CN101296600A - Radiating assembly and electronic device using the same - Google Patents
Radiating assembly and electronic device using the same Download PDFInfo
- Publication number
- CN101296600A CN101296600A CNA2007101024766A CN200710102476A CN101296600A CN 101296600 A CN101296600 A CN 101296600A CN A2007101024766 A CNA2007101024766 A CN A2007101024766A CN 200710102476 A CN200710102476 A CN 200710102476A CN 101296600 A CN101296600 A CN 101296600A
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- heat pipe
- heat
- pyrotoxin
- radiating
- radiating subassembly
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Abstract
The invention discloses a heat dissipation component and an electronic device using the component. The electronic device comprises a heat generator and the heat dissipation component. The heat dissipation component is used for cooling the heat generator, wherein, the heat dissipation component comprises a first thermotube and a second thermotube. The first thermotube is arranged on the heat generator for conducting the heat source of the heat generator. The second thermotube is arranged on the first thermotube and the heat source is conducted to the second thermotube by the first thermotube.
Description
Technical field
The invention relates to a kind of radiating subassembly and electronic installation thereof, and particularly relevant for a kind of radiating subassembly and electronic installation thereof of effective lifting heat radiation function.
Background technology
In the electronic installation running, because electronic component is not a superconductor, the resistance that itself has promptly can cause the loss of electric energy, and wherein the electric energy that is lost between the running promptly can change into the form of heat.Along with the raising of increase of electronic component number and operating frequency, the heat that electronic component produced is also many more, causes crashing owing to high temperature tends to cause the electronic component operational failure, and therefore high efficiency radiator becomes present inevitable demand.
Be to use heat pipe and heat-conducting block collocation to transmit thermal source at present in the radiating subassembly, wherein heat pipe is an elongated pipeline, wherein closely heating place of termination, so that the heated liquid in the pipe, the liquid that is heated reaches the boiling point vaporization and evaporates.Gas after the evaporation moves towards the other end of heat pipe, after arriving the other end of pipe, the gas permeation tube wall discharges heat energy, the gas that discharges heat energy reverts back to liquid again, liquid is attached to tube wall, and the heat pipe inwall has capillary structure in addition, and liquid utilization capillary principle begins down to reflux, again flow back to the end near heating place of heat pipe, so go round and begin again to reach the effect of heat radiation.
Yet the material of heat-conducting block is a metal, but owing to temperature on the metal material is often all even inadequately, so easily cause being heated of heat pipe inhomogeneous.Thus, heat pipe just can't be brought into play the effect of its conduction heat sources fully, and then causes the heat dissipation capacity of radiating subassembly to descend.Because the heat dissipation capacity of radiating subassembly is not good, understands the related stability that influences electronic installation, even influence the running effect of this electronic installation.
Summary of the invention
The purpose of this invention is to provide a kind of radiating subassembly and electronic installation thereof, the high thermal conductance effect that is produced by the heat pipe collocation with different tube diameters is to improve the heat-sinking capability of radiating subassembly.
According to the present invention, a kind of radiating subassembly is proposed, be installed in the electronic installation, this electronic installation has a pyrotoxin.This radiating subassembly comprises one first heat pipe and second heat pipe at least.First heat pipe is to be arranged on the pyrotoxin, in order to the thermal source of conduction pyrotoxin.Second heat pipe is arranged on first heat pipe, and thermal source is to conduct to second heat pipe by first heat pipe.
According to the present invention, a kind of electronic installation is proposed, this electronic installation comprises: a pyrotoxin and a radiating subassembly.Radiating subassembly is that wherein radiating subassembly comprises one first heat pipe and one second heat pipe in order to the cooling pyrotoxin.First heat pipe is to be arranged on the pyrotoxin, in order to the thermal source of conduction pyrotoxin.Second heat pipe is arranged on first heat pipe, and thermal source is to conduct to second heat pipe by first heat pipe.
Description of drawings
For foregoing of the present invention can be become apparent, below will be especially exemplified by a preferred embodiment, and conjunction with figs. is elaborated, wherein:
Figure 1A is the schematic diagram according to the electronic installation of a preferred embodiment of the present invention;
Figure 1B is according to the side cutaway view of Figure 1A along the 1B-1B hatching; And
Fig. 2 is that the computer simulation performance of the radiating subassembly of Figure 1A compares schematic diagram.
Embodiment
Please refer to Figure 1A and 1B.Figure 1A is the schematic diagram according to the electronic installation of a preferred embodiment of the present invention.Figure 1B is according to the side cutaway view of Figure 1A along the 1B-1B hatching.Electronic installation 100 comprises a pyrotoxin 110, a radiating subassembly.Radiating subassembly is that wherein radiating subassembly comprises one first heat pipe 120 and one second heat pipe 130 in order to cooling pyrotoxin 110.First heat pipe 120 is arranged on the pyrotoxin 110, in order to the thermal source of conduction pyrotoxin 110.Second heat pipe 130 is arranged on first heat pipe 120, and thermal source is to conduct to second heat pipe 130 by first heat pipe 120.
Pyrotoxin 110 for example is a central processing unit, a hard disk, a chipset, a bulb or other heater elements.Because heat pipe is to change principle by liquid phase to transmit thermal source, when heat pipe contacts the higher pyrotoxin of a heat generation density 110, can the heat of pyrotoxin be taken away by the character of heat pipe.In present embodiment, pyrotoxin 110 is a central processing unit, and this central processing unit has a heat generating part 110a.Therefore, first heat pipe 120 is that heat generating part 110a contacts with conduction heat sources to second heat pipe 130 therewith.
In addition, because its heat-sinking capability of heat pipe of big caliber is preferable in the heat pipe of little caliber, but the plasticity of the heat pipe of little caliber is better than the heat pipe of big caliber, and more easily cooperates electronic installation 100 internal configurations.In present embodiment, the caliber of first heat pipe 120 is the calibers that are designed to greater than second heat pipe 130, to increase the heat dissipation capacity of pyrotoxin 110.And the plasticity of second heat pipe 130 by less caliber cooperates the inside of electronic installation 100 to deploy.In addition, because the caliber of first heat pipe 120 is good than the win internal liquid circulation of heat pipe 120 of ambassador, produce in order to the situation of avoiding heat pipe failure.
Radiating subassembly also comprises a fixture 150, a heat dissipation element 140.Fixture 150 is arranged on second heat pipe 130, makes second heat pipe 130 be fixed on first heat pipe 120.Heat dissipation element 140 comprises a plurality of radiating fins 142 (Heat Sink) and a fan 144.This heat dissipation element 140 is arranged at the adjacent side of second heat pipe 130, and when second heat pipe, 130 conduction heat sources during to heat dissipation element 140, heat dissipation element 140 is whereby to cool off second heat pipe 130.In this embodiment, be to arrange in pairs or groups to reach second heat pipe, 130 cooling purpose mutually with a plurality of radiating fins 142 and fan 144.Therefore, a plurality of radiating fins 142 are arranged on second heat pipe 130, and wherein the material of radiating fin 142 is a heat-conducting, for example is copper or aluminium, and its basic principle is for increasing area of dissipation to quicken radiating efficiency.In addition, fan 144 is arranged at this a little radiating fins 142 sides.Because the radiating fin 142 and second heat pipe 130 all belong to the passive heat radiation device, be to dispel the heat by the physical property of itself.Fan 144 then connects a power supply 146 in addition because of need, belongs to active heat abstractor.This fan 144 is to order about airflow convection in 142 of these radiating fins, and the heat energy that makes radiating fin 142 conduct out quickens to discharge, and accelerates the interior thermal convection speed of body so that radiating fin 142 heat radiations.
Please refer to Fig. 2, Fig. 2 is that the computer simulation performance of the radiating subassembly of Figure 1A compares schematic diagram.In this embodiment, first heat pipe 120 is to contact with pyrotoxin 110, in order to conduction heat sources to the second heat pipe 130, to cool off this pyrotoxin 110.As previously mentioned, existing radiating subassembly is to take heat-conducting block to contact with pyrotoxin, with conduction heat sources to heat pipe.So, radiating subassembly and the existing radiating subassembly of this embodiment compared its thermal resistance efficient mutually with the computer simulation result.Learn that by bending point A and B compare the heat load that both radiating efficiency failpoints can carry, the heat load of existing radiating subassembly and embodiment is respectively 30 watts (W) and reaches greater than 40 watts (W).Therefore, learn relatively mutually that the radiating subassembly of present embodiment can effectively promote heat-sinking capability really with existing radiating subassembly.
A kind of radiating subassembly that the above embodiment of the present invention disclosed and use its electronic installation is to utilize a heat pipe to contact with pyrotoxin to improve the degree of being heated evenly of heat pipe, to increase the heat-sinking capability of radiating subassembly.In addition, be to arrange in pairs or groups mutually with the heat pipe of different tube diameters, not only can promote the heat-sinking capability of radiating subassembly, also can increase the configuration elasticity of radiating subassembly.
In sum, though the present invention with preferred embodiment announcement as above, yet it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when doing various changes that are equal to and retouching.Therefore, protection scope of the present invention is when looking accompanying being as the criterion that the application's claim scope defined.
Claims (11)
1. a radiating subassembly is installed in the electronic installation, and this electronic installation has a pyrotoxin, and this radiating subassembly comprises at least:
One first heat pipe is arranged on this pyrotoxin, to conduct the thermal source of this pyrotoxin; And
One second heat pipe is arranged on this first heat pipe, and this thermal source is to conduct to this second heat pipe by this first heat pipe.
2. radiating subassembly according to claim 1 is characterized in that also comprising:
One heat dissipation element is arranged at the adjacent side of this second heat pipe, and this second heat pipe conducts this thermal source to this heat dissipation element, and this heat dissipation element is by this to cool off this second heat pipe.
3. radiating subassembly according to claim 2 is characterized in that this heat dissipation element comprises:
A plurality of radiating fins; And
One fan is arranged at by these radiating fins, and this fan orders about airflow convection between these radiating fins, so that these radiating fin heat radiations.
4. radiating subassembly according to claim 1, the caliber that it is characterized in that this first heat pipe are the calibers greater than this second heat pipe.
5. radiating subassembly according to claim 1 is characterized in that also comprising:
One fixture is arranged on this second heat pipe, makes this second heat pipe be fixed on this first heat pipe.
6. electronic installation comprises:
One pyrotoxin; And
One radiating subassembly, in order to cool off this pyrotoxin, wherein this radiating subassembly comprises:
One first heat pipe is arranged on this pyrotoxin, to conduct the thermal source of this pyrotoxin; And
One second heat pipe is arranged on this first heat pipe, and this thermal source is to conduct to this second heat pipe by this first heat pipe.
7. electronic installation according to claim 6 is characterized in that this radiating subassembly also comprises:
One heat dissipation element is arranged at the adjacent side of this second heat pipe, and this second heat pipe conducts this thermal source to this heat dissipation element, and this heat dissipation element is whereby to cool off this second heat pipe.
8. electronic installation according to claim 7 is characterized in that this heat dissipation element comprises:
A plurality of radiating fins; And
One fan is arranged at by these radiating fins, and this fan is to make airflow convection between these radiating fins, so that this radiating fin heat radiation.
9. electronic installation according to claim 6, the caliber that it is characterized in that this first heat pipe are the calibers greater than this second heat pipe.
10. electronic installation according to claim 6 is characterized in that this radiating subassembly also comprises:
One fixture is arranged on this second heat pipe, makes this second heat pipe be fixed on this first heat pipe.
11. electronic installation according to claim 6 is characterized in that this pyrotoxin is a central processing unit, a hard disk, a chipset, a bulb or other heater elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101024766A CN101296600A (en) | 2007-04-29 | 2007-04-29 | Radiating assembly and electronic device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101024766A CN101296600A (en) | 2007-04-29 | 2007-04-29 | Radiating assembly and electronic device using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101296600A true CN101296600A (en) | 2008-10-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101024766A Pending CN101296600A (en) | 2007-04-29 | 2007-04-29 | Radiating assembly and electronic device using the same |
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| Country | Link |
|---|---|
| CN (1) | CN101296600A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104065767A (en) * | 2013-03-21 | 2014-09-24 | 联想(北京)有限公司 | Mobile phone heat dissipation system, mobile phone radiator and mobile phone |
| CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
| CN110536586A (en) * | 2019-06-13 | 2019-12-03 | 北京玖琳创新科技有限公司 | A kind of immersion cooling device |
| WO2020082420A1 (en) * | 2018-10-25 | 2020-04-30 | 苏州市英酷莱德信息科技有限公司 | Hard disk fixing device with heat dissipation function |
| CN117849593A (en) * | 2024-03-05 | 2024-04-09 | 武汉普赛斯电子股份有限公司 | High heat conduction efficiency chip test carrier device |
-
2007
- 2007-04-29 CN CNA2007101024766A patent/CN101296600A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104065767A (en) * | 2013-03-21 | 2014-09-24 | 联想(北京)有限公司 | Mobile phone heat dissipation system, mobile phone radiator and mobile phone |
| CN104065767B (en) * | 2013-03-21 | 2018-03-27 | 联想(北京)有限公司 | A kind of mobile phone cooling system, radiator for mobile phone and mobile phone |
| CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
| CN108762443B (en) * | 2018-05-24 | 2020-08-04 | 苏州浪潮智能科技有限公司 | T-shaped heat dissipation device applied to computer |
| WO2020082420A1 (en) * | 2018-10-25 | 2020-04-30 | 苏州市英酷莱德信息科技有限公司 | Hard disk fixing device with heat dissipation function |
| CN110536586A (en) * | 2019-06-13 | 2019-12-03 | 北京玖琳创新科技有限公司 | A kind of immersion cooling device |
| CN110536586B (en) * | 2019-06-13 | 2024-01-30 | 刘一航 | Immersed cooling device |
| CN117849593A (en) * | 2024-03-05 | 2024-04-09 | 武汉普赛斯电子股份有限公司 | High heat conduction efficiency chip test carrier device |
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Open date: 20081029 |