CN211297541U

CN211297541U - Embedded mainboard heat abstractor

Info

Publication number: CN211297541U
Application number: CN202020278808.7U
Authority: CN
Inventors: 张旭勇
Original assignee: Nanjing Junfang Instrument Technology Co ltd
Current assignee: Nanjing Junfang Instrument Technology Co ltd
Priority date: 2020-03-09
Filing date: 2020-03-09
Publication date: 2020-08-18
Anticipated expiration: 2030-03-09

Abstract

The utility model belongs to the circuit board field, concretely relates to embedded mainboard heat abstractor, which comprises a housin, logical groove has been seted up to the rear end of casing, the inside fixedly connected with backup pad of lower extreme of casing, the mounting groove has been seted up to the upper end of backup pad, the upper end welding of backup pad has the connecting rod, the rear end of connecting rod is provided with fixed ear, the upper end welding of backup pad has fixed ear, the fixed orifices has been seted up in the fixed ear, the entry has been seted up to the front end of casing, the cooling tube has been cup jointed in the entry, the export has been seted up to the rear end of casing, the cooling tube has been cup jointed in the export, the joint. This device is through setting up the backup pad in casing lower extreme inboard, and the mounting groove is seted up to the backup pad upper end, inlays the cooling tube in the mounting groove, and casing outside joint fin accelerates the radiating rate of mainboard in the casing through cooling tube and fin, avoids the mainboard when the circular telegram, and operating temperature is too high, causes the mainboard to damage.

Description

Embedded mainboard heat abstractor

Technical Field

The utility model relates to a circuit board technical field specifically is an embedded mainboard heat abstractor.

Background

The main board, also called main board, system board or mother board, is divided into commercial main board and industrial main board. It is installed in the cabinet, and is one of the most basic and important parts of the microcomputer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes control chip, keys and board control switch interface, indicator light plug-in unit, expansion slot, main board and direct current power supply plug-in unit of plug-in card, etc.

Among the prior art, when dispelling the heat to the mainboard, mostly be the mainboard self-cooling, the radiating efficiency is low, simultaneously, when using the fin to dispel the heat to the mainboard, the fin damages unable change. Accordingly, there is a need for improvements in the art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an embedded mainboard heat abstractor has solved the problem that mainboard radiating efficiency is low, has still solved the problem that the fin damages unable change.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an embedded mainboard heat abstractor, includes the casing, logical groove has been seted up to the rear end of casing, the inside fixedly connected with backup pad of lower extreme of casing, the mounting groove has been seted up to the upper end of backup pad, the upper end welding of backup pad has the connecting rod, the rear end of connecting rod is provided with fixed ear, the upper end welding of backup pad has fixed ear, the fixed orifices has been seted up in the fixed ear, the entry has been seted up to the front end of casing, the cooling tube has been cup jointed in sliding in the entry, the export has been seted up to the rear end of casing, the cooling tube has been cup jointed in sliding in the export, the mounting groove internal joint has the cooling tube, the lateral wall joint of casing has the fin, the right-hand member of fin is provided with.

Preferably, the number of the through grooves is four, and the four through grooves are symmetrically distributed at the front end and the rear end of the shell.

Preferably, the connecting rod has two, two the connecting rod symmetric distribution is in the upper end of backup pad, the rear end of connecting rod all is provided with fixed ear.

Preferably, the fixed ears are two, the two fixed ears are symmetrically distributed at the rear end of the connecting rod, and the two fixed ears are internally provided with fixed holes.

Preferably, the upper end of the shell is provided with four mounting holes, and the four mounting holes are uniformly distributed at the upper end of the shell.

Preferably, the cooling fin has a plurality ofly, and a plurality of cooling fins evenly distributed are both provided with the trapezoidal piece at the left and right ends of casing, the right-hand member of cooling fin.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a set up the backup pad in casing lower extreme inboard, the mounting groove is seted up to the backup pad upper end, inlays the cooling tube in the mounting groove, and casing outside joint fin accelerates the radiating rate of mainboard in the casing through cooling tube and fin, avoids the mainboard when the circular telegram, and operating temperature is too high, causes the mainboard to damage.

2. The utility model discloses a set up trapezoidal piece at the fin right-hand member, the dovetail is seted up to the casing left end, sliding connection trapezoidal piece in the dovetail for the fin is in the use, when leading to the fin to damage because exogenic action, is convenient for change the fin.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a top view of the present invention in fig. 1;

fig. 3 is an enlarged view of a portion a in fig. 2 according to the present invention.

In the figure: 1. a housing; 2. a through groove; 3. a support plate; 4. mounting grooves; 5. a connecting rod; 6. fixing the ear; 7. a fixing hole; 8. an inlet; 9. a radiating pipe; 10. an outlet; 11. mounting holes; 12. a heat sink; 13. a trapezoidal block; 14. a dovetail groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1, 2 and 3, an embedded motherboard heat dissipation device includes a housing 1, a through groove 2 is formed at the rear end of the housing 1, a support plate 3 is fixedly connected inside the lower end of the housing 1, the support plate 3 and the housing 1 are of an integrated structure, a mounting groove 4 is formed at the upper end of the support plate 3, a connecting rod 5 is welded at the upper end of the support plate 3, a fixing lug 6 is arranged at the rear end of the connecting rod 5, the fixing lug 6 and the connecting rod 5 are of an integrated structure, a fixing lug 6 is welded at the upper end of the support plate 3, a fixing hole 7 is formed in the fixing lug 6, an inlet 8 is formed at the front end of the housing 1, a heat dissipation pipe 9 is slidably sleeved in the inlet 8, the heat dissipation pipe 9 is a copper pipe, an outlet 10 is formed at the rear end of the housing 1, a heat dissipation pipe 9 is slidably sleeved in the outlet 10, the radiating fin 12 and the trapezoidal block 13 are of an integrated structure, the dovetail groove 14 is formed in the left end of the shell 1, and the trapezoidal block 13 is connected in the dovetail groove 14 in a sliding mode.

