CN211297541U - An embedded motherboard cooling device - Google Patents

Abstract

The utility model belongs to the circuit board field, concretely relates to embedded mainboard heat abstractor, which comprises a housin, logical groove has been seted up to the rear end of casing, the inside fixedly connected with backup pad of lower extreme of casing, the mounting groove has been seted up to the upper end of backup pad, the upper end welding of backup pad has the connecting rod, the rear end of connecting rod is provided with fixed ear, the upper end welding of backup pad has fixed ear, the fixed orifices has been seted up in the fixed ear, the entry has been seted up to the front end of casing, the cooling tube has been cup jointed in the entry, the export has been seted up to the rear end of casing, the cooling tube has been cup jointed in the export, the joint. This device is through setting up the backup pad in casing lower extreme inboard, and the mounting groove is seted up to the backup pad upper end, inlays the cooling tube in the mounting groove, and casing outside joint fin accelerates the radiating rate of mainboard in the casing through cooling tube and fin, avoids the mainboard when the circular telegram, and operating temperature is too high, causes the mainboard to damage.

Description

An embedded motherboard cooling device

technical field

The utility model relates to the technical field of circuit boards, in particular to an embedded motherboard heat sink.

Background technique

Motherboard, also known as motherboard, system board or motherboard, is divided into two types: commercial motherboard and industrial motherboard. It is installed in the chassis and is one of the most basic and important parts of the computer. The main board is generally a rectangular circuit board, on which the main circuit systems that make up the computer are installed, generally including control chips, keys and panel control switch interfaces, indicator light connectors, expansion slots, DC power supply connectors for the main board and cards, etc. element.

In the prior art, when dissipating heat on the mainboard, the mainboard dissipates heat by itself, and the heat dissipation efficiency is low. At the same time, when the heatsink is used to dissipate heat on the mainboard, the heatsink is damaged and cannot be replaced. Therefore, there is a need for improvements to the prior art.

Utility model content

The purpose of the utility model is to provide an embedded motherboard heat dissipation device, which solves the problem of low heat dissipation efficiency of the motherboard, and also solves the problem that the heat sink cannot be replaced due to damage.

In order to achieve the above purpose, the present invention provides the following technical solutions: an embedded motherboard heat sink, comprising a casing, a rear end of the casing is provided with a through slot, and a support plate is fixedly connected to the lower end of the casing, The upper end of the support plate is provided with a mounting groove, the upper end of the support plate is welded with a connecting rod, the rear end of the connecting rod is provided with a fixing lug, the upper end of the supporting plate is welded with a fixing lug, and the fixing lug is inside the fixed lug. A fixing hole is provided, an inlet is provided at the front end of the casing, a heat dissipation pipe is slidably sleeved in the inlet, an outlet is opened at the rear end of the case, and a heat dissipation pipe is slidably sleeved in the outlet, and the A heat dissipation pipe is clamped in the installation groove, a heat dissipation fin is clamped to the side wall of the casing, a trapezoidal block is arranged on the right end of the heat dissipation fin, and a dovetail groove is opened at the left end of the casing, and the dovetail groove slides in the A ladder block is connected.

Preferably, there are four through slots, and the four through slots are symmetrically distributed at the front and rear ends of the housing.

Preferably, there are two connecting rods, the two connecting rods are symmetrically distributed on the upper end of the support plate, and the rear ends of the connecting rods are all provided with fixing ears.

Preferably, there are two fixing ears, the two fixing ears are symmetrically distributed at the rear end of the connecting rod, and both fixing ears are provided with fixing holes.

Preferably, the upper end of the casing is provided with installation holes, there are four installation holes, and the four installation holes are evenly distributed on the upper end of the casing.

Preferably, there are a plurality of the heat sinks, the plurality of heat sinks are evenly distributed on the left and right ends of the housing, and the right ends of the heat sinks are provided with trapezoidal blocks.

