M413159 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關一種散熱元件，特別是關於一種具支 撐結構之均熱板。 【先前技術】 [0002] 現代的科技月新日新、發展迅速，科技研發設計之M413159 V. New description: [New technical field] [0001] This paper is about a heat dissipating component, especially a soaking plate with a supporting structure. [Prior Art] [0002] Modern technology is new and rapid, and its technology is developing and designing.
電子元件轉向輕量化、薄型化、微型化及功能取向，使 其單位面積的發熱密度也愈來愈高，且因電子元件設計 之不同，使電子元件表面聚熱量分佈不均，造成局部溫 度過高現象，因此散熱效率成為決定電子產品之使用壽 命及穩定性重要因素。 [0003] 故，業者選用一種現今能被大量應用之電子元件均The electronic components turn to light weight, thinning, miniaturization and functional orientation, so that the heat density per unit area is also higher and higher, and due to the difference in electronic component design, the heat distribution on the surface of the electronic components is uneven, resulting in local temperature over temperature. High phenomenon, so heat dissipation efficiency is an important factor in determining the service life and stability of electronic products. [0003] Therefore, the industry chooses an electronic component that can be widely used today.
溫板，該均溫板主要將一殼體内部鋪設毛細組織，於内 填充工作流體，並於殼體内鋪設波浪片，該波浪片波峰 波谷間係分別開設有穿孔，工作流體係流經間隔通道及 穿孔，以提升均溫板之熱傳導效率；然而，該均溫板熱 傳導效率仍不甚理想，且鋪設多層結構，如上、下層毛 細組織及波浪片等，相對增加生產成本及組裝時間，若 能針對上述之缺失提出一種具支撐結構之均熱板，相信 更具經濟效益，也適合大量生產。 [0004] 有鑑於此，本創作係針對上述之問題，提出一種具 支撐結構之均熱板，以克服習知缺點。 【新型内容】 [0005] 本創作之主要目的，係在提供一種具支撐結構之均 表單編號A0101 第3頁/共15頁 M413159 熱板，透過具多孔隙之支撐結構利於水分子達到二相流（ 液態、氣態）變化傳輸，與植物物理待性透過呼吸原理及 氣體在有限空間與環境造成氣漩，形成龍捲風氣旋進而 快速汽化流動原理，利用液態將熱飽和吸收，氣態快速 熱傳導之二相物理現象，有效利用腔體内之傳導作業達 到最佳功能，進而快速將電子元件產生之熱能均勻傳送 至第一板體及第二板體。 [0006] 本創作之另一目的，係在腔體内之支撐結構連結第 一 '第二板體，透過支撐結構發揮熱傳導連接功效，由 左至右，從上到下，任一方向皆可。 [0007] 本創作之再一目的，係在提供一種具支撐結構之均 熱板，其係具有構造簡單、適合大量生產、符合經濟效 益及熱傳導迅速之優點。 [0008] 為達上述之目的，本創作為一種具支撐結構之均熱 板，用於電子元件之散熱，其係具有一第一及一第二板 體連結形成一密閉之腔體，腔體内灌注有流體，第一板 體之内側表面及第二板體之内壁將金屬銅粉末利用高壓 空氣噴灑方式，使其分別被覆一層金屬薄膜層，金屬薄 膜層進一步燒結形成一種毛細結構，及設置於腔體内之 流體與複數個由銅金屬粉末冶金擠壓燒結成型之具多孔 隙之支撐結構，並做頂接與支撐第一與第二板體。 【實施<方式】 為使本創作之上述和其他目的、特徵及功效能更明 顯易懂，茲藉由下述具體之實施例，並配合所附之圖式 表單编號A0101 第4頁/共15頁 [0009] ’對本創作做一詳細說明如下。 請參閱第1至第3圖所示，本創作為一種具支樓結構 之均熱板10，均熱板10包含—第一板體丨丨及一第二板體 12，第二板體12設有一容置空間丨21，其容置空間121之 —側邊設有一填充孔122，第一板體η之内側表面與第二 板體12容置空間121之内壁各別設有一金屬薄膜層2〇，其 容置空間121設置有複數具多孔隙之支撐結構4〇。 第一板體11及第二板體12係為高導熱銅金屬材質， 其中，容置空間121係由第二板體丨2藉沖壓形成；金屬薄 膜層20係由金屬銅粉末藉由高壓空氣分別喷灑至第一板 體11之内側表面與第二板體之容置空間121内壁而成，再 經由時間5〜60分鐘、溫度為6〇〇〜850度燒結，使金屬薄 膜層2 0分別在第一板體11之内側表面及容置空間i 2丨内壁 形成毛細結構》 接續請參閱第4圖所示，支撐結構4〇藉由粉末冶金與 沖壓設備擠壓成一銅粉柱體，在經燒結後銅粉柱體成形 為具多孔隙結構41，因多孔隙結構41(稱砂孔）如毛細般 ，以利水分子來達到二相流功能（液態、氣態），使支撐 結構4 0能達到均熱板1 〇内極佳的傳導功能。 支撐結構40排列置放於容置空間121内作為頂接、支 撐第一板體11及第二板體12 ,接續將第一板體丨丨及第二 板體12相互接合，再經由時間為5~6〇分鐘、溫度為 600~850度燒結、使第一板體U與第二板體12緊密結合 ，並藉由焊接將第一及第二板體U、U結合處作封合固 定’使本創作之均熱板10成型。 請繼續參閱第5-1圖所示，腔體3〇是由第一板體η及 表單編號Α0101 第5頁/共丨5頁 M413159 第二板體12係經由前述燒結、封焊後所共同形成一密閉 之腔體30，腔體30内具有複數支撐結構40用於頂接第一 板體11及第二板體12，而流體50則從填充孔122透過一 注料管（圖中未示）填充入腔體30内，接續再由注料管對 腔體30進行抽真空，使腔體30成為一負壓真空狀態；其 中流體50可為氣體或液體，液體可為純水或超純水。 接續，請再參閱第5-2圖，為本創作均熱板10之剖視 圖，藉此剖視可清楚觀察腔體30内部流體50之作動，均 熱板10接觸熱源的一端為蒸發端10a，另一相對端為冷凝 端10b，假如熱源位於均熱板10下方，流體50因蒸發端 10a吸熱而蒸發成汽態，使飽和蒸汽50a上升，並迅速擴 散至整個冷凝端10b ;冷凝端10b在使用上係與一散熱器（ 圖中未示）接觸，同時吸收冷凝端l〇b之熱能，冷凝端10b 熱能被吸收後會使飽和蒸汽50a再度液化成流體50b，其 流體50b會沿腔體30之内壁與支撐結構40，由左至右，從 上到下，任一方向形成二相流熱傳導，其流體50b藉由二 相流透過植物物理特性呼吸原理與氣體在有限空間及環 境造成氣漩，形成龍捲風氣漩進而快速汽化流動原理， 利用液態將熱飽和吸收及氣態快速熱傳導功能，達到不 斷吸收熱能及散熱之效果。 