CN117849593A - High heat conduction efficiency chip test carrier device - Google Patents
High heat conduction efficiency chip test carrier device Download PDFInfo
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- CN117849593A CN117849593A CN202410245805.6A CN202410245805A CN117849593A CN 117849593 A CN117849593 A CN 117849593A CN 202410245805 A CN202410245805 A CN 202410245805A CN 117849593 A CN117849593 A CN 117849593A
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- 238000012360 testing method Methods 0.000 title claims abstract description 35
- 239000007788 liquid Substances 0.000 claims abstract description 30
- 238000003825 pressing Methods 0.000 claims description 44
- 239000004065 semiconductor Substances 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 238000001179 sorption measurement Methods 0.000 claims description 14
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 17
- 229910052751 metal Inorganic materials 0.000 abstract description 17
- 238000011056 performance test Methods 0.000 abstract description 4
- 239000007787 solid Substances 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000000110 cooling liquid Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Toxicology (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a chip test carrier device with high heat conduction efficiency, which relates to the technical field of chip test and comprises a carrier body and a heat conduction assembly, wherein a vacuum channel is arranged in the carrier body, and the carrier body is provided with a carrier surface for placing chips. The heat conduction component comprises a temperature control piece and heat conduction liquid, the temperature control piece is connected with the carrier, the temperature control piece can generate heat with preset temperature and transmit the heat to the vacuum channel, and the heat conduction liquid can be vaporized in the vacuum channel when receiving the heat of the temperature control piece and is liquefied at one end of the vacuum channel close to the carrier so as to conduct heat to the carrier. The invention uses the heat pipe principle to conduct heat, and the movement speed of gas molecules is much faster than that of solid molecules, and the heat conduction efficiency of the heat pipe is much higher than that of metal, so the invention can greatly improve the heat conduction efficiency of the object carrying surface by the heat pipe principle, the speed of the object carrying surface reaching the preset temperature is high, and the temperature can reach high consistency, so that the performance test of the chip is more accurate.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a chip testing carrier device with high heat conduction efficiency.
Background
The chip is widely applied to various fields such as mobile terminals, computer equipment, face recognition, intelligent home, aerospace and the like. In the development and use process of the chip, multiple parameters (such as beam divergence angle, optical power, current, voltage, etc.) of the chip generally need to be tested to determine whether the performance and working state of the chip meet the requirements. The existing chip testing mode is generally that a temperature control mechanism firstly heats cooling liquid to a preset temperature, then the cooling liquid is contacted with a metal object stage, and the temperature of the cooling liquid is transmitted to the metal object stage through the heat conductivity of metal, so that a chip on the metal object stage reaches the preset temperature, and the chip is convenient to test at the preset temperature.
However, the prior art has drawbacks, for example, the metal stage reaches the preset temperature by means of heat conduction of the liquid and metal conduction, so that the metal stage reaches the preset temperature slowly, and the temperature of the metal stage is difficult to reach high consistency, and the test of the chip is affected.
Disclosure of Invention
In view of the foregoing, it is necessary to provide a chip test carrier device with high heat conduction efficiency, which solves the technical problems that in the prior art, the metal stage reaches the preset temperature by means of heat conduction of liquid and metal heat conduction, so that the speed of the metal stage reaching the preset temperature is slow, the temperature of the metal stage is difficult to reach high consistency, and the test of the chip is affected.
In order to achieve the above technical purpose, the technical solution of the present invention provides a chip test carrier device with high heat conduction efficiency, comprising:
the carrier is internally provided with a vacuum channel and is provided with a carrier surface for placing chips; and
the heat conduction assembly comprises a temperature control piece and heat conduction liquid, wherein the temperature control piece is connected with the carrier, the temperature control piece can generate heat corresponding to the preset temperature of the carrier, the heat can be transmitted to the vacuum channel, and the heat conduction liquid can be vaporized in the vacuum channel when receiving the heat of the temperature control piece and is liquefied at one end of the vacuum channel close to the carrier so as to conduct heat to the carrier.
