end cover.

Preferably, a pulling lug for pulling the end plate is arranged at the end of the end plate far away from the first cooling fin.

Preferably, a magnet is arranged between the end plate and the housing, by means of which magnet the end plate can be attracted to the housing.

Preferably, the partition plate, the heat exchange fins, the radiating fins and the first radiating fins are all made of copper.

Preferably, the supporting device comprises a placing groove, a rotating seat is arranged in the placing groove, a supporting rod is arranged on the rotating seat, and a clamping block which is convenient for clamping the supporting rod is arranged at a position far away from the rotating seat in the placing groove.

The utility model has the beneficial effects that: compared with the prior art, this device can enlarge the cooling surface through heat abstractor, can be faster cool down, also can be through other cooling arrangement to the further heat dissipation of heat abstractor, and it is faster to make to place the intracavity cooling, its simple structure, and convenient operation is fit for promoting.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a front view of the present invention;

fig. 3 is a connection diagram of the heat sink and the first heat sink of the present invention.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.

In the description of the present invention, it is to be understood that the terms "one end", "the other end", "outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.

Further, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "sleeved," "connected," "penetrating," "plugged," and the like are to be construed broadly, e.g., as a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

A broadly applicable electronic chip heat sink as shown in fig. 1, 2 and 3, comprises a housing 1, a placing cavity 101 and two heat dissipation cavities 102 are arranged inside the shell 1, an electronic chip 2 is arranged in the placing cavity 101, through grooves 103 are arranged on two sides of the placing cavity 101, a partition plate 104 is arranged in the through grooves 103, a plurality of heat exchange plates 105 are arranged on the side of the partition plate 104 positioned in the placing cavity 101, a plurality of fins 106 are disposed on the side of the partition 104 located in the heat dissipation chamber 102, an opening 107 is provided at the end of the heat dissipation chamber 102 remote from the placement chamber 101, a heat sink 3 is connected to the opening 107, the heat sink 3 is connected to the heat sink 106, a plurality of rubber supporting blocks 108 are uniformly distributed on the bottom of the shell 1, and a plurality of supporting devices 4 are uniformly distributed on the bottom of the shell 1.

In a preferred embodiment of the present invention, the heat dissipation device 3 includes an end plate 301 disposed at the opening 107, a plurality of first heat dissipation fins 302 are disposed at an end of the end plate 301 close to the heat dissipation cavity 102, one heat dissipation fin 106 corresponds to one heat dissipation fin 302, a T-shaped sliding slot 109 is disposed at one side of the heat dissipation fin 106, a T-shaped sliding block 303 cooperating with the T-shaped sliding slot 109 is disposed at one side of the first heat dissipation fin 302, two stepped slots 304 are transversely disposed at both front and rear ends of the housing 1, two positioning rods 305 are disposed at an end of the end plate 301 close to the housing 1, the positioning rods 305 are inserted into the stepped slots 304, a limiting block 306 is fixed at an end of the positioning rod 305 far from the end plate 301 by gluing, and an end cap 307 is fixed at an external screw of the stepped slot 304.

In a preferred embodiment of the present invention, a pulling lug 308 for pulling the end plate is disposed at an end of the end plate 301 away from the first heat sink 302.

In a preferred embodiment of the present invention, a magnet 309 is disposed between the end plate 301 and the housing 1, and the magnet 309 can be used to attach the end plate 301 to the housing 1.

In a preferred embodiment of the present invention, the partition plate 104, the heat exchanger plate 105, the heat sink 106 and the first heat sink 302 are made of copper, which has a good heat dissipation property.

In a preferred embodiment of the present invention, the supporting device 4 comprises a placement slot 401, a rotating base 402 is disposed in the placement slot 401, a supporting rod 403 is mounted on the rotating base 402, and a clamping block 404 is disposed in the placement slot 401 at a position far from the rotating base 402 for clamping the supporting rod 403.

Working principle; when electronic chip was overheated during operation, with bracing piece jack-up, with casing jack-up, pull out the end plate through drawing the ear, first fin was drawn to the outside of casing this moment, place the heat of intracavity this moment and pass through the heat exchanger fin, the baffle, the fin transmits first fin and dispels the heat, will place the fan with the bottom of first fin this moment and dispel the heat, also can dispel the heat to it through the coolant liquid, effect through the baffle can not make electronic chip wet, when need not to dispel the heat the end plate promote to original position can.

The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.

Claims

1. The utility model provides a be suitable for extensive electronic chip radiator which characterized in that: the heat dissipation device comprises a shell, wherein a placing cavity and two heat dissipation cavities are arranged inside the shell, an electronic chip is arranged in the placing cavity, through grooves are formed in two sides of the placing cavity, a partition plate is arranged in each through groove and located on one side of the placing cavity, a plurality of heat exchange fins are arranged on one side of each partition plate located on each heat dissipation cavity, a plurality of cooling fins are arranged on one side of each partition plate located on each heat dissipation cavity, an opening is formed in one end, far away from the placing cavity, of each heat dissipation cavity, a heat dissipation device is connected to the opening, the cooling fins are connected to the heat dissipation device, a plurality of rubber supporting blocks are evenly distributed at the bottom of the shell, and a plurality of supporting devices are evenly distributed at the bottom of the shell.

2. The broadly adaptable electronic chip heat sink of claim 1, wherein: heat abstractor includes a setting and is in the end plate of opening part the end plate is close to that one end in heat dissipation chamber is provided with the first fin of multi-disc, a slice the fin corresponds a slice first fin one side of fin is provided with a T type spout one side of first fin is provided with the cooperation the T type slider of T type spout both ends all transversely are provided with two ladder grooves around the casing the end plate is close to that one end of casing is provided with two locating levers, the locating lever inserts the ladder inslot the locating lever is kept away from that one end veneer of end plate is fixed with a stopper the external screw fixation in ladder groove has the end cover.

3. The broadly adaptable electronic chip heat sink of claim 2, wherein: and a pulling lug which is convenient for pulling the end plate is arranged at the end of the end plate far away from the first radiating fin.

4. The broadly adaptable electronic chip heat sink of claim 2, wherein: and a magnet is arranged between the end plate and the shell, and the end plate can be adsorbed on the shell through the magnet.

5. The broadly adaptable electronic chip heat sink of claim 2, wherein: the partition plate, the heat exchange fins, the radiating fins and the first radiating fins are all made of copper.

6. The broadly adaptable electronic chip heat sink of claim 1, wherein: the supporting device comprises a placing groove, a rotating seat is arranged in the placing groove, a supporting rod is mounted on the rotating seat, and a clamping block convenient for clamping the supporting rod is arranged at a position far away from the rotating seat in the placing groove.