CN212812416U

CN212812416U - Adjustable heat radiation structure of electronic product internal circuit board

Info

Publication number: CN212812416U
Application number: CN202021920891.XU
Authority: CN
Inventors: 刘斌; 陈景胜; 魏建程; 肖作超; 吴进; 朱锋华
Original assignee: Guangzhou Jiadu Technology Software Development Co ltd; PCI Suntek Technology Co Ltd
Current assignee: Guangzhou Jiadu Technology Software Development Co ltd; PCI Technology Group Co Ltd
Priority date: 2020-09-04
Filing date: 2020-09-04
Publication date: 2021-03-26
Anticipated expiration: 2030-09-04

Abstract

The utility model discloses an adjustable heat radiation structure of an electronic product internal circuit board, which relates to the technical field of electronic product heat radiation.A device shell comprises a coaming and a heat radiation clapboard, wherein two opposite side surfaces of the heat radiation clapboard form a first side surface and a second side surface respectively, and the first side surface and the second side surface are respectively connected with the coaming to form a corresponding first mounting groove and a second mounting groove; set up in the mainboard of second mounting groove, form heat dissipation channel between mainboard and the second side, be provided with altitude mixture control subassembly between mainboard and the equipment casing, through set up altitude mixture control subassembly between mainboard and the equipment casing, altitude mixture control subassembly is used for adjusting the mainboard and moves in the direction that is close to and keeps away from the second side, make the distance between the relative equipment casing of mainboard produce the change, change heat dissipation channel's high dimension, thereby help the increase or reduce product inner space, let heat dissipation channel's altitude mixture control be optimum size, satisfy electronic product heat dissipation demand.

Description

Adjustable heat radiation structure of electronic product internal circuit board

Technical Field

The utility model relates to a radiating technical field of electronic product especially relates to an adjustable heat radiation structure of electronic product internal circuit board.

Background

At present, a conventional heat dissipation structure for electronic products comprises a printed circuit board, an on-board component, a metal shell and a heat-conducting insulating material, wherein the on-board component is a heating device. The metal shell covers the printed circuit board to define an accommodating space of the printed circuit board, and the heat-conducting insulating material is arranged between the heating device and the metal shell to connect the heating device and the metal shell. Among this kind of heat radiation structure, heat conduction insulating material's insulating nature can be isolated device and the metal casing that generates heat in the aspect of the electric, short circuit and outside electrostatic shock have been avoided, heat conduction insulating material's heat conductivity can make and generate heat and form effectual heat route between device and the metal casing simultaneously, through the air of crowding between device and the metal casing that generates heat, the heat in the device that generates heat can get into the metal casing through heat conduction insulating material more easily, utilize the external heat that escapes of the surface area of metal casing itself at last, obtain good radiating effect.

However, in the process of implementing the present invention, the inventor finds that the existing heat dissipation structure of electronic products has at least the following problems: the PCB inside the product is mostly locked and fixed on the shell by screws and can not be movably adjusted, the inner space of the PCB is in clearance fit with the shell, the space is compact, and the local heat of the PCB is statically accumulated at the clearance. When the heights of the plurality of heating devices on the printed circuit board are different, the distances between the plurality of heating devices and the metal shell are different due to the fact that the surfaces of the plurality of heating devices opposite to the metal shell are flat, and therefore the problems that the PCB is locally dissipated heat and accumulated, and the product is in a black screen and is halted or software is restarted frequently occur.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides an aim at: the utility model provides an adjustable heat radiation structure of electronic product internal circuit board relies on altitude mixture control subassembly to adjust heat dissipation channel's height to help increasing product inner space, improve the radiating efficiency, thereby solve the above-mentioned problem that exists among the prior art.

