CN212873406U

CN212873406U - Cooling structure of reinforced computer storage chip

Info

Publication number: CN212873406U
Application number: CN202021843821.9U
Authority: CN
Inventors: 宋清卿; 韩源; 黄鑫权
Original assignee: Digital Efficiency Research Institute Foshan Co ltd
Current assignee: Digital Efficiency Research Institute Foshan Co ltd
Priority date: 2020-08-29
Filing date: 2020-08-29
Publication date: 2021-04-02
Anticipated expiration: 2030-08-29

Abstract

The utility model discloses a reinforcement type computer memory chip's cooling structure relates to computer chip heat dissipation equipment technical field, lacks heat dissipation mechanism to current computer memory chip, uses the computer to cause the problem of computer crash or blue screen easily for a long time, now proposes following scheme, and it includes radiating seat, DRAM, memory socket, fastening bolt, heat dissipation splint, dead lever and mainboard, there is the fan groove in the inside of radiating seat is seted up, just the fan groove runs through the radiating seat, a side that the radiating seat is close to the mainboard is seted up evenly distributed's mounting hole, and the inside rotation of mounting hole installs the leg brace, the leg brace respectively with mounting hole threaded connection, a side slidable mounting that the radiating seat was kept away from to the leg brace has the telescopic link. The utility model has novel structure, and the device can not only actively dissipate heat for the memory bank; meanwhile, the influence of vibration generated by the operation of the cooling fan on the memory bank and the mainboard can be reduced, and the use reliability is high.

Description

Cooling structure of reinforced computer storage chip

Technical Field

The utility model relates to a computer chip heat dissipation equipment technical field especially relates to a reinforcement type computer memory chip's cooling structure.

Background

Along with the improvement of the performance of the computer, the heat generation of the computer is increased, and in order to keep the higher performance of the computer, a certain heat dissipation device is often used for dissipating heat of core components of the computer.

The existing computer heat dissipation device mainly aims at dissipating heat of a central processing unit and a graphic processor, a storage chip is often lack of a heat dissipation device, and therefore after the computer is used for a long time, due to the fact that the temperature of the storage chip is too high, computer crash or blue screen is easily caused after a certain threshold value is reached, and even the risk of damage of a memory chip is caused.

SUMMERY OF THE UTILITY MODEL

The utility model provides a pair of reinforcement type computer memory chip's cooling structure has solved current computer memory chip and has lacked heat dissipation mechanism, uses the computer to cause the problem of computer crash or blue screen easily for a long time.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a cooling structure of a reinforced computer storage chip comprises a heat radiating seat, a memory bar, a memory socket, a fastening bolt, a heat radiating clamp plate, a fixing rod and a mainboard, wherein a fan groove is formed in the heat radiating seat and penetrates through the heat radiating seat, uniformly distributed mounting holes are formed in one side surface, close to the mainboard, of the heat radiating seat, supporting legs are rotatably mounted in the mounting holes and are respectively in threaded connection with the mounting holes, a telescopic rod is slidably mounted on one side surface, far away from the heat radiating seat, of each supporting leg, mounting feet are fixedly mounted on one side surface, far away from the corresponding supporting legs, of each telescopic rod, a buffer spring is connected between each mounting foot and each supporting leg and is respectively sleeved with each telescopic rod, a heat conducting copper pipe is fixedly mounted on one side surface, close to the mainboard, of the heat radiating seat, the fixing rod is symmetrically distributed and is fixedly connected with the heat conducting copper pipe, and a connecting rod is fixedly, and the both ends of connecting rod are equal fixed mounting have the slide bar, the heat dissipation splint are close to the equal fixed mounting of one side surface of heat conduction copper pipe has the sliding seat of symmetric distribution, and the sliding seat all with slide bar sliding connection.

Preferably, the mounting foot fixed mounting is in the surface of mainboard, just the side that the radiating seat was kept away from to the mounting foot all rotates and installs the set screw, the set screw run through the mainboard and with mounting foot threaded connection.

Preferably, both sides face of heat dissipation splint all fixed mounting have the bolt seat, just fastening bolt rotates with the bolt seat respectively to be connected, just one side that fastening bolt kept away from the bolt head is connected with bolt seat threaded connection.

Preferably, one side surface, close to each other, of each of the two heat dissipation clamping plates in the corresponding position is coated with heat conduction silicone grease which is uniformly distributed.

Preferably, the memory bank is fixedly installed in the memory socket, and the memory bank is arranged between the two heat dissipation clamping plates.

