CN221079276U - Heat dissipation shell and satellite-borne chassis - Google Patents
Heat dissipation shell and satellite-borne chassis Download PDFInfo
- Publication number
- CN221079276U CN221079276U CN202323091023.1U CN202323091023U CN221079276U CN 221079276 U CN221079276 U CN 221079276U CN 202323091023 U CN202323091023 U CN 202323091023U CN 221079276 U CN221079276 U CN 221079276U
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- heat conduction
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 55
- 238000010438 heat treatment Methods 0.000 claims description 8
- 230000004308 accommodation Effects 0.000 claims description 5
- 230000005855 radiation Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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Abstract
The utility model relates to a heat dissipation shell and a space-borne chassis, which comprises a first shell, wherein the first shell comprises a heat conduction plate, a heat dissipation plate and a connecting plate, the heat conduction plate and the heat dissipation plate are oppositely arranged in a first direction, the connecting plate is provided with a first side edge and a second side edge which are opposite in the first direction, the first side edge and the heat conduction plate are in an integrated structure, the second side edge and the heat dissipation plate are in an integrated structure, and the heat conduction plate, the heat dissipation plate and the connecting plate enclose a containing groove.
Description
Technical Field
The utility model relates to the field of satellite vehicles, in particular to a heat dissipation shell and a satellite-borne chassis.
Background
The satellite space is limited, so that strict requirements are placed on the size of the satellite-borne equipment, however, the power consumption level of the satellite-borne computer equipment is also larger and the requirements on heat dissipation capacity are also higher and higher facing the increasing computing demands.
The space-borne computer equipment generally comprises an upper shell, a lower shell and a circuit board, wherein two sides of the circuit board are respectively opposite to the upper shell and the lower shell, and the upper shell and the lower shell are spliced. The outer wall surface of the lower shell is a mounting surface, the mounting surface is generally fixed on the satellite, and the mounting surface is a constant temperature surface, so that heat of the satellite-borne computer equipment can be conducted to a colder part of the satellite.
Under the condition that splicing fit is adopted between the upper shell and the lower shell, the joint of the upper shell and the lower shell is difficult to completely fit, a certain gap always exists, and air is not contained in space, so that the upper shell and the lower shell are always in a nearly adiabatic state. On the other hand, a part of heat of the circuit board is conducted to the upper case, and the heat accumulated in the upper case is difficult to be conducted to the lower case, which leads to a sudden rise in temperature of the upper case.
Disclosure of utility model
Based on this, it is necessary to provide a heat dissipation case and a satellite-borne chassis for the problem of difficulty in heat dissipation of the satellite-borne equipment.
The utility model provides a heat dissipation shell, includes first casing, first casing includes heat-conducting plate, heating panel and connecting plate, the heat-conducting plate with the heating panel sets up relatively in first direction, the connecting plate has first side edge and the second side edge opposite in first direction, first side edge with the heat-conducting plate structure as an organic whole, the second side edge with the heating panel structure as an organic whole, the heat-conducting plate the heating panel and the connecting plate encloses into the holding tank.
The first heat conducting block is arranged on one surface of the heat conducting plate, which faces the heat radiating plate.
According to the utility model, one surface of the heat conducting plate, which is away from the heat radiating plate, is concaved inwards to form a plurality of heat radiating grooves.
According to the utility model, at least two first heat conducting blocks are arranged, and an avoidance gap is arranged between the first heat conducting blocks.
The second heat conducting block is arranged on one surface of the heat radiating plate facing the heat conducting plate.
The heat-conducting plate is provided with a first heat-conducting hole, the heat-radiating plate is provided with a second heat-conducting hole, the connecting plate is provided with a connecting hole, two ends of the connecting hole are respectively communicated with the first heat-conducting hole and the second heat-conducting hole, and the flexible heat-conducting pipe sequentially penetrates through the first heat-conducting hole, the connecting hole and the second heat-conducting hole.
According to the utility model, one end of the first heat conduction hole is positioned on the edge of the heat conduction plate at the opening of the accommodating groove, one end of the second heat conduction hole is positioned on the edge of the heat dissipation plate at the opening of the accommodating groove, and the heat dissipation shell further comprises a second shell, wherein the second shell covers the opening of the accommodating groove so as to shield the end part of the second heat conduction hole and the end part of the first heat conduction hole.
According to the heat-conducting plate, the first screw hole is formed in the heat-conducting plate, the second screw hole is formed in the heat-radiating plate, and the first screw hole and the second screw hole are oppositely arranged in the first direction.
The space-borne chassis comprises a heat dissipation shell and a circuit board, wherein the circuit board is installed in the accommodating groove, so that two sides of the circuit board are opposite to the heat conduction plate and the heat dissipation plate respectively.