When the object carrying surface is required to be heated to a preset temperature, the temperature control piece can be controlled to heat the vacuum channel, so that the heat conducting liquid is vaporized first, and then the heat conducting liquid is liquefied at one end of the vacuum channel close to the object carrying surface to realize heat conduction. It can be understood that the invention uses the heat pipe principle to conduct heat, and the movement speed of gas molecules is much faster than that of solid molecules, and the heat conduction efficiency of the heat pipe is much higher than that of metal, so the invention can greatly improve the heat conduction efficiency of the object carrying surface by the heat pipe principle, the speed of the object carrying surface reaching the preset temperature is high, and the temperature of the object carrying surface can reach high consistency, so that the performance test of the chip is more accurate.
Further, the vacuum channel comprises a first channel and a second channel which are communicated, one end of the second channel away from the first channel is close to the object carrying surface, and the first channel and the second channel are arranged in an included angle.
Further, a heat conducting channel is arranged in the object carrying body, the heat conducting channel is communicated with the vacuum channel and is arranged at an included angle with the vacuum channel, and the heat conducting channel extends along the length direction of the object carrying surface.
Further, the carrier surface is provided with a plurality of adsorption holes, the adsorption holes are arranged along the length direction of the carrier surface, and the adsorption holes are used for vacuum adsorption of chips positioned on the carrier surface.
Further, the temperature control piece is a semiconductor refrigerator, and a heating surface of the semiconductor refrigerator is attached to the surface of the carrier.
Further, the heat conduction assembly further comprises a heat dissipation part, the heat dissipation part comprises a liquid storage part, a water inlet head and a water outlet head, the water inlet head and the water outlet head are arranged on the liquid storage part, the liquid storage part is attached to the surface of the semiconductor refrigerator, which is far away from the carrier, and the water inlet head and the water outlet head are both used for being connected into a water circulation system so as to take away heat of the semiconductor refrigerator, which is far away from the surface of the carrier.
Further, the high heat conduction efficiency chip test carrier device further comprises an auxiliary fixing assembly, the auxiliary fixing assembly comprises an elastic pressing sheet, and the elastic pressing sheet can elastically press the chip located on the carrier surface when moving.
Further, the auxiliary fixing assembly further comprises a pressing block, a sliding rod, an elastic piece and a driving motor, wherein the sliding rod is connected with the pressing block, the elastic piece is connected with the pressing block, the pressing block is connected with the elastic pressing piece, the driving motor can drive the sliding rod to move up and down so that the sliding rod drives the pressing block to move, the pressing block drives the elastic pressing piece to elastically press against the chip, and the pressing block drives the elastic piece to store elastic force; the elastic piece can drive the elastic pressing piece to be separated from the chip when the elastic force is released.
Further, the auxiliary fixing assembly further comprises a cam and a connecting rod, the connecting rod is connected with the sliding rod, the cam is connected with the driving motor and can rotate under the driving of the driving motor so as to press the connecting rod to drive the sliding rod to move up and down.
Further, the elastic pressing piece comprises a first section and a second section which are connected, the first section and the second section are arranged at an included angle, and the second section inclines towards the object carrying plane and can elastically press against the chip.
Compared with the prior art, the invention has the beneficial effects that: the movable part and the limiting part are respectively positioned at two sides of the connecting part and are in threaded connection with the supporting rods, when the cabinet body needs to be positioned, the movable part can be driven by a tool to rotate, the movable part moves towards the connecting part through threaded fit and is pressed against the connecting part to drive the connecting part to move upwards, so that the cabinet body is driven to rise, the roller at the bottom of the cabinet body is separated from the ground, the supporting bottom plate is positioned on the ground and supports the cabinet body, and the contact area of the supporting bottom plate and the ground is far larger than the contact area of the roller and the ground, so that more stable support can be provided for the cabinet body, and the cabinet body is not easy to topple even if the cabinet body is subjected to larger external force. When the position of the cabinet body needs to be adjusted, the movable part can be rotated firstly, so that the movable part moves away from the connecting part through threaded fit, and then the limiting part is rotated, so that the limiting part drives the supporting rod to ascend through threaded fit, the supporting rod drives the supporting bottom plate to ascend and separate from the ground, and the roller at the moment contacts the ground and can roll on the ground, so that the power distribution cabinet is pushed to move to a new position.
