CN214507694U - Motor controller, power module, heat dissipation device and cooling plate - Google Patents
Motor controller, power module, heat dissipation device and cooling plate Download PDFInfo
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- CN214507694U CN214507694U CN202022922142.7U CN202022922142U CN214507694U CN 214507694 U CN214507694 U CN 214507694U CN 202022922142 U CN202022922142 U CN 202022922142U CN 214507694 U CN214507694 U CN 214507694U
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Abstract
The utility model relates to a machine controller, power module, heat abstractor and cooling plate, cooling plate are including the heat-conducting piece that is equipped with the cooling surface, be equipped with the radiating piece on the cooling surface, the cooling surface is used for enclosing with the casing and establishes into heat dissipation channel, the radiating piece be used for set up in the heat dissipation channel, just the radiating piece is followed heat dissipation channel's axial is the cockscomb structure setting. In the axial flow process of the cooling medium along the heat dissipation channel, the heat dissipation piece is arranged in a zigzag mode in the axial direction of the heat dissipation channel, so that the contact area between the heat dissipation piece and the cooling medium is increased, the heat exchange effect between the heat dissipation piece and the cooling medium can be guaranteed even if the temperature of the cooling medium rises to some extent, the cooling medium can effectively take away heat and is discharged, and the cooling effect is guaranteed.
Description
Technical Field
The utility model relates to a heat dissipation device technical field especially relates to a machine controller, power module, heat abstractor and cooling plate.
Background
The power module is used as a very critical part in a motor controller of the electric automobile, and the performance of the motor controller is directly influenced by whether the power module can stably and reliably work. When the power module works, the heat dissipation device is required to be used for dissipating heat of related parts, and heat generated by each part can be timely and quickly dissipated. The heat dissipation device usually uses liquid as a cooling medium, and heat exchange between the cooling medium and the cooling plate is realized through the flow of the cooling medium in the heat dissipation channel, so that heat is absorbed and discharged to realize the effect of cooling. Traditional cooling plate has the not good problem of cooling effect in the use.
SUMMERY OF THE UTILITY MODEL
Accordingly, it is desirable to provide a motor controller, a power module, a heat dissipation device and a cooling plate for solving the problem of poor cooling effect.
The technical scheme is as follows:
on the one hand, the cooling plate comprises a heat conducting piece with a heat radiating surface, wherein a heat radiating piece is arranged on the heat radiating surface, the heat radiating surface is used for enclosing a heat radiating channel with a shell, the heat radiating piece is used for being arranged in the heat radiating channel, and the heat radiating piece is arranged along the axial direction of the heat radiating channel in a zigzag mode.
According to the cooling plate provided by the embodiment, in the axial flowing process of the cooling medium along the heat dissipation channel, the heat dissipation part is arranged in the zigzag mode in the axial direction of the heat dissipation channel, so that the contact area between the heat dissipation part and the cooling medium is increased, the heat exchange effect between the heat dissipation part and the cooling medium can be guaranteed even if the temperature of the cooling medium rises to some extent, the cooling medium can effectively take away heat and discharge, and the cooling effect is guaranteed.
The technical solution is further explained below:
in one embodiment, the number of the heat dissipation elements is at least two, and at least two heat dissipation elements are oppositely arranged at intervals. Thus, the contact area between the radiating piece and the cooling medium is increased, and the heat exchange efficiency is higher.
In one embodiment, the distance between two adjacent heat dissipation elements is L, the thickness of each heat dissipation element is D, and L is 2D. Therefore, the heat dissipation piece and the cooling medium are ensured to have enough contact area, and the arrangement of the heat dissipation piece is also ensured not to cause interference or blockage to the flow of the cooling medium.
In one embodiment, the heat dissipation member includes a peak portion and a valley portion, and the peak portion of one of the heat dissipation members is disposed corresponding to the peak portion of the other heat dissipation member, and the valley portion of one of the heat dissipation members is disposed corresponding to the valley portion of the other heat dissipation member. Therefore, the arrangement of the radiating pieces on the radiating surface is more compact, more radiating pieces can be arranged on the radiating surface with the same area, and the cooling effect is ensured.
In one embodiment, the wave crest portions and/or the wave trough portions are provided with circular arc transition structures. In this way, the uniformity of the flow velocity of the cooling medium in the flow channel is ensured.
In one embodiment, the heat dissipation surface is configured to surround the housing to form at least two heat dissipation channels, the at least two heat dissipation channels are spaced apart from each other, and the heat dissipation member is correspondingly disposed in each heat dissipation channel.
