CN219958180U - Computer heat radiation fin with high heat conduction efficiency - Google Patents
Computer heat radiation fin with high heat conduction efficiency Download PDFInfo
- Publication number
- CN219958180U CN219958180U CN202321701175.6U CN202321701175U CN219958180U CN 219958180 U CN219958180 U CN 219958180U CN 202321701175 U CN202321701175 U CN 202321701175U CN 219958180 U CN219958180 U CN 219958180U
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- heat
- heat conduction
- plate
- wall
- computer
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- 230000005855 radiation Effects 0.000 title claims description 16
- 239000000428 dust Substances 0.000 claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 238000001816 cooling Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 230000007774 longterm Effects 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006386 memory function Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model discloses a computer radiating fin with high heat conduction efficiency, which comprises a heat conduction plate, wherein a second thread groove is formed in the upper end surface of the heat conduction plate, and a second screw rod is movably connected to the inner wall of the second thread groove; the heat conducting plate is matched with the fan, so that heat in the upper shell of the computer is absorbed on the heat conducting plate when the computer is used, the heat conducting plate is transferred to the heat radiating fins, the heat is radiated through the heat radiating fins, the fan is matched for cooling the heat radiating fins in an air cooling manner, the heat radiating efficiency of the heat radiating fins is improved, the heat conducting effect of the heat radiating fins is faster, the heat radiating efficiency is improved, the dust-proof effect can be achieved on the inside of the heat radiating fins due to the arrangement of the dust-proof net, more dust is prevented from being accumulated in the heat radiating fins under the condition of long-term use, the heat radiating fins are inconvenient to clean, and the dust-proof net and the bottom plate are convenient to detach and replace due to the matching of the clamping groove and the clamping block.
Description
Technical Field
The utility model relates to the technical field related to computer heat dissipation, in particular to a computer heat dissipation fin with high heat conduction efficiency.
Background
The computer is commonly called as a computer, is a modern electronic computing machine for high-speed computing, can perform numerical computation and logic computation, has a memory function, is a modern intelligent electronic device capable of automatically and high-speed processing mass data according to program operation, is a heat dissipation device which is indispensable in the use process of the computer, is classified as a passive heat dissipation element in the field of electronic engineering design, is made of aluminum or copper as metal with good heat conductivity, light weight and easy processing, is too expensive, is generally not attached to a heating surface, and dissipates heat in a compound heat exchange mode.
In the patent publication number CN213182640U, a stable notebook computer cooling fin comprises a cooling fin, a heat pipe, a copper block and a supporting aluminum plate, wherein one end of the heat pipe and the copper block are respectively embedded and fixed on the front and back sides of the supporting aluminum plate, the copper block is attached to the heat pipe, the other end of the heat pipe is connected with the cooling fin, the copper block is provided with two blocks and is respectively attached to a CPU chip and a bridge piece, the supporting aluminum plate is provided with a mounting hole.
Disclosure of Invention
The present utility model is directed to a computer heat sink fin with high heat conduction efficiency, so as to solve the above-mentioned problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high heat conduction efficiency's computer heat radiation fin, includes the heat-conducting plate, the second screw thread groove has been seted up to the upper end surface of heat-conducting plate, the inner wall swing joint in second screw thread groove has the second screw rod, the one end of second screw rod is connected with the bottom plate, the fixed slot has been seted up to the outer wall surface of bottom plate, the inner wall in fixed slot is provided with the diaphragm, one side of diaphragm is connected with the pivot, the outer wall of pivot is provided with the fan, the outer wall of fan is provided with the dust screen, the draw-in groove has been seted up on one side surface of bottom plate, the outer wall one side fixed mounting of dust screen has the fixture block, the upper end of heat-conducting plate is provided with the circuit board.
Preferably, the two sides of the heat conducting plate are both fixed with mounting blocks, the upper end surface of the mounting block is provided with a first thread groove, the inner wall of the first thread groove is movably connected with a first screw rod, and the lower end of the heat conducting plate is connected with radiating fins.
Preferably, the heat conducting plate and the mounting block are arranged in an integrated structure, and the first screw rod is movably connected with the mounting block.
Preferably, the bottom plate is in threaded connection with the heat conducting plate through a second screw rod, and the second screw rod is symmetrically arranged on the central axis of the heat conducting plate.
Preferably, a rotating structure is formed between the rotating shaft and the transverse plate, and the fans are symmetrically arranged by the central axis of the bottom plate.
