CN220855616U - Heat dissipation device for edge computing substation - Google Patents
Heat dissipation device for edge computing substation Download PDFInfo
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- CN220855616U CN220855616U CN202322633457.3U CN202322633457U CN220855616U CN 220855616 U CN220855616 U CN 220855616U CN 202322633457 U CN202322633457 U CN 202322633457U CN 220855616 U CN220855616 U CN 220855616U
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- heat
- edge computing
- heat dissipation
- substation
- fixedly connected
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 48
- 238000001816 cooling Methods 0.000 claims abstract description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 11
- 238000009434 installation Methods 0.000 claims description 2
- 239000000428 dust Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of computer heat dissipation, in particular to a heat dissipation device for an edge computing substation, which comprises a shell and a cover plate arranged on the shell, wherein sliding grooves are formed in two sides of the top surface of the shell, an adjusting mechanism is clamped in the sliding grooves, a heat dissipation mechanism is arranged on the adjusting mechanism, and the heat dissipation mechanism is used for dissipating heat of a CPU (Central processing Unit) on a mainboard of the edge computing substation; according to the utility model, the heat-conducting plate is provided with the heat-radiating mechanism, so that heat generated by long-time work of the CPU on the main board of the edge computing substation is conducted to the condensing plate, then the condensing plate absorbs heat, the heat is led into the fins, then the fans are matched for gas exchange, high-temperature heat is led to the outside of the shell through the fans, the heat radiation of the CPU with the largest heat source on the main board of the edge computing substation is realized, the timely heat radiation is ensured, the rapid cooling of the CPU is realized, a large amount of dust can be effectively prevented from entering the shell by the heat-radiating mechanism and the dust-proof mechanism, the dust-proof effect is improved, and the running environment inside the shell is ensured.
Description
Technical Field
The utility model relates to the technical field of computer heat dissipation, in particular to a heat dissipation device for an edge computing substation.
Background
The edge computing substation is a distributed open platform, provides edge intelligent service nearby on the network edge side close to objects or data sources by integrating network, computing, storage and application core capabilities, is light-weight edge equipment for wide-range edge application scenes, and has the characteristics of super-strong computing performance, high-capacity storage, flexible configuration, small volume, easiness in maintenance and management and the like, and the whole shape is a set top box shape.
At present, the edge computing substation in the market is provided with a computer main board in a box body, so that heat generated by the main board after a long time cannot be timely dissipated, faults are easy to occur, and the service life of the edge computing substation is reduced.
Disclosure of utility model
In order to overcome the technical problems, the utility model aims to provide the heat dissipation device for the edge computing substation, which is used for realizing heat dissipation of a CPU (central processing unit) which generates the maximum heat source on a main board of the edge computing substation through the heat dissipation mechanism, ensuring timely heat dissipation, avoiding the problem of equipment failure caused by untimely heat dissipation and ensuring the normal service life of the edge computing substation.
The aim of the utility model can be achieved by the following technical scheme:
A heat abstractor for marginal calculation workstation, including casing and the apron of installing on the casing, the spout has been seted up to the both sides of casing top surface, the joint has adjustment mechanism in the spout, be equipped with cooling mechanism on the adjustment mechanism, cooling mechanism is used for CPU heat dissipation on the marginal calculation workstation mainboard.
Preferably, the adjusting mechanism comprises a sliding plate, a sliding rail is fixedly connected to the sliding plate, a sliding block is movably sleeved on the outer surface of the sliding rail, and a heat dissipation mechanism is fixedly connected to the sliding block.
Preferably, the heat dissipation mechanism comprises a cover, a fixed frame is fixedly connected to the bottom of the cover, a fan is fixedly installed on the fixed frame, fins are fixedly connected to the bottom of the fixed frame, a condensing plate is fixedly installed at the bottom of each fin, a heat conducting plate is fixedly connected to the bottom surface of each condensing plate, a sliding block is fixedly connected to the outer surface of the fixed frame, a mounting groove matched with the cover is formed in the cover plate, and a cover plate is movably sleeved on the outer wall of the cover plate.
Preferably, the two sides of the cover plate are provided with L-shaped heat dissipation openings, and a plurality of L-shaped heat dissipation openings are uniformly distributed on the two sides of the cover plate.
Preferably, the installation groove is provided with a dustproof mechanism, the dustproof mechanism comprises a dustproof net and magnet blocks, and the magnet blocks are annularly distributed at the edge of the bottom surface of the dustproof net.
Preferably, the cover plate is fixedly connected with an iron ring piece, the iron ring piece is positioned on the mounting groove, and the iron ring piece is magnetically connected with the magnet block.