In one embodiment, the flow directions of the cooling medium in two adjacent heat dissipation channels are opposite. Therefore, the cooling media in the two adjacent heat dissipation channels can realize complementation, and the cooling effect is ensured.
On the other hand, the heat dissipation device comprises a shell and the cooling plate, wherein the shell is covered on the cooling plate and surrounds the cooling plate to form the heat dissipation channel.
The heat dissipation device of the embodiment installs electronic components on the cooling plate or makes the cooling plate contact with electronic components, when electronic components work and generate heat, electronic components will produce heat transfer to the cooling plate, let in cooling medium in the heat dissipation channel, cooling medium absorbs the heat on the cooling plate and discharges at the flow in-process to reach the effect of cooling.
In still another aspect, a power module is provided, which includes the heat dissipation device.
The power module of above-mentioned embodiment, in the use, utilizes heat abstractor can distribute away the heat that relevant electronic components produced fast, efficient, guarantees that power module can be stable, reliable work.
In a further aspect, a motor controller is provided, comprising the power module.
The motor controller of the embodiment has the advantages that in the operation process, heat generated by the power module can be quickly and effectively dissipated through the heat dissipation device, and the motor controller can continuously and reliably operate.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification.
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment;
FIG. 2 is a schematic structural diagram of a cooling plate of the heat dissipation device of FIG. 1;
fig. 3 is a schematic view of an arrangement between adjacent two heat dissipation members of a cooling plate of the heat dissipation device of fig. 1;
fig. 4 is a schematic structural diagram of a heat dissipation device according to another embodiment.
Description of reference numerals:
10. heat sink, 100, cooling plate, 110, heat conducting element, 111, heat dissipating surface, 120, heat dissipating element, 121, wave crest, 122, wave trough, 200, housing, 300, heat dissipating channel, 310, flow channel.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
As shown in fig. 1, in one embodiment, a heat dissipation apparatus 10 is provided, which includes a housing 200 and a cooling plate 100, wherein the housing 200 is disposed on the cooling plate 100 and can enclose a heat dissipation channel 300 with the cooling plate 100. In this way, when an electronic component (not shown) is mounted on the cooling plate 100 or the cooling plate 100 is in contact with the electronic component, when the electronic component generates heat during operation, the electronic component transfers the generated heat to the cooling plate 100, and the cooling medium is introduced into the heat dissipation channel 300, and absorbs and discharges the heat on the cooling plate 100 during the flowing process, thereby achieving the cooling effect.
Wherein, the cooling medium can be water, oil or other fluids capable of realizing heat exchange to achieve the cooling effect. The casing 200 covers the cooling plate 100 and can be clamped, screwed or riveted, and the casing 200 and the cooling plate 100 are only required to be enclosed into the heat dissipation channel 300, and the cooling medium does not leak in the circulation process in the heat dissipation channel 300. The housing 200 may be in the form of a housing or the like, and may be provided as long as the housing is provided with the heat dissipation channel 300 through which the cooling medium can pass in cooperation with the cooling plate 100.
As shown in fig. 1 and 2, in one embodiment, the cooling plate 100 includes a heat conduction member 110 and a heat dissipation member 120. Wherein, the heat conducting element 110 is provided with a heat radiating surface 111, and the heat radiating element 120 is arranged on the heat radiating surface 111; the heat dissipating surface 111 and the housing 200 are arranged to form a heat dissipating channel 300, the heat dissipating member 120 is arranged in the heat dissipating channel 300, and the heat dissipating member 120 is arranged along the axial direction of the heat dissipating channel 300 in a zigzag manner.
In the cooling plate 100 of the above embodiment, when in use, the electronic component is mounted on the side of the heat-conducting member 110 away from the heat-dissipating surface 111 or the electronic component is in contact with the heat-conducting member 110; the housing 200 is covered on the heat dissipation surface 111 of the heat conduction member 110 by clamping, screwing, riveting or the like to form a heat dissipation channel 300, so that the heat dissipation member 120 is included in the heat dissipation channel 300; when the electronic component starts to work and generates heat, the electronic component transfers the heat to the heat conduction member 110, and the heat conduction member 110 transfers the heat to the heat dissipation member 120, so that the temperatures of the heat conduction member 110 and the heat dissipation member 120 are increased; at this moment, the cooling medium can be introduced into the heat dissipation channel 300, and the cooling medium contacts the heat conduction piece 110 and the heat dissipation piece 120 along the axial flow process of the heat dissipation channel 300, so that the cooling medium exchanges heat with the heat conduction piece 110 and the heat dissipation piece 120, the heat of the heat conduction piece 110 and the heat dissipation piece 120 is absorbed and finally the heat is discharged, the purpose of cooling the heat conduction piece 110 and the heat dissipation piece 120 is achieved, and then the electronic component is cooled, so that the electronic component works within a normal temperature range.
