CN213586756U - Overheat protection device for electronic component processing equipment - Google Patents

Abstract

The utility model discloses an electronic components processing equipment prevent overheat protection device, including heat dissipation case and casing, the intermediate position department of the inside bottom of casing installs the through-hole frame, the singlechip is installed to one side on the inside top of casing, and the opposite side on the inside top of casing installs temperature sensor, the heat dissipation case is all installed to the lower extreme of casing both sides, the process chamber has all been seted up to the inside upper end of heat dissipation case, and all communicates through pipe and casing both sides upper end in process chamber one side upper end, the inside one side that is close to the casing of process chamber all is provided with the filter screen, and the inside opposite side of process chamber all is provided with the drying plate. The utility model discloses a set up the heat exchange tube, utilize the heat exchange tube of U type, be convenient for with the heat in the air and the coolant liquid of heat dissipation intracavity portion abundant contact, and then improve its radiating effect, avoid needing to shut down the heat dissipation, improve processing equipment's work efficiency.

Description

Overheat protection device for electronic component processing equipment

Technical Field

The utility model relates to an electronic components production facility technical field specifically is an electronic components processing equipment prevents overheat protection device.

Background

The development of society can not leave the development of all kinds of instruments, and the inside device of all kinds of automatic instrument all has a large amount of electronic components, therefore electronic components is very huge at present demand, in order to guarantee electronic components's production efficiency, the production line is intelligent increasingly, but electronic components processing equipment is in the course of working, can be accompanied by great heat, its heat can reduce the life of equipment, consequently, need carry out temperature monitoring to it, but current electronic components processing equipment prevent overheat protection device still have many problems or defects:

first, the overheat protection device of preventing of traditional electronic components processing equipment does not have the regulation structure of being convenient for during the use, and different processing equipment that is applicable to that can not be fine reduces the device practicality.

Second, traditional electronic components processing equipment prevent overheat protection device does not have the filter drying structure during the use, and dust or steam are too much, can influence the normal work of power supply in the processing equipment, and then reduce production efficiency.

Thirdly, the traditional overheat protection device for the electronic component processing equipment has poor heat dissipation performance during use, and generally adopts a power-off or power consumption reduction mode to dissipate heat after overheating, so that the efficiency is low.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic components processing equipment prevent overheat protection device to solve the inconvenient regulation that proposes in the above-mentioned background art, inconvenient filter drying and the relatively poor problem of thermal diffusivity.

In order to achieve the above object, the utility model provides a following technical scheme: an anti-overheating protection device of electronic component processing equipment comprises a heat dissipation box and a shell, and further comprises an installation structure for avoiding the reduction of the service life of the equipment, a clamping structure for improving the practicability of the device and a heat dissipation structure for ensuring the normal work of the equipment;

a through hole frame is arranged in the middle of the bottom end in the shell, and the clamping structures are arranged on two sides of the top end of the through hole frame;

the single chip microcomputer is mounted on one side of the top end inside the shell, the temperature sensor is mounted on the other side of the top end inside the shell, the heat dissipation boxes are mounted at the lower ends of the two sides of the shell, and the heat dissipation structures are arranged at the lower ends of the inside of the heat dissipation boxes;

the utility model discloses a heat dissipation incasement portion, including casing, heat dissipation incasement portion, pipe and casing both sides upper end, the treatment chamber has all been seted up to the upper end of heat dissipation incasement portion, and all communicates through pipe and casing both sides upper end in treatment chamber one side upper end, the inside one side that is close to the casing of treatment chamber all is provided with the filter screen, and the inside opposite side of treatment chamber all is provided with the drying plate, mounting structure all sets up the heat dissipation incasement portion on filter screen.

Preferably, heat radiation structure includes the heat dissipation chamber, the lower extreme at heat dissipation incasement portion is all seted up in the heat dissipation chamber, and the heat exchange tube has all been laid to the inside of heat dissipation case, heat exchange tube one end all communicates through pipe and the inside bottom opposite side of treatment chamber, the inside intermediate position department of through-hole frame installs the fan housing, and the inside lower extreme of fan housing installs negative-pressure air fan, the fan housing bottom both sides all communicate through pipe and the heat exchange tube other end, the heat dissipation case is kept away from the lower extreme of casing one side and is evenly installed radiating fin.

