TW201351583A - Phase change type heat dissipating device - Google Patents
Phase change type heat dissipating device Download PDFInfo
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- TW201351583A TW201351583A TW101120758A TW101120758A TW201351583A TW 201351583 A TW201351583 A TW 201351583A TW 101120758 A TW101120758 A TW 101120758A TW 101120758 A TW101120758 A TW 101120758A TW 201351583 A TW201351583 A TW 201351583A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明涉及一種散熱裝置,尤其涉及一種運用相變化原理散發電子元件所產生熱量的散熱裝置。The invention relates to a heat dissipating device, in particular to a heat dissipating device for dissipating heat generated by an electronic component by using a phase change principle.
近年來電子技術迅速發展,電子元件的高頻、高速運行以及積體電路的密集及微型化,使得電子元件在工作過程中持續產生熱量,因此需要在電子元件處貼附一散熱裝置,將電子元件工作時所產生的熱量帶走,以確保電子元件能穩定運轉。In recent years, electronic technology has developed rapidly. The high-frequency, high-speed operation of electronic components and the intensive and miniaturization of integrated circuits have caused electronic components to continuously generate heat during operation. Therefore, it is necessary to attach a heat sink to the electronic components to The heat generated by the components is taken away to ensure stable operation of the electronic components.
傳統的散熱方式係在發熱電子元件上方設置一金屬材質的散熱器,該散熱器具有基座,基座下表面與電子元件接觸,而其上表面則設有複數散熱鰭片,基座吸收電子元件產生的熱量並傳遞給散熱鰭片,藉由鰭片將熱量散發至周圍空氣中。但針對一些間歇性高負荷運行的電子裝置,其高負荷運行的時間較短,而其待機或低負荷運行的時間相對較長,因此,該種電子裝置高負荷運行時發熱元件產生的熱量會在短時間內經由散熱鰭片傳至電子裝置外殼體內的空氣中,從而導致外殼體的溫度在短時間內過高,使得工作人員操作時會產生不適感;而待機或低負荷運行時,發熱元件產生熱量較少而並不會導致外殼體溫度升高,此時散熱鰭片又得不到充分的利用。故,需進一步改進。The conventional heat dissipation method is to provide a metal heat sink above the heat-generating electronic component, the heat sink has a base, the lower surface of the base is in contact with the electronic component, and the upper surface is provided with a plurality of heat-dissipating fins, and the base absorbs the electrons. The heat generated by the component is transferred to the heat sink fins, which dissipate heat into the surrounding air. However, for some intermittent high-load operation electronic devices, the high-load operation time is short, and the standby or low-load operation time is relatively long. Therefore, the heat generated by the heating elements during the high-load operation of the electronic device will be It is transmitted to the air in the outer casing of the electronic device through the heat dissipation fins in a short time, so that the temperature of the outer casing is too high in a short time, so that the staff can feel uncomfortable during operation; and the heat is generated during standby or low load operation. The component generates less heat and does not cause the temperature of the outer casing to rise, and the heat sink fins are not fully utilized. Therefore, further improvement is needed.
本發明旨在提供一種避免電子裝置高負荷運作時外殼體溫度過高、且在電子裝置低負荷運作時利用效率較高的相變化散熱裝置。The invention aims to provide a phase change heat dissipating device which avoids excessive temperature of the outer casing when the electronic device is operated under high load and has high utilization efficiency when the electronic device operates under low load.
一種相變化散熱裝置,用以對發熱元件散熱,其包括一腔體及設置於所述腔體內的工作介質,所述工作介質為在常溫呈現固態的相變化絕緣物質,所述腔體收容所述發熱元件。A phase change heat dissipating device for dissipating heat to a heat generating component, comprising a cavity and a working medium disposed in the cavity, the working medium being a phase change insulating substance exhibiting a solid state at a normal temperature, the cavity housing The heating element is described.