The conventional heat dissipating member 120 is a heat dissipating cylinder or a heat dissipating fin, the cooling medium contacts with the heat dissipating cylinder or the heat dissipating fin during the flowing process to realize heat exchange, when the cooling medium initially flows into the heat dissipating channel 300, the heat exchange effect between the cooling medium and the heat dissipating cylinder or the heat dissipating fin close to the liquid inlet of the heat dissipating channel 300 is better, and along with the flowing of the cooling medium, the temperature of the cooling medium continuously rises, so that the heat exchange effect between the cooling medium and the heat dissipating cylinder or the heat dissipating fin close to the liquid outlet of the heat dissipating channel 300 is poor, thereby affecting the cooling effect. In the cooling plate 100 of the above embodiment, in the axial flow process of the cooling medium along the heat dissipation channel 300, the heat dissipation member 120 is arranged along the axial direction of the heat dissipation channel 300 in a zigzag manner, so that the contact area between the heat dissipation member 120 and the cooling medium is increased, and even if the temperature of the cooling medium rises to some extent, the heat exchange effect between the heat dissipation member 120 and the cooling medium can be ensured, so that the cooling medium can effectively take away the heat and discharge, and further the cooling effect is ensured.
The heat conducting member 110 may be a heat conducting plate, a heat conducting sheet or other shapes, and may be made of copper or other materials with excellent heat conducting property. The heat sink 120 may be in the form of a strip or other shape, or may be made of copper or other material having excellent heat conductivity. The heat conduction member 110 and the heat dissipation member 120 may be integrally formed, or may be separately formed and assembled by welding, clamping, or riveting. In addition, in order to ensure that the electronic component can better transmit heat to the heat conducting member 110, an intermediate element which is beneficial to heat transmission, such as heat-conducting silicone grease, can be additionally arranged between the electronic component and the heat conducting member 110.
The heat dissipation member 120 is disposed along the axial direction of the heat dissipation channel 300 in a zigzag manner, which means that the overall profile of the heat dissipation member 120 is in a zigzag form fluctuating up and down along the axial direction of the heat dissipation channel 300.
In addition, the number of the heat dissipation members 120 may be flexibly selected or adjusted according to actual heat dissipation needs, and only the requirement of effectively transferring heat to the cooling medium is satisfied.
As shown in fig. 2, in one embodiment, the heat dissipation members 120 are at least two, and at least two heat dissipation members 120 are oppositely spaced. Therefore, heat on the heat conduction piece 110 is transferred to the at least two heat dissipation pieces 120, the contact area between the heat conduction piece 110 and the cooling medium is further increased, heat on the heat conduction piece 110 and the heat dissipation pieces 120 can be more effectively exchanged to the cooling medium, and the cooling effect is improved. Moreover, each heat dissipation member 120 is arranged along the axial direction of the heat dissipation channel 300 in a zigzag manner, so that even if the temperature of the cooling medium near the liquid outlet is high, at least two heat dissipation members 120 have enough contact area with the cooling medium, and the heat exchange effect is ensured. Moreover, at least two heat dissipation pieces 120 are arranged at intervals relatively, the heat dissipation channel 300 can be separated into at least three circulation channels 310, it is ensured that the cooling medium and the heat dissipation pieces 120 have enough contact area, and in combination with the fact that each heat dissipation piece 120 is arranged along the axial direction of the heat dissipation channel 300 in a zigzag manner, turbulence in the flowing process of the cooling medium can be reduced, the flow speed of the cooling medium in each flow channel is more uniform, the heat exchange between the cooling medium and the heat conduction piece 110 and between the cooling piece 120 is more uniform, and the cooling effect is more uniform and good.
The size of the heat dissipation member 120 and the distance between two adjacent heat dissipation members 120 can be flexibly designed or adjusted according to actual heat dissipation requirements, and only the heat exchange effect between the heat dissipation member 120 and the cooling medium needs to be ensured.
As shown in fig. 3, in one embodiment, a distance between two adjacent heat dissipation elements 120 is L, a thickness of each heat dissipation element 120 is D, and L is 2D. Therefore, a sufficient contact area between the heat dissipation member 120 and the cooling medium is ensured, the heat dissipation member 120 does not influence the flow of the cooling medium, and the heat exchange effect between the heat dissipation member 120 and the cooling medium is ensured to be good. Wherein, the specific size of L and D can carry out nimble adjustment according to the heat dissipation needs of reality, only need satisfy L2D.
