CN207488929U - A contact type cold energy radiator - Google Patents

Abstract

The utility model discloses a contact cold energy radiator, which comprises a water tank, a water inlet pipe, a circulating water pump, a heat dissipation plate, a water outlet pipe, a heat dissipation fin, a first heat-conducting silica gel layer, a second heat-conducting silica gel layer, a CPU, a semiconductor refrigeration sheet, a mainboard and a telescopic thimble, wherein one side of the water tank is connected with the water inlet pipe; the water inlet pipe is connected with a circulating water pump; the circulating water pump is connected with the heat dissipation plate through a water inlet pipe; the bottom of the other end of the heat dissipation plate is connected with a water outlet pipe; the radiating fins are connected to one side of the radiating plate; and both ends are communicated with the heat dissipation plate; the heat dissipation plate is internally provided with a heat conduction pipe and is respectively connected with a water inlet pipe and a water outlet pipe; this contact cold energy radiator has guaranteed the low temperature and the radiating efficiency of heating panel to contact through a plurality of flexible thimbles and mainboard and heating panel, increase the thermal conductivity between heating panel and the mainboard, thereby improved the radiating rate to the mainboard, be fit for using widely.

Description

A contact type cold energy radiator

technical field

The utility model relates to a cold energy radiator, in particular to a contact type cold energy radiator.

Background technique

The CPU chip of the computer will generate heat when it is working, and the temperature will rise. At this time, a radiator is needed to dissipate heat. The current heat dissipation method is air-cooled. This is the most common heat dissipation method. With continuous improvement, the calorific value increases greatly, and the heat on the surface of the processor cannot be dissipated in time, which will greatly affect the working stability of the CPU. It has obvious advantages, but because the heat on the heat sink is continuously taken away, the water temperature will gradually rise higher, and the heat dissipation effect will be worse. Semiconductor heat dissipation uses semiconductor heat dissipation elements, and uses the thermoelectric effect of semiconductor materials to cooperate with air cooling. And water-cooled devices use its heat dissipation effect is remarkable, therefore, the application of semiconductor materials to radiators deserves further attention.

Utility model content

The purpose of this utility model is to provide a contact type cold energy radiator to solve the problems raised in the above-mentioned background technology.

The purpose of this utility model is achieved through the following technical solutions: a contact type cold energy radiator, including a water tank, a water inlet pipe, a circulating water pump, a heat dissipation plate, a water outlet pipe, a heat dissipation fin, a first heat-conducting silica gel layer, a second Heat-conducting silicone layer, CPU, semiconductor refrigeration sheet, main board and telescopic thimble, one side of the water tank is connected to the water inlet pipe; the water inlet pipe is connected to the circulating water pump; the circulating water pump is connected to the heat dissipation plate through the water inlet pipe; the bottom of the other end of the heat dissipation plate A water outlet pipe is connected; the heat dissipation fins are connected to one side of the heat dissipation plate; It is arranged in the middle of the top of the cooling plate; the second heat-conducting silica gel layer is arranged on one side of the CPU; the semiconductor cooling chip is arranged in the middle of the first heat-conducting silica gel layer and the second heat-conducting silica gel layer, and is connected with a wire; The main board is arranged on the side of the CPU away from the second heat-conducting silicone layer, and a telescopic thimble is connected between the heat-dissipating plate.

Further, water passages are arranged in the heat dissipation fins.

Further, the side of the semiconductor cooling chip facing the first heat-conducting silica gel layer is a hot end surface, and the side facing the second heat-conducting silica gel layer is a cold end surface.

Further, one end of the telescopic thimble is fixed on the heat dissipation plate, and the other end touches the main board.

Further, the telescopic thimble is made of heat-conducting material.

Compared with the prior art, the beneficial effect of the utility model is that the new contact type cold energy radiator ensures the low temperature and heat dissipation efficiency of the heat dissipation plate, and contacts with the main board and the heat dissipation plate through a number of telescopic thimbles to increase heat dissipation. The thermal conductivity between the board and the main board improves the heat dissipation speed of the main board, and is suitable for promotion and use.