與現有技術相比,本發明中相變化散熱裝置的腔體罩設收容所述發熱元件,且該腔體內的工作介質為在常溫下呈現固態的相變化物質。高負荷運行時,發熱元件產生的熱量會先被轉移至該工作介質,促使該工作介質液化以暫態儲熱,減緩熱量由電子裝置內部傳導至外部殼體的速度,使得發熱元件表面維持在較低的範圍內的同時,避免電子裝置外部殼體的溫度升高過快;當發熱元件待機或低負荷運行時,工作介質逐漸降溫釋放熱量,工作介質繼續進行熱量的傳遞與交換,利用效率較高。Compared with the prior art, the cavity of the phase change heat dissipating device of the present invention covers the heat generating component, and the working medium in the cavity is a phase change substance which exhibits solid state at normal temperature. During high-load operation, the heat generated by the heating element is first transferred to the working medium, causing the working medium to liquefy to temporarily store heat, slowing the conduction of heat from the inside of the electronic device to the outer casing, so that the surface of the heating element is maintained at In the lower range, the temperature of the outer casing of the electronic device is prevented from rising too fast; when the heating element is in standby or low-load operation, the working medium gradually cools down to release heat, and the working medium continues to transfer and exchange heat, and the utilization efficiency is utilized. Higher.
以下將結合附圖對本發明的相變化散熱裝置作進一步的詳細說明。The phase change heat sink of the present invention will be further described in detail below with reference to the accompanying drawings.
請同時參閱圖1至圖3,本發明一較優實施例的相變化散熱裝置10,用於對電子裝置(圖未示)內的發熱元件20進行散熱,其包括一上蓋11、與該上蓋11相對的一下蓋12及設置於該上蓋11和下蓋12之間的工作介質30。Referring to FIG. 1 to FIG. 3, a phase change heat dissipation device 10 according to a preferred embodiment of the present invention is configured to dissipate heat from a heat generating component 20 in an electronic device (not shown), and includes an upper cover 11 and the upper cover. 11 opposite lower cover 12 and working medium 30 disposed between the upper cover 11 and the lower cover 12.
具體的,該上蓋11與下蓋12大體呈平板狀,且該上蓋11尺寸略大於下蓋12尺寸,所述下蓋12周緣向上延伸形成側壁13,側壁13上緣向外側彎折形成側壁上端131。該上蓋11邊緣抵觸該側壁上端131而與該下蓋12配合形成密封的腔體14。所述上蓋11、下蓋12及側壁13均採用傳導性較佳的材料,如鋁、銅等金屬製成。可以理解的,所述上蓋11、下蓋12可為電子裝置的外部殼體或者電子裝置內部的其他元件(圖未示)的板體。Specifically, the upper cover 11 and the lower cover 12 are substantially in the shape of a flat plate, and the upper cover 11 is slightly larger in size than the lower cover 12. The peripheral edge of the lower cover 12 extends upward to form a side wall 13 , and the upper edge of the side wall 13 is bent outward to form a side wall. Upper end 131. The edge of the upper cover 11 abuts against the upper end 131 of the side wall to cooperate with the lower cover 12 to form a sealed cavity 14. The upper cover 11, the lower cover 12 and the side wall 13 are made of a material having better conductivity, such as aluminum or copper. It can be understood that the upper cover 11 and the lower cover 12 can be an outer casing of an electronic device or a plate of other components (not shown) inside the electronic device.
該工作介質30設置於該腔體14中,該工作介質30為在常溫下呈現固態的絕緣物質,其可在一定的溫度環境下液化成液體,該工作介質30為相變化材料,其熔點介於發熱元件20待機/低負荷運行時的表面溫度和發熱元件20高負荷運行時所能承受的最高溫度之間,如結晶水合鹽類、有機酸或酯類等。The working medium 30 is disposed in the cavity 14. The working medium 30 is an insulating material that exhibits a solid state at a normal temperature, and can be liquefied into a liquid under a certain temperature environment. The working medium 30 is a phase change material, and the melting point thereof The surface temperature of the heating element 20 during standby/low-load operation and the maximum temperature that the heating element 20 can withstand during high-load operation, such as crystalline hydrated salts, organic acids or esters, and the like.