Preferably, a clamping groove formed in one side surface of the bottom plate is connected with a clamping block fixedly arranged on one side of the outer wall of the dust screen in a clamping mode, and the clamping groove is matched with the clamping block.
Preferably, the circuit board and the heat conducting plate are arranged in an integrated structure, and the outer wall size of the circuit board is smaller than that of the heat conducting plate.
Compared with the prior art, the utility model has the beneficial effects that:
1. this high heat conduction efficiency's computer heat radiation fin, through diaphragm, the pivot, the fan, the dust screen, the setting of draw-in groove and fixture block, cooperate between heat-conducting plate and the fan, heat-conducting plate adsorbs the heat of computer upper housing inside on the heat-conducting plate when the computer uses, thereby heat-conducting plate transmits heat to heat radiation fin, dispel the heat through heat radiation fin, cooperate the fan to play forced air cooling to heat radiation fin at heat radiation fin radiating in-process, thereby increase heat radiation fin's radiating efficiency, make heat radiation fin's heat conduction effect faster, the radiating efficiency reinforcing, the setting of dust screen can play dirt-proof effect to heat radiation fin's inside, prevent that the dust that the inside was accumulated is more under the long-term circumstances of heat radiation fin use, it is more inconvenient to clear up, the cooperation of draw-in groove and fixture block is convenient for dismantle between dust screen and the bottom plate and change.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of the connection between the heat-conducting plate and the bottom plate according to the present utility model;
FIG. 3 is a schematic view of the installation of the heat conducting plate of the present utility model;
fig. 4 is a schematic structural view of the engaging mechanism of the present utility model.
In the figure: 1. a heat conductive plate; 2. a mounting block; 3. a first thread groove; 4. a first screw; 5. a heat radiation fin; 6. a second thread groove; 7. a second screw; 8. a bottom plate; 9. a fixing groove; 10. a cross plate; 11. a rotating shaft; 12. a fan; 13. a dust screen; 14. a clamping groove; 15. a clamping block; 16. a circuit board.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides the following technical solutions: the utility model provides a high heat conduction efficiency's computer heat radiation fin, including heat-conducting plate 1, the second screw thread groove 6 has been seted up to heat-conducting plate 1's upper end surface, the inner wall swing joint of second screw thread groove 6 has second screw rod 7, the one end of second screw rod 7 is connected with bottom plate 8, fixed slot 9 has been seted up to bottom plate 8's outer wall surface, fixed slot 9's inner wall is provided with diaphragm 10, one side of diaphragm 10 is connected with pivot 11, pivot 11's outer wall is provided with fan 12, fan 12's outer wall is provided with dust screen 13, draw-in groove 14 has been seted up on bottom plate 8's one side surface, the outer wall one side fixed mounting of dust screen 13 has fixture block 15, heat-conducting plate 1's upper end is provided with circuit board 16.
In this embodiment, the two sides of the heat-conducting plate 1 are both fixed with the mounting blocks 2, the upper end surface of the mounting block 2 is provided with the first thread groove 3, the inner wall of the first thread groove 3 is movably connected with the first screw 4, the lower end of the heat-conducting plate 1 is connected with the heat-radiating fins 5, and the heat-conducting speed of the heat-radiating fins 5 can be increased through the arrangement of the heat-conducting plate 1.
In this embodiment, the heat-conducting plate 1 and the mounting block 2 are integrally configured, the first screw 4 is movably connected with the mounting block 2, and the whole heat-dissipating mechanism and the computer casing can be connected and mounted through the arrangement of the mounting block 2 and the first screw 4.
In this embodiment, the bottom plate 8 is in threaded connection with the heat conducting plate 1 through the second screw rod 7, the second screw rod 7 is symmetrically arranged with the central axis of the heat conducting plate 1, and the bottom plate 8 and the heat conducting plate 1 can be connected through the arrangement of the second screw rod 7.
In this embodiment, the fan 12 forms a rotating structure between the rotating shaft 11 and the transverse plate 10, the fan 12 is symmetrically arranged on the central axis of the bottom plate 8, and after the heat is absorbed and conducted to the heat-dissipating fins 5 by the heat-conducting plate 1, the heat-dissipating fins 5 are cooled by air, so that the heat-dissipating efficiency of the heat-dissipating fins 5 is faster.
In this embodiment, a clamping groove 14 formed on one side surface of the bottom plate 8 is connected with a clamping block 15 fixedly mounted on one side of the outer wall of the dust screen 13 in a clamping manner, the clamping groove 14 and the clamping block 15 are matched for use, and the dust screen 13 and the bottom plate 8 can be movably connected through the arrangement of the clamping groove 14 and the clamping block 15, so that the dust screen 13 is more convenient to detach.