Description of drawings

Fig. 1 is the overall structure rendering of the utility model;

In the figure: 1-water tank, 2-inlet pipe, 3-circulating water pump, 4-radiating plate, 5-outlet pipe, 6-radiating fin, 7-first thermal silica gel layer, 8-second thermal silica gel layer, 9 -CPU, 10-semiconductor cooling sheet, 11-main board, 12-telescopic thimble.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. For example, based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

As shown in Figure 1, the utility model discloses a contact type cold energy radiator, comprising a water tank 1, a water inlet pipe 2, a circulating water pump 3, a heat dissipation plate 4, a water outlet pipe 5, a heat dissipation fin 6, and a first heat-conducting silica gel layer 7. The second heat-conducting silica gel layer 8, CPU9, semiconductor cooling chip 10, main board 11 and telescopic thimble 12, one side of the water tank 1 is connected to the water inlet pipe 2; the water inlet pipe 2 is connected to the circulating water pump 3; the circulating water pump 3 passes through The water inlet pipe 2 is connected to the heat dissipation plate 4; the bottom of the other end of the heat dissipation plate 4 is connected to the water outlet pipe 5; the heat dissipation fin 6 is connected to one side of the heat dissipation plate 4; and both ends are connected to the heat dissipation plate 4; A heat pipe is provided, and is respectively connected to the water inlet pipe 2 and the water outlet pipe 5; the first heat-conducting silica gel layer 7 is arranged at the top middle position of the cooling plate 4; the second heat-conducting silica gel layer 8 is arranged on one side of the CPU9; Said semiconductor refrigerating sheet 10 is arranged in the middle of the first heat-conducting silica gel layer 7 and the second heat-conducting silica gel layer 8, and is connected with a wire; 4 is connected with a telescopic thimble 12, the heat dissipation fin 6 is provided with a water channel, the side of the semiconductor refrigeration sheet 10 facing the first heat-conducting silica gel layer 7 is a hot end surface, and the side facing the second heat-conducting silica gel layer 8 The side is the cold end surface, and one end of the telescopic thimble 12 is fixed on the heat dissipation plate 4, and the other end touches the main board 11, and the telescopic thimble 12 is made of heat-conducting material.

During use, the semiconductor cooling sheet 10 cools down the CPU 9 by refrigeration. When the heat generated by the CPU 9 is too large, the heat is conducted to the cooling plate 4 by the semiconductor cooling sheet 10, and the heat is passed through the cooling water circulating in the heat pipe in the cooling plate 4. Take it away to achieve a rapid cooling effect.

This kind of contact cold energy radiator ensures the low temperature and heat dissipation efficiency of the heat dissipation plate, and contacts the main board and the heat dissipation plate through a number of telescopic thimbles to increase the heat conduction performance between the heat dissipation plate and the main board, thereby improving the protection against the main board. Cooling speed.

It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, no matter from all points of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, so it is intended to fall within the scope of the claims All changes within the meaning and range of equivalents of the required elements are included in the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.

In addition, it should be understood that although this specification is described according to implementation modes, not each implementation mode only contains an independent technical solution, and this description in the specification is only for clarity, and those skilled in the art should take the specification as a whole , the technical solutions in the various embodiments can also be properly combined to form other implementations that can be understood by those skilled in the art.

Claims (5)

1. A contact type cold energy radiator, including a water tank (1), a water inlet pipe (2), a circulating water pump (3), a cooling plate (4), a water outlet pipe (5), cooling fins (6), a first The heat-conducting silica gel layer (7), the second heat-conducting silica gel layer (8), the CPU (9), the semiconductor cooling chip (10), the main board (11) and the telescopic thimble (12), are characterized in that: the water tank (1) is The side is connected to the water inlet pipe (2); the water inlet pipe (2) is connected to the circulating water pump (3); the circulating water pump (3) is connected to the heat dissipation plate (4) through the water inlet pipe (2); the heat dissipation plate (4) is A water outlet pipe (5) is connected to the bottom of one end; the heat dissipation fin (6) is connected to one side of the heat dissipation plate (4); and both ends are connected to the heat dissipation plate (4); the heat dissipation plate (4) is provided with a heat pipe , and respectively connected to the water inlet pipe (2) and the water outlet pipe (5); the first heat-conducting silica gel layer (7) is set at the top middle position of the cooling plate (4); the second heat-conducting silica gel layer (8) is set at One side of the CPU (9); the semiconductor cooling chip (10) is set in the middle of the first heat-conducting silica gel layer (7) and the second heat-conducting silica gel layer (8), and is connected with a wire; the main board (11) is set A retractable thimble (12) is connected between the side of the CPU (9) away from the second heat-conducting silicone layer (8) and the cooling plate (4). 2. A contact type cold energy radiator according to claim 1, characterized in that: said cooling fins (6) are provided with water passages. 3. A contact type cold energy radiator according to claim 1, characterized in that: the side of the semiconductor cooling sheet (10) facing the first heat-conducting silica gel layer (7) is a thermal end surface, and facing the second heat-conducting One side of the silica gel layer (8) is a cold end face. 4. A contact type cold energy radiator according to claim 1, characterized in that: one end of the telescopic thimble (12) is fixed on the heat dissipation plate (4), and the other end touches the main board (11). 5. A contact type cold energy radiator according to claim 1, characterized in that: the telescopic thimble (12) is made of heat-conducting material.