In order to achieve the purpose, the utility model adopts the following technical proposal:

an adjustable heat dissipation structure of an internal circuit board of an electronic product comprises an equipment shell, wherein the equipment shell comprises a surrounding plate and a heat dissipation partition plate, the surrounding plate is arranged on the periphery of the heat dissipation partition plate in a surrounding manner, the heat dissipation partition plate is arranged in the middle of the surrounding plate, a first side surface and a second side surface are respectively formed on two opposite side surfaces of the heat dissipation partition plate, and the first side surface and the second side surface are respectively connected with the surrounding plate to form a corresponding first installation groove and a corresponding second installation groove; the main board is arranged in the second mounting groove, a heat dissipation channel is formed between the main board and the second side surface, a height adjusting component is arranged between the main board and the equipment shell and used for adjusting the main board to move in the direction close to and far away from the second side surface so as to change the height size of the heat dissipation channel.

Further, the coaming and the heat dissipation partition plate are integrally formed.

Further, the device shell further comprises a bottom shell, and the bottom shell cover is arranged on one side, provided with the second mounting groove, of the enclosing plate.

Furthermore, two opposite ends of the heat dissipation partition plate are respectively provided with a circulating air port for communicating the first mounting groove and the second mounting groove; a screen component (20) is embedded in the first mounting groove (13); a gap is formed between the screen assembly and the first side face, and the gap and the two opposite ends of the heat dissipation channel are communicated through the two circulating air openings respectively.

Furthermore, a plurality of radiating fins are arranged on the second side surface, and the radiating channel is formed between any two adjacent radiating fins.

Further, a fan is arranged in the second mounting groove.

Further, a water flowing heat pipe is arranged in the second installation groove and arranged in the heat dissipation channel.

Further, the height adjusting assembly comprises an adjusting screw rod, the adjusting screw rod is provided with a screw head and a threaded rod section, the adjusting screw rod penetrates through the main board from the side of the main board far away from the second side face and is in threaded fit with the equipment shell, so that the main board is arranged between the second side face and the screw head; the threaded rod section is sleeved with a butterfly spring, and two opposite ends of the butterfly spring are respectively abutted to the equipment shell and the main board.

Further, the height adjusting assembly comprises a first fork shearing frame and a second fork shearing frame, the first fork shearing frame and the second fork shearing frame are arranged in a crossed mode, and the middle portions of the first fork shearing frame and the second fork shearing frame are in pin joint matching; the enclosure plate is provided with a plurality of adjacent sliding grooves, the extending direction of each sliding groove is consistent with the extending direction of the enclosure plate, one end of the first fork shearing frame and/or one end of the second fork shearing frame are/is in sliding fit with the sliding grooves, and the other ends of the first fork shearing frame and the second fork shearing frame are rotationally connected with the main plate.

Further, the height adjusting assemblies are multiple, and the height adjusting assemblies are arranged at the edge of the main plate and between the enclosing plates at intervals.

The utility model has the advantages that: through set up altitude mixture control subassembly between mainboard and equipment casing, altitude mixture control subassembly is used for adjusting the mainboard and moves in the direction that is close to and keeps away from the second side, make the distance between the relative equipment casing of mainboard produce the change, change the height dimension of heat dissipation channel, thereby help the increase or reduce the product inner space, let the altitude mixture control of heat dissipation channel be optimum size, satisfy electronic product heat dissipation demand, guarantee that heat dissipation channel can bring the optimal radiating effect for the device that generates heat on the mainboard, improve electronic product's radiating efficiency, and through the height of adjusting the mainboard, can change the casing wall thickness that reduces electronic product, make electronic product outward appearance slimmer, inner structure is compacter.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and examples.

Fig. 1 is one of the exploded views of the adjustable heat dissipation structure of the circuit board in the electronic product of the present invention;

fig. 2 is an exploded view of the adjustable heat dissipation structure of the circuit board in the electronic product according to the present invention;

fig. 3 is a sectional view of the adjustable heat dissipation structure of the circuit board in the electronic product of the present invention;

FIG. 4 is an enlarged view of section A of FIG. 3;

FIG. 5 is a schematic structural view of another embodiment of the height adjustment assembly.