The circuit board is provided with the power consumption component, and the power consumption component is contacted with the first heat conduction block or the second heat conduction block.
The beneficial effects of the utility model are as follows:
One surface of the radiating plate, which is away from the heat conducting plate, is a mounting surface, the radiating plate is mounted on the satellite, and heat in the radiating plate can be directly contacted with the satellite to be conducted to the satellite at a high heat conducting speed. The connecting plate and the radiating plate are in an integral structure and are in direct contact, so that heat in the connecting plate can be directly contacted with the radiating plate at a high heat conduction speed and is conducted to the satellite through the radiating plate. In the same way, the heat conducting plate and the connecting plate are of an integrated structure, so that the heat of the heat conducting plate can be directly contacted with the connecting plate to be conducted to the connecting plate at a high heat conducting speed, and then the connecting plate conducts the heat to the heat radiating plate. Finally, heat generated in the accommodating groove can be conducted to the heat dissipation plate, the heat dissipation plate is used for realizing high-efficiency heat dissipation of the accommodating groove, and the two sides of the circuit board can be fully dissipated, so that the operation stability of the circuit board and the power consumption component is improved, and the operation power of the power consumption component and the circuit board is further improved.
Drawings
Fig. 1 is a schematic three-dimensional structure of a satellite-borne chassis in embodiment 1 of the present utility model;
Fig. 2 is a schematic three-dimensional structure of a satellite-borne chassis in embodiment 1 of the present utility model;
Fig. 3 is a schematic perspective view of a space-borne chassis (with a second housing omitted) in embodiment 1 of the present utility model;
fig. 4 is a schematic perspective view of a first housing in embodiment 1 of the present utility model.
Reference numerals:
1. a circuit board; 11. a power consumption component; 2. a heat dissipation housing; 21. a first housing; 211. a heat conductive plate; 2111. a first heat conduction block; 21112. avoidance gap; 2112. a heat sink; 2113. a first heat conduction hole; 2114. a first screw hole; 212. a heat dissipation plate; 2121. a second heat conduction block; 2122. a second heat conduction hole; 2123. a second screw hole; 213. a connecting plate; 2131. a first side edge; 2132. a second side edge; 214. a receiving groove; 22. a second housing; 3. a flexible heat pipe.
Detailed Description
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Example 1:
Referring to fig. 1-4, the present embodiment provides a satellite-borne chassis, which includes a heat dissipation housing 2 and a circuit board 1. The circuit board 1 is mounted inside the heat dissipation case 2.
Wherein the heat dissipation case 2 includes a first case 21 and a second case 22.
The first case 21 includes a heat conductive plate 211 and a heat dissipation plate 212, wherein the heat conductive plate 211 and the heat dissipation plate 212 are disposed opposite to each other in a first direction, and the heat conductive plate 211 and the heat dissipation plate 212 are in a state of being parallel to each other in the present embodiment. The first case 21 further includes a plurality of connection plates 213, the heat conductive plates 211 and the heat dissipation plates 212 are connected by the connection plates 213, and accordingly, the connection plates 213 have a first side edge 2131 and a second side edge 2132 opposite to each other in the first direction, wherein the first side edge 2131 is integrally formed with the heat conductive plates 211, and the second side edge 2132 is integrally formed with the heat dissipation plates 212, whereby the heat conductive plates 211 can conduct heat to the heat dissipation plates 212 through the connection plates 213 even in an air-free environment.
In this embodiment, the number of the connecting plates 213 is three, the three connecting plates 213 are also in an integral structure, the heat conducting plate 211, the heat dissipating plate 212 and the three connecting plates 213 form a cuboid box body and enclose a containing groove 214, the opening of the containing groove 214 faces in a second direction, and the second direction is perpendicular to the first direction.
The circuit board 1 can be moved in the second direction at the opening of the accommodation groove 214, and can be attached to and detached from the accommodation groove 214. After the circuit board 1 is mounted in the accommodating groove 214, the first housing 21 is covered at the opening of the accommodating groove 214 to seal, the front and the back of the circuit board 1 are both provided with the power consumption components 11, the power consumption components 11 generate heat in the accommodating groove 214, and the heat can be directly conducted to the heat conducting plate 211, the heat dissipating plate 212 or the connecting plate 213.