Drawings
FIG. 1 is a schematic view of a chip test stage apparatus with high thermal conductivity according to an embodiment of the present invention;
FIG. 2 is a schematic view of a thermal conductivity testing apparatus according to another embodiment of the present invention;
FIG. 3 is a schematic view of a carrier according to an embodiment of the invention;
FIG. 4 is a schematic exploded view of the thermal conductivity testing apparatus of the present invention;
fig. 5 is a schematic structural view of an elastic pressing sheet according to an embodiment of the present invention.
Detailed Description
Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form a part hereof, and together with the description serve to explain the principles of the invention, and are not intended to limit the scope of the invention.
Referring to fig. 1 and 2, the present invention provides a chip test stage device 100 with high heat conduction efficiency, where the test device 100 is used for performing performance test on chips at a preset temperature to screen out qualified chips and unqualified chips. In addition, the test device 100 can quickly heat the object carrying surface of the chip to a preset temperature, and the temperature of the object carrying surface can also keep high consistency, so that a better test environment can be provided for the chip, and the chip test is more accurate.
The high heat conduction efficiency chip test carrier device 100 comprises a fixing piece 1, a carrier 2, a heat conduction component 3 and an auxiliary fixing component 4, wherein the carrier 2, the heat conduction component 3 and the auxiliary fixing component 4 are all arranged on the fixing piece 1, the carrier 2 is provided with a carrier surface 22 for carrying chips, and the auxiliary fixing component 4 is used for pressing the chips positioned on the carrier surface 22 so as to strengthen the positioning of the chips and prevent the chips from moving in the test process to influence the test. The heat conduction assembly 3 is used for conducting heat to the carrier 2, so that the carrier surface 22 can reach a preset temperature, and the chip can be tested at the preset temperature.
The fixing piece 1 is provided with a first accommodating cavity 11 and a second accommodating cavity 12, the first accommodating cavity 11 is arranged near the bottom of the fixing piece 1 and penetrates through the fixing piece 1, and the first accommodating cavity 11 is used for accommodating a motor. The second accommodating chamber 12 has a semi-open groove-shaped structure for accommodating the fixed heat conduction assembly 3. The second accommodating chamber 12 is further provided with a limiting post 13, and the limiting post 13 is used for limiting the heat conduction assembly 3, so that the heat conduction assembly 3 can be stably placed in the second accommodating chamber 12.
Through holes 14 are formed in two sides of the fixing piece 1 in a penetrating mode, and the through holes 14 are used for assisting a sliding rod of the fixing assembly 4 to penetrate through, so that the sliding rod can slide up and down relative to the fixing piece 1.
Referring to fig. 3, a vacuum channel 21 is provided in the carrier body 2, and the carrier body 2 has a carrier surface 22 for placing chips.
The heat conduction assembly 3 includes a temperature control member 31 and a heat conducting liquid (not shown in the figure), the temperature control member 31 is connected to the carrier member 2, the temperature control member 31 can generate heat corresponding to a preset temperature and transmit the heat to the vacuum channel 21, and the heat conducting liquid can be vaporized in the vacuum channel 21 when receiving the heat of the temperature control member 31 and liquefied at one end of the vacuum channel 21 close to the carrier member 22 to conduct heat to the carrier member 22. The heat conducting liquid may be water, alcohol or diethyl ether, and each of which has a different boiling point, and the corresponding heat conducting liquid is selected according to the temperature to be heated by the carrier surface 22.