工作時,所述發熱元件20藉由印刷電路板或導線與電子裝置內的其他元件形成電性連接,該腔體14罩設收容所述發熱元件20,本實施例中,該發熱元件20位於該下蓋12上。工作時,發熱元件20產生熱量並將熱量快速轉移至工作介質30,靠近發熱元件20的工作介質30由於距離熱源最近而逐漸受熱液化、繼而產生熱對流使得相對遠離發熱元件20、鄰近腔體14內壁的工作介質30也逐漸受熱液化,最終當所有工作介質30均變為液態時,熱量才能傳遞至腔體14的內壁,從而達成暫態儲熱的效果,減緩熱量由電子裝置內部傳導至外部殼體的速度,保證發熱元件20的表面維持在較低的溫度範圍內的同時,避免電子裝置外部殼體的溫度升高過快,而降低工作人員操作時的不適感。當電子裝置待機或者低負荷運作而使得發熱元件20的發熱能力小於外部殼體向外界的散熱能力時,工作介質30逐漸降溫釋放熱量,從而逐漸固化至固態以備進行下一次的暫態儲熱,以達迴圈利用。上述高負荷運作以及待機/低負荷運行的過程中,工作介質30都在進行熱量的傳遞與交換,作為散熱介質,該工作介質30的利用效率較高。由於工作介質30的絕緣性,其在促使發熱元件20表面溫度均勻降低的同時並不會影響該發熱元件20的工作特性。In operation, the heating element 20 is electrically connected to other components in the electronic device by a printed circuit board or a wire, and the cavity 14 is configured to receive the heating element 20. In the embodiment, the heating element 20 is located. The lower cover 12 is on. In operation, the heating element 20 generates heat and rapidly transfers heat to the working medium 30. The working medium 30 near the heating element 20 is gradually liquefied due to being closest to the heat source, and then generates heat convection so as to be relatively far from the heating element 20, adjacent to the cavity 14. The working medium 30 of the inner wall is also gradually liquefied. Finally, when all the working medium 30 becomes liquid, heat can be transferred to the inner wall of the cavity 14, thereby achieving the effect of transient heat storage, and the heat is relieved from being conducted inside the electronic device. The speed to the outer casing ensures that the surface of the heat generating component 20 is maintained in a relatively low temperature range, and the temperature rise of the outer casing of the electronic device is prevented from being excessively fast, thereby reducing the discomfort of the worker during operation. When the electronic device is in standby or low-load operation, so that the heating capability of the heating element 20 is less than the heat dissipation capability of the external casing to the outside, the working medium 30 gradually cools down and releases heat, thereby gradually solidifying to the solid state for the next transient heat storage. To use the loop. During the above-mentioned high-load operation and standby/low-load operation, the working medium 30 is performing heat transfer and exchange, and the working medium 30 is used as a heat dissipating medium with high efficiency. Due to the insulation of the working medium 30, it does not affect the operational characteristics of the heat generating element 20 while causing the surface temperature of the heat generating element 20 to be uniformly lowered.
可以理解的,當發熱元件20配備電路板(圖未示)時,所述電路板可收容於該腔體14內。上述上蓋11、下蓋12並不限於平板狀,也可為其他形狀,如三棱柱狀等。該工作介質30的形狀可根據形成腔體14的形狀進行相應改變,只要達到收容於該腔體14即可。It can be understood that when the heating element 20 is equipped with a circuit board (not shown), the circuit board can be received in the cavity 14. The upper cover 11 and the lower cover 12 are not limited to a flat plate shape, and may have other shapes such as a triangular prism shape. The shape of the working medium 30 can be changed according to the shape of the forming cavity 14 as long as it is accommodated in the cavity 14.