The side of the heat dissipation plate 212 away from the heat conduction plate 211 is a mounting surface, and the heat dissipation plate is mounted on a satellite, and heat in the heat dissipation plate 212 can be directly contacted and conducted to the satellite at a high heat conduction speed. The connection plate 213 and the heat dissipation plate 212 are integrated, and are in direct contact, so that heat in the connection plate 213 can be directly contacted and conducted to the heat dissipation plate 212 at a high heat conduction speed, and then the heat dissipation plate 212 conducts the heat to the satellite. Similarly, the heat conducting plate 211 and the connecting plate 213 are integrated, so that the heat of the heat conducting plate 211 can be directly contacted with the connecting plate 213 at a high heat conducting speed, and then the heat is conducted to the heat dissipating plate 212 by the connecting plate 213. Therefore, in this embodiment, the heat generated in the accommodating groove 214 can be finally conducted to the heat dissipation plate 212, and the heat dissipation plate 212 realizes the high-efficiency heat dissipation of the accommodating groove 214, so that the two sides of the circuit board 1 can be fully dissipated, and the operation stability of the circuit board 1 and the power consumption component 11 is improved, so as to further improve the operation power of the power consumption component 11 and the circuit board 1.
For the front power consumption component 11 of the circuit board 1, the heat generated by the front power consumption component 11 is directly opposite to the heat conducting plate 211, and the heat generated by the front power consumption component is mainly directly conducted to the heat conducting plate 211, instead of the connecting plate 213 and the heat dissipating plate 212, in an air-free environment, in order to ensure the heat conduction efficiency between the heat conducting plate 211 and the front power consumption component 11 of the circuit board 1, a first heat conducting block 2111 is arranged on the surface of the heat conducting plate 211 facing the heat dissipating plate 212 in the embodiment.
In other embodiments, d 1 is different from 0, and the power consumption component 11 on the front side of the circuit board 1 and the first heat conduction block 2111 have a distance d 1, and the power consumption component 11 needs to conduct heat to the first heat conduction block 2111 through heat radiation, and then the first heat conduction block 2111 conducts heat to the heat conduction plate 211 through contact heat conduction. Since d 1 is smaller than the distance between the power consumption component 11 and the heat conduction plate 211, the heat radiation distance required in the heat conduction process of the power consumption component 11 is reduced as compared with the case without the first heat conduction block 2111, thereby improving the heat conduction efficiency of the power consumption component 11.
Further preferably, d 1 =0 in this embodiment, that is, the first heat conduction block 2111 is directly contacted with the power consumption component 11 on the front side of the circuit board 1, so that the power consumption component 11 can directly conduct heat to the heat conduction plate 211 through contact heat conduction, and heat conduction efficiency of the power consumption component 11 on the front side of the circuit board 1 is maximally improved.
The heat conducting plate 211 is concaved inwards to form a plurality of heat dissipating grooves 2112 on one surface of the heat conducting plate 211 facing away from the heat dissipating plate 212, and the heat dissipating grooves 2112 increase the specific surface area of one surface of the heat conducting plate 211 facing away from the heat dissipating plate 212, so that the heat dissipation of the heat conducting plate 211 in a heat radiation mode is facilitated, and the heat dissipation efficiency of the heat conducting plate 211 is further improved.
In this embodiment, there are at least two first heat conduction blocks 2111, but the number of power consumption components 11 on the front side of the circuit board 1 is greater than the number of first heat conduction blocks 2111, so not all the power consumption components 11 on the front side of the circuit board 1 will contact the first heat conduction blocks 2111. For this reason, an avoidance gap 21112 needs to be left between different first heat conduction blocks 2111, and during the process of disassembling and moving the circuit board 1, a part of the power consumption components 11 on the front surface of the circuit board 1 can be avoided through the avoidance gap 21112.
Similar to the first heat conduction block 2111, the surface of the heat dissipation plate 212 facing the heat conduction plate 211 is provided with the second heat conduction block 2121, and the heat conduction efficiency between the back power consumption component 11 of the circuit board 1 and the heat dissipation plate 212 can be maximally improved under the condition that the second heat conduction block 2121 is directly contacted with the back power consumption component 11 of the circuit board 1
In the case where the power consumption components 11 on the front and back sides of the circuit board 1 contact the first heat conduction block 2111 and the second heat conduction block 2121, respectively, the circuit board 1 is clamped between the heat conduction plate 211 and the heat dissipation plate 212, thereby improving the stability of the circuit board 1 in the accommodating groove 214.
In some embodiments, due to the heat conducting property of the material of the first housing 21, the heat conducting plate 211 may not fully meet the requirement for the heat conducting efficiency of the heat conducting plate 212 through the connecting plate 213. In this case, the heat dissipation case 2 of the present embodiment includes the flexible heat conduction pipe 3, and the flexible heat conduction pipe 3 is made of a material having good contact heat conduction performance and has good bending deformation capability.
