CN210639584U

CN210639584U - Mainboard heat dissipation mechanism

Info

Publication number: CN210639584U
Application number: CN201922433545.2U
Authority: CN
Inventors: 廖文超
Original assignee: Shenzhen Hongruifeng Security Electronics Co ltd
Current assignee: Shenzhen Hongruifeng Security Electronics Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-05-29
Anticipated expiration: 2029-12-30

Abstract

The utility model discloses a mainboard heat dissipation mechanism, which comprises a mainboard, the top of mainboard is fixedly connected with a processor, the top of mainboard is provided with two chutes which are symmetrical by taking the central point of the processor as the center of symmetry, the top of mainboard is provided with a heat dissipation plate, support rings are welded on both sides of the heat dissipation plate, the top of mainboard is fixedly connected with two fixed blocks which are symmetrical by taking the central point of the processor as the center of symmetry, and the inside of the fixed blocks is connected with a rod body in a sliding manner; at the top installation fixed block of mainboard, at radiator fan's both sides installation support ring, knob and the body of rod, insert two bodies of rod of radiator fan and pass the fixed block, rotatory knob drives the body of rod and fixture block and rotates, makes the fixture block slide to the bottom of draw-in groove along the ring channel, under the effect of spring, promotes slide and the body of rod, makes the inside of fixture block embedding draw-in groove to fixed radiator fan, convenient operation is simple, can not damage the mainboard.

Description

Mainboard heat dissipation mechanism

Technical Field

The utility model relates to a mainboard technical field specifically is a mainboard heat dissipation mechanism.

Background

A motherboard of a computer case, which is also called a main board (main board), a system board (system board) or a motherboard (mother board); it is divided into two types, namely a commercial mainboard and an industrial mainboard. It is installed in the cabinet, and is one of the most basic and important parts of the microcomputer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes elements such as a BIOS chip, an I/O control chip, a keyboard and a panel control switch interface, an indicator light plug-in, an expansion slot, a main board, and a direct current power supply plug-in of a plug-in card. The main board adopts an open structure. The main board has 6-15 expansion slots for the connection of control cards (adapters) of peripheral equipment of PC. By replacing these plug-in cards, the corresponding subsystems of the microcomputer can be locally upgraded, so that manufacturers and users have greater flexibility in configuring the models. In summary, the motherboard plays a significant role in the entire microcomputer system. It can be said that the type and grade of the motherboard determine the type and grade of the entire microcomputer system. The performance of the motherboard affects the performance of the entire microcomputer system. A typical motherboard can provide a series of joints for the processor, graphics card, sound card, hard disk, memory, external device, etc. to join, and a heat dissipation fan is generally used to dissipate heat on the motherboard.

At present, when a general cooling fan is installed, a buckle of the cooling fan needs to be pressed hard to push out a protection clamping block in a main board clamping groove, so that the cooling fan is fixed, the process needs to be realized by heavy pressure, the main board is easy to damage due to heavy pressing, and unnecessary loss is caused.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a mainboard heat dissipation mechanism to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a mainboard heat dissipation mechanism comprises a mainboard, a processor is fixedly connected with the top of the mainboard, the top of the mainboard is provided with two sliding grooves which are symmetrical by taking the central point of the processor as a symmetrical center, the top of the mainboard is provided with a heat dissipation plate, the two sides of the heat dissipation plate are welded with support rings, the top of the mainboard is fixedly connected with two fixed blocks which are symmetrical by taking the central point of the processor as a symmetrical center, the inside of the fixed block is connected with a rod body in a sliding way, the top of the rod body is welded with a knob, the outer side wall of the rod body is connected with the inner side wall of the support ring in a sliding way, the bottom of the rod body penetrates through the fixed block and extends to the inside of the sliding chute, the bottom of the rod body is provided with a sliding plate, the sliding plate is connected to the inside of the sliding groove in a sliding mode, a spring is fixedly connected to the bottom of the sliding plate, and the bottom end of the spring is welded to the main board.

As further preferable in the present technical solution: the ring channel has been seted up to the inside of fixed block, erect groove and draw-in groove have been seted up to the inside of ring channel, the lateral wall welding of the body of rod has the fixture block, the fixture block is located the inside of draw-in groove, fixture block sliding connection is in the inside in draw-in groove, ring channel and perpendicular groove.