Preferably, mounting structure is including installation pole, installation spring, briquetting, fixed block and mounting groove, the mounting groove is evenly installed on the inside top and the bottom of process chamber, and mounting groove one side all is provided with the installation pole that extends to the mounting groove inside, the inside installation spring that has all twined of mounting groove on installation pole surface, and the inside briquetting that all installs of mounting groove of installation pole one end, the fixed block that extends to the mounting groove inside is all installed at filter screen and drying plate both ends.

Preferably, the inclination angle of filter screen and drying plate and vertical direction is 35, and filter screen and drying plate all distribute about the vertical axis symmetric distribution of casing.

Preferably, the heat exchange tubes are all in a U-shaped tube structure, and the two sides of each heat exchange tube and the inner wall of the heat dissipation cavity are in a welding integrated structure.

Preferably, the clamping structure includes riser, threaded rod, fly leaf and rubber pad, the equal vertical both sides of installing on through-hole frame top of riser, and riser one side upper end all rotates and is connected with the threaded rod, threaded rod one end all runs through the riser and rotates and be connected with the fly leaf, and the fly leaf is kept away from the upper end and the lower extreme of riser one side and all installs the rubber pad.

Preferably, the middle position department of the inside top both sides of through-hole frame all transversely has seted up the spout, and the equal sliding connection in inside of spout has the slider, the top of slider all with riser bottom fixed connection.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) by arranging the clamping structure, the sliding groove and the sliding block, the sliding of the sliding block in the sliding groove is utilized to drive the movable plate to move stably and relatively by rotating the threaded rod, so that the power source of the processing equipment is clamped and fixed by utilizing the rubber pad, and the phenomenon that the vibration sense generated by the work of the power source influences the effect of overheat protection in the working process is avoided, so that the device can be suitable for the power sources of processing equipment with different specifications, and the practicability of the device is improved;

(2) by arranging the mounting structure, the filter screen and the drying plate, in the overheating protection process, the inclined filter screen and the drying plate are utilized to adsorb dust or water vapor in hot air, so that the influence of the dust or the water vapor on the normal work of a power source is avoided, the service life of the power source is further prolonged, the maintenance cost is reduced, meanwhile, the mounting rod can be pulled regularly to drive the pressing block to move, and then the filter screen and the drying plate are taken out from the inside of the processing cavity and cleaned or replaced by utilizing the sliding of the fixing block in the mounting groove, so that the filtering and drying effects of the device are ensured;

(3) the temperature inside the shell is detected by the temperature sensor through the arrangement of the heat radiating fins, the heat exchange tube and the negative pressure fan, when the temperature is overhigh, the negative pressure fan is started to suck hot air into the heat exchange tube, the flow speed of the air is reduced by utilizing the heat exchange tube of the U-shaped tube, the contact area of the heat radiating fin and cooling liquid inside the heat radiating cavity is increased, the rapid heat exchange is convenient, the passive heat radiating area of the device can be increased by arranging the heat radiating fins, the heat inside the heat radiating cavity is conveniently and rapidly led out, then the cooled cold air is discharged into the shell, the rapid cooling is realized, the normal work of a power source is ensured, the processing efficiency of electronic components is improved, the shutdown heat radiating protection is avoided, meanwhile, when the temperature reaches a certain value, a signal is transmitted to an external control terminal by a single chip microcomputer, the power source is cut off, thereby prolonging the service life of the processing equipment.

Drawings

Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;

fig. 2 is a schematic side view of the cross-sectional structure of the present invention;

fig. 3 is a schematic top view of the cross-sectional structure of the present invention;

fig. 4 is a schematic view of the front view of the appearance structure of the present invention;

fig. 5 is an enlarged schematic structural view of the mounting structure of the present invention.