Compared with the prior art, the beneficial effects of the present utility model are as follows:

1. In the present utility model, a support plate is arranged on the inner side of the lower end of the casing, a mounting groove is set at the upper end of the support plate, a heat dissipation pipe is embedded in the mounting groove, and the heat dissipation fin is clamped on the outside of the casing, and the heat dissipation speed of the main board in the casing is accelerated by the heat dissipation pipe and the heat dissipation fin. , to prevent the motherboard from being damaged when the working temperature is too high when it is powered on.

2. In the present invention, a trapezoidal block is arranged on the right end of the heat sink, a dovetail groove is provided at the left end of the housing, and the trapezoidal block is slidably connected in the dovetail groove, so that the heat sink is easily replaced when the heat sink is damaged due to external force during use. .

Description of drawings

Fig. 1 is the structural representation of the utility model;

Fig. 2 is the top view of Fig. 1 of the utility model;

FIG. 3 is an enlarged view of part A in FIG. 2 of the utility model.

In the figure: 1. Shell; 2. Through slot; 3. Support plate; 4. Installation slot; 5. Connecting rod; 6. Fixing ear; 7. Fixing hole; 8. Inlet; ; 11. Mounting hole; 12. Heat sink; 13. Trapezoidal block; 14. Dovetail slot.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

Example

Please refer to FIG. 1, FIG. 2, and FIG. 3, an embedded motherboard heat dissipation device, including a casing 1, a through slot 2 is formed at the rear end of the casing 1, and a support plate 3 is fixedly connected to the lower end of the casing 1 to support The plate 3 and the shell 1 are of an integrated structure, the upper end of the support plate 3 is provided with a mounting groove 4, the upper end of the support plate 3 is welded with a connecting rod 5, and the rear end of the connecting rod 5 is provided with a fixing ear 6, the fixing ear 6 and the connection The rod 5 has a one-piece structure, the upper end of the support plate 3 is welded with a fixing ear 6, a fixing hole 7 is opened in the fixing ear 6, an inlet 8 is opened at the front end of the housing 1, and a heat dissipation pipe 9 is slidably sleeved in the inlet 8 to dissipate heat. The pipe 9 is a copper pipe, the rear end of the casing 1 is provided with an outlet 10, a heat dissipation pipe 9 is slidably sleeved in the outlet 10, a heat dissipation pipe 9 is clamped in the installation groove 4, and a heat dissipation fin is clamped to the side wall of the casing 1 12. The right end of the heat sink 12 is provided with a trapezoidal block 13. The heat sink 12 and the trapezoidal block 13 are integral structures. The left end of the housing 1 is provided with a dovetail groove 14, and the trapezoidal block 13 is slidably connected in the dovetail groove 14.

Please refer to FIG. 2 , there are four through slots 2 , and the four through slots 2 are symmetrically distributed at the front and rear ends of the housing 1 . The through slot 2 is used to pass the main board wires installed in the housing 1 .

Please refer to FIG. 2 , there are two connecting rods 5 , the two connecting rods 5 are symmetrically distributed on the upper end of the support plate 3 , and the rear ends of the connecting rods 5 are provided with fixing ears 6 . The connecting rod 5 is used to connect the fixing ears 6 and support the main board installed in the housing 1 , so that there is a gap between the main board and the support plate 3 .

Referring to FIG. 2 , there are two fixing ears 6 , the two fixing ears 6 are symmetrically distributed at the rear end of the connecting rod 5 , and a fixing hole 7 is opened in the two fixing ears 6 . The fixing ears 6 are used for opening fixing holes 7 , and the fixing holes 7 are threaded holes, which are convenient for fixing the main board on the upper end of the fixing ears 6 with screws.

Referring to FIG. 2 , the upper end of the housing 1 is provided with mounting holes 11 , there are four mounting holes 11 , and the four mounting holes 11 are evenly distributed on the upper end of the housing 1 . The mounting hole 11 is used to facilitate the fixing of the cover on the upper end of the casing 1 and the closure of the casing 1 when the cover is installed.

