CN206546044U - A kind of Speciality of Physics semiconductor cooling device - Google Patents
A kind of Speciality of Physics semiconductor cooling device Download PDFInfo
- Publication number
- CN206546044U CN206546044U CN201720238416.6U CN201720238416U CN206546044U CN 206546044 U CN206546044 U CN 206546044U CN 201720238416 U CN201720238416 U CN 201720238416U CN 206546044 U CN206546044 U CN 206546044U
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- CN
- China
- Prior art keywords
- speciality
- coil pipe
- cooling device
- physics
- support platform
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Abstract
The utility model discloses a kind of Speciality of Physics semiconductor cooling device, including heat exchanger coil, coil pipe shell, tank, micro pump, slide rail, semiconductor chilling plate, base support and support platform, the support platform of horizontal positioned is connected by screw at the top of the base support, tank is placed in support platform, and the bottom of tank is relative to open up two through holes for Inlet and outlet water；The bottom of the base support sets two slide rails parallel with support platform, and slide rail is welded on base support by connecting rod, and two slide rails are be arranged in parallel and its notch is relative, and the both sides of semiconductor chilling plate are slidably connected in the notch of two slide rails.This practicality is coordinated the circulatory system, is realized the heating and cooling of water temperature in tank using this cold characteristic of semiconductor, very convenient, also rapidly and efficiently, is adapted to physics profession experiment and is used.
Description
Technical field
The utility model is related to Speciality of Physics experiment equipment, specifically a kind of Speciality of Physics semiconductor cooling device.
Background technology
Semiconductor chilling plate, is also thermoelectric module, is a kind of heat pump.Its advantage is no slide unit, is applied
Some spaces are restricted, and reliability requirement is high, the occasion of no refrigerant pollution.Using the Peltier effects of semi-conducting material,
When the galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, heat can be absorbed respectively at the two ends of galvanic couple and put
Go out heat, it is possible to achieve the purpose of refrigeration.It is a kind of Refrigeration Technique for producing negative thermal resistance, is characterized in movement-less part, can
It is also higher by property.
In the experimentation of Speciality of Physics, it is sometimes desirable to control water temperature, in advance need quickly by water temperature improve or
Certain temperature is reduced to, existing mode is heated up and cooled by the way of alcolhol burner and refrigerator, such processing
Mode is cumbersome, the complicated precipitation of experiment is improved, while efficiency is very low.
Utility model content
The purpose of this utility model is to provide a kind of Speciality of Physics semiconductor cooling device, to solve above-mentioned background skill
The problem of being proposed in art.
To achieve the above object, the utility model provides following technical scheme：
A kind of Speciality of Physics semiconductor cooling device, including heat exchanger coil, coil pipe shell, tank, micro pump, cunning
The branch of horizontal positioned is connected by screw at the top of rail, semiconductor chilling plate, base support and support platform, the base support
Platform is supportted, tank is placed in support platform, the bottom of tank is relative to open up two through holes for Inlet and outlet water；The base branch
The bottom of frame sets two slide rails parallel with support platform, and slide rail is welded on base support by connecting rod, two slide rails
It is arranged in parallel and its notch is relative, the both sides of semiconductor chilling plate is slidably connected in the notch of two slide rails, the semiconductor
Cooling piece overlying contact sets coil pipe shell, and the inside of coil pipe shell sets heat exchanger coil, one end port of heat exchanger coil
By a through hole of pipeline connection water channel bottom, and the other end port of heat exchanger coil connects micro pump by pipeline
Input, another through hole that the output end of micro pump passes through pipeline connection water channel bottom.
It is used as further program of the utility model：The heat exchanger coil is copper pipe.
It is used as further program of the utility model：Spring is connected between the coil pipe shell and support platform, is passed through
Spring ensures that coil pipe shell is pressed on the upper surface of semiconductor chilling plate.
It is used as further program of the utility model：It is filled with space between heat exchanger coil and the coil pipe shell
Heat conductive silica gel.
It is used as further program of the utility model：The lower section of the semiconductor chilling plate sets blower fan, and blower fan passes through even
Bar is fixedly connected on base support, and blower fan be used for semiconductor chilling plate freeze when, generate heat end face radiating.
It is used as further program of the utility model：The outside of the pipeline is coated with sponge heat-insulating layer.
It is used as further program of the utility model：When the pipeline is plastic cement pipeline, it is directly inserted into through hole, utilizes
The elasticity of plastic cement ensures sealing.
Compared with prior art, the beneficial effects of the utility model are：This practicality is matched somebody with somebody using this cold characteristic of semiconductor
The circulatory system is closed, the heating and cooling of water temperature in tank is realized, it is very convenient, also rapidly and efficiently, it is adapted to physics profession experiment
With.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Referring to Fig. 1, in the utility model embodiment, a kind of Speciality of Physics semiconductor cooling device, including heat exchange
Coil pipe 1, spring 2, coil pipe shell 3, tank 4, pipeline 5, micro pump 6, slide rail 7, semiconductor chilling plate 8, blower fan 9, base branch
Frame 10 and support platform 11, the top of the base support 10 are connected by screw the support platform 11 of horizontal positioned, and tank 4 is put
Put in support platform 11, the bottom of tank 4 is relative to open up two through holes for Inlet and outlet water, in order to be heated with external refrigeration
System carries out heat exchange；
The bottom of the base support 10 sets two slide rails 7 parallel with support platform 11, and slide rail 7 is welded by connecting rod
It is connected on base support 10, two slide rails 7 are be arranged in parallel and its notch is relative, and the both sides of semiconductor chilling plate 8 are slidably connected at
In the notch of two slide rails 7, the overlying contact of semiconductor chilling plate 8 sets coil pipe shell 3, and the inside of coil pipe shell 3 is set
Heat exchanger coil 1, one end port of heat exchanger coil 1 is by a through hole of the bottom of 5 connection water channel of pipeline 4, and heat exchange disk
The other end port of pipe 1 connects the input of micro pump 6 by pipeline 5, and the output end of micro pump 6 connects water by pipeline
Another through hole of the bottom of groove 4, so that the circulation of internal water is realized, while entering by heat exchanger coil 1 with semiconductor chilling plate 8
Row heat exchange, for controlling water temperature.
The heat exchanger coil 1 is copper pipe.
Spring 2 is connected between the coil pipe shell 3 and support platform 11, ensures that coil pipe shell 3 is pressed on by spring 2
The upper surface of semiconductor chilling plate 8, improves the effect of heat exchange.
Heat conductive silica gel is filled with space between the heat exchanger coil 1 and coil pipe shell 3, it is ensured that heat conduction is good, heat
The purpose for exchanging coil pipe 1 is the stroke for improving current in heat transfer zone, improves output temperature.
The lower section of the semiconductor chilling plate 8 sets blower fan 9, and blower fan 9 is fixedly connected on base support 10 by connecting rod,
And blower fan 9 be used for semiconductor chilling plate 8 freeze when, generate heat end face radiating.
The outside of the pipeline 5 is coated with sponge heat-insulating layer, while pipeline 5 and the through hole of the bottom of tank 4 use existing
Connected mode connection, such as pipeline 5 be plastic cement pipeline when, be directly inserted into through hole, using plastic cement elasticity ensure it is close
Feng Xing.
Wherein semiconductor chilling plate 8, blower fan 9 and micro pump 6 are by switching connection power supply, it is ensured that power supply.
Operation principle of the present utility model is：
This practicality is slidably connected by two slide rails 7 and semiconductor chilling plate 8 so that semiconductor chilling plate 8 can be dismantled,
When needing refrigeration, the refrigeration end of semiconductor chilling plate is contacted with coil pipe shell 3, opening micro pump can be to water system
It is cold；And when needing to heat water, semiconductor chilling plate is extracted, it is inserted into after upset one side in the chute of slide rail 7 so that
Heat face to contact with coil pipe shell 3, water can be heated by opening micro pump.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and
And in the case of without departing substantially from spirit or essential attributes of the present utility model, can realize that this practicality is new in other specific forms
Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new
The scope of type limits by appended claims rather than described above, it is intended that the equivalency fallen in claim is contained
All changes in justice and scope are included in the utility model.Any reference in claim should not be considered as limitation
Involved claim.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It may be appreciated other embodiment.
Claims (7)
1. a kind of Speciality of Physics semiconductor cooling device, including it is heat exchanger coil (1), coil pipe shell (3), tank (4), miniature
Water pump (6), slide rail (7), semiconductor chilling plate (8), base support (10) and support platform (11), it is characterised in that the bottom
The support platform (11) of horizontal positioned is connected by screw at the top of seat support (10), tank (4) is placed on support platform (11)
On, the bottom of tank (4) is relative to open up two through holes for Inlet and outlet water；The bottom of the base support (10) set two with
The parallel slide rail (7) of support platform (11), slide rail (7) is welded on base support (10) by connecting rod, and two slide rails (7) are put down
Row is set and its notch is relative, and the both sides of semiconductor chilling plate (8) are slidably connected in the notch of two slide rails (7), and described half
Conductor cooling piece (8) overlying contact sets coil pipe shell (3), and the inside of coil pipe shell (3) sets heat exchanger coil (1), and heat is handed over
One end port of coil pipe (1) is changed by a through hole of pipeline (5) connection water channel (4) bottom, and heat exchanger coil (1) is another
Port is held to connect the input of micro pump (6) by pipeline (5), the output end of micro pump (6) passes through pipeline connection water channel
(4) another through hole of bottom.
2. a kind of Speciality of Physics semiconductor cooling device according to claim 1, it is characterised in that the heat exchange disk
It is copper pipe to manage (1).
3. a kind of Speciality of Physics semiconductor cooling device according to claim 1, it is characterised in that the coil pipe shell
(3) spring (2) is connected between support platform (11), ensures that coil pipe shell (3) is pressed on semiconductor refrigerating by spring (2)
The upper surface of piece (8).
4. a kind of Speciality of Physics semiconductor cooling device according to claim 1 or 2, it is characterised in that the heat is handed over
Change and heat conductive silica gel is filled with the space between coil pipe (1) and coil pipe shell (3).
5. a kind of Speciality of Physics semiconductor cooling device according to claim 1, it is characterised in that the semiconductor system
The lower section of cold (8) sets blower fan (9), and blower fan (9) is fixedly connected on base support (10) by connecting rod.
6. a kind of Speciality of Physics semiconductor cooling device according to claim 1, it is characterised in that the pipeline (5)
Outside be coated with sponge heat-insulating layer.
7. a kind of Speciality of Physics semiconductor cooling device according to claim 1 or 6, it is characterised in that the pipeline
(5) when being plastic cement pipeline, it is directly inserted into through hole, sealing is ensured using the elasticity of plastic cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720238416.6U CN206546044U (en) | 2017-03-13 | 2017-03-13 | A kind of Speciality of Physics semiconductor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720238416.6U CN206546044U (en) | 2017-03-13 | 2017-03-13 | A kind of Speciality of Physics semiconductor cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206546044U true CN206546044U (en) | 2017-10-10 |
Family
ID=59994586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720238416.6U Expired - Fee Related CN206546044U (en) | 2017-03-13 | 2017-03-13 | A kind of Speciality of Physics semiconductor cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206546044U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114234476A (en) * | 2021-12-23 | 2022-03-25 | 北方民族大学 | Semiconductor refrigerating device for physics major |
-
2017
- 2017-03-13 CN CN201720238416.6U patent/CN206546044U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114234476A (en) * | 2021-12-23 | 2022-03-25 | 北方民族大学 | Semiconductor refrigerating device for physics major |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171010 Termination date: 20180313 |