CN205137905U - Air can water heater semiconductor refrigerator all -in -one - Google Patents
Air can water heater semiconductor refrigerator all -in -one Download PDFInfo
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- CN205137905U CN205137905U CN201520928131.6U CN201520928131U CN205137905U CN 205137905 U CN205137905 U CN 205137905U CN 201520928131 U CN201520928131 U CN 201520928131U CN 205137905 U CN205137905 U CN 205137905U
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Abstract
Air can water heater semiconductor refrigerator all -in -one, including compressor, double -pipe heat exchanger, thermostatic expansion valve and evaporimeter, compressor, double -pipe heat exchanger, thermostatic expansion valve and evaporimeter connect gradually through the pipeline, include still that semiconductor refrigeration heats piece, semiconductor heat -conducting plate and refrigeration case, and the end that heats that semiconductor refrigeration heated the piece links to each other with the evaporimeter through the semiconductor heat -conducting plate, and the refrigeration end that semiconductor refrigeration heated the piece links to each other with the refrigeration case, one side of double -pipe heat exchanger is equipped with the storage water tank, is equipped with hot water mouth and cold water mouth on the storage water tank. The utility model discloses because have air ability water heater now, on the basis of air ability water heater, combine the semiconductor refrigeration technique of heating, make up air ability water heater and semiconductor device, full play is the function separately, still can realize continuously refrigerating in the hydrothermal while of manufacturing, can be used to the hot water demand of family and enterprise etc. And application scope is wide.
Description
Technical field
The utility model relates to a kind of air-source water heater semiconductor cooling device all-in-one.
Background technology
At present, air-source water heater, semiconductor cooling device are as different product function singleness separately, and air-source water heater is only for the manufacture of hot water, and semiconductor cooling device is only for refrigeration.
Existing air-source water heater is according to inverse Carnot cycle principle, adopt few electrical energy drive, by heat absorption working media, the air heat source of more than-15 DEG C in air is delivered to air generator, cause the refrigerant in brethaid be heated heat up gasification, the heat produced is released in water, and water temperature is raised.The use of this kind of air-source water heater is subject to territorial environment impact, and be only applicable to the torrid zone and the higher area of subtropical zone temperature, this type water heater also affects by weather conditions simultaneously, causes its heat absorption deficiency.
Existing semiconductor cooling device, due to its heat radiation difficulty, is only limitted to the little field such as semiconductor water dispenser, car refrigerator.Air-source water heater and the semiconductor cooling device scope of application are all restricted.Existing semiconductor refrigerating heats the exploitation that technology lays particular emphasis on refrigerating function, and the amount of heat that semiconductor heating end produces rejects heat in air by complicated heat abstractor, and use cost is high, and energy dissipation is large.
CN203177534U discloses a kind of refrigerating circulatory device and outdoor heat source unit, this patent utilization semiconductor refrigerating realizes air conditioner refrigerating, heating and cooling semiconductor chip hot-side heat dissipation is carried out by pressure fan, that heating and cooling semiconductor chip heats the conventional radiating mode of end---air-cooled, the heat radiation of this radiating mode is slow, radiating effect is poor, badly influences the normal operation of system.On the one hand, hold radiating effect poor because heating and cooling semiconductor chip heats, the bulk temperature of heating and cooling semiconductor chip thus can be made to raise, the effect of heating and cooling semiconductor chip refrigeration end can be affected, and then affect the refrigeration of air-conditioning, use this phenomenon in summer of peak period particularly outstanding at air-conditioning.On the other hand, hold radiating effect poor because heating and cooling semiconductor chip heats, thus hot water supply unit recovery heating and cooling semiconductor chip distribute heat efficiency is low, and heat is few, can have a strong impact on the operational effect that this system off heat reclaims.
Utility model content
The technical problems to be solved in the utility model is, overcomes the above-mentioned defect that prior art exists, and providing a kind of can be used for again for the manufacture of hot water the air-source water heater semiconductor cooling device all-in-one that freezes.
The utility model solves the technical scheme that its technical problem adopts:
Air-source water heater semiconductor cooling device all-in-one, comprise compressor, double-tube heat exchanger, heating power expansion valve and evaporimeter, compressor, double-tube heat exchanger, heating power expansion valve are connected by pipeline successively with evaporimeter, also comprise heating and cooling semiconductor chip, semiconductor heat-conducting plate and refrigeration case, the end that heats of heating and cooling semiconductor chip is connected with evaporimeter by semiconductor heat-conducting plate, and the refrigeration end of heating and cooling semiconductor chip is connected with refrigeration case; The side of double-tube heat exchanger is provided with storage tank, and storage tank is provided with hot water mouth and cold water outlet.
Further, be also provided with controller and fan, controller is electrically connected with fan; Described compressor, heating and cooling semiconductor chip are all connected with controller with evaporimeter.
Described controller is connected to four each and every one gauge taps, and one of them gauge tap is connected with fan, for controlling the start-stop of fan; Second gauge tap is connected with compressor, for controlling start-stop and the speed of service of compressor; 3rd gauge tap is connected with heating and cooling semiconductor chip, for controlling the energising cooling and warming work of heating and cooling semiconductor chip; 4th gauge tap is connected with evaporimeter, for controlling the start-stop of evaporimeter.
Further, described semiconductor heat-conducting plate is provided with U-type groove, and the evaporation tube of evaporimeter is placed in the U-type groove of semiconductor heat-conducting plate.
Further, described double-tube heat exchanger comprises cold-producing medium sleeve pipe, phase-change material sleeve pipe and jacket pipe, and cold-producing medium sleeve pipe is located in phase-change material sleeve pipe, and phase-change material sleeve pipe is located in jacket pipe; Cold-producing medium sleeve pipe two ends are respectively equipped with refrigerant inlet end and refrigerant outlet end, and the refrigerant inlet end of cold-producing medium sleeve pipe is connected with the port of export of compressor; The refrigerant outlet end of cold-producing medium sleeve pipe is connected with the entrance point of heating power expansion valve.
Further, described jacket pipe is provided with water inlet and delivery port, and water inlet and the delivery port of jacket pipe stretch in storage tank.
Further, be provided with floor between the outer wall of described cold-producing medium sleeve pipe and the inwall of phase-change material sleeve pipe, between the outer wall of phase-change material sleeve pipe and the inwall of jacket pipe, be also provided with floor.
Further, described cold-producing medium sleeve pipe is built with cold-producing medium, and cold-producing medium is prior art, as carbon-hydrogen refrigerant, ammonia, freon, R-410A cold-producing medium etc.Space between the outer wall of cold-producing medium sleeve pipe and the inwall of phase-change material sleeve pipe is built with phase-change material.Phase-change material is prior art, as PCM, water etc.The bad water that follows in storage tank flows into from water inlet through the jacket pipe of double-tube heat exchanger, flows out from delivery port.
Described compressor, double-tube heat exchanger, heating power expansion valve and evaporimeter form the main circulation loop of air-source water heater semiconductor cooling device all-in-one jointly.Compressor, double-tube heat exchanger, heating power expansion valve, evaporimeter and storage tank form hot water generation component jointly.Heating and cooling semiconductor chip, semiconductor heat-conducting plate and refrigeration case form refrigerating part jointly.
During work, compressor 1 and evaporimeter 2 is opened by controller 7, and start cooling and warming work to heating and cooling semiconductor chip 8 energising, cold-producing medium is transformed into the liquid of low-temp low-pressure through heating power expansion valve, during by evaporimeter, heat in absorption surrounding air and the heat heating end generation of semiconductor, cold-producing medium becomes gas by liquid rotating, then by compressor wasted work, cold-producing medium becomes the liquid of HTHP by gas compression, arrive in double-tube heat exchanger, to the recirculated water heat release in the jacket pipe flowing through double-tube heat exchanger, water temperature in storage tank is raised, finally, cold-producing medium comes back to heating power expansion valve, complete and once circulate, reciprocal with this.The problem that the use that the heat heating end generation due to heating and cooling semiconductor chip can solve air-source water heater limits by region and weather; And ceaselessly circulated by cold-producing medium and can take away the amount of heat heating end generation of heating and cooling semiconductor chip in time, make the refrigeration end of heating and cooling semiconductor chip continue to obtain refrigeration.
The utility model is based on existing air-source water heater, on the basis of air-source water heater, technology is heated in conjunction with semiconductor refrigerating, air-source water heater and semiconductor device are combined, give full play to respective function, also can realize continuing refrigeration while manufacture hot water, can be used for the hot water demand of family and enterprise etc., applied widely.
Accompanying drawing explanation
Fig. 1 is the structural principle schematic diagram of the utility model air-source water heater semiconductor cooling device all-in-one;
Fig. 2 is the perspective view of the semiconductor heat-conducting plate of the semiconductor cooling device of air-source water heater shown in Fig. 1 all-in-one;
Fig. 3 is the profile of the double-tube heat exchanger of the semiconductor cooling device of air-source water heater shown in Fig. 1 all-in-one;
Fig. 4 is the side view of double-tube heat exchanger.
In figure: 1---compressor; 2---evaporimeter; 3---fan; 4---heating power expansion valve; 5---storage tank; 6---double-tube heat exchanger; 6-1---cold-producing medium sleeve pipe; 6-2---phase-change material sleeve pipe; 6-3---jacket pipe; 6-1-1---refrigerant inlet end; 6-1-2---refrigerant outlet end; The water inlet of 6-3-1---jacket pipe; The delivery port of 6-3-2---jacket pipe; 7---controller; 8---heating and cooling semiconductor chip; 9---semiconductor heat-conducting plate; 10---refrigeration case; 11---hot water mouth; 12---cold water outlet; 13---floor; 14---cold-producing medium; 15---phase-change material; 16---follow bad water.
Detailed description of the invention
Below in conjunction with drawings and Examples, the utility model is described in further detail.
With reference to Fig. 1, air-source water heater semiconductor cooling device all-in-one, comprise compressor 1, double-tube heat exchanger 6, heating power expansion valve 4 and evaporimeter 2, compressor 1, double-tube heat exchanger 6, heating power expansion valve 4 are connected by pipeline successively with evaporimeter 2, also comprise heating and cooling semiconductor chip 8, semiconductor heat-conducting plate 9 and refrigeration case 10, the end that heats of heating and cooling semiconductor chip 8 is connected with evaporimeter 2 by semiconductor heat-conducting plate 9, and the refrigeration end of heating and cooling semiconductor chip 8 is connected with refrigeration case 10; Double-tube heat exchanger 6 side is provided with storage tank 5, and storage tank 5 is provided with hot water mouth 11 and cold water outlet 12.
Also be provided with controller 7 and fan 3, controller is electrically connected with fan 3; Described compressor 1, heating and cooling semiconductor chip 8 are all connected with controller 7 with evaporimeter 2.
Described controller 7 is connected to four each and every one gauge taps, and one of them gauge tap is connected with fan 3, for controlling the start-stop of fan; Second gauge tap is connected with compressor 1, for controlling start-stop and the speed of service of compressor; 3rd gauge tap is connected with heating and cooling semiconductor chip 8, for controlling the energising cooling and warming work of heating and cooling semiconductor chip; 4th gauge tap is connected with evaporimeter 2, for controlling the start-stop of evaporimeter 2.
With reference to Fig. 2, described semiconductor heat-conducting plate 9 is provided with U-type groove, and the evaporation tube of evaporimeter 2 is placed in the U-type groove of semiconductor heat-conducting plate 9.
With reference to Fig. 3, Fig. 4, described double-tube heat exchanger 6 comprises cold-producing medium sleeve pipe 6-1, phase-change material sleeve pipe 6-2 and jacket pipe 6-3, and cold-producing medium sleeve pipe 6-1 is located in phase-change material sleeve pipe 6-2, and phase-change material sleeve pipe 6-2 is located in jacket pipe 6-3; Cold-producing medium sleeve pipe 6-1 two ends are respectively equipped with refrigerant inlet end 6-1-1 and refrigerant outlet end 6-1-2, and the refrigerant inlet end 6-1-1 of cold-producing medium sleeve pipe 6-1 is connected with the port of export of compressor 1; The refrigerant outlet end 6-1-2 of cold-producing medium sleeve pipe 6-1 is connected with the entrance point of heating power expansion valve 4.
Described jacket pipe 6-3 is provided with water inlet 6-3-1 and delivery port 6-3-2, and water inlet 6-3-1 and the delivery port 6-3-2 of jacket pipe 6-3 stretch in storage tank 5.
Be provided with floor 13 between the outer wall of described cold-producing medium sleeve pipe 6-1 and the inwall of phase-change material sleeve pipe 6-2, between the outer wall of phase-change material sleeve pipe 6-2 and the inwall of jacket pipe 6-3, be also provided with floor 13.
Described cold-producing medium sleeve pipe 6-1 is built with cold-producing medium 14, and cold-producing medium is prior art, as carbon-hydrogen refrigerant, ammonia, freon, R-410A cold-producing medium etc.Space between the outer wall of cold-producing medium sleeve pipe 6-1 and the inwall of phase-change material sleeve pipe 6-2 is built with phase-change material 15.Phase-change material is prior art, as PCM, water etc.The bad water 16 that follows in storage tank 5 flows into from water inlet 6-3-1 through the jacket pipe 6-3 of double-tube heat exchanger 6, flows out from delivery port 6-3-2.
Described compressor 1, double-tube heat exchanger 6, heating power expansion valve 4 and evaporimeter 2 form the main circulation loop of air-source water heater semiconductor cooling device all-in-one jointly.Compressor 1, double-tube heat exchanger 6, heating power expansion valve 4, evaporimeter 2 and storage tank 5 form hot water generation component jointly.Heating and cooling semiconductor chip 8, semiconductor heat-conducting plate 9 and refrigeration case 10 form refrigerating part jointly.
During work, compressor 1 and evaporimeter 2 is opened by controller 7, and start cooling and warming work to heating and cooling semiconductor chip 8 energising, cold-producing medium is transformed into the liquid of low-temp low-pressure through heating power expansion valve 4, during by evaporimeter 2, heat in absorption surrounding air and the heat heating end generation of heating and cooling semiconductor chip 8, cold-producing medium becomes gas by liquid rotating, then by compressor 1 wasted work, cold-producing medium becomes the liquid of HTHP by gas compression, arrive in double-tube heat exchanger 6, to the recirculated water heat release in the jacket pipe 6-3 flowing through double-tube heat exchanger 6, water temperature in storage tank 5 is raised, finally, cold-producing medium comes back to heating power expansion valve 4, complete and once circulate, reciprocal with this.The problem that the use that the heat heating end generation due to heating and cooling semiconductor chip 8 can solve air-source water heater limits by region and weather; And ceaselessly circulated by cold-producing medium and can take away the amount of heat heating end generation of heating and cooling semiconductor chip 8 in time, make the refrigeration end of heating and cooling semiconductor chip 8 continue to obtain refrigeration.
The air-source water heater semiconductor cooling device all-in-one of the utility model also realizes hot water/refrigeration mode, refrigeration mode and hot-water mode's three kinds of control models by controller 7.
Hot water/refrigeration mode: control compressor 1 by controller 7 and evaporimeter 2 is opened, and control the cooling and warming of heating and cooling semiconductor chip 8, by evaporimeter 2, heating and cooling semiconductor chip 8 is heated the heat efficient absorption of end periphery, and be hot water by its converting heat, realize energy-conservation; Because heating and cooling semiconductor chip 8 heats the efficient release of end heat, heating and cooling semiconductor chip 8 refrigeration improves, and promotes refrigeration.This pattern was both conducive to semiconductor refrigerating, and the heat absorption being beneficial to again air energy heats, and is integrated the optimal mode of machine advantage.
Refrigeration mode: control by controller 7 cooling and warming that fan 3 opens and control heating and cooling semiconductor chip 8, heating and cooling semiconductor chip 8 refrigeration end provides refrigeration; By fan 3, heating and cooling semiconductor chip 8 is heated the thermal release of end periphery, keep the efficiency of refrigeration; Be refrigeration to work independently pattern.If this refrigerating state can not reach refrigeration requirement, or heating and cooling semiconductor chip 8 heats end heat accumulation, cannot discharge, then start low speed hot-water mode, control compressor 1 and evaporimeter 2 enter low cruise, heating and cooling semiconductor chip 8 is heated end heat absorption in evaporimeter 2, can effectively promote semiconductor refrigerating effect.
Hot-water mode: control compressor 1 by controller 7 and evaporimeter 2 is opened, is absorbed the heat in air, is translated into hot water by evaporimeter 2.Be hot water generation component to work independently pattern.
Above detailed introduction is done to a kind of preferred embodiment of the present utility model.Described detailed description of the invention just understands core concept of the present utility model for helping.It should be pointed out that for those skilled in the art, under the prerequisite not departing from the utility model principle, can also carry out some improvement and modification to the utility model, these improve and modify the protection domain also belonging to the utility model claim.
Claims (6)
1. air-source water heater semiconductor cooling device all-in-one, it is characterized in that, comprise compressor, double-tube heat exchanger, heating power expansion valve and evaporimeter, compressor, double-tube heat exchanger, heating power expansion valve are connected by pipeline successively with evaporimeter, also comprise heating and cooling semiconductor chip, semiconductor heat-conducting plate and refrigeration case, the end that heats of heating and cooling semiconductor chip is connected with evaporimeter by semiconductor heat-conducting plate, and the refrigeration end of heating and cooling semiconductor chip is connected with refrigeration case; The side of double-tube heat exchanger is provided with storage tank, and storage tank is provided with hot water mouth and cold water outlet.
2. air-source water heater semiconductor cooling device all-in-one according to claim 1, it is characterized in that, be also provided with controller and fan, controller is electrically connected with fan; Described compressor, heating and cooling semiconductor chip are all connected with controller with evaporimeter.
3. air-source water heater semiconductor cooling device all-in-one according to claim 1 and 2, is characterized in that, described semiconductor heat-conducting plate is provided with U-type groove, and the evaporation tube of evaporimeter is placed in the U-type groove of semiconductor heat-conducting plate.
4. air-source water heater semiconductor cooling device all-in-one according to claim 1 and 2, it is characterized in that, described double-tube heat exchanger comprises cold-producing medium sleeve pipe, phase-change material sleeve pipe and jacket pipe, and cold-producing medium sleeve pipe is located in phase-change material sleeve pipe, and phase-change material sleeve pipe is located in jacket pipe; Cold-producing medium sleeve pipe two ends are respectively equipped with refrigerant inlet end and refrigerant outlet end, and the refrigerant inlet end of cold-producing medium sleeve pipe is connected with the port of export of compressor; The refrigerant outlet end of cold-producing medium sleeve pipe is connected with the entrance point of heating power expansion valve.
5. air-source water heater semiconductor cooling device all-in-one according to claim 4, it is characterized in that, described jacket pipe is provided with water inlet and delivery port, and water inlet and the delivery port of jacket pipe stretch in storage tank.
6. air-source water heater semiconductor cooling device all-in-one according to claim 4, it is characterized in that, be provided with floor between the outer wall of described cold-producing medium sleeve pipe and the inwall of phase-change material sleeve pipe, between the outer wall of phase-change material sleeve pipe and the inwall of jacket pipe, be also provided with floor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520928131.6U CN205137905U (en) | 2015-11-20 | 2015-11-20 | Air can water heater semiconductor refrigerator all -in -one |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520928131.6U CN205137905U (en) | 2015-11-20 | 2015-11-20 | Air can water heater semiconductor refrigerator all -in -one |
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| Publication Number | Publication Date |
|---|---|
| CN205137905U true CN205137905U (en) | 2016-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520928131.6U Expired - Fee Related CN205137905U (en) | 2015-11-20 | 2015-11-20 | Air can water heater semiconductor refrigerator all -in -one |
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| Country | Link |
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| CN (1) | CN205137905U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109405343A (en) * | 2018-10-19 | 2019-03-01 | 宁波工程学院 | A kind of refrigerator and phase-changing energy-storing hot water coupling system |
| CN113606814A (en) * | 2021-07-26 | 2021-11-05 | 南华大学 | Water-cooling air energy heat exchange tower heat pump system |
-
2015
- 2015-11-20 CN CN201520928131.6U patent/CN205137905U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109405343A (en) * | 2018-10-19 | 2019-03-01 | 宁波工程学院 | A kind of refrigerator and phase-changing energy-storing hot water coupling system |
| CN113606814A (en) * | 2021-07-26 | 2021-11-05 | 南华大学 | Water-cooling air energy heat exchange tower heat pump system |
| CN113606814B (en) * | 2021-07-26 | 2022-08-26 | 南华大学 | Water-cooling air energy heat exchange tower heat pump system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160406 Termination date: 20161120 |