Referring to FIG. 2 , there are a plurality of heat sinks 12 , the plurality of heat sinks 12 are evenly distributed on the left and right ends of the housing 1 , and trapezoidal blocks 13 are disposed on the right ends of the heat sinks 12 . By clamping a plurality of heat sinks 12 on the outer side of the housing 1 , the contact area between the housing 1 and the air is increased, and heat dissipation is performed.

The specific implementation process of the present invention is as follows: when in use, the main board is placed on the upper end of the support plate 3 , the main board is fixed through the cooperation of the screws and the fixing holes 7 , one end of the heat dissipation pipe 9 is connected to the external fan for air intake, and the inner part of the casing 1 is installed. For heat dissipation, since the outer side of the casing 1 is clamped with the heat sink 12, the heat dissipation speed of the motherboard in the casing 1 is accelerated through the heat dissipation pipe 9 and the heat sink 12, so as to avoid the working temperature of the motherboard being too high when the power is on, causing damage to the motherboard. The right end of the sheet 12 is provided with a trapezoidal block 13, and the left end of the housing 1 is provided with a dovetail groove 14, and the trapezoidal block 13 is slidably connected in the dovetail groove 14, so that when the heat sink 12 is damaged due to external force during use, it is convenient to replace the heat sink 12.

Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes and modifications can be made to these embodiments without departing from the principles and spirit of the present invention , alternatives and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims (6)

1. An embedded motherboard heat sink, comprising a casing (1), characterized in that: a through slot (2) is provided at the rear end of the casing (1), and a lower end of the casing (1) is internally fixed A support plate (3) is connected, the upper end of the support plate (3) is provided with a mounting groove (4), the upper end of the support plate (3) is welded with a connecting rod (5), and the connecting rod (5) is The rear end is provided with a fixing lug (6), the upper end of the support plate (3) is welded with a fixing lug (6), and a fixing hole (7) is opened in the fixing lug (6), and the casing (1) The front end of the casing (1) is provided with an inlet (8), and a heat dissipation pipe (9) is slidably sleeved in the inlet (8), and an outlet (10) is opened at the rear end of the casing (1), and the outlet (10) has an outlet (10). A heat dissipation pipe (9) is connected to the sliding sleeve, a heat dissipation pipe (9) is clamped in the installation groove (4), and a heat dissipation fin (12) is clamped to the side wall of the casing (1). The right end of (12) is provided with a trapezoidal block (13), the left end of the casing (1) is provided with a dovetail groove (14), and a trapezoidal block (13) is slidably connected in the dovetail groove (14). 2. An embedded motherboard heat sink according to claim 1, characterized in that: there are four through slots (2), and the four through slots (2) are symmetrically distributed on the outer surface of the casing (1). Front and rear ends. 3. An embedded motherboard heat sink according to claim 1, characterized in that: there are two said connecting rods (5), and the two said connecting rods (5) are symmetrically distributed on the side of the support plate (3). At the upper end, the rear end of the connecting rod (5) is provided with a fixing ear (6). 4. An embedded motherboard heat sink according to claim 1, characterized in that: there are two said fixing ears (6), and the two said fixing ears (6) are symmetrically distributed on the side of the connecting rod (5). At the rear end, both the fixing ears (6) are provided with fixing holes (7). 5. An embedded motherboard heat sink according to claim 1, characterized in that: the upper end of the casing (1) is provided with mounting holes (11), and the mounting holes (11) have four, four The mounting holes (11) are evenly distributed on the upper end of the housing (1). 6. An embedded motherboard heat sink according to claim 1, characterized in that: there are a plurality of said heat sinks (12), and the plurality of heat sinks (12) are evenly distributed on the left and right sides of the casing (1). The right ends of the heat sinks (12) are provided with trapezoidal blocks (13).

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