In the figure: 1. a mounting structure; 101. mounting a rod; 102. installing a spring; 103. briquetting; 104. a fixed block; 105. mounting grooves; 2. a heat dissipation box; 3. a housing; 4. a temperature sensor; 5. a single chip microcomputer; 6. filtering with a screen; 7. drying the plate; 8. a heat dissipation cavity; 9. a heat dissipating fin; 10. a heat exchange pipe; 11. a clamping structure; 1101. a vertical plate; 1102. a threaded rod; 1103. a movable plate; 1104. a rubber pad; 12. a via frame; 13. a negative pressure fan; 14. a fan housing; 15. a chute; 16. a slider; 17. a processing chamber.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1: referring to fig. 1-5, an overheat protection device for electronic component processing equipment comprises a heat dissipation box 2 and a housing 3, and further comprises an installation structure 1 for avoiding reducing the service life of the equipment, a clamping structure 11 for improving the practicability of the device, and a heat dissipation structure for ensuring the normal operation of the equipment;

a through hole frame 12 is arranged in the middle of the bottom end in the shell 3, and the clamping structures 11 are arranged on two sides of the top end of the through hole frame 12;

a single chip microcomputer 5 is mounted on one side of the top end inside the shell 3, the type of the single chip microcomputer 5 can be STM32F103RCT6, a temperature sensor 4 is mounted on the other side of the top end inside the shell 3, the type of the temperature sensor 4 can be TS200, the lower ends of the two sides of the shell 3 are both provided with a heat dissipation box 2, and heat dissipation structures are both arranged at the lower ends inside the heat dissipation box 2;

the upper end of the inside of the heat dissipation box 2 is provided with a treatment cavity 17, the upper end of one side of the treatment cavity 17 is communicated with the upper ends of two sides of the shell 3 through a guide pipe, one side of the inside of the treatment cavity 17, which is close to the shell 3, is provided with a filter screen 6, the other side of the inside of the treatment cavity 17 is provided with a drying plate 7, and the mounting structures 1 are arranged inside the heat dissipation box 2 at the top end and the bottom end of the filter screen 6 and the drying plate 7;

referring to fig. 1-5, the overheating prevention protection device for the electronic component processing equipment further comprises a heat dissipation structure, the heat dissipation structure comprises heat dissipation cavities 8, the heat dissipation cavities 8 are all arranged at the lower end inside the heat dissipation box 2, heat exchange tubes 10 are all laid inside the heat dissipation box 2, one ends of the heat exchange tubes 10 are all communicated with the other side of the bottom end inside the processing cavity 17 through guide pipes, a fan cover 14 is installed at the middle position inside the through hole frame 12, a negative pressure fan 13 is installed at the lower end inside the fan cover 14, the type of the negative pressure fan 13 can be FDR-02, two sides of the bottom end of the fan cover 14 are all communicated with the other end of the heat exchange tube 10 through guide pipes, and heat dissipation fins 9 are evenly installed at the lower end;

the heat exchange tubes 10 are all in a U-shaped tube structure, and both sides of the heat exchange tubes 10 are in a welding integrated structure with the inner wall of the heat dissipation cavity 8;

specifically, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, utilize the heat exchange tube 10 of U type pipe, reduce the air flow speed, increase and the inside coolant liquid area of contact in heat dissipation chamber 8, be convenient for quick heat transfer, and set up radiating fin 9 and can increase the passive radiating area of this device, be convenient for derive the heat of 8 inside heat dissipation chambers fast, the cold air after the later cooling is discharged inside casing 3 again, realize rapid cooling, guarantee the normal work of power supply, improve electronic components's machining efficiency, and after the high temperature, can be given signal transmission to external control terminal by singlechip 5, and then cut off the power, avoid the incident because of accidents such as short circuit lead to.

Example 2: the mounting structure 1 comprises a mounting rod 101, a mounting spring 102, a pressing block 103, a fixing block 104 and a mounting groove 105, the mounting groove 105 is uniformly mounted at the top end and the bottom end inside the processing cavity 17, the mounting rod 101 extending into the mounting groove 105 is arranged on one side of the mounting groove 105, the mounting spring 102 is wound inside the mounting groove 105 on the surface of the mounting rod 101, the pressing block 103 is mounted inside the mounting groove 105 at one end of the mounting rod 101, and the fixing block 104 extending into the mounting groove 105 is mounted at two ends of the filter screen 6 and the drying plate 7;