When the object surface 22 needs to be heated to a preset temperature, the temperature control member 31 can be controlled to heat the vacuum channel 21, so that the heat conducting liquid is vaporized first, and then liquefied at one end of the vacuum channel 21 close to the object surface 22 to realize heat conduction. It can be understood that the heat conduction is performed by using the heat pipe principle, and the movement speed of gas molecules is much faster than that of solid molecules, and the heat conduction efficiency of the heat pipe is much higher than that of metal, so that the heat conduction efficiency of the carrier surface 22 can be greatly improved by using the heat pipe principle, the speed of heat generated by the temperature control element 31 to the carrier surface 22 is high, the speed of the carrier surface 22 reaching the preset temperature is high, and the temperature of the carrier surface 22 can reach high consistency, so that the performance test of the chip is more accurate.
The vacuum channel 21 provided in the carrier 2 is not limited in structure, and may be linear or corner, in an embodiment, the vacuum channel 21 includes a first channel 211 and a second channel 212 that are connected, one end of the second channel 212 away from the first channel 211 is close to the carrier surface 22, the first channel 211 and the second channel 212 are disposed at an included angle, and the embodiment shown in fig. 3 is in a mutually perpendicular state. Compared with the straight vacuum channel 21, the embodiment adopts the corner-shaped vacuum channel 21, which is beneficial to saving the transverse space.
The end of the first channel 211 far away from the second channel 212 is provided with a first opening 213, the carrier 2 is provided with a second opening 214, during actual operation, firstly, heat conduction liquid is injected into the first channel 211 through the first opening 213, then, the first opening 213 is blocked by half, a negative pressure pump is used for connecting into the second opening 214 and vacuumizing the first channel 211, when the vacuum degree reaches a preset value, the first opening 213 is completely sealed, the second opening is blocked, and the whole vacuum channel 21 can form a heat pipe.
The side of the carrier body 2 remote from the carrier surface 22 has a heat conducting surface 23, the heat conducting surface 23 being more proximate to the first channel 211, the first channel 211 storing a heat conducting liquid prior to heat conduction. The heat conducting surface 23 is used for contacting with the temperature control element 31, and the temperature control element 31 can conduct heat to the heat conducting surface 23 during operation, and then conduct heat to the first channel 211 from the heat conducting surface 23, the heat conducting liquid of the first channel 211 becomes gas after being heated and vaporized, and then liquefies at a position close to the object carrying surface 22 through the second channel 212, so as to complete heat conduction.
The size of the carrier surface 22 is not limited, and may be, for example, a size close to the cross-sectional area of the second channel 212, in which case the second channel 212 conducts heat to the carrier surface 22 more quickly, enabling the carrier surface 22 to reach the preset temperature more quickly.
The carrier 22 of the embodiment shown in fig. 3 is of a larger size and is rectangular in configuration. The carrier 2 is provided with a heat conducting channel 24, and the heat conducting channel 24 is communicated with the vacuum channel 21 and is perpendicular to the vacuum channel 21, and in other embodiments, the heat conducting channel 24 and the vacuum channel 21 can be arranged at other included angles, which is beneficial to saving the occupied space of the carrier 2. The heat conducting channel 24 extends along the length direction of the object carrying surface 22, and the gas formed by the heat conducting liquid after being heated and vaporized can reach the heat conducting channel 24 through the second channel 212 and liquefy in the heat conducting channel 24 so as to conduct heat to all positions of the object carrying surface 22, thereby being beneficial to improving the consistency of the temperature of the object carrying surface 22. The carrier 22 may house a plurality of chips that are placed at any location on the carrier 22 and can be maintained at the same temperature for testing.
The carrier 2 may be made of a material with good thermal conductivity, such as copper, and most of the heat generated by the temperature control member 31 is transferred to the carrier 22 by the heat pipe principle, and a small portion of the heat is transferred to the carrier 22 by the metal heat transfer property of the carrier 2 itself.
In an embodiment, the carrier surface 22 is provided with a plurality of adsorption holes 25, and the plurality of adsorption holes 25 are disposed along the length direction of the carrier surface 22. The adsorption hole 25 can be communicated with a negative pressure pump, and the negative pressure pump can drive the adsorption hole 25 to form negative pressure when working, so that the adsorption hole 25 can vacuum adsorb a chip positioned on the carrier surface 22, and the chip is not easy to damage in a vacuum adsorption fixing mode.