In the figure: 10. an equipment housing; 11. enclosing plates; 111. a sliding groove; 12. a heat dissipating partition; 121. a first side surface; 122. a second side surface; 123. a heat dissipation channel; 124. a circulating tuyere; 125. a heat dissipating fin; 13. a first mounting groove; 14. a second mounting groove; 15. a bottom case; 20. a screen assembly; 21. a gap; 30. a main board; 40. a height adjustment assembly; 41. adjusting the screw rod; 411. a screw head; 412. a threaded rod section; 42. a belleville spring; 43. a first fork carriage; 44. a second scissor carriage.

Detailed Description

In order to make the technical problem solved by the present invention, the technical solutions adopted by the present invention and the technical effects achieved by the present invention clearer, the embodiments of the present invention are described in further detail below, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

As shown in fig. 1-3, in order to improve the heat dissipation effect inside the electronic product and ensure the internal structure thereof to be compact, the present embodiment provides an adjustable heat dissipation structure for an internal circuit board of an electronic product, which is configured to be disposed inside an electronic device to improve the heat dissipation effect of the electronic device body, the heat dissipation structure includes a device housing 10 as an overall supporting structure of the electronic device, the device housing 10 includes a surrounding plate 11 and a heat dissipation partition 12, the surrounding plate 11 is disposed around the periphery of the heat dissipation partition 12, and serves as an outer shell of the electronic device, in this example, the surrounding plate 11 is a vertical plate-shaped structure for surrounding the side edge of the electronic device, the heat dissipation partition 12 is disposed in the middle of the surrounding plate 11, the heat dissipation partition 12 is preferably perpendicular to the surrounding plate 11, two opposite side surfaces of the heat dissipation partition 12 respectively form a first side surface 121 and, The second side 122 is connected to the enclosure 11 to form a corresponding first mounting slot 13 and a corresponding second mounting slot 14, respectively, for dividing the interior of the electronic product into two parts.

The screen assembly 20 of the electronic equipment is embedded in the first mounting groove 13, the screen assembly 20 is used for displaying corresponding information such as images and colors, the screen assembly 20 can be combined by a backlight plate and a liquid crystal screen to form a two-in-one combined screen, the backlight plate can be arranged in the first mounting groove 13, the liquid crystal screen can cover the coaming 11 and is respectively arranged on two opposite sides of the backlight plate with the heat dissipation partition plate 12, the edge of the liquid crystal screen is matched with the coaming 11 to perform corresponding sealing treatment, the water tightness is increased, and the light leakage is avoided.

The main board 30 of the electronic device is disposed in the second mounting groove 14, the main board 30 generally includes a PCB and electronic devices such as a processor and a memory disposed on the PCB, wherein the electronic devices include a plurality of heat generating devices, in order to keep the temperature of the heat generating devices within a range meeting the standard requirements during the operation of the electronic device, the main board 30 and the second side surface 122 cooperate to form a heat dissipating channel 123, the heat generating devices on the main board 30 exchange heat with air or corresponding heat dissipating and conducting structures in the heat dissipating channel 123 and discharge the heat out of the electronic device or dissipate the heat through the heat dissipating device, a height adjusting assembly 40 is disposed between the main board 30 and the device housing 10, the height adjusting assembly 40 is used for adjusting the main board 30 to move in a direction close to and away from the second side surface 122, so that the distance between the main board 30 and the device housing 10 changes, thereby changing the height dimension of the heat dissipating channel 123, thereby help increase or reduce the product inner space, let the altitude mixture control of heat dissipation channel 123 be optimum size, the heat transfer medium flow and/or increase heat dissipation area of contact in the heat dissipation channel 123 of assistance, satisfy electronic product heat dissipation demand, guarantee that heat dissipation channel 123 can bring the optimal radiating effect for the device that generates heat on the mainboard 30, improve electronic product's radiating efficiency, and through the height of adjusting mainboard 30, can reduce electronic product's casing wall thickness, let electronic product outward appearance more slim, inner structure is compacter.

