CN211085626U - High-temperature test fixture for high-power laser - Google Patents
High-temperature test fixture for high-power laser Download PDFInfo
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- CN211085626U CN211085626U CN201922135161.2U CN201922135161U CN211085626U CN 211085626 U CN211085626 U CN 211085626U CN 201922135161 U CN201922135161 U CN 201922135161U CN 211085626 U CN211085626 U CN 211085626U
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Abstract
The utility model provides a high-power laser high-temperature test fixture, including laser instrument, connecting plate, two sockets, semiconductor refrigeration piece, scattered cold unit and power, the bilateral symmetry of laser instrument is provided with two sets of pins, sets up