As further preferable in the present technical solution: the top of mainboard is seted up the quantity and is offered two and use the central point of treater as symmetrical centrosymmetric louvre, the top of mainboard is offered the evenly distributed's of quantity four screw hole.

As further preferable in the present technical solution: the both sides of heating panel all are seted up quantity and are two through-holes, the inside wall welding of heating panel has the heat dissipation fin, the inboard bottom fixedly connected with heat conduction copper of heating panel.

As further preferable in the present technical solution: the motor is installed at the top of heat dissipation finned plate, the output shaft welding of motor has the pivot, the one end welding that the motor was kept away from in the pivot has the axle plate, the lateral wall fixedly connected with flabellum of axle plate.

As further preferable in the present technical solution: and the top of the heat dissipation plate is fixedly connected with a ring plate.

Compared with the prior art, the beneficial effects of the utility model are that: at the top installation fixed block of mainboard, at radiator fan's both sides installation support ring, knob and the body of rod, insert two bodies of rod of radiator fan and pass the fixed block, rotatory knob drives the body of rod and fixture block and rotates, makes the fixture block slide to the bottom of draw-in groove along the ring channel, under the effect of spring, promotes slide and the body of rod, makes the inside of fixture block embedding draw-in groove to fixed radiator fan, convenient operation is simple, can not damage the mainboard.

Drawings

Fig. 1 is a schematic top view of the present invention;

FIG. 2 is a schematic top view of a processor according to the present invention;

fig. 3 is a schematic top view of the heat dissipating plate of the present invention;

fig. 4 is a schematic side view of the fixing block of the present invention.

In the figure: 1. a main board; 2. a processor; 3. heat dissipation holes; 4. a threaded hole; 5. a heat dissipation plate; 6. a through hole; 7. a heat dissipation fin plate; 8. a motor; 9. a rotating shaft; 10. a heat-conducting copper plate; 11. a shaft plate; 12. a fan blade; 13. a ring plate; 14. a fixed block; 15. a support ring; 16. a rod body; 17. a vertical slot; 18. a card slot; 19. a clamping block; 20. an annular groove; 21. a slide plate; 22. a chute; 23. a spring; 24. a knob.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a mainboard heat dissipation mechanism, including mainboard 1, mainboard 1's top fixedly connected with treater 2, quantity is two for the spout 22 that the central point that uses treater 2 is symmetry center symmetry at the top of mainboard 1, mainboard 1's top is provided with heating panel 5, support ring 15 has all been welded to heating panel 5's both sides, mainboard 1's top fixedly connected with quantity is two and uses treater 2's central point to be symmetrical fixed block 14 as symmetry center symmetry, fixed block 14's inside sliding connection has the body of rod 16, the top welding of the body of rod 16 has knob 24, the lateral wall sliding connection of the body of rod 16 is in the inside of support ring 15, the bottom of the body of rod 16 is run through the inside that fixed block 14 extends to spout 22, the bottom of the body of rod 16 is provided with slide 21, slide 21 sliding connection is in the inside of spout 22, slide 21's bottom fixedly connected with.

In this embodiment, specifically: annular groove 20 has been seted up to the inside of fixed block 14, vertical groove 17 and draw-in groove 18 have been seted up to the inside of annular groove 20, the outside wall welding of the body of rod 16 has fixture block 19, fixture block 19 is located the inside of draw-in groove 18, fixture block 19 sliding connection is in draw-in groove 18, the inside of annular groove 20 and vertical groove 17, through above setting, when the body of rod 16 inserts fixed block 14, fixture block 19 gets into annular groove 20 inside along vertical groove 17, rotate the body of rod 16, fixture block 19 rotates to the bottom of draw-in groove 18 along annular groove 20, under the effect of spring 23, extrude slide 21 and the body of rod 16, make fixture block 19 embedding draw-in groove 18 inside, thereby fixed knob.

In this embodiment, specifically: the louvre 3 that quantity was two and uses the central point of treater 2 as the symmetry center symmetry is seted up at the top of mainboard 1, and the threaded hole 4 that quantity was four evenly distributed is seted up at the top of mainboard 1, and louvre 3 is used for strengthening the radiating effect, and the bolt passes through threaded hole 4 fixed mainboard 1.