Specifically, the coaming 11 and the heat dissipation partition plate 12 are integrally formed, and can be formed through milling or die forming, so that the structural integrity of the electronic equipment is improved, and the assembly difficulty of the electronic equipment is reduced.

Further, equipment casing 10 still includes drain pan 15, drain pan 15 lid is located bounding wall 11 and is had one side of second mounting groove 14, with bounding wall 11, heat dissipation baffle 12 encloses jointly and establishes formation second mounting groove 14, let electronic equipment wholeness nature stronger, avoid mainboard 30 to expose simultaneously, guarantee radiating efficiency maximize of radiating channel 123, avoid mainboard 30 one side fretwork to lead to the heat-generating body contact outside the heating element on heat transfer medium and the mainboard 30, also can set up the part that increases leakproofness and the cooperation degree between the two such as waterproof rubber ring between drain pan 15 and the bounding wall 11.

In order to further improve the heat dissipation efficiency of the main board 30 in the electronic device, two opposite ends of the heat dissipation partition plate 12 are respectively provided with a circulation air opening 124 communicating the first installation groove 13 and the second installation groove 14, so that a certain distance is provided between two opposite sides of the heat dissipation partition plate 12 and the enclosure plate 11, a gap 21 is formed between the screen assembly 20 and the first side surface 121, and two opposite ends of the gap 21 and the heat dissipation channel 123 are respectively communicated through the two circulation air openings 124, in this example, the electronic product is an approximately cuboid structure as a whole, the two opposite circulation air openings 124 are arranged at two opposite ends in the length direction of the device housing 10, so that the contact area of the circulation air duct formed by the communication of the heat dissipation channel 123, the circulation air opening 124 and the gap 21 and the main board 30 is maximized, and a heat exchange medium circulates in the gap 21, one of the circulation air openings 124, the heat dissipation channel 123 and the other circulation air opening 124 to exchange, and the heat after heat exchange is discharged or exchanged with a corresponding heat dissipation device, so that the effect of overall heat dissipation of the electronic equipment is achieved, and the electronic equipment is ensured to operate at the temperature meeting the requirements.

As a preferred embodiment of the above technical solution, a plurality of heat dissipation fins 125 are disposed on the second side surface 122, and the heat dissipation channel 123 as described above is formed between any two adjacent heat dissipation fins 125, that is, the extending direction of the heat dissipation fins 125 is the same as the length direction of the electronic device, so that the heat dissipation channel 123 is communicated with the circulation air ports 124 at two ends, in the process of heat dissipation inside the electronic device, the heat dissipation partition 12 exchanges heat with the screen assembly 20 and the medium after heat is emitted from the main board 30 and then exchanges heat with the heat dissipation fins 125 in an air cooling or water cooling manner, so as to achieve the effect of heat dissipation between the screen assembly 20 and the main board 30.

Preferably, a fan is disposed in the second mounting groove 14, the fan can circulate air in a circulating air duct formed by the communication of the gap 21, the two circulating air outlets 124 and the heat dissipation channel 123, and further an air inlet and/or an air outlet can be formed in the enclosure 11 to allow air with relatively low temperature to enter the circulating air duct or to discharge air after heat exchange out of the device housing 10.

Preferably, a water flow heat pipe is disposed in the second mounting groove 14, the water flow heat pipe is disposed in the heat dissipation channel 123, the water flow heat pipe can be communicated with the water cooling device, and the water flow heat pipe exchanges heat with the heat dissipation fins 125 by being disposed in the heat dissipation channel 123, so as to achieve a heat dissipation effect.