Preferably, a heat dissipation fan is fixedly installed inside the fan groove, and an input end of the heat dissipation fan is electrically connected with an output end of the main board.

The utility model has the advantages that:

1. one side and bolt seat threaded connection through fastening bolt, and the one side coating that is close to each other through the heat dissipation splint that correspond two has heat conduction silicone grease, make two heat dissipation splint to be close to each other through rotatory fastening bolt, thereby make the abundant contact in surface of heat conduction silicone grease and memory bank, thereby make the heat accessible heat dissipation splint transmission to the heat conduction copper pipe that the memory bank operation produced, and through the air current on radiator fan acceleration heat conduction copper pipe surface, thereby with the quick discharge of the heat on heat conduction copper pipe surface, can carry out the initiative heat dissipation to the memory bank.

2. The buffer springs are arranged between the supporting legs and the mounting feet, so that the vibration generated by the operation of the cooling fan of the device can be absorbed by the buffer springs, the influence of the vibration generated by the operation of the cooling fan on the memory bank and the mainboard is reduced, and the use reliability is high.

In summary, the device can not only perform active heat dissipation on the memory bank; meanwhile, the influence of vibration generated by the operation of the cooling fan on the memory bank and the mainboard can be reduced, the use reliability is high, and the cooling fan is suitable for popularization.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic view of the mounting structure of the heat dissipation fan of the present invention.

Fig. 3 is a schematic structural view of the device and the main board of the present invention.

Fig. 4 is an enlarged view of a structure shown in fig. 3 according to the present invention.

Fig. 5 is a top view of the heat dissipation clamping plate of the present invention.

Reference numbers in the figures: 1. a heat dissipation base; 2. supporting legs; 3. a telescopic rod; 4. a buffer spring; 5. mounting a foot; 6. fixing screws; 7. a fan groove; 8. a heat radiation fan; 9. a heat conducting copper pipe; 10. fixing the rod; 11. a slide bar; 12. a heat dissipation clamping plate; 13. a bolt seat; 14. fastening a bolt; 15. heat-conducting silicone grease; 16. a memory bank; 17. a memory socket; 18. a main board.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-5, a cooling structure of a reinforced computer memory chip comprises a heat sink 1, a memory bar 16, a memory socket 17, a fastening bolt 14, a heat sink clamp plate 12, a fixing rod 10 and a main board 18, wherein a fan groove 7 is formed in the heat sink 1, the fan groove 7 penetrates through the heat sink 1, a side surface of the heat sink 1, which is close to the main board 18, is provided with uniformly distributed mounting holes, supporting legs 2 are rotatably mounted in the mounting holes, the supporting legs 2 are respectively in threaded connection with the mounting holes, a side surface of the supporting legs 2, which is far away from the heat sink 1, is slidably mounted with a telescopic rod 3, a side surface of the telescopic rod 3, which is far away from the supporting legs 2, is fixedly mounted with a mounting leg 5, a buffer spring 4 is connected between the mounting leg 5 and the supporting legs 2, the buffer spring 4 is respectively in sleeve connection with the telescopic rod 3, a side surface of the heat sink 1, which is, dead lever 10 is the symmetric distribution and with heat conduction copper pipe 9 fixed connection, dead lever 10 keeps away from the one end fixed mounting of heat conduction copper pipe 9 has the connecting rod, and the equal fixed mounting in both ends of connecting rod has slide bar 11, heat dissipation splint 12 is close to the equal fixed mounting in a side surface of heat conduction copper pipe 9 has the sliding seat of symmetric distribution, and the sliding seat all with slide bar 11 sliding connection, 5 fixed mounting in the surface of mainboard 18 of installation foot, just installation foot 5 keeps away from a side of heat dissipation seat 1 and all rotates and install set screw 6, set screw 6 runs through mainboard 18 and with 5 threaded connection of installation foot, the equal fixed mounting in both sides face of heat dissipation splint 12 has bolt seat 13, just fastening bolt 14 rotates with bolt seat 13 respectively to be connected, just one side that fastening bolt 14 keeps away from the bolt head and 13 threaded connection of bolt seat, two correspond the position a side that heat dissipation splint 12 is close to each other all coats and has evenly distributed's heat conduction silicone grease 15, the memory bank 16 is fixedly installed inside the memory socket 17, the memory bank 16 is disposed between the two heat dissipation clamp plates 12, the heat dissipation fan 8 is fixedly installed inside the fan slot 7, and an input end of the heat dissipation fan 8 is electrically connected with an output end of the main board 18.