The temperature control member 31 is mainly used for providing a heat source for the object carrying surface 22 reaching a preset temperature, and various temperature control members 31 capable of achieving the effect are available, such as a semiconductor refrigerator, a heating wire, etc. In one embodiment, the temperature control member 31 is a semiconductor refrigerator, and the semiconductor refrigerator is stable in heat supply and easy to adjust. The heat-generating surface of the semiconductor refrigerator is attached to the heat-conducting surface 23 of the carrier 2, so as to conduct heat to the heat-conducting surface 23, and then conduct heat from the heat-conducting surface 23 to the heat-conducting liquid of the first channel 211.
The other side of the semiconductor refrigerator is in a refrigerating state when the heating surface generates heat, for example, the other side of the semiconductor refrigerator is in a refrigerating state. When the heat generating surface is cooled, the other surface of the semiconductor refrigerator is in a heat generating state. In order to avoid that the heat emitted from the other side of the semiconductor refrigerator affects the heat conduction of the carrier body 2, it is necessary to treat the heat emitted from the other side of the semiconductor refrigerator.
In addition, the semiconductor refrigerator can be connected with the carrier surface 22, and the power of the semiconductor refrigerator can be automatically adjusted according to the temperature of the carrier surface 22, so that the heat emitted by the semiconductor refrigerator can drive the carrier surface to be continuously maintained at a preset temperature, a chip can be tested in a stable temperature environment, and the principle is similar to the working principle of the variable-frequency air conditioner.
Referring to fig. 4, further, the heat conduction assembly 3 further includes a heat dissipation member 33, the heat dissipation member 33 includes a liquid storage member 331, and a water inlet head 332 and a water outlet head 333 disposed on the liquid storage member 331, the liquid storage member 331 is attached to a surface of the semiconductor refrigerator far away from the heating surface, the water inlet head 332 and the water outlet head 333 are connected to the water circulation system through water pipes, when the water circulation system works, a cooling liquid can enter the liquid storage member 331 through the water inlet head 332, and then is discharged through the water outlet head 333, so as to take away heat of the surface of the semiconductor refrigerator far away from the heating surface.
The auxiliary fixing component 4 is used for performing an auxiliary fixing function on the chip located on the carrier surface 22, so that the chip can be fixed on the carrier surface 22 more stably.
Referring to fig. 4, the auxiliary fixing assembly 4 includes a driving motor 41, a cam 42, a connecting rod 43, a slide bar 44, a pressing block 45, an elastic member 46 and an elastic pressing piece 47, wherein the driving motor 41 is connected with the cam 42 and can drive the cam 42 to rotate, the slide bar 44 has two slide bars 44 respectively slide through holes 14 arranged at the left side and the right side of the fixing member 1. Two ends of the connecting rod 43 are respectively connected with two sliding rods 44 to drive the two sliding rods 44 to synchronously slide up and down. The two pressing blocks 45 are also provided, and the two pressing blocks 45 are respectively arranged at the end parts of the two sliding rods 44. The two elastic members 46 are also provided, the two elastic members 46 are respectively sleeved on the two sliding rods 44, one end of each elastic member 46 is abutted against the pressing block 45, and the other end is abutted against the fixing member 1. The number of the elastic pressing pieces 47 is two, and the two elastic pressing pieces 47 are respectively arranged on the two pressing blocks 45 and are used for elastically pressing the chip.
The cam 42 may directly bear against the link 43 upon rotation, or may indirectly drive the link 43 for movement by other structures. The link 43 of the embodiment shown in fig. 4 is rotatably connected to a roller 431, and the roller 431 is disposed corresponding to the cam 42. When the cam 42 rotates, the cam 42 can press against the roller 431, and the link 43 is driven to move downward by the roller 431. The roller 431 drives the connecting rod 43 to move, so that the connecting rod 43 can be effectively protected, and the surface of the connecting rod 43 is prevented from being worn by the cam 42 for a long time.