the inclination angles of the filter screen 6 and the drying plate 7 in the vertical direction are both 35 degrees, and the filter screen 6 and the drying plate 7 are both symmetrically distributed about the vertical central axis of the shell 3;

specifically, as shown in fig. 1, fig. 2, fig. 3 and fig. 5, in the overheat protection process, the inclined filter screen 6 and the drying plate 7 are used for adsorbing dust or water vapor in hot air, so as to prevent the dust or water vapor from affecting the normal operation of the power source, meanwhile, the mounting rod 101 can be periodically pulled to drive the pressing block 103 to move, and then the filter screen 6 and the drying plate 7 are taken out from the inside of the processing cavity 17 and cleaned or replaced by the sliding of the fixing block 104 in the mounting groove 105, so that the filtering and drying effects of the device are ensured.

Example 3: the clamping structure 11 comprises a vertical plate 1101, a threaded rod 1102, a movable plate 1103 and rubber pads 1104, wherein the vertical plate 1101 is vertically arranged on two sides of the top end of the through hole frame 12, the upper end of one side of the vertical plate 1101 is rotatably connected with the threaded rod 1102, one end of the threaded rod 1102 penetrates through the vertical plate 1101 and is rotatably connected with the movable plate 1103, and the upper end and the lower end of one side, away from the vertical plate 1101, of the movable plate 1103 are respectively provided with the rubber pads;

sliding grooves 15 are transversely formed in the middle positions of two sides of the top end of the interior of the through hole frame 12, sliding blocks 16 are connected to the interior of the sliding grooves 15 in a sliding mode, and the top ends of the sliding blocks 16 are fixedly connected with the bottom ends of vertical plates 1101;

specifically, as shown in fig. 1 and 3, by rotating the threaded rod 1102, the sliding of the sliding block 16 inside the sliding groove 15 drives the movable plate 1103 to make a steady relative motion, and then the rubber pad 1104 is used to clamp and fix the power source of the processing equipment, so that the device can be applied to the power sources of processing equipment with different specifications, and the practicability of the device is improved.

The output end of the singlechip 5 is electrically connected with the input end of the negative pressure fan 13 through a lead, and the output end of the singlechip 5 is electrically connected with the input end of the temperature sensor 4.

The working principle is as follows: when the device is used, firstly, a power source of processing equipment is arranged at the top end of the through hole frame 12, then the threaded rods 1102 are respectively rotated, the movable plate 1103 is driven to stably move relatively by the sliding of the sliding block 16 in the sliding groove 15, then the power source of the processing equipment is clamped and fixed by the rubber pad 1104, and then the power source and the processing equipment are connected with the external power source after being well installed and fixed;

the temperature inside the shell 3 is monitored in real time through the temperature sensor 4, when the temperature inside the shell 3 rises to exceed the preset value of the temperature sensor 4 due to the fact that heat generated by the work of a power source is too large, the temperature sensor 4 transmits signals to the single chip microcomputer 5, the single chip microcomputer 5 controls the negative pressure fan 13 to work, negative pressure is further generated inside the fan cover 14, hot air inside the shell 3 is conveniently sucked into the processing cavity 17 through a guide pipe, dust or water vapor in the hot air is adsorbed by utilizing the inclined filter screen 6 and the drying plate 7, the influence of the dust or the water vapor on the normal work of the power source is avoided, meanwhile, the mounting rod 101 can be pulled regularly, the pressing block 103 is made to move and compress the mounting spring 102, and then the filter screen 6 and the drying plate 7 are taken out of the processing cavity 17 and cleaned or replaced;

inside later hot-air admission heat exchange tube 10, utilize the heat exchange tube 10 of U type pipe, reduce the air flow speed, increase and the inside coolant liquid area of contact of heat dissipation chamber 8, be convenient for quick heat transfer, cold air rethread pipe after later cooling is carried to inside fan housing 14, and arrange to the power supply by the hole on through-hole frame 12 top, be convenient for reduce the inside temperature of casing 3 fast, it can increase the passive radiating area of this device to set up radiating fin 9 simultaneously, be convenient for derive the heat in heat dissipation chamber 8 inside fast, and after the temperature reaches a definite value, can be given external control terminal with signal transmission by singlechip 5, and then cut off the power supply, and inform the user in time to overhaul, avoid because of the potential safety hazard that accidents such as short circuit lead to.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides an electronic components processing equipment prevent overheat protection device, includes heat dissipation case (2) and casing (3), its characterized in that: the device also comprises an installation structure (1) for avoiding reducing the service life of the equipment, a clamping structure (11) for improving the practicability of the device and a heat dissipation structure for ensuring the normal work of the equipment;