The working principle is as follows: before the device is used, the device is firstly installed on a main board 18, a memory bar 16 is positioned between two heat dissipation clamping plates 12, then the device is fixed on the main board 18 through a fixing screw 6, then fastening bolts 14 on two sides of each heat dissipation clamping plate 12 are rotated, so that the two heat dissipation clamping plates 12 are close to each other, so that the heat dissipation clamping plates 12 tightly clamp the memory bar 16, the heat conduction silicone grease 15 is in close contact with the surface of the memory bar 16 through the heat conduction silicone grease 15 coated inside the heat dissipation clamping plates 12, and then the device is powered through the main board 18; when the device is used, firstly, the memory bank 16 operates to generate heat, the heat is transferred to the heat-conducting clamping plate 12 through the heat-conducting silicone grease 15, the heat is transferred to the heat-conducting copper pipe 9 through the sliding rod 11, the connecting rod and the fixing rod 10 by the heat-conducting clamping plate 12, and meanwhile, the heat-radiating fan 8 starts to radiate the heat, so that the airflow on the surface of the heat-conducting copper pipe 9 is accelerated, the heat on the surface of the heat-conducting copper pipe 9 can be quickly led out through the heat-radiating fan 8, and the heat radiation of the; and the buffer springs 4 are arranged between the supporting legs 2 and the mounting feet 5, so that the vibration generated by the operation of the heat radiation fan 8 can be absorbed by the buffer springs 4 arranged at the four corners of the heat radiation seat 1, and the influence of the operation vibration of the heat radiation fan 8 on the memory bank 16 and the main board 18 is reduced.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A cooling structure of a reinforced computer storage chip comprises a heat dissipation seat (1), a memory bar (16), a memory socket (17), a fastening bolt (14), a heat dissipation clamping plate (12), a fixing rod (10) and a main board (18), and is characterized in that a fan groove (7) is formed in the heat dissipation seat (1), the fan groove (7) penetrates through the heat dissipation seat (1), a side face, close to the main board (18), of the heat dissipation seat (1) is provided with uniformly distributed mounting holes, supporting legs (2) are rotatably mounted in the mounting holes, the supporting legs (2) are respectively in threaded connection with the mounting holes, a telescopic rod (3) is slidably mounted on one side face, far away from the heat dissipation seat (1), of the telescopic rod (3) is fixedly mounted with mounting feet (5), and a buffer spring (4) is connected between the mounting feet (5) and the supporting legs (2), just buffer spring (4) cup joint with telescopic link (3) respectively, a side fixed mounting that radiating seat (1) is close to mainboard (18) has heat conduction copper pipe (9), dead lever (10) be symmetric distribution and with heat conduction copper pipe (9) fixed connection, the one end fixed mounting that heat conduction copper pipe (9) were kept away from in dead lever (10) has the connecting rod, and the equal fixed mounting in both ends of connecting rod has slide bar (11), the equal fixed mounting in one side surface that radiating splint (12) are close to heat conduction copper pipe (9) has the slide block of symmetric distribution, and the slide block all with slide bar (11) sliding connection.

2. The cooling structure of the reinforced computer memory chip as claimed in claim 1, wherein the mounting feet (5) are fixedly mounted on the surface of the main board (18), and a fixing screw (6) is rotatably mounted on a side surface of the mounting feet (5) away from the heat sink (1), the fixing screw (6) penetrates through the main board (18) and is in threaded connection with the mounting feet (5).

3. The cooling structure for the reinforced computer memory chip according to claim 1, wherein a bolt seat (13) is fixedly installed on each of two side surfaces of the heat-dissipating clamping plate (12), the fastening bolts (14) are respectively rotatably connected with the bolt seats (13), and one side of each fastening bolt (14) away from the head of the bolt is in threaded connection with the bolt seat (13).

4. The cooling structure of a reinforced computer memory chip as claimed in claim 1, wherein the heat-conducting silicone grease (15) is uniformly distributed on the side surfaces of the two heat-radiating clamping plates (12) at the corresponding positions, which are close to each other.

5. The cooling structure of a reinforced computer memory chip as claimed in claim 1, wherein the memory stick (16) is fixedly installed inside the memory socket (17), and the memory stick (16) is disposed between two heat-dissipating clamping plates (12).

6. The cooling structure of the reinforced computer memory chip as claimed in claim 1, wherein a heat dissipation fan (8) is fixedly installed inside the fan slot (7), and an input end of the heat dissipation fan (8) is electrically connected to an output end of the main board (18).