Referring to fig. 2, there are four through grooves 2, and the four through grooves 2 are symmetrically distributed at the front and rear ends of the housing 1. The through groove 2 is used for passing through a main board wire installed in the housing 1.

Referring to fig. 2, there are two connecting rods 5, the two connecting rods 5 are symmetrically distributed at the upper end of the supporting plate 3, and the rear ends of the connecting rods 5 are provided with fixing lugs 6. The connecting rod 5 is used for connecting the fixing lug 6 and supporting the main board installed in the casing 1, so that a gap exists between the main board and the supporting plate 3.

Referring to fig. 2, two fixing lugs 6 are provided, the two fixing lugs 6 are symmetrically distributed at the rear end of the connecting rod 5, and fixing holes 7 are formed in the two fixing lugs 6. The fixing lugs 6 are used for forming fixing holes 7, the fixing holes 7 are threaded holes, and the main board is conveniently fixed to the upper ends of the fixing lugs 6 through screws.

Referring to fig. 2, the upper end of the housing 1 is provided with four mounting holes 11, and the four mounting holes 11 are uniformly distributed at the upper end of the housing 1. The mounting hole 11 is used to facilitate fixing the housing cover on the upper end of the housing 1 to close the housing 1 when the housing cover is mounted.

Referring to fig. 2, a plurality of heat dissipation fins 12 are provided, the plurality of heat dissipation fins 12 are uniformly distributed at the left and right ends of the housing 1, and trapezoidal blocks 13 are provided at the right ends of the heat dissipation fins 12. The plurality of radiating fins 12 are clamped outside the casing 1, so that the contact area between the casing 1 and the air is increased, and heat dissipation is performed.

The utility model discloses the concrete implementation process as follows: during the use, place the mainboard in the upper end of backup pad 3, it is fixed with the mainboard through screw and the cooperation of fixed orifices 7, connect the air inlet with 9 one ends of cooling tube and external fan, dispel the heat to casing 1 inside, because casing 1 outside joint fin 12, accelerate the radiating rate of mainboard in casing 1 through cooling tube 9 and fin 12, avoid the mainboard when the circular telegram, operating temperature is too high, cause the mainboard to damage, through set up trapezoidal piece 13 at fin 12 right-hand member, dovetail 14 is seted up to casing 1 left end, sliding connection trapezoidal piece 13 in the dovetail 14, make fin 12 in the use, when external force leads to fin 12 to damage, be convenient for change fin 12.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An embedded mainboard heat abstractor, includes casing (1), its characterized in that: the rear end of the shell (1) is provided with a through groove (2), a support plate (3) is fixedly connected inside the lower end of the shell (1), a mounting groove (4) is formed in the upper end of the support plate (3), a connecting rod (5) is welded at the upper end of the support plate (3), a fixing lug (6) is arranged at the rear end of the connecting rod (5), a fixing lug (6) is welded at the upper end of the support plate (3), a fixing hole (7) is formed in the fixing lug (6), an inlet (8) is formed in the front end of the shell (1), a radiating pipe (9) is sleeved in the inlet (8) in a sliding manner, an outlet (10) is formed in the rear end of the shell (1), a radiating pipe (9) is sleeved in the outlet (10) in a sliding manner, a radiating pipe (9) is clamped in the mounting groove (4), and a, the right end of fin (12) is provided with trapezoidal piece (13), dovetail (14) have been seted up to the left end of casing (1), sliding connection has trapezoidal piece (13) in dovetail (14).

2. The embedded motherboard heat sink of claim 1, wherein: the number of the through grooves (2) is four, and the four through grooves (2) are symmetrically distributed at the front end and the rear end of the shell (1).

3. The embedded motherboard heat sink of claim 1, wherein: connecting rod (5) have two, two connecting rod (5) symmetric distribution is in the upper end of backup pad (3), the rear end of connecting rod (5) all is provided with fixed ear (6).

4. The embedded motherboard heat sink of claim 1, wherein: the fixed lugs (6) are two, the two fixed lugs (6) are symmetrically distributed at the rear end of the connecting rod (5), and the two fixed lugs (6) are internally provided with fixed holes (7).

5. The embedded motherboard heat sink of claim 1, wherein: mounting holes (11) are formed in the upper end of the shell (1), the number of the mounting holes (11) is four, and the four mounting holes (11) are evenly distributed in the upper end of the shell (1).

6. The embedded motherboard heat sink of claim 1, wherein: the radiating fins (12) are multiple, the radiating fins (12) are evenly distributed at the left end and the right end of the shell (1), and the right ends of the radiating fins (12) are provided with trapezoidal blocks (13).