201029557 六、發明說明： ' 【發明所屬之技術領域】 - 本發明涉及一種散熱器，特別涉及一種用於為電 子元件進行散熱之相變化散熱器。 【先前技術】 電子元件在運行過程中通常產生大量之熱量為 確保電子元件正常運行，該等熱量f要及時散熱出 ❿ 去，該電子元件上通常加裝一散熱器為其散熱。、該 散熱器通常包括一吸熱板及設置於該吸熱板上之散 熱鰭片。該吸熱板由銅、鋁等熱傳導性良好之金^ 材料製成，但金屬板受制於材料本身有限之数傳導 性’若對高發熱量之電子元件，會產生明顯I熱阻 而無法達到良好散熱，影響電子元件之運行穩定性。 A提升散熱器之效率，業界亦採用在吸熱板内設 置-腔體’該腔體内密封有水、乙醇等工作流體， 利用工作流體之相變化來提高傳熱速度。工作時， 作"U·體在吸熱板之吸熱區吸熱氣化到達吸熱板之 放熱區’而後冷卻液化。為使液化後之工作流體能 更决回"比至吸熱板之吸熱區，該吸熱板於腔體周邊 設置-種毛細結構。毛細結構—般分為粉末燒結毛 =結構、網線毛細結構、溝槽毛細結構三種。液化 ，之，流體在毛細結構流至吸熱區參與相變 循衣j而，在使用之過程中，該散熱器之吸熱 201029557 板在受到來自外部和内部之壓力作用容易出現產品 變形，甚至導致吸熱板内之毛細結構脫落，嚴重影 - 響了散熱器之散熱效率和穩定性。 【發明内容】 ~ 有鑒於此’實有必要提供一種結構穩固之相變化 散熱器。 一種散熱器，包括一吸熱板、與該吸熱板結合之 ❹ 一放熱板、貼附在該放熱板上之一第一毛細結構層 及貼附在吸熱板上之一第二毛細結構層，該吸熱板 與放熱板之間形成一腔體，該腔體内填充有工作流 體，該第一、二毛細結構層位於該腔體内，該吸熱 板和放熱板之間設置有一支撐體，該支樓體在腔體 内呈起伏之波浪狀排布並支撐該第一毛細結構層和 第二毛細結構層。 與習知技術相比’本發明散熱器内設置有支撐 ❹ 體，該支撐體位於吸熱板和放熱板之間且連通第一 毛細結構層及第二毛細結構層’能夠對其兩側之二 毛細結構層、吸熱板及放熱板提供有力之支撐，防 止散熱器在内、外力之作用下發生變形。 【實施方式】 如圖1及圖2所示’本發明一實施例散熱器包括 一吸熱板10、與該吸熱板10結合之一放熱板20、 設置在放熱板20内之一第一毛細結構層3〇、設置在 4 201029557 吸熱板10頂部之一第二毛細結構層40及夾置在第 — 一、二毛細結構層30、40間之一支撐體50。 • 請同時參照圖4及圖5，該放熱板20包括一容 槽22及從容槽22底部周緣向外一體延伸之折邊 24。該容槽22具有一矩形蓋板222及從該蓋板222 四周緣向下垂直延伸之首尾連接之四侧壁224。上述 吸熱板10之周緣密封貼置該折邊24，從而在吸熱板 10與放熱板20之間形成一密閉之腔體26。該腔體 攀 26内填充有一定量之工作流體（未標號）。 該第一毛細結構層30包括一本體部32及從該本 體部32四周緣垂直向下延伸之首尾連接之四侧部 34。該第一毛細結構層30之本體部32貼設在上述 容槽22之蓋板222内侧。該第一毛細結構層30由 金屬粉末燒結而成，可以理解地，該第一毛細結構 層30也可由金屬網線編制而成。 該第二毛細結構層40包括一本體部42及從該本 體部42四周緣垂直向上延伸之首尾連接之四侧部 44。該第二毛細結構層40之本體部42貼設在上述 吸熱板頂部對應該腔體26部分，該第二毛細結構層 40之四侧部44外侧與上述容槽22之四侧壁224内 側相貼設，該第二毛細結構層40之四侧部44之内 側則與第一毛細結構層30之四側部34之外側相貼 設，從而使該第二毛細結構層40與上述第一毛細結 5 201029557 構層30相連通且第一毛細結構層30容置在第二毛 _ 細結構層40内，工作流體可以從第一毛細結構層30 • 回流入第二毛細結構層40。可以理解地，該第一毛 細結構層30與第二毛細結構層40可以一體形成。 在本實施例中，該第二毛細結構層40由金屬網線編 制而成，可以理解地，該第二毛細結構層40也可由 金屬粉末燒結而成或由在該吸熱板10頂部及上述放 熱板20容槽22之四側壁224内側上刻溝槽形成。 ® 本發明中，第一毛細結構層30可與第二毛細結構層 40相同，也可不同。 請同時參照圖3，上述支撐體50置於上述腔體 26内並夾置在第一、二毛細結構層30、40之間。該 支撐體50由一板體一體加工形成，其具有一定強 度，以對其兩側之二毛細結構層30、40、吸熱板10 及放熱板20提供有力之支撐，防止散熱器在内、外 ⑩ 力之作用下變形。該支撐體50在上述腔體26内大 致呈連續起伏之波浪狀排布。該支撐體50包括與第 一毛細結構層30相抵壓之複數上抵靠部52、與第二 毛細結構層40相抵壓之複數下抵靠部54及連接該 上、下抵靠部52、54之複數連接部56。所有上抵靠 部52都處於同一水平面上，以與第一毛細結構層30 之本體部32充分接觸；所有之下抵靠部54都處於 同一水平面上，以與第二毛細結構層40之本體部42 充分接觸。上述複數連接部56將腔體26分隔成複 6 201029557 數相互間隔之腔室260。每一上抵靠部52或下抵靠 ' 部54與其兩端之連接部56之橫截面為梯形。每一 - 連接部56上開設複數間隔排列之矩形孔560，以連 通各腔室260且為氣態之工作流體向放熱板20流動 提供通路。 使用時，散熱器之吸熱板10緊貼熱源（圖未示） 吸熱，腔體26内之工作流體從該吸熱板10吸熱氣 赢 化為蒸汽而上升穿過支撐體50之矩形孔560到達上201029557 VI. Description of the invention: 'Technical field to which the invention pertains» The present invention relates to a heat sink, and more particularly to a phase change heat sink for dissipating heat for an electronic component. [Prior Art] Electronic components usually generate a large amount of heat during operation. In order to ensure the normal operation of the electronic components, the heat is dissipated in time, and a heat sink is usually added to the electronic components for heat dissipation. The heat sink usually includes a heat absorbing plate and a heat radiating fin disposed on the heat absorbing plate. The heat absorbing plate is made of a metal material having good thermal conductivity such as copper or aluminum, but the metal plate is subject to a limited number of conductivity of the material itself. If the electronic component with high heat generation has a significant I heat resistance, it cannot achieve good heat dissipation. , affect the operational stability of electronic components. A. The efficiency of the heat sink is improved. The industry also uses a cavity in the heat absorbing plate. The cavity is sealed with working fluids such as water and ethanol, and the phase change of the working fluid is used to