CN219225468U

CN219225468U - CPU heat conduction device

Info

Publication number: CN219225468U
Application number: CN202320124111.8U
Authority: CN
Inventors: 官昆; 刘增伟; 张海娜; 蒲玉玮; 王环
Original assignee: Qingdao Adelson Internet Of Things Technology Co ltd; Qingdao Jieneng Yidao Energy Efficiency Technology Co ltd; Qingdao Aidesen Energy Technology Co ltd
Current assignee: Qingdao Adelson Internet Of Things Technology Co ltd; Qingdao Jieneng Yidao Energy Efficiency Technology Co ltd; Qingdao Aidesen Energy Technology Co ltd
Priority date: 2023-01-11
Filing date: 2023-01-11
Publication date: 2023-06-20
Anticipated expiration: 2033-01-11

Abstract

The utility model discloses a heat conducting device of a central processing unit, which comprises a shell, wherein two sides of an inner cavity of the shell are fixedly connected with support plates, a heat conducting plate is fixedly connected between the two support plates, the bottoms of the heat conducting plates are fixedly connected with radiating fins, the tops of the two support plates are fixedly connected with a central processing unit, and two sides of the bottom of the inner cavity of the shell are fixedly connected with a first motor. According to the utility model, through the matched use of the shell, the supporting plate, the heat conducting plate, the radiating fins, the central processing unit, the first motor, the fan blades, the ventilation opening, the refrigerating box, the semiconductor refrigerator, the fan, the hose, the air outlet cover, the box body, the second motor, the turntable, the pin shaft, the movable plate and the connecting rod, the problems that the central processing unit heat conducting device in the prior art only radiates heat to the central processing unit through the fan, the central processing unit cannot be cooled rapidly, the radiating efficiency is low, the actual use requirement cannot be met, and the practicability is low are solved.

Description

CPU heat conduction device

Technical Field

The utility model relates to the technical field of heat conduction devices, in particular to a heat conduction device of a central processing unit.

Background

The CPU, which is the final execution unit for information processing and program operation, has been greatly developed in terms of logic structure, operation efficiency and functional extension since the CPU was generated.

For example, the utility model in China provides a heat conduction device of a central processing unit of a portable computer, and the bulletin number is: CN218037917U, this portable computer central processing unit's heat conduction device, through the fin, can make the fin can not break away from the sliding range of draw-in groove through the buckle, the fin can absorb the temperature that the central processing unit during operation produced simultaneously, owing to set up the fin and have the multiunit, and lie in the central processing unit directly over, can be more quick with the steam absorption of radiator fan up guide, central processing unit places in the backup pad, can dispel the heat through the ventilation hole, can adjust the height of supporting leg according to the radiating effect, make the backup pad more closely from radiator fan, and the fin installation quantity increase directly over the backup pad, accelerate the radiating rate, reach the good effect of heat dispersion, and prior art central processing unit heat conduction device only dispels the heat to the central processing unit through the fan, can't make the quick cooling of central processing unit, the radiating efficiency is lower, thereby can't satisfy the in-service demand, the practicality is lower.

Disclosure of Invention

The utility model aims to provide a heat conduction device for a central processing unit, which has the advantage of high heat dissipation efficiency, and solves the problems that the heat conduction device for the central processing unit in the prior art only dissipates heat to the central processing unit through a fan, cannot enable the central processing unit to rapidly cool down, has low heat dissipation efficiency, cannot meet actual use requirements and has low practicability.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a central processing unit heat conduction device, includes the casing, the equal fixedly connected with backup pad in both sides of casing inner chamber, fixedly connected with heat-conducting plate between two backup pads, the bottom fixedly connected with fin of heat-conducting plate, the equal fixedly connected with central processing unit in top of two backup pads, the equal fixedly connected with first motor in both sides of casing inner chamber bottom, the output fixedly connected with flabellum of first motor, the vent has all been seted up to the bottom of casing both sides, the top fixedly connected with refrigeration case of casing inner chamber, the top fixedly connected with semiconductor refrigerator of refrigeration case inner chamber, the one end of semiconductor refrigerator runs through to the top of casing, the both sides of refrigeration case all communicate with the fan, the bottom intercommunication of fan has the hose, the one end intercommunication that the fan was kept away from to the hose has the fan housing, the equal fixedly connected with box in top of casing both sides, the back fixedly connected with second motor, the output fixedly connected with round pin axle of second motor, the surface sliding connection has the fly leaf, the one end of connecting rod is kept away from to the opposite side of fan, the front swing joint has the connecting rod fixedly connected with carousel to one end of the opposite swing joint to the fan.