惟以上所述者，僅為本創作之較佳實施例而已，其 目的在使熟習該項技藝者能夠瞭解本創作之内容而據以 實施，並非用來限定本創作實施之範圍；故舉凡依本創 作申請專利範圍所述之形狀、構造、特徵及精神所為之 均等變化與修飾，均應涵蓋在本創作之申請專利範圍内 表單编號A0101The warming plate mainly lays a capillary structure inside a casing, fills the working fluid therein, and lays a wave piece in the casing, and the wave plate has a perforation between the peaks and valleys, and the working system flows through the interval. Channels and perforations to improve the heat transfer efficiency of the uniform temperature plate; however, the heat transfer efficiency of the temperature equalization plate is still not ideal, and the multi-layer structure, the upper and lower layers of capillary structure and wave sheets, etc., relatively increase the production cost and assembly time, if It is possible to propose a soaking plate with a supporting structure for the above-mentioned lacking, which is believed to be more economical and suitable for mass production. In view of this, the present invention proposes a heat equalizing plate having a supporting structure to overcome the above-mentioned problems in view of the above problems. [New Content] [0005] The main purpose of this creation is to provide a M131159 hot plate with a support structure, Form No. A0101, Page 3/15, through a porous support structure to facilitate the two-phase flow of water molecules. (liquid, gaseous) change transmission, and plant physiology through the principle of breathing and gas in a limited space and environment caused by air vortex, forming a tornado cyclone and then rapid vaporization of the flow principle, the use of liquid to absorb heat, the rapid thermal conduction of two-phase physics The phenomenon effectively utilizes the conduction operation in the cavity to achieve the optimal function, and thus the thermal energy generated by the electronic component is quickly transmitted to the first plate body and the second plate body. [0006] Another object of the present invention is that the support structure in the cavity is coupled to the first 'second plate body, and the heat transfer connection effect is exerted through the support structure, from left to right, from top to bottom, in either direction. . [0007] A further object of the present invention is to provide a heat spreader having a support structure which is simple in construction, suitable for mass production, economical and rapid in heat transfer. [0008] In order to achieve the above purpose, the present invention is a heat-receiving plate with a supporting structure for heat dissipation of electronic components, which has a first and a second plate body connected to form a sealed cavity, a cavity The inner surface of the first plate body and the inner wall of the second plate body are sprayed with high-pressure air by a high-pressure air spray method, and the metal film layer is further sintered to form a capillary structure, and is disposed. The fluid in the cavity is filled with a plurality of porous support structures formed by metallurgical extrusion sintering of copper metal powder, and the first and second plates are topped and supported. [Implementation] In order to make the above and other objects, features and effects of the present invention more comprehensible, the following specific embodiments