increase the heat transfer rate. During operation, the "U body absorbs heat in the endothermic zone of the heat absorbing plate and reaches the heat release zone of the heat absorbing plate' and then liquefies. In order to make the working fluid after liquefaction more responsive to the heat absorbing zone of the heat absorbing plate, the heat absorbing plate is provided with a capillary structure around the cavity. The capillary structure is generally divided into powder sintered wool = structure, mesh capillary structure, and groove capillary structure. Liquefaction, the fluid flows into the heat absorption zone in the capillary structure and participates in the phase change process. In the process of use, the heat absorption of the heat sink 201029557 plate is subject to pressure from the outside and the inside, which is prone to product deformation and even heat absorption. The capillary structure inside the board falls off, which seriously affects the heat dissipation efficiency and stability of the heat sink. SUMMARY OF THE INVENTION ~ In view of this, it is necessary to provide a structurally stable phase change heat sink. A heat sink comprising a heat absorbing plate, a heat releasing plate combined with the heat absorbing plate, a first capillary structure layer attached to the heat releasing plate, and a second capillary structure layer attached to the heat absorbing plate, Forming a cavity between the heat absorbing plate and the heat releasing plate, the cavity is filled with a working fluid, the first and second capillary structure layers are located in the cavity, and a support body is disposed between the heat absorbing plate and the heat releasing plate, the branch The floor body is undulatingly arranged in the cavity and supports the first capillary structure layer and the second capillary structure layer. Compared with the prior art, the heat sink of the present invention is provided with a supporting body which is located between the heat absorbing plate and the heat releasing plate and communicates with the first capillary structure layer and the second capillary structure layer The capillary structure layer, the heat absorbing plate and the heat release plate provide strong support to prevent deformation of the heat sink under the action of internal and external forces. [Embodiment] As shown in FIG. 1 and FIG. 2, a heat sink according to an embodiment of the present invention includes a heat absorbing plate 10, a heat releasing plate 20 combined with the heat absorbing plate 10, and a first capillary structure disposed in the heat releasing plate 20. The layer 3 is disposed on the top of the 4 201029557 heat absorbing plate 10 as a second capillary structure layer 40 and a support body 50 interposed between the first and second capillary structure layers 30 and 40. • Referring to Figures 4 and 5 simultaneously, the heat release plate 20 includes a recess 22 and a flange 24 extending integrally outwardly from the bottom periphery of the recess 22. The receptacle 22 has a rectangular cover plate 222 and four side walls 224 extending vertically downward from the peripheral edge of the cover plate 222. The periphery of the heat absorbing plate 10 is sealed to the flange 24 to form a sealed cavity 26 between the heat absorbing plate 10 and the heat releasing plate 20. The chamber 26 is filled with a quantity of working fluid (not labeled). The first capillary structure layer 30 includes a body portion 32 and four side portions 34 that extend vertically downward from the peripheral edge of