In this embodiment, specifically: the through-holes 6 that quantity is two are all seted up to the both sides of heating panel 5, and the inside wall welding of heating panel 5 has heat dissipation fin 7, and the inboard bottom fixedly connected with heat conduction copper 10 of heating panel 5, heat dissipation fin 7 and heat conduction copper 10 all can accelerate the heat and give off.

In this embodiment, specifically: motor 8 is installed at the top of heat dissipation finned plate 7, and the welding of motor 8's output shaft has pivot 9, and the welding of motor 8's one end is kept away from to pivot 9 has axle plate 11, and the lateral wall fixedly connected with flabellum 12 of axle plate 11, motor 8 drive pivot 9 and rotate, drive flabellum 12, improve the radiating effect.

In this embodiment, specifically: the top of the heat dissipation plate 5 is fixedly connected with a ring plate 13, and the arrangement of the ring plate 13 can prevent dust from accumulating around the motor 8.

Theory of operation or structure, during the use, insert heating panel 5 to mainboard 1, the body of rod 16 inserts fixed block 14, the bottom of the body of rod 16 runs through fixed block 14 and extends to the top of slide 21, the downward extrusion, inside fixture block 19 got into ring channel 20 along erecting groove 17, rotatory knob 24, knob 24 drives the body of rod 16, make the body of rod 16 rotate, fixture block 19 rotates the bottom to draw-in groove 18 along ring channel 20, under spring 23's effect, upwards extrude slide 21 and the body of rod 16, make inside fixture block 19 embedding draw-in groove 18, thereby fixed knob 24 and the body of rod 16, fixed heating panel 5.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a mainboard heat dissipation mechanism, includes mainboard (1), its characterized in that: the top fixedly connected with treater (2) of mainboard (1), quantity is seted up at the top of mainboard (1) and is two spout (22) that the central point that uses treater (2) is symmetry center symmetry, the top of mainboard (1) is provided with heating panel (5), support ring (15) have all been welded to the both sides of heating panel (5), the top fixedly connected with quantity of mainboard (1) is two fixed block (14) that use the central point of treater (2) as symmetry center symmetry, the inside sliding connection of fixed block (14) has the body of rod (16), the top welding of the body of rod (16) has knob (24), the lateral wall sliding connection of the body of rod (16) is in the inside wall of support ring (15), the bottom of the body of rod (16) runs through the inside that fixed block (14) extended to spout (22), the bottom of the body of rod (16) is provided with slide (21), slide (21) sliding connection is in the inside of spout (22), the bottom fixedly connected with spring (23) of slide (21), the bottom and the mainboard (1) of spring (23) weld mutually.

2. The heat dissipating mechanism for a motherboard of claim 1, wherein: annular groove (20) have been seted up to the inside of fixed block (14), perpendicular groove (17) and draw-in groove (18) have been seted up to the inside of annular groove (20), the lateral wall welding of the body of rod (16) has fixture block (19), fixture block (19) are located the inside of draw-in groove (18), fixture block (19) sliding connection is in the inside of draw-in groove (18), annular groove (20) and perpendicular groove (17).

3. The heat dissipating mechanism for a motherboard of claim 1, wherein: the top of mainboard (1) is seted up quantity and is two louvre (3) that use the central point of treater (2) as symmetry center symmetry, the top of mainboard (1) is seted up quantity and is four evenly distributed's screw hole (4).

4. The heat dissipating mechanism for a motherboard of claim 1, wherein: the both sides of heating panel (5) all are seted up quantity and are two through-holes (6), the inside wall welding of heating panel (5) has heat dissipation fin (7), the inboard bottom fixedly connected with heat conduction copper (10) of heating panel (5).

5. The heat dissipating mechanism for a motherboard of claim 4, wherein: motor (8) are installed at the top of heat dissipation finned plate (7), the output shaft welding of motor (8) has pivot (9), the one end welding that motor (8) were kept away from in pivot (9) has axle plate (11), lateral wall fixedly connected with flabellum (12) of axle plate (11).

6. The heat dissipating mechanism for a motherboard of claim 1, wherein: the top of the heat dissipation plate (5) is fixedly connected with a ring plate (13).