The heat conducting plate 211 is provided with a first heat conducting hole 2113, the first heat conducting hole 2113 can extend along a second direction, the heat dissipating plate 212 is provided with a second heat conducting hole 2122, the second heat conducting hole 2122 can also extend along the second direction, and the connecting plate 213 is provided with a connecting hole, and the connecting hole can extend along the first direction. The two ends of the connection hole are respectively connected to the first heat conduction hole 2113 and the second heat conduction hole 2122, and thus the flexible heat conduction pipe 3 can be sequentially arranged at the first heat conduction hole 2113, the connection hole and the second heat conduction hole 2122 in a penetrating manner through bending. The heat conductive plate 211 can achieve efficient contact heat conduction to the heat dissipation plate 212 through the flexible heat conductive pipe 3.
In order to prevent the flexible heat pipe 3 from coming out of the first heat conduction hole 2113, the connection hole, and the second heat conduction hole 2122, one end of the first heat conduction hole 2113 is located on the edge of the heat conduction plate 211 at the opening of the accommodation groove 214, and one end of the second heat conduction hole 2122 is located on the edge of the heat dissipation plate 212 at the opening of the accommodation groove 214. After the second housing 22 is covered on the opening of the accommodating groove 214, the end of the second heat conduction hole 2122 and the end of the first heat conduction hole 2113 can be blocked, so that the flexible heat conduction pipe 3 can be restricted in position.
Since the front surface of the circuit board 1 is opposite to the heat conducting plate 211, and the back surface of the circuit board 1 is opposite to the heat dissipating plate 212, in this embodiment, a first screw hole 2114 is provided on the heat conducting plate 211, a second screw hole 2123 is provided on the heat dissipating plate 212, the first screw hole 2114 and the second screw hole 2123 are opposite to each other in the first direction, and the screw can directly penetrate the circuit board 1 through the first screw hole 2114 and the second screw hole 2123 to achieve locking of the circuit board 1.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. The utility model provides a heat dissipation shell, its characterized in that includes first casing, first casing includes heat-conducting plate, heating panel and connecting plate, the heat-conducting plate with the heating panel sets up relatively in first direction, the connecting plate has first side edge and the second side edge opposite in first direction, first side edge with the heat-conducting plate structure as an organic whole, the second side edge with the heating panel structure as an organic whole, the heat-conducting plate the heating panel and the connecting plate encloses into the holding tank.
2. The heat dissipating housing of claim 1, wherein a side of the heat conducting plate facing the heat dissipating plate is provided with a first heat conducting block.
3. The heat dissipating housing of claim 2, wherein a face of said heat conducting plate facing away from said heat dissipating plate is concave to form a plurality of heat dissipating grooves.
4. The heat dissipation case of claim 2, wherein there are at least two first heat conducting blocks, and an avoidance gap is provided between the first heat conducting blocks.
5. The heat dissipation case according to claim 2, wherein a side of the heat dissipation plate facing the heat conduction plate is provided with a second heat conduction block.
6. The heat dissipation shell of claim 1, further comprising a flexible heat pipe, wherein a first heat conduction hole is formed in the heat conduction plate, a second heat conduction hole is formed in the heat dissipation plate, a connection hole is formed in the connection plate, two ends of the connection hole are respectively communicated with the first heat conduction hole and the second heat conduction hole, and the flexible heat pipe sequentially penetrates through the first heat conduction hole, the connection hole and the second heat conduction hole.
7. The heat dissipating housing of claim 6, wherein one end of the first heat conducting hole is located on an edge of the heat conducting plate at the opening of the receiving slot, one end of the second heat conducting hole is located on an edge of the heat dissipating plate at the opening of the receiving slot, and the heat dissipating housing further comprises a second housing that covers the opening of the receiving slot to shield an end of the second heat conducting hole and an end of the first heat conducting hole.
8. The heat dissipating housing of claim 1, wherein the heat conducting plate is provided with a first screw hole, the heat dissipating plate is provided with a second screw hole, and the first screw hole and the second screw hole are disposed opposite to each other in a first direction.
9. A space-borne chassis, comprising the heat dissipation case according to any one of claims 1 to 8 and a circuit board mounted in the accommodation groove such that both sides of the circuit board are opposed to the heat conduction plate and the heat dissipation plate, respectively.
10. The spaceborne cabinet of claim 9, wherein a power consumption component is mounted on the circuit board, and the power consumption component is in contact with the first heat conduction block or the second heat conduction block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323091023.1U CN221079276U (en) | 2023-11-15 | 2023-11-15 | Heat dissipation shell and satellite-borne chassis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323091023.1U CN221079276U (en) | 2023-11-15 | 2023-11-15 | Heat dissipation shell and satellite-borne chassis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221079276U true CN221079276U (en) | 2024-06-04 |
Family
ID=91265044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323091023.1U Active CN221079276U (en) | 2023-11-15 | 2023-11-15 | Heat dissipation shell and satellite-borne chassis |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221079276U (en) |
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2023
- 2023-11-15 CN CN202323091023.1U patent/CN221079276U/en active Active
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