The heat dissipation member 120 is disposed along the axial direction of the heat dissipation channel 300 in a zigzag manner, which means that the overall profile of the heat dissipation member 120 is in a zigzag form fluctuating up and down along the axial direction of the heat dissipation channel 300.
As shown in fig. 3, in one embodiment heat spreading member 120 includes peak portions 121 and valley portions 122. In two adjacent heat dissipation members 120, the peak portion 121 of one heat dissipation member 120 is disposed corresponding to the peak portion 121 of the other heat dissipation member 120; the valley portions 122 of one heat sink 120 are disposed to correspond to the valley portions 122 of the other heat sink 120. Therefore, the two adjacent heat dissipation members 120 are arranged on the heat dissipation surface 111 more compactly, so that as many heat dissipation members 120 as possible can be arranged on the heat dissipation surface 111, a sufficiently large contact area is ensured between the heat conduction member 110 and the heat dissipation members 120 and the cooling medium, and the heat exchange effect is improved. The distance between two adjacent heat dissipation elements 120 may be represented by a distance between two corresponding wave crests 121, and may also be represented by a distance between two corresponding wave troughs 122.
Optionally, the peak portion 121 is provided with a rounded transition. So, when cooling medium flowed through crest portion 121 for cooling medium's velocity of flow keeps steadily, and cooling medium's velocity of flow can not take place great fluctuation on a large scale, guarantees the homogeneity of the velocity of flow of cooling medium in circulation passageway 310, thereby guarantees to carry out even heat exchange between cooling medium and the radiating piece 120, and cooling is effectual.
Optionally, the trough portion 122 is provided with a rounded transition structure. Therefore, when the cooling medium flows through the wave trough portion 122, the flow rate of the cooling medium is kept stable, the flow rate of the cooling medium cannot fluctuate in a large range, the uniformity of the flow rate of the cooling medium in the flow channel 310 is ensured, uniform heat exchange between the cooling medium and the heat dissipation member 120 is ensured, and the cooling effect is good.
Of course, in other embodiments, it is also possible that the wave crest portions 121 are provided with circular arc transition structures, and the wave trough portions 122 are provided with circular arc transition structures. Therefore, the uniformity of the flow velocity of the cooling medium in the flow channel 310 is ensured, so that the uniform heat exchange between the cooling medium and the heat dissipation member 120 is ensured, and the cooling effect is good.
The arc transition structure is a rounded corner between two adjacent edges which are arranged at an acute angle or an obtuse angle.
In addition, the number of the heat dissipation channels 300 can be flexibly adjusted or designed according to actual use conditions, and only the requirement that the heat on the heat conduction member 110 and the heat dissipation member 120 can be timely and effectively discharged by using the cooling medium is satisfied.
As shown in fig. 4, in one embodiment, the heat dissipating surface 111 is configured to surround the housing 200 to form at least two heat dissipating channels 300, the at least two heat dissipating channels 300 are spaced apart from each other, and the heat dissipating member 120 is correspondingly disposed in each heat dissipating channel 300. So, all let in cooling medium in every heat dissipation channel 300 to utilize the cooling medium in two at least heat dissipation channels 300 to dispel the heat to radiating piece 120 and heat-conducting piece 110, the cooling is effectual.
Further, the flow directions of the cooling medium in two adjacent heat dissipation channels 300 are opposite. Thus, in two adjacent heat dissipation channels 300, the liquid inlet of the first heat dissipation channel 300 and the liquid outlet of the second heat dissipation channel 300 are located on the same side, and the liquid outlet of the first heat dissipation channel 300 and the liquid inlet of the second heat dissipation channel 300 are displaced on the same side; even if the temperature of the cooling medium in the first heat dissipation channel 300 at the liquid outlet of the first heat dissipation channel 300 is increased, the cooling medium which just enters the liquid inlet of the second heat dissipation channel 300 can also ensure effective heat exchange with the heat conduction piece 110 and the heat dissipation piece 120, and the cooling effect is good; similarly, even if the temperature of the cooling medium in the second heat dissipation channel 300 at the liquid outlet of the second heat dissipation channel 300 rises to some extent, the cooling medium which has just entered from the liquid inlet of the first heat dissipation channel 300 can also ensure effective heat exchange with the heat conduction element 110 and the heat dissipation element 120, and the cooling effect is good.
In one embodiment, a power module is also provided, including the heat dissipation device 10 of any of the above embodiments.
In the use process of the power module of the embodiment, the heat generated by the related electronic component can be quickly and efficiently dissipated by the heat dissipation device 10, so that the power module can stably and reliably work.