As shown in fig. 4, as one of the preferred embodiments of the height adjusting assembly 40, the height adjusting assembly 40 includes an adjusting screw 41, the adjusting screw 41 has a screw head 411 and a threaded rod section 412, the adjusting screw 41 is threaded through the main board 30 from the side of the main board 30 away from the second side 122 and is in threaded engagement with the device housing 10, so that the main board 30 is disposed between the second side 122 and the screw head 411; the threaded rod section 412 is sleeved with a belleville spring 42, and two opposite ends of the belleville spring 42 are respectively abutted against the device housing 10 and the main plate 30. Through adjusting screw 41, the length of making the screw section 412 screw in equipment casing 10 changes, disc spring 42 is used for propping up mainboard 30 on spiral head 411, in spiral head 411 is close to or keeps away from equipment casing 10 in-process, make mainboard 30 be close to relatively or keep away from equipment casing 10, thereby let the heat dissipation passageway 123 height between mainboard 30 and the heat dissipation baffle 12 change, disc spring 42 can play the effect of pretension, also can cushion mainboard 30, for with mainboard 30 complete rigid connection and adjusting screw 41, the mode of propping up through disc spring 42 more can protect mainboard 30 structure.

As shown in fig. 5, as another preferred embodiment of the height adjusting assembly 40, the height adjusting assembly 40 includes a first fork arm 43 and a second fork arm 44, the first fork arm 43 and the second fork arm 44 are arranged crosswise, and the first fork arm 43 and the second fork arm 44 are pivotally engaged at their middle portions; a plurality of adjacent sliding grooves 111 are formed in the enclosing plate 11, the extending direction of each sliding groove 111 is consistent with the extending direction of the enclosing plate 11, one end of the first fork shearing frame 43 and/or one end of the second fork shearing frame 44 are/is in sliding fit with the sliding groove 111, the other ends of the first fork shearing frame 43 and the second fork shearing frame 44 are/is rotatably connected with the main plate 30, the first fork shearing frame 43 and/or one end of the second fork shearing frame 44, which are/is arranged on the equipment housing 10, are/is enabled to slide on the sliding grooves 111 by adjusting the first fork shearing frame 43 and the second fork shearing frame 44, if one end of the first fork shearing frame 43 or one end of the second fork shearing frame 44 is not in sliding fit with the sliding groove 111, the first fork shearing frame 43 or one end of the second fork frame 44 are arranged on the equipment housing 10 in a rotating connection manner, so that the included angle between the first fork shearing frame 43 and the second fork shearing frame 44 can be changed, and, if the height of the heat dissipation channel 123 is changed and one end of the first fork shearing frame 43 and one end of the second fork shearing frame 44 are in sliding fit with the sliding groove 111, a screw and a nut may be disposed at the end of the first fork shearing frame 43, the end of the second fork shearing frame 44, which is in sliding fit with the sliding groove 111, and the corresponding height of the main board 30 is adjusted, and the screw and the nut are screwed, so as to clamp the first fork shearing frame 43 and the second fork shearing frame 44 on the enclosing plate 11.

The height adjusting assemblies 40 are arranged in a plurality of numbers, the height adjusting assemblies 40 are arranged between the edge of the main plate 30 and the inner edge of the coaming 11 at intervals, and the outer circumference size of the main plate 30 is smaller than the inner circumference size of the coaming 11, so that the height adjusting assemblies 40 can be kept in a state of being perpendicular to the main plate 30 relatively, and the operation of the height adjusting assemblies 40 is more stable.

In the description herein, it is to be understood that the terms "upper," "lower," "left," "right," and the like are used merely for convenience in description and simplicity in operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.