與現有技術相比,本發明中相變化散熱裝置10的腔體14收容所述發熱元件20,且該腔體14內的工作介質30為在常溫下呈現固態的相變化絕緣物質。因此,該工作介質30可直接與發熱元件20接觸,高負荷運行時,發熱元件20產生的熱量會先被直接轉移至該工作介質30,促使該工作介質30液化以暫態儲熱,減緩熱量由電子裝置內部傳導至外部殼體的速度,使得發熱元件20表面維持在較低的範圍內的同時,避免電子裝置外部殼體的溫度升高過快;當發熱元件20待機或低負荷運行時,工作介質30逐漸降溫釋放熱量,工作介質30繼續進行熱量的傳遞與交換,利用效率較高。Compared with the prior art, the cavity 14 of the phase change heat dissipation device 10 of the present invention accommodates the heat generating component 20, and the working medium 30 in the cavity 14 is a phase change insulating material which exhibits a solid state at normal temperature. Therefore, the working medium 30 can be directly in contact with the heating element 20. During high-load operation, the heat generated by the heating element 20 is directly transferred to the working medium 30, causing the working medium 30 to be liquefied to temporarily store heat and reduce heat. The speed of conduction from the inside of the electronic device to the outer casing is such that the surface of the heating element 20 is maintained in a lower range while avoiding excessive temperature rise of the outer casing of the electronic device; when the heating element 20 is in standby or under low load operation The working medium 30 gradually cools down to release heat, and the working medium 30 continues to transfer and exchange heat, and the utilization efficiency is high.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10...相變化散熱裝置10. . . Phase change heat sink
20...發熱元件20. . . Heating element
11...上蓋11. . . Upper cover
12...下蓋12. . . lower lid
13...側壁13. . . Side wall
131...側壁上端131. . . Upper end of side wall
14...腔體14. . . Cavity
30...工作介質30. . . Working medium
圖1為本發明一實施例的相變化散熱裝置的立體示意圖。1 is a perspective view of a phase change heat sink according to an embodiment of the invention.
圖2至圖1所示相變化散熱裝置的分解示意圖。2 to 1 is an exploded perspective view of the phase change heat sink.
圖3為圖1所示相變化散熱裝置的剖面示意圖。3 is a schematic cross-sectional view of the phase change heat sink of FIG. 1.
20...發熱元件20. . . Heating element
11...上蓋11. . . Upper cover
12...下蓋12. . . lower lid
13...側壁13. . . Side wall
131...側壁上端131. . . Upper end of side wall
14...腔體14. . . Cavity
30...工作介質30. . . Working medium
Claims (7)
Priority Applications (3)
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TW101120758A TWI492341B (en) | 2012-06-08 | 2012-06-08 | Phase change type heat dissipating device |
US13/631,767 US20130327501A1 (en) | 2012-06-08 | 2012-09-28 | Phase change type heat dissipating device |
JP2013117605A JP2013258404A (en) | 2012-06-08 | 2013-06-04 | Phase change heat radiator |
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TW101120758A TWI492341B (en) | 2012-06-08 | 2012-06-08 | Phase change type heat dissipating device |
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TWI492341B TWI492341B (en) | 2015-07-11 |
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TWI483099B (en) * | 2012-06-08 | 2015-05-01 | Foxconn Tech Co Ltd | Phase change type heat dissipating device |
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US20090109623A1 (en) * | 2007-10-31 | 2009-04-30 | Forcecon Technology Co., Ltd. | Heat-radiating module with composite phase-change heat-radiating efficiency |
TW201029557A (en) * | 2009-01-22 | 2010-08-01 | Foxconn Tech Co Ltd | Heat dissipation device |
JP2012099612A (en) * | 2010-11-01 | 2012-05-24 | Denso Corp | Semiconductor device |
KR101800437B1 (en) * | 2011-05-02 | 2017-11-22 | 삼성전자주식회사 | Semiconductor Package |
-
2012
- 2012-06-08 TW TW101120758A patent/TWI492341B/en not_active IP Right Cessation
- 2012-09-28 US US13/631,767 patent/US20130327501A1/en not_active Abandoned
-
2013
- 2013-06-04 JP JP2013117605A patent/JP2013258404A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI744195B (en) * | 2021-02-24 | 2021-10-21 | 創意電子股份有限公司 | Thermal peak suppression device |
Also Published As
Publication number | Publication date |
---|---|
TWI492341B (en) | 2015-07-11 |
JP2013258404A (en) | 2013-12-26 |
US20130327501A1 (en) | 2013-12-12 |
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