are used, together with the accompanying drawing form number A0101, page 4 / A total of 15 pages [0009] 'A detailed description of this creation is as follows. Please refer to the first to third figures. The present invention is a heat equalizing plate 10 having a branch structure, and the heat equalizing plate 10 includes a first plate body and a second plate body 12, and the second plate body 12 An accommodating space 丨21 is provided, and a filling hole 122 is defined in a side of the accommodating space 121. The inner surface of the first plate body η and the inner wall of the accommodating space 121 of the second plate body 12 are respectively provided with a metal film layer. 2〇, the accommodating space 121 is provided with a plurality of supporting structures 4 porous. The first plate body 11 and the second plate body 12 are made of a high thermal conductivity copper metal material, wherein the accommodating space 121 is formed by stamping the second plate body 丨 2; the metal film layer 20 is made of metal copper powder by high pressure air. Sprayed to the inner surface of the first plate body 11 and the inner wall of the accommodating space 121 of the second plate body respectively, and then sintered at a temperature of 6 〇〇 to 850 degrees for 5 to 60 minutes to make the metal thin film layer 2 0 A capillary structure is formed on the inner surface of the first plate body 11 and the inner wall of the accommodating space i 2 》 respectively. Referring to FIG. 4, the support structure 4 is extruded into a copper powder cylinder by powder metallurgy and a punching device. After sintering, the copper powder cylinder is formed into a porous structure 41, because the porous structure 41 (called a sand hole) is capillary-like, and the water molecules are used to achieve the two-phase flow function (liquid state, gaseous state), so that the support structure 40 It can achieve excellent conduction function in the uniform plate. The support structure 40 is arranged in the accommodating space 121 to be connected to support the first plate body 11 and the second plate body 12, and then the first plate body 丨丨 and the second plate body 12 are joined to each other, and then the time is 5~6〇 minutes, the temperature is 600~850 degrees, the first plate U and the second plate 12 are tightly combined, and the first and second plates U and U are sealed by welding. 'Make the creation of the so-called hot plate 10. Please continue to refer to Figure 5-1. The cavity 3〇 is the first plate body η and the form number Α0101 page 5/total 5 pages M413159 The second plate body 12 is common through the aforementioned sintering and sealing welding. Forming a closed cavity 30 having a plurality of support structures 40 for abutting the first plate body 11 and the second plate body 12, and the fluid 50 is passed through the filling hole 122 through a injection tube (not shown) Filled into the cavity 30, and then vacuumed the cavity 30 by the injection tube, so that the cavity 30 becomes a vacuum state; wherein the fluid 50 can be a gas or a liquid, and the liquid can be pure water or super Pure water. For the continuation, please refer to FIG. 5-2, which is a cross-sectional view of the heat equalizing plate 