It should be noted that the heat dissipation device 10 of the above embodiment is not limited to be applied to a power module, and may be applied to other places or scenes where heat dissipation is required.
In one embodiment, there is also provided a motor controller comprising the power module of any of the above embodiments.
In the motor controller of the embodiment, in the operation process, heat generated by the power module can be quickly and effectively dissipated through the heat dissipation device 10, and the motor controller can continuously and reliably operate.
The "certain body" and the "certain portion" may be a part corresponding to the "member", that is, the "certain body" and the "certain portion" may be integrally formed with the other part of the "member"; the "part" can be made separately from the "other part" and then combined with the "other part" into a whole. The expressions "a certain body" and "a certain part" in the present application are only one example, and are not intended to limit the scope of the present application for reading convenience, and the technical solutions equivalent to the present application should be understood as being included in the above features and having the same functions.
It should be noted that, the components included in the "unit", "assembly", "mechanism" and "device" of the present application can also be flexibly combined, i.e., can be produced in a modularized manner according to actual needs, so as to facilitate the modularized assembly. The division of the above-mentioned components in the present application is only one example, which is convenient for reading and is not a limitation to the protection scope of the present application, and the same functions as the above-mentioned components should be understood as equivalent technical solutions in the present application.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. The term "and/or" as used in this disclosure includes any and all combinations of one or more of the associated listed items.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to," "disposed on," "secured to," or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. Further, when one element is considered as "fixed transmission connection" with another element, the two elements may be fixed in a detachable connection manner or in an undetachable connection manner, and power transmission can be achieved, such as sleeving, clamping, integrally-formed fixing, welding and the like, which can be achieved in the prior art, and is not cumbersome. When an element is perpendicular or nearly perpendicular to another element, it is desirable that the two elements are perpendicular, but some vertical error may exist due to manufacturing and assembly effects. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
It should also be understood that in explaining the connection relationship or the positional relationship of the elements, although not explicitly described, the connection relationship and the positional relationship are interpreted to include an error range which should be within an acceptable deviation range of a specific value determined by those skilled in the art. For example, "about," "approximately," or "substantially" may mean within one or more standard deviations, without limitation.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The cooling plate is characterized by comprising a heat conducting piece with a heat radiating surface, wherein a heat radiating piece is arranged on the heat radiating surface, the heat radiating surface is used for enclosing a heat radiating channel with a shell, the heat radiating piece is used for being arranged in the heat radiating channel, and the heat radiating piece is arranged along the axial direction of the heat radiating channel in a sawtooth shape.
2. A cooling plate as claimed in claim 1, wherein there are at least two of said heat dissipation elements, at least two of said heat dissipation elements being spaced apart from one another.
3. A cooling plate according to claim 2, wherein a distance between two adjacent heat dissipation elements is L, a thickness of the heat dissipation element is D, and L is 2D.
4. A cooling plate according to claim 2, wherein said heat dissipation member includes peak and valley portions, and of two adjacent heat dissipation members, the peak portion of one of said heat dissipation members is disposed in correspondence with the peak portion of the other of said heat dissipation members, and the valley portion of one of said heat dissipation members is disposed in correspondence with the valley portion of the other of said heat dissipation members.
5. A cooling plate according to claim 4, characterized in that the crest portions and/or the trough portions are provided with a rounded transition.
6. A cooling plate as claimed in any one of claims 1 to 5, wherein said heat dissipating surface is configured to surround at least two said heat dissipating channels with the housing, at least two said heat dissipating channels are spaced apart, and each said heat dissipating channel has a corresponding said heat dissipating member.
7. The cooling plate as claimed in claim 6, wherein the flow directions of the cooling medium in two adjacent heat dissipation channels are opposite.
8. A heat dissipating device comprising a housing and a cooling plate as claimed in any one of claims 1 to 7, wherein the housing is covered on the cooling plate and encloses the cooling plate to form the heat dissipating passage.
9. A power module comprising the heat dissipating device of claim 8.
10. A motor controller comprising the power module of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202022922142.7U CN214507694U (en) | 2020-12-08 | 2020-12-08 | Motor controller, power module, heat dissipation device and cooling plate |
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| CN202022922142.7U CN214507694U (en) | 2020-12-08 | 2020-12-08 | Motor controller, power module, heat dissipation device and cooling plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114542610A (en) * | 2022-03-01 | 2022-05-27 | 哈电风能有限公司 | Main bearing cooling structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114542610A (en) * | 2022-03-01 | 2022-05-27 | 哈电风能有限公司 | Main bearing cooling structure |
| CN114542610B (en) * | 2022-03-01 | 2024-02-27 | 哈电风能有限公司 | Main bearing cooling structure |
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