Preferably, sliding rods are fixedly connected between the top and the bottom of the two sides of the inner cavity of the box body, and the surfaces of the sliding rods are in sliding connection with the inner wall of the movable plate.

Preferably, the bottoms of the two sides of the shell are fixedly connected with dustproof nets, and the front face of the box body is fixedly connected with a baffle plate through screws.

Preferably, the front of the shell is fixedly connected with a sealing plate through a bolt, and the front of the sealing plate is provided with a heat dissipation opening.

Preferably, the front surface of the movable plate is provided with a through groove, and the tops of the two sides of the inner cavity of the shell are provided with openings.

Preferably, a connecting block is fixedly connected between the top of the fan and the top of the inner cavity of the shell, and the hose is made of PVC material.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, through the matched use of the shell, the supporting plate, the heat conducting plate, the radiating fins, the central processing unit, the first motor, the fan blades, the ventilation opening, the refrigerating box, the semiconductor refrigerator, the fan, the hose, the air outlet cover, the box body, the second motor, the turntable, the pin shaft, the movable plate and the connecting rod, the problems that the central processing unit heat conducting device in the prior art only radiates heat to the central processing unit through the fan, the central processing unit cannot be cooled rapidly, the radiating efficiency is low, the actual use requirement cannot be met, and the practicability is low are solved.

2. According to the utility model, the movable plate can be limited by arranging the sliding rod, so that the stability of the movable plate in moving is improved, the shell can be dustproof by arranging the dustproof net, the shell can be sealed by arranging the sealing plate, the heat in the shell can be dissipated by arranging the heat dissipation port, and the pin shaft can be convenient to drive the movable plate to move by arranging the through groove.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of the front view of the structure of the present utility model;

fig. 3 is a schematic side view of a second motor of the present utility model.

In the figure: 1. a housing; 2. a support plate; 3. a heat conductive plate; 4. a heat sink; 5. a central processing unit; 6. a first motor; 7. a fan blade; 8. a vent; 9. a refrigeration box; 10. a semiconductor refrigerator; 11. a blower; 12. a hose; 13. an air outlet cover; 14. a case; 15. a second motor; 16. a turntable; 17. a pin shaft; 18. a movable plate; 19. a connecting rod; 20. a slide bar; 21. a dust-proof net.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, a heat conducting device for a central processing unit comprises a housing 1, wherein two sides of an inner cavity of the housing 1 are fixedly connected with support plates 2, a heat conducting plate 3 is fixedly connected between the two support plates 2, the bottoms of the heat conducting plates 3 are fixedly connected with cooling fins 4, the tops of the two support plates 2 are fixedly connected with a central processing unit 5, two sides of the bottom of the inner cavity of the housing 1 are fixedly connected with a first motor 6, the output end of the first motor 6 is fixedly connected with a fan blade 7, the bottoms of the two sides of the housing 1 are provided with ventilation openings 8, the top of the inner cavity of the housing 1 is fixedly connected with a refrigerating box 9, the top of the inner cavity of the refrigerating box 9 is fixedly connected with a semiconductor refrigerator 10, one end of the semiconductor refrigerator 10 penetrates to the top of the housing 1, two sides of the refrigerating box 9 are communicated with a fan 11, the bottom of the fan 11 is communicated with a hose 12, one end of the hose 12 away from the fan 11 is communicated with a fan housing 13, the top of the two sides of the shell 1 is fixedly connected with the box 14, the back of the inner cavity of the box 14 is fixedly connected with the second motor 15, the output end of the second motor 15 is fixedly connected with the rotary table 16, the front of the rotary table 16 is fixedly connected with the pin shaft 17, the surface of the pin shaft 17 is slidingly connected with the movable plate 18, one side opposite to the movable plate 18 is fixedly connected with the connecting rod 19, one end of the connecting rod 19 far away from the movable plate 18 penetrates through the inner cavity of the shell 1 and is fixedly connected with the air outlet cover 13, the top and the bottom of the two sides of the inner cavity of the box 14 are fixedly connected with the slide bar 20, the surface of the slide bar 20 is slidingly connected with the inner wall of the movable plate 18, the bottom of the two sides of the shell 1 is fixedly connected with the dust screen 21, the front of the box 14 is fixedly connected with the baffle through a screw, the front of the shell 1 is fixedly connected with the sealing plate through a bolt, the front of the sealing plate is provided with a heat dissipation opening, the front of fly leaf 18 has been seted up logical groove, the opening has all been seted up at the top of casing 1 inner chamber both sides, fixedly connected with joint piece between the top of fan 11 and the top of casing 1 inner chamber, the hose 12 is the PVC material, through setting up slide bar 20, can carry out spacingly to fly leaf 18, stability when improving fly leaf 18 and remove, through setting up dust screen 21, can prevent dust to casing 1, through setting up the closing plate, can seal casing 1, through setting up the thermovent, can dispel the heat in the casing 1, through setting up logical groove, can make things convenient for round pin axle 17 to drive fly leaf 18 and remove, through casing 1, backup pad 2, heat-conducting plate 3, fin 4, central processing unit 5, first motor 6, flabellum 7, vent 8, refrigeration case 9, semiconductor refrigerator 10, fan 11, hose 12, air-out housing 13, box 14, second motor 15, carousel 16, round pin axle 17, the cooperation use of fly leaf 18 and connecting rod 19, the CPU device has been solved prior art and only carries out the unable heat dissipation to the CPU through the fan, thereby can't make the CPU fast, thereby the heat dissipation efficiency is lower, the practical heat dissipation demand is lower, and the practical heat dissipation is lower, the heat dissipation demand is lower.