10 of the present invention. The cross-sectional view clearly shows the operation of the fluid 50 inside the cavity 30. The end of the heat equalizing plate 10 contacting the heat source is the evaporation end 10a. The other opposite end is the condensation end 10b. If the heat source is located below the heat equalizing plate 10, the fluid 50 evaporates into a vapor state due to the heat absorption of the evaporation end 10a, so that the saturated steam 50a rises and rapidly diffuses to the entire condensation end 10b; the condensation end 10b is The upper system is contacted with a heat sink (not shown) while absorbing the heat energy of the condensation end lb, and the heat energy of the condensation end 10b is absorbed to re-liquefy the saturated steam 50a into the fluid 50b, and the fluid 50b is along the cavity. The inner wall of the 30 and the support structure 40, from left to right, from top to bottom, form two-phase flow heat conduction in either direction, and the fluid 50b is caused by the two-phase flow through the physiological principle of plant physical property and the gas in a limited space and environment. Swirling, forming a tornado vortex and then rapidly vaporizing the flow principle, using the liquid to absorb the heat and the rapid thermal conduction of the gas, to achieve the effect of continuously absorbing heat and heat. However, the above is only the preferred embodiment of the present invention, and the purpose thereof is to enable the skilled person to understand the content of the present invention and implement it, and is not intended to limit the scope of the implementation of the present invention; The changes, modifications, and modifications of the shapes, structures, features, and spirits described in the scope of the patent application should be covered in the scope of the patent application of this creation. Form No. A0101
第6頁/共15頁 M413159 【圖式簡單說明】 [0010] 第1圖：係本創作之立體分解圖。 [0011] 第2圖：係本創作之第一板體藉由高壓空氣噴灑示意圖 〇 [0012] 第3圖：係本創作之第二板體藉由高壓空氣喷灑示意圖 [0013] 第4圖：係本創作之支撐結構立體圖。Page 6 of 15 M413159 [Simple description of the diagram] [0010] Figure 1: An exploded view of the creation. [0011] Figure 2: Schematic diagram of the first plate of the present invention sprayed by high-pressure air [0012] Figure 3: Schematic diagram of the second plate of the present invention sprayed by high-pressure air [0013] Figure 4 : A perspective view of the support structure of this creation.
[0014] 第5-1圖：係本創作之組合立體圖。 [0015] 第5-2圖：係第5-1圖於A-A位置之剖視示意圖。 【主要元件符號說明】 [0016] 均熱板.10 蒸發端.10a [0017] 冷凝端.10b 第一板體.11 [0018] 第二板體.12 容置空間.1 21 [0019] 填充孔.122 金屬薄膜層.2 0 [0020] 腔體.30 支撐結構.40 [0021] 多孔隙結構.41 流體.50 [0022] 飽和蒸汽.5 0 a 流體.5 0 b 表單編號A0101 第7頁/共15頁[0014] Figure 5-1: A combined perspective view of the present creation. [0015] Figure 5-2 is a cross-sectional view of the 5-1th position at the A-A position. [Main component symbol description] [0016] Heat equalizing plate. 10 Evaporating end. 10a [0017] Condensing end. 10b First plate body. 11 [0018] Second plate body. 12 accommodating space. 1 21 [0019] Hole.122 Metal film layer. 2 0 [0020] Cavity. 30 Support structure. 40 [0021] Porous structure. 41 Fluid. 50 [0022] Saturated steam. 5 0 a Fluid. 5 0 b Form No. A0101 No. 7 Page / Total 15 pages