the body portion 32. The body portion 32 of the first capillary structure layer 30 is attached to the inside of the cover plate 222 of the above-mentioned pocket 22. The first capillary structure layer 30 is formed by sintering a metal powder. It will be understood that the first capillary structure layer 30 can also be formed from a metal mesh. The second capillary structure layer 40 includes a body portion 42 and four side portions 44 extending vertically upward from the peripheral edge of the body portion 42. The body portion 42 of the second capillary structure layer 40 is attached to the top of the heat absorbing plate corresponding to the cavity portion 26, and the outer side of the four side portions 44 of the second capillary structure layer 40 and the inner side of the four side walls 224 of the cavity 22 The inner side of the four side portions 44 of the second capillary structure layer 40 is disposed on the outer side of the four side portions 34 of the first capillary structure layer 30, so that the second capillary structure layer 40 and the first capillary layer Junction 5 201029557 The formation 30 is in communication and the first capillary structure layer 30 is received within the second capillary structure layer 40, and the working fluid can flow back from the first capillary structure layer 30 into the second capillary structure layer 40. It can be understood that the first capillary structure layer 30 and the second capillary structure layer 40 can be integrally formed. In this embodiment, the second capillary structure layer 40 is made of a metal mesh wire. It can be understood that the second capillary structure layer 40 can also be sintered from metal powder or from the top of the heat absorption plate 10 and the above heat release. A groove is formed on the inner side of the four side walls 224 of the groove 20 of the plate 20. In the present invention, the first capillary structure layer 30 may be the same as or different from the second capillary structure layer 40. Referring to Fig. 3 at the same time, the support body 50 is placed in the cavity 26 and interposed between the first and second capillary structure layers 30, 40. The support body 50 is integrally formed by a plate body, and has a certain strength to provide strong support for the two capillary structure layers 30, 40, the heat absorbing plate 10 and the heat release plate 20 on both sides, preventing the heat sink from being inside and outside. 10 deformation under the action of force. The support body 50 is arranged in a continuous undulating wave shape in the cavity 26. The support body 50 includes a plurality of upper abutting portions 52 that are pressed against the first capillary structure layer 30, a plurality of lower abutting portions 54 that are pressed against the second capillary structure layer 40, and connects the upper and lower abutting portions 52 and 54. The plurality of connecting portions 56. All of the upper abutting portions 52 are on the same horizontal surface to be in full contact with the body portion 32 of the first capillary structure layer 30; all of the lower abutting portions 54 are on the same horizontal surface to be in contact with the body of the second capillary structure layer 40. Part 42 is in full contact. The plurality of connecting portions 56 divide the cavity 26 into a plurality of chambers 260 that are spaced apart from each other. The cross section of each of the upper abutment portion 52 or the lower abutment portion 54 and its both ends is trapezoidal. A plurality of rectangular holes 560 are formed in each of the connecting portions 56 to communicate with each of the chambers 260 and provide a passage for the gaseous working fluid to flow to the heat radiating plate 20. In use, the heat absorbing plate 10 of the heat sink is in close contact with the heat source (not shown), and the working fluid in the cavity 26 is heated from the heat absorbing plate 10 to the steam and rises through the rectangular hole 560 of the support body 50.