During the use, derive the heat that central processing unit 5 produced through heat-conducting plate 3 and fin 4, simultaneously first motor 6 starts, make first motor 6 drive flabellum 7 rotate, thereby discharge the heat that central processing unit 5 produced through vent 8, simultaneously restart semiconductor refrigerator 10, fan 11 and second motor 15, semiconductor refrigerator 10 refrigerates in to refrigerating box 9, fan 11 discharges the air conditioning through the cooperation of hose 12 and air-out cover 13, the carousel 16 is driven to the second motor 15 rotates, carousel 16 drives round pin axle 17 rotation, round pin axle 17 drives fly leaf 18 and moves about, fly leaf 18 drives air-out cover 13 through the cooperation of connecting rod 19, thereby cool down the top of central processing unit 5, in order to improve radiating efficiency.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a central processing unit heat conduction device, includes casing (1), its characterized in that: the utility model discloses a rotary table type air conditioner, including casing (1), fan (11), hose (12), fan cover (13) are kept away from to the bottom intercommunication of fan (11), motor (15) are connected with the top of the inner chamber of casing (1), motor (14) are connected with the top of the inner chamber of casing (1), fan (15) are connected with the bottom of the inner chamber of casing (1), fan (7) are connected with the bottom of the inner chamber of casing (1), vent (8) are all offered to the bottom of casing (1), the top fixedly connected with refrigerating box (9) of casing (1), semiconductor refrigerator (10) are connected with the top of refrigerating box (9) inner chamber, semiconductor refrigerator (10) one end runs through to the top of casing (1), fan (11) are all connected with both sides of refrigerating box (9), hose (12) are connected with hose (12) and are kept away from the one end intercommunication of fan (11), motor (13) are connected with the motor (14) of casing (1), motor (16) are connected with the top of the second inner chamber (14), the front fixedly connected with round pin axle (17) of carousel (16), the surface sliding connection of round pin axle (17) has fly leaf (18), the equal fixedly connected with connecting rod (19) of one side opposite of fly leaf (18), the one end that fly leaf (18) was kept away from to connecting rod (19) runs through to the inner chamber of casing (1) and with air-out cover (13) fixed connection.

2. The cpu heat transfer device of claim 1, wherein: a sliding rod (20) is fixedly connected between the top and the bottom of the two sides of the inner cavity of the box body (14), and the surface of the sliding rod (20) is in sliding connection with the inner wall of the movable plate (18).

3. The cpu heat transfer device of claim 1, wherein: the dustproof nets (21) are fixedly connected to the bottoms of the two sides of the shell (1), and the baffle is fixedly connected to the front face of the box body (14) through screws.

4. The cpu heat transfer device of claim 1, wherein: the front of the shell (1) is fixedly connected with a sealing plate through a bolt, and the front of the sealing plate is provided with a heat radiation opening.

5. The cpu heat transfer device of claim 1, wherein: the front of the movable plate (18) is provided with a through groove, and the tops of the two sides of the inner cavity of the shell (1) are provided with openings.

6. The cpu heat transfer device of claim 1, wherein: a connecting block is fixedly connected between the top of the fan (11) and the top of the inner cavity of the shell (1), and the hose (12) is made of PVC material.