a through hole frame (12) is arranged in the middle of the bottom end in the shell (3), and the clamping structures (11) are arranged on two sides of the top end of the through hole frame (12);

a single chip microcomputer (5) is mounted on one side of the top end inside the shell (3), a temperature sensor (4) is mounted on the other side of the top end inside the shell (3), heat dissipation boxes (2) are mounted at the lower ends of the two sides of the shell (3), and heat dissipation structures are arranged at the lower ends inside the heat dissipation boxes (2);

treatment chamber (17) have all been seted up to the inside upper end of heat dissipation case (2), and all communicate with casing (3) both sides upper end through pipe in treatment chamber (17) one side upper end, the inside one side that is close to casing (3) of treatment chamber (17) all is provided with filter screen (6), and the inside opposite side of treatment chamber (17) all is provided with drying plate (7), mounting structure (1) all sets up inside heat dissipation case (2) on filter screen (6) and drying plate (7) top and bottom.

2. The device for preventing overheating of electronic component processing equipment according to claim 1, wherein: the heat radiation structure comprises a heat radiation cavity (8), the lower end of the heat radiation box (2) is arranged at the lower end of the heat radiation cavity (8), a heat exchange tube (10) is arranged inside the heat radiation box (2), one end of the heat exchange tube (10) is communicated with the other side of the inner bottom of the processing cavity (17) through a pipe, a fan cover (14) is arranged at the middle position of the inner part of the through hole frame (12), a negative pressure fan (13) is arranged at the lower end of the inner part of the fan cover (14), the two sides of the bottom of the fan cover (14) are communicated with the other end of the heat exchange tube (10) through a pipe, and heat radiation fins (9) are uniformly arranged at the lower end of the heat radiation box.

3. The device for preventing overheating of electronic component processing equipment according to claim 1, wherein: mounting structure (1) is including installation pole (101), installation spring (102), briquetting (103), fixed block (104) and mounting groove (105), mounting groove (105) evenly install the top and the bottom in treatment chamber (17) inside, and mounting groove (105) one side all is provided with and extends to inside installation pole (101) of mounting groove (105), installation spring (102) have all been twined to mounting groove (105) inside on installation pole (101) surface, and inside briquetting (103) of all installing of mounting groove (105) of installation pole (101) one end, filter screen (6) and drying plate (7) both ends are all installed and are extended to inside fixed block (104) of mounting groove (105).

4. The device for preventing overheating of electronic component processing equipment according to claim 1, wherein: the inclination angles of the filter screen (6) and the drying plate (7) in the vertical direction are both 35 degrees, and the filter screen (6) and the drying plate (7) are symmetrically distributed about the vertical central axis of the shell (3).

5. The device for preventing overheating of electronic component processing equipment according to claim 2, wherein: the heat exchange tubes (10) are all in a U-shaped tube structure, and the two sides of each heat exchange tube (10) and the inner wall of the heat dissipation cavity (8) are in a welding integrated structure.

6. The device for preventing overheating of electronic component processing equipment according to claim 1, wherein: clamping structure (11) include riser (1101), threaded rod (1102), fly leaf (1103) and rubber pad (1104), the equal vertical both sides on through-hole frame (12) top of installing of riser (1101), and riser (1101) one side upper end all rotates and is connected with threaded rod (1102), threaded rod (1102) one end all runs through riser (1101) and swivelling joint has fly leaf (1103), and fly leaf (1103) keep away from the upper end and the lower extreme of riser (1101) one side and all install rubber pad (1104).

7. The device according to claim 6, wherein the protection device comprises: spout (15) have all transversely been seted up in the intermediate position department of the inside top both sides of through-hole frame (12), and the equal sliding connection in inside of spout (15) has slider (16), the top of slider (16) all with riser (1101) bottom fixed connection.

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