The utility model has the beneficial effects that:
1. The heat conducting plate is arranged to conduct heat generated by long-time work of the CPU on the edge computing substation mainboard to the condensing plate, then absorbs heat through the condensing plate, the heat is led into the fins, then the fans are matched for gas exchange, high-temperature heat is led to the outside of the shell through the fans, heat dissipation of the CPU with the largest heat source on the edge computing substation mainboard is achieved, timely heat dissipation is guaranteed, rapid cooling of the CPU is achieved, a large amount of dust can be effectively prevented from entering the shell through the heat dissipation mechanism and the dust prevention mechanism, the dust prevention effect is improved, and the internal operation environment of the shell is guaranteed;
2. Through being provided with adjustment mechanism and heat dissipation mechanism, conveniently dismantle and install heat dissipation mechanism, through seting up the mounting groove on the apron, conveniently install heat dissipation mechanism according to the position of CPU on the edge calculation workstation mainboard to guarantee the radiating effect to CPU, can also carry out the customization to the mainboard that CPU position is different and handle, change the trompil position of mounting groove, cooperate adjustment mechanism to carry out the adaptation.
Drawings
The utility model is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is an exploded view of the overall structure of the present utility model;
FIG. 3 is an exploded view of the dust-proof mechanism of the present utility model;
FIG. 4 is an exploded view of a heat dissipating mechanism according to the present utility model;
Fig. 5 is an exploded view of the structure of the adjusting mechanism of the present utility model.
In the figure: 1. a housing; 2. a heat dissipation mechanism; 201. a cover; 202. a fixed frame; 203. a blower; 204. fins; 205. a condensing plate; 206. a heat conductive plate; 3. an adjusting mechanism; 301. a slide plate; 302. a slide rail; 303. a slide block; 4. a chute; 5. a dust-proof mechanism; 6. a mounting groove; 7. iron ring pieces; 8. an L-shaped heat radiation port; 9. and a cover plate.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, a heat dissipation device for an edge computing substation comprises a shell 1 and a cover plate 9 installed on the shell 1, wherein sliding grooves 4 are formed in two sides of the top surface of the shell 1, an adjusting mechanism 3 is clamped in the sliding grooves 4, a heat dissipation mechanism 2 is arranged on the adjusting mechanism 3, and the heat dissipation mechanism 2 is used for dissipating heat of a CPU on a motherboard of the edge computing substation.
In an alternative embodiment, the adjusting mechanism 3 comprises a sliding plate 301, a sliding rail 302 is fixedly connected to the sliding plate 301, a sliding block 303 is movably sleeved on the outer surface of the sliding rail 302, and a heat dissipation mechanism 2 is fixedly connected to the sliding block 303.
It should be noted that, the sliding rail 302 may move back and forth in the sliding groove 4, and the sliding block 303 may move left and right on the sliding rail 302, so as to drive the heat dissipation mechanism 2 located on the sliding block 303 to move, so that the heat dissipation mechanism 2 is located above the CPU on the motherboard of the edge computing substation, and the position of the heat dissipation mechanism 2 is adjusted to adapt to heat dissipation processes of the CPUs located at different positions on the motherboard.
In an alternative embodiment, the heat dissipation mechanism 2 includes a cover 201, a fixed frame 202 is fixedly connected to the bottom of the cover 201, a fan 203 is fixedly installed on the fixed frame 202, a fin 204 is fixedly connected to the bottom of the fixed frame 202, a condensation plate 205 is fixedly installed at the bottom of the fin 204, a heat conducting plate 206 is fixedly connected to the bottom surface of the condensation plate 205, a sliding block 303 is fixedly connected to the outer surface of the fixed frame 202, a mounting groove 6 matched with the cover 201 is formed in the cover 9, and the cover 9 is movably sleeved on the outer wall of the cover 201.
It should be noted that, the heat conducting plate 206 conducts the heat generated by the CPU on the motherboard of the edge computing substation during long-time operation to the condensing plate 205, then absorbs heat through the condensing plate 205, and the heat is led to the fin 204, and then the air exchange is performed by matching with the fan 203, and the high-temperature heat is led to the outside of the housing 1 through the fan 203, so as to realize the heat dissipation of the CPU with the largest heat source generated on the motherboard of the edge computing substation.
In an alternative embodiment, both sides of the cover plate 9 are provided with the L-shaped heat dissipation openings 8, and the plurality of L-shaped heat dissipation openings 8 are uniformly arranged on both sides of the cover plate 9.
It should be noted that, the two sides of the cover plate 9 are provided with the L-shaped heat dissipation openings 8, which is convenient for circulating the air inside and outside, so that the heat dissipation mechanism 2 can perform heat dissipation operation better.
In an alternative embodiment, the mounting groove 6 is provided with a dust-proof mechanism 5, the dust-proof mechanism 5 is composed of a dust-proof net and magnet blocks, and the magnet blocks are annularly distributed on the edge of the bottom surface of the dust-proof net.
It should be noted that, by setting the dustproof mechanism 5, dust is effectively prevented from entering the housing 1, and normal operation of the main board is endangered.
In an alternative embodiment, the cover plate 9 is fixedly connected with the iron ring piece 7, and the iron ring piece 7 is located on the mounting groove 6, and the iron ring piece 7 is magnetically connected with the magnet block.