The driving motor 41 is installed in the first accommodation chamber 11 of mounting 1, and when driving motor 41 during operation, driving motor 41 can order about cam 42 to rotate, and cam 42 supports and presses connecting rod 43 downward movement, and connecting rod 43 drives two slide bars 44 and slides downwards simultaneously, and two slide bars 44 drive two briquetting 45 and two elastic pressing piece 47 simultaneously and move downwards to make two elastic pressing piece 47 elasticity support the chip, carry out the assistance-localization real-time to the chip. At the same time, both elastic members 46 are compressed by the corresponding pressing blocks 45 to accumulate elastic force.
When the chip testing is completed, the driving motor 41 can drive the cam 42 to separate from the connecting rod 43, and the two elastic pieces 46 simultaneously release elastic force to drive the two elastic pressing pieces 47 to separate from the chip, so that the chip can be conveniently detached from the carrier surface 22.
The elastic pressing sheet 47 may be made of a metal sheet having elasticity, so that the elastic pressing sheet 47 can provide a stable positioning effect for the chip, and is not easy to damage the chip.
The structure of the elastic pressing piece 47 is not limited, and may be a straight rod or a non-straight rod. Referring to fig. 5, in one embodiment, the resilient compression sheet 47 includes a first segment 471, a second segment 472, and a third segment 473 connected, the first segment 471 and the second segment 472 being disposed at an obtuse angle, the second segment 472 and the third segment 473 also being disposed at an obtuse angle, it being understood that the second segment 472 is inclined toward the carrier surface 22. In other embodiments, the second segment 472 may be disposed at other angles with the first and third segments 471, 473, not otherwise limited herein. When the elastic pressing sheet 47 is pressed down, the contact area between the third segment 473 and the chip is large, so that the chip can be pressed and positioned more stably. The second section is inclined towards the object carrying surface and can elastically press the chip.
The mounting hole 474 has been seted up in the elasticity preforming 47 run through, and briquetting 45 has the screw hole, can use the screw to wear to establish mounting hole 474 and threaded connection in the screw hole to with elasticity preforming 47 and briquetting 45 detachable connection, be convenient for change elasticity preforming 47.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention.
Claims (9)
1. A high thermal conductivity chip test carrier device, comprising:
the carrier is internally provided with a vacuum channel and is provided with a carrier surface for placing chips; and
the heat conduction assembly comprises a temperature control piece and a heat conduction liquid, the temperature control piece is connected with the carrier, the temperature control piece can generate heat corresponding to the fact that the carrier reaches a preset temperature and can transmit the heat to the vacuum channel, and the heat conduction liquid can be vaporized in the vacuum channel when receiving the heat of the temperature control piece and is liquefied at one end, close to the carrier, of the vacuum channel so as to conduct heat to the carrier; the heat conduction channel is arranged in the object carrying body, is communicated with the vacuum channel and is arranged at an included angle with the vacuum channel, and extends along the length direction of the object carrying body.
2. The high thermal conductivity chip test carrier device of claim 1, wherein the vacuum channel comprises a first channel and a second channel which are communicated, one end of the second channel away from the first channel is close to the carrier surface, and the first channel and the second channel are arranged at an included angle.
3. The high thermal conductivity chip test carrier device of claim 1, wherein the carrier surface is provided with a plurality of adsorption holes, the plurality of adsorption holes are arranged along a length direction of the carrier surface, and the adsorption holes are used for vacuum adsorption of chips located on the carrier surface.
4. The high thermal conductivity chip test carrier device of claim 1, wherein the temperature control member is a semiconductor refrigerator, and a heat generating surface of the semiconductor refrigerator is attached to a surface of the carrier.
5. The high thermal conductivity chip test carrier device of claim 4, wherein the heat conduction assembly further comprises a heat sink, the heat sink comprises a liquid storage part, and a water inlet head and a water outlet head arranged on the liquid storage part, the liquid storage part is attached to the surface of the semiconductor refrigerator far away from the carrier, and the water inlet head and the water outlet head are both used for being connected into a water circulation system so as to take away heat of the semiconductor refrigerator far away from the surface of the carrier.
6. The high thermal conductivity chip test carrier device of claim 1, further comprising an auxiliary fixing assembly comprising an elastic pressing piece capable of elastically pressing a chip located on the carrier surface when moving.
7. The high thermal conductivity chip test carrier device according to claim 6, wherein the auxiliary fixing assembly further comprises a pressing block, a sliding rod, an elastic piece and a driving motor, the sliding rod is connected with the pressing block, the elastic piece is connected with the pressing block, the pressing block is connected with the elastic pressing piece, the driving motor can drive the sliding rod to move up and down so that the sliding rod drives the pressing block to move, the pressing block drives the elastic pressing piece to elastically press against the chip, and the pressing block drives the elastic piece to accumulate elastic force; the elastic piece can drive the elastic pressing piece to be separated from the chip when the elastic force is released.
8. The high thermal conductivity chip test carrier device according to claim 7, wherein the auxiliary fixing assembly further comprises a cam and a connecting rod, the connecting rod is connected to the sliding rod, the cam is connected with the driving motor and can rotate under the driving of the driving motor so as to press the connecting rod to drive the sliding rod to move up and down.
9. The high thermal conductivity chip test carrier device of any one of claims 6-8, wherein the resilient compression member comprises a first section and a second section connected to each other, the first section and the second section being disposed at an angle, and the second section being inclined toward the carrier surface and being capable of resiliently compressing the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410245805.6A CN117849593A (en) | 2024-03-05 | 2024-03-05 | High heat conduction efficiency chip test carrier device |
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| TW200820401A (en) * | 2006-10-23 | 2008-05-01 | Via Tech Inc | Chip package and manufacturing method thereof |
| CN101296600A (en) * | 2007-04-29 | 2008-10-29 | 英业达股份有限公司 | Radiating assembly and electronic device using the same |
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| CN215116377U (en) * | 2021-04-23 | 2021-12-10 | 苏州富达仪精密科技有限公司 | Chip life aging baking test fixture |
| CN116252085A (en) * | 2021-12-09 | 2023-06-13 | 杭州普惠医疗器械有限公司 | Chip bonding device and chip bonding method |
| CN220503194U (en) * | 2023-07-11 | 2024-02-20 | 芯恩（青岛）集成电路有限公司 | Temperature control device and semiconductor device |
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| CN2355291Y (en) * | 1998-09-29 | 1999-12-22 | 张金华 | High performance energy saving superconductive radiator |
| CN1403778A (en) * | 2001-09-06 | 2003-03-19 | 李嘉豪 | Plate loop heat pipe (II) |
| CN1805133A (en) * | 2005-01-14 | 2006-07-19 | 杨洪武 | Plate-type heat-pipe radiator |
| TW200820401A (en) * | 2006-10-23 | 2008-05-01 | Via Tech Inc | Chip package and manufacturing method thereof |
| CN101296600A (en) * | 2007-04-29 | 2008-10-29 | 英业达股份有限公司 | Radiating assembly and electronic device using the same |
| CN103538722A (en) * | 2012-04-17 | 2014-01-29 | 空中客车作业有限公司 | Heat dissipation of power electronics of a cooling unit |
| CN103344141A (en) * | 2013-07-30 | 2013-10-09 | 黄斌 | Heat pipe heating device, heat pipe heat dissipation method and superconduction liquid |
| CN215116377U (en) * | 2021-04-23 | 2021-12-10 | 苏州富达仪精密科技有限公司 | Chip life aging baking test fixture |
| CN116252085A (en) * | 2021-12-09 | 2023-06-13 | 杭州普惠医疗器械有限公司 | Chip bonding device and chip bonding method |
| CN220503194U (en) * | 2023-07-11 | 2024-02-20 | 芯恩（青岛）集成电路有限公司 | Temperature control device and semiconductor device |
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