W 述放熱板20容槽22之蓋板222,氣態之工作流體在 該蓋板222處遇冷放出熱量而冷卻為液態，該熱量 進而傳遞至蓋板222外散發出去。液態之工作流體 藉由第一毛細結構層30、第二毛細結構層40流回吸 熱板10進行相變化循環。 與習知技術相比，本發明散熱器内設置有支撐體 50，該支撐體50位於吸熱板10和放熱板20之蓋板 © 222之間且連通第一毛細結構層30及第二毛細結構 層40，能夠對其兩侧之二毛細結構層30、40、吸熱 板10及放熱板20提供有力之支撐，防止散熱器在 内、外力之作用下發生變形。另外，該支撐體50上 設置之複數矩形孔560可供從吸熱板10吸熱氣化之 工作流體穿過到達放熱板20之蓋板222，從而保證 了工作流體相變化循環之順利進行。 綜上所述，本發明確已符合發明專利之要件，遂 7 201029557 依法提出專利申請。惟，以上所述者僅為本發明之 較佳實施方式，自不能以此限制本案之申請專利範 圍。舉凡熟悉本案技藝之人士援依本發明之精神所 作之等效修飾或變化，皆應涵蓋於以下申請專利範 圍内。 【圖式簡單說明】 圖1係本發明一實施例散熱器之立體組裝圖。 圖2係圖1中散熱器之立體分解圖。 圖3係圖2中支撐體之放大圖。 圖4係圖1中散熱器沿IV -IV線之剖視圖。 圖5係圖4中圈V部分之放大示意圖。 【主要元件符號說明】 吸熱板 10 放熱板 20 容槽 22 ' 蓋板 222 側壁 224 折邊 24 腔體 26 腔室 260 第一毛細結構層 30 本體部 32 側部 34 第二毛細結構層40 本體部 42 側部 44 支撐體 50 上抵靠部 52 下抵靠部 54 連接部 56 孔 560 8The cover plate 222 of the heat sink 20 receiving groove 22, the gaseous working fluid is cooled by the heat released from the cover plate 222 and cooled to a liquid state, and the heat is further transmitted to the outside of the cover plate 222 to be dissipated. The liquid working fluid flows back to the heat absorbing plate 10 through the first capillary structure layer 30 and the second capillary structure layer 40 to perform a phase change cycle. Compared with the prior art, the heat sink of the present invention is provided with a support body 50 located between the heat absorbing plate 10 and the cover plate 222 of the heat release plate 20 and communicating with the first capillary structure layer 30 and the second capillary structure. The layer 40 can provide strong support for the two capillary structure layers 30, 40, the heat absorbing plate 10 and the heat release plate 20 on both sides, and prevent the heat sink from being deformed by the internal and external forces. In addition, the plurality of rectangular holes 560 disposed on the support body 50 allow the working fluid that absorbs heat and vaporization from the heat absorbing plate 10 to pass through the cover plate 222 of the heat release plate 20, thereby ensuring smooth progress of the working fluid phase change cycle. In summary, the present invention has indeed met the requirements of the invention patent, and 遂 7 201029557 filed a patent application according to law. However, the above is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by those skilled in the art to the spirit of the invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective assembled view of a heat sink according to an embodiment of the present invention. 2 is an exploded perspective view of the heat sink of FIG. 1. Figure 3 is an enlarged view of the support of Figure 2. Figure 4 is a cross-sectional view of the heat sink of Figure 1 taken along line IV-IV. Fig. 5 is an enlarged schematic view showing a portion V of the circle in Fig. 4. [Main component symbol description] Heat absorbing plate 10 Heat release plate 20 Cuvette 22 ' Cover plate 222 Side wall 224 Folding 24 Cavity 26 Chamber 260 First capillary structure layer 30 Body portion 32 Side portion 34 Second capillary structure layer 40 Body portion 42 Side 44 Support 50 Upper abutment 52 Lower abutment 54 Connection 56 Hole 560 8