The iron ring piece 7 and the magnet block are arranged, so that the dust-proof mechanism 5 is convenient to replace.
Working principle: when in use, a worker prepares accessories such as a main board, a lower interface and the like required by the edge computing substation, then the accessories are fixedly arranged in the shell 1 through screws, then the position of the adjusting mechanism 3 is adjusted according to the position of a CPU on the main board, the sliding rail 302 can move back and forth in the sliding groove 4, the sliding block 303 can move left and right on the sliding rail 302, then the heat dissipation mechanism 2 positioned on the sliding block 303 is driven to move, so that the heat dissipation mechanism 2 is positioned above the CPU on the main board of the edge computing substation, the adjustment of the position of the heat dissipation mechanism 2 is achieved to adapt the heat dissipation treatment of the CPUs at different positions on the main board, then the cover plate 9 is provided with the mounting groove 6 matched with the outer contour of the heat dissipation mechanism 2, so that part of the heat dissipation mechanism 2 is sleeved with the mounting groove 6, then reach the spacing to cooling mechanism 2, then close apron 9 on casing 1 again, then use the screw with apron 9 fixed mounting on casing 1, then fix hoop piece 7 on the edge of mounting groove 6, then place dustproof mechanism 5 on hoop piece 7, be connected through magnetic force, then turn on external power supply for equipment, be connected with external circuit with the interface, when CPU produces heat on the marginal computing station mainboard, the heat conduction board 206 conducts the heat that CPU on the marginal computing station mainboard works for a long time to condensation plate 205, then absorb heat through condensation plate 205, the heat is imported to fin 204, then cooperate fan 203 to carry out gaseous exchange again, pass through fan 203 with the high-temperature heat, the outside of casing 1 is led to, realize the heat dissipation to the biggest heat source CPU that produces on the marginal computing station mainboard.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely illustrative and explanatory of the utility model, as various modifications and additions may be made to the particular embodiments described, or in a similar manner, by those skilled in the art, without departing from the scope of the utility model or exceeding the scope of the utility model as defined in the claims.
Claims (6)
1. A heat abstractor for marginal calculation workstation, includes casing (1) and installs apron (9) on casing (1), its characterized in that, spout (4) have been seted up to the both sides of casing (1) top surface, the joint has adjustment mechanism (3) in spout (4), be equipped with cooling mechanism (2) on adjustment mechanism (3), cooling mechanism (2) are used for CPU heat dissipation on the marginal calculation workstation mainboard.
2. The heat dissipating device for the edge computing substation according to claim 1, wherein the adjusting mechanism (3) comprises a sliding plate (301), a sliding rail (302) is fixedly connected to the sliding plate (301), a sliding block (303) is movably sleeved on the outer surface of the sliding rail (302), and a heat dissipating mechanism (2) is fixedly connected to the sliding block (303).
3. The heat dissipating device for the edge computing substation according to claim 2, wherein the heat dissipating mechanism (2) comprises a cover (201), a fixed frame (202) is fixedly connected to the bottom of the cover (201), a fan (203) is fixedly installed on the fixed frame (202), fins (204) are fixedly connected to the bottom of the fixed frame (202), a condensing plate (205) is fixedly installed on the bottom of the fins (204), a heat conducting plate (206) is fixedly connected to the bottom surface of the condensing plate (205), a sliding block (303) is fixedly connected to the outer surface of the fixed frame (202), an installation groove (6) matched with the cover (201) is formed in the cover plate (9), and a cover plate (9) is movably sleeved on the outer wall of the cover (201).
4. The heat dissipating device for the edge computing substation according to claim 1, wherein the two sides of the cover plate (9) are provided with L-shaped heat dissipating openings (8), and a plurality of the L-shaped heat dissipating openings (8) are uniformly arranged on the two sides of the cover plate (9).
5. A heat sink for an edge computing workstation according to claim 3, characterized in that the mounting groove (6) is provided with a dust-proof mechanism (5), the dust-proof mechanism (5) is composed of a dust-proof net and magnet blocks, and the magnet blocks are annularly distributed at the edge of the bottom surface of the dust-proof net.
6. The heat dissipating device for an edge computing station according to claim 5, wherein an iron ring piece (7) is fixedly connected to the cover plate (9), and the iron ring piece (7) is located on the mounting groove (6), and the iron ring piece (7) is magnetically linked with the magnet block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322633457.3U CN220855616U (en) | 2023-09-26 | 2023-09-26 | Heat dissipation device for edge computing substation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322633457.3U CN220855616U (en) | 2023-09-26 | 2023-09-26 | Heat dissipation device for edge computing substation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220855616U true CN220855616U (en) | 2024-04-26 |
Family
ID=90775562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322633457.3U Active CN220855616U (en) | 2023-09-26 | 2023-09-26 | Heat dissipation device for edge computing substation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220855616U (en) |
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2023
- 2023-09-26 CN CN202322633457.3U patent/CN220855616U/en active Active
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