In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims

1. The utility model provides an adjustable heat radiation structure of inside circuit board of electronic product which characterized in that includes:

the equipment comprises an equipment shell (10), wherein the equipment shell (10) comprises a surrounding plate (11) and a heat dissipation partition plate (12), the surrounding plate (11) is arranged on the periphery of the heat dissipation partition plate (12), the heat dissipation partition plate (12) is arranged in the middle of the surrounding plate (11), a first side surface (121) and a second side surface (122) are respectively formed on two opposite side surfaces of the heat dissipation partition plate (12), and the first side surface (121) and the second side surface (122) are respectively connected with the surrounding plate (11) to form a corresponding first mounting groove (13) and a corresponding second mounting groove (14);

a main board (30) disposed in the second mounting groove (14), a heat dissipation channel (123) is formed between the main board (30) and the second side surface (122), a height adjustment assembly (40) is disposed between the main board (30) and the device housing (10), and the height adjustment assembly (40) is used for adjusting the main board (30) to move in a direction close to and away from the second side surface (122) so as to change a height dimension of the heat dissipation channel (123).

2. The adjustable heat dissipation structure for internal circuit boards of electronic products according to claim 1, wherein the enclosure plate (11) is integrally formed with the heat dissipation partition plate (12).

3. The adjustable heat dissipation structure for internal circuit boards of electronic products according to claim 1, wherein the device housing (10) further comprises a bottom shell (15), and the bottom shell (15) is disposed on the side of the enclosure (11) having the second mounting slot (14).

4. The adjustable heat dissipation structure of the internal circuit board of the electronic product as claimed in any one of claims 1 to 3, wherein the opposite ends of the heat dissipation partition (12) are respectively provided with a circulation air opening (124) communicating the first mounting groove (13) and the second mounting groove (14);

a screen component (20) is embedded in the first mounting groove (13); a gap (21) is formed between the screen assembly (20) and the first side surface (121), and the gap (21) and the two opposite ends of the heat dissipation channel (123) are respectively communicated through the two circulating air openings (124).

5. The adjustable heat dissipation structure of the internal circuit board of the electronic product as claimed in claim 4, wherein a plurality of heat dissipation fins (125) are disposed on the second side surface (122), and the heat dissipation channel (123) is formed between any two adjacent heat dissipation fins (125).

6. The adjustable heat dissipation structure for internal circuit boards of electronic products as claimed in claim 5, wherein a fan is disposed in the second mounting groove (14).

7. The adjustable heat dissipation structure of circuit board inside electronic product according to claim 5, wherein a water flow heat pipe is disposed inside the second mounting groove (14), and the water flow heat pipe is disposed inside the heat dissipation channel (123).

8. The adjustable heat dissipation structure of the internal circuit board of the electronic product according to claim 1, wherein the height adjustment assembly (40) comprises an adjustment screw (41), the adjustment screw (41) has a screw head (411) and a screw rod section (412), the adjustment screw (41) is threaded to the main board (30) from the side of the main board (30) away from the second side (122) and is in threaded fit with the device housing (10), so that the main board (30) is disposed between the second side (122) and the screw head (411);

the threaded rod section (412) is sleeved with a butterfly spring (42), and two opposite ends of the butterfly spring (42) are respectively abutted to the equipment shell (10) and the main board (30).

9. The adjustable heat dissipation structure for internal circuit boards of electronic products according to claim 1, wherein the height adjustment assembly (40) comprises a first fork frame (43) and a second fork frame (44), the first fork frame (43) and the second fork frame (44) are arranged crosswise, and the first fork frame (43) and the second fork frame (44) are pivotally engaged in the middle;

the enclosing plate (11) is provided with a plurality of adjacent sliding grooves (111), the extending direction of each sliding groove (111) is consistent with the extending direction of the enclosing plate (11), one end of the first fork shearing frame (43) and/or one end of the second fork shearing frame (44) are/is in sliding fit with the sliding grooves (111), and the other ends of the first fork shearing frame (43) and the second fork shearing frame (44) are rotationally connected with the main plate (30).

10. The adjustable heat dissipation structure for internal circuit boards of electronic products according to any one of claims 1, 8 and 9, wherein the height adjustment assembly (40) is provided in plurality, and the height adjustment assemblies (40) are arranged at intervals between the edge of the main board (30) and the enclosure (11).