In this embodiment, the circuit board 16 and the heat conducting plate 1 are integrally configured, the outer wall size of the circuit board 16 is smaller than the outer wall size of the heat conducting plate 1, and the heat conducting plate 1 can absorb the heat in the upper casing of the computer through the electrical connection between the circuit board 16 and the heat conducting plate 1, so that the heat is transferred to the heat radiating fins 5 for heat radiation, and the heat conducting speed of the heat radiating fins 5 is faster.
Working principle: firstly, the dustproof net 13 is in butt joint installation with the clamping groove 14 formed in the bottom plate 8 through the clamping block 15, the dustproof net 13 plays a dustproof role in the using process of the fan 12, so that after the dustproof net 13 is installed, the heat conducting plate 1 is electrically connected with the circuit board 16, the external power supply of the circuit board 16 is connected, after the heat conducting plate 1 is in butt joint installation with the upper computer shell through the installation block 2 and the first screw 4, after the heat conducting plate 1 is installed, the heat radiating fins 5 and the bottom plate 8 are connected with the heat conducting plate 1 through the second screw 7, and then the fan 12 is installed in the fixing groove 9, so that the fan 12 is electrically connected with the circuit board 16, and the type of the fan 12 is as follows: g12038HA2SL, thus completing the use process of the computer heat dissipation fin with high heat conduction efficiency.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A computer heat radiation fin with high heat conduction efficiency is characterized in that: including heat-conducting plate (1), second thread groove (6) have been seted up to the upper end surface of heat-conducting plate (1), the inner wall swing joint of second thread groove (6) has second screw rod (7), the one end of second screw rod (7) is connected with bottom plate (8), fixed slot (9) have been seted up on the outer wall surface of bottom plate (8), the inner wall of fixed slot (9) is provided with diaphragm (10), one side of diaphragm (10) is connected with pivot (11), the outer wall of pivot (11) is provided with fan (12), the outer wall of fan (12) is provided with dust screen (13), draw-in groove (14) have been seted up on one side surface of bottom plate (8), outer wall one side fixed mounting of dust screen (13) has fixture block (15), the upper end of heat-conducting plate (1) is provided with circuit board (16).
2. The computer radiating fin with high heat conduction efficiency according to claim 1, wherein the two sides of the heat conduction plate (1) are both fixed with a mounting block (2), a first thread groove (3) is formed in the upper end surface of the mounting block (2), a first screw rod (4) is movably connected to the inner wall of the first thread groove (3), and the lower end of the heat conduction plate (1) is connected with a radiating fin (5).
3. The computer heat dissipation fin with high heat conduction efficiency according to claim 2, wherein the heat conduction plate (1) and the mounting block (2) are arranged in an integrated structure, and the first screw (4) is movably connected with the mounting block (2).
4. The computer heat dissipation fin with high heat conduction efficiency according to claim 1, wherein the bottom plate (8) is in threaded connection with the heat conduction plate (1) through a second screw (7), and the second screw (7) is symmetrically arranged with a central axis of the heat conduction plate (1).
5. A heat-conducting fin according to claim 1, wherein the fan (12) is configured to rotate between the rotating shaft (11) and the transverse plate (10), and the fan (12) is symmetrically arranged about the central axis of the bottom plate (8).
6. The computer radiating fin with high heat conduction efficiency according to claim 1, wherein a clamping groove (14) formed on one side surface of the bottom plate (8) is in clamping connection with a clamping block (15) fixedly mounted on one side of the outer wall of the dust screen (13), and the clamping groove (14) and the clamping block (15) are matched for use.
7. The heat dissipation fin of a computer with high heat conduction efficiency according to claim 1, wherein the circuit board (16) and the heat conduction board (1) are integrally arranged, and the outer wall of the circuit board (16) is smaller than the outer wall of the heat conduction board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321701175.6U CN219958180U (en) | 2023-06-30 | 2023-06-30 | Computer heat radiation fin with high heat conduction efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321701175.6U CN219958180U (en) | 2023-06-30 | 2023-06-30 | Computer heat radiation fin with high heat conduction efficiency |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219958180U true CN219958180U (en) | 2023-11-03 |
Family
ID=88554129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321701175.6U Active CN219958180U (en) | 2023-06-30 | 2023-06-30 | Computer heat radiation fin with high heat conduction efficiency |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219958180U (en) |
-
2023
- 2023-06-30 CN CN202321701175.6U patent/CN219958180U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |