CN101296600A - Heat radiation assembly and electronic device using same - Google Patents

Abstract

The invention discloses a heat dissipation assembly and an electronic device using the same. The electronic device comprises a heat source and a heat dissipation assembly. The heat dissipation assembly is used for cooling the heating source, wherein the heat dissipation assembly comprises a first heat pipe and a second heat pipe. The first heat pipe is arranged on the heating source and used for conducting a heat source of the heating source. The second heat pipe is arranged on the first heat pipe, and the heat source is conducted from the first heat pipe to the second heat pipe.

Description

Heat dissipation component and electronic device using same

technical field

The present invention relates to a heat dissipation component and its electronic device, and in particular to a heat dissipation component and its electronic device which can effectively improve the heat dissipation effect.

Background technique

During the operation of electronic devices, since the electronic components are not superconductors, their own resistance will cause loss of electric energy, and the electric energy lost between operations will be converted into heat. With the increase in the number of electronic components and the increase in operating frequency, the heat generated by electronic components is also increasing. Because high temperature often causes electronic components to fail and cause crashes, high-efficiency radiators have become an inevitable demand at present.

At present, heat pipes and heat conduction blocks are used in heat dissipation components to transfer heat. The heat pipe is a long pipe, one end of which is close to the heat source, so that the liquid in the pipe is heated, and the heated liquid reaches the boiling point to vaporize and evaporate. The evaporated gas moves towards the other end of the heat pipe. After reaching the other end of the pipe, the gas releases heat energy through the pipe wall, and the gas released heat energy returns to liquid again, and the liquid adheres to the pipe wall. In addition, the inner wall of the heat pipe has a capillary structure, and the liquid Use the capillary principle to start to flow back down, and then flow back to the end of the heat pipe close to the heat generating place, so as to achieve the effect of heat dissipation.

However, the material of the heat conduction block is metal, but because the temperature on the metal material is often not uniform enough, it is easy to cause uneven heating of the heat pipe. As a result, the heat pipe cannot fully exert its function of conducting the heat source, thereby causing the heat dissipation of the heat dissipation component to decrease. Due to poor heat dissipation of the heat dissipation component, it will affect the stability of the electronic device, and even affect the operation efficiency of the electronic device.

Contents of the invention

The purpose of the present invention is to provide a heat dissipation component and its electronic device, which can improve the heat dissipation capability of the heat dissipation component through the high thermal conductivity effect produced by the combination of heat pipes with different diameters.

According to the present invention, a heat dissipation component is provided, which is installed in an electronic device, and the electronic device has a heat source. The heat dissipation component at least includes a first heat pipe and a second heat pipe. The first heat pipe is arranged on the heat source for conducting the heat source of the heat source. The second heat pipe is arranged on the first heat pipe, and the heat source is conducted from the first heat pipe to the second heat pipe.

According to the present invention, an electronic device is proposed, and the electronic device includes: a heat source and a heat dissipation component. The heat dissipation component is used for cooling the heat source, wherein the heat dissipation component includes a first heat pipe and a second heat pipe. The first heat pipe is arranged on the heat source for conducting the heat source of the heat source. The second heat pipe is arranged on the first heat pipe, and the heat source is conducted from the first heat pipe to the second heat pipe.

Description of drawings

In order to make the above content of the present invention more obvious and easy to understand, a preferred embodiment will be given below and described in detail in conjunction with the accompanying drawings, wherein:

FIG. 1A is a schematic diagram of an electronic device according to a preferred embodiment of the present invention;

Figure 1B is a side cross-sectional view along section line 1B-1B according to Figure 1A; and

FIG. 2 is a schematic diagram of computer simulation performance comparison of the heat dissipation component of FIG. 1A .

Detailed ways

Please refer to FIGS. 1A and 1B . FIG. 1A is a schematic diagram of an electronic device according to a preferred embodiment of the present invention. FIG. 1B is a side cross-sectional view along section line 1B-1B according to FIG. 1A . The electronic device 100 includes a heat source 110 and a heat dissipation component. The heat dissipation component is used to cool the heat source 110 , wherein the heat dissipation component includes a first heat pipe 120 and a second heat pipe 130 . The first heat pipe 120 is disposed on the heat source 110 for conducting the heat source of the heat source 110 . The second heat pipe 130 is disposed on the first heat pipe 120 , and the heat source is conducted from the first heat pipe 120 to the second heat pipe 130 .

The heat source 110 is, for example, a central processing unit, a hard disk, a chipset, a light bulb or other heat generating elements. Since the heat pipe transfers the heat source through the principle of liquid phase change, when the heat pipe contacts a heat source 110 with high heat density, the heat from the heat source can be taken away by the nature of the heat pipe. In this embodiment, the heat source 110 is a central processing unit, and the central processing unit has a heat generating part 110a. Therefore, the first heat pipe 120 is in contact with the heat generating portion 110 a to transfer heat to the second heat pipe 130 .

In addition, since the large diameter heat pipe has a better heat dissipation capability than the small diameter heat pipe, the plasticity of the small diameter heat pipe is better than that of the large diameter heat pipe, and it is easier to match the internal configuration of the electronic device 100 . In this embodiment, the diameter of the first heat pipe 120 is designed to be larger than the diameter of the second heat pipe 130 to increase the heat dissipation of the heat source 110 . In addition, the plasticity of the second heat pipe 130 with a smaller diameter is used to match the internal configuration of the electronic device 100 . In addition, due to the large diameter of the first heat pipe 120 , the internal liquid circulation of the first heat pipe 120 is good, so as to avoid failure of the heat pipe.

The heat dissipation assembly further includes a fixing piece 150 and a heat dissipation element 140 . The fixing member 150 is disposed on the second heat pipe 130 such that the second heat pipe 130 is fixed on the first heat pipe 120 . The heat dissipation element 140 includes a plurality of heat dissipation fins 142 (Heat Sink) and a fan 144 . The heat dissipation element 140 is disposed adjacent to the second heat pipe 130 , and when the second heat pipe 130 conducts heat to the heat dissipation element 140 , the heat dissipation element 140 thereby cools the second heat pipe 130 . In this embodiment, a plurality of cooling fins 142 and fans 144 cooperate with each other to achieve the purpose of cooling the second heat pipe 130 . Therefore, a plurality of heat dissipation fins 142 are disposed on the second heat pipe 130 , wherein the material of the heat dissipation fins 142 is a heat conduction material, such as copper or aluminum, and its basic principle is to increase heat dissipation area to accelerate heat dissipation efficiency. In addition, the fan 144 is disposed beside the cooling fins 142 . Since both the heat dissipation fins 142 and the second heat pipe 130 are passive heat dissipation devices, they dissipate heat through their own physical properties. The fan 144 is an active cooling device because it needs to be connected to a power supply 146 . The fan 144 drives air convection between the heat dissipation fins 142 to accelerate the heat energy conducted by the heat dissipation fins 142 and accelerate the heat convection speed in the body to dissipate heat from the heat dissipation fins 142 .

Please refer to FIG. 2 . FIG. 2 is a schematic diagram of computer simulation performance comparison of the cooling assembly of FIG. 1A . In this embodiment, the first heat pipe 120 is in contact with the heat source 110 for conducting the heat source to the second heat pipe 130 for cooling the heat source 110 . As mentioned above, in the existing heat dissipation components, the heat conducting block is in contact with the heat source to conduct the heat source to the heat pipe. Therefore, the thermal resistance efficiency of the heat dissipation assembly of this embodiment and the existing heat dissipation assembly is compared with each other based on computer simulation results. According to the bending points A and B, comparing the heat loads that can be carried by the failure point of the heat dissipation efficiency of the two, the heat loads of the existing heat dissipation assembly and the embodiment are respectively 30 watts (W) and greater than 40 watts (W). Therefore, comparing with the existing heat dissipation components, it can be known that the heat dissipation component of this embodiment can effectively improve the heat dissipation capability.

The above-mentioned embodiments of the present invention disclose a heat dissipation component and an electronic device using the same. A heat pipe is used to contact a heat source to improve the heat uniformity of the heat pipe, so as to increase the heat dissipation capacity of the heat dissipation component. In addition, the matching of heat pipes with different diameters can not only improve the heat dissipation capability of the heat dissipation component, but also increase the configuration flexibility of the heat dissipation component.

To sum up, although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Those skilled in the technical field to which the present invention belongs may make various equivalent changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the appended claims of the application.

Claims (11)

1. a radiating subassembly is installed in the electronic installation, and this electronic installation has a pyrotoxin, and this radiating subassembly comprises at least:

One first heat pipe is arranged on this pyrotoxin, to conduct the thermal source of this pyrotoxin; And

One second heat pipe is arranged on this first heat pipe, and this thermal source is to conduct to this second heat pipe by this first heat pipe.

2. radiating subassembly according to claim 1 is characterized in that also comprising:

One heat dissipation element is arranged at the adjacent side of this second heat pipe, and this second heat pipe conducts this thermal source to this heat dissipation element, and this heat dissipation element is by this to cool off this second heat pipe.

3. radiating subassembly according to claim 2 is characterized in that this heat dissipation element comprises:

A plurality of radiating fins; And

One fan is arranged at by these radiating fins, and this fan orders about airflow convection between these radiating fins, so that these radiating fin heat radiations.

4. radiating subassembly according to claim 1, the caliber that it is characterized in that this first heat pipe are the calibers greater than this second heat pipe.

5. radiating subassembly according to claim 1 is characterized in that also comprising:

One fixture is arranged on this second heat pipe, makes this second heat pipe be fixed on this first heat pipe.

6. electronic installation comprises:

One pyrotoxin; And

One radiating subassembly, in order to cool off this pyrotoxin, wherein this radiating subassembly comprises:

One first heat pipe is arranged on this pyrotoxin, to conduct the thermal source of this pyrotoxin; And

One second heat pipe is arranged on this first heat pipe, and this thermal source is to conduct to this second heat pipe by this first heat pipe.

7. electronic installation according to claim 6 is characterized in that this radiating subassembly also comprises:

One heat dissipation element is arranged at the adjacent side of this second heat pipe, and this second heat pipe conducts this thermal source to this heat dissipation element, and this heat dissipation element is whereby to cool off this second heat pipe.

8. electronic installation according to claim 7 is characterized in that this heat dissipation element comprises:

A plurality of radiating fins; And

One fan is arranged at by these radiating fins, and this fan is to make airflow convection between these radiating fins, so that this radiating fin heat radiation.

9. electronic installation according to claim 6, the caliber that it is characterized in that this first heat pipe are the calibers greater than this second heat pipe.

10. electronic installation according to claim 6 is characterized in that this radiating subassembly also comprises:

One fixture is arranged on this second heat pipe, makes this second heat pipe be fixed on this first heat pipe.

11. electronic installation according to claim 6 is characterized in that this pyrotoxin is a central processing unit, a hard disk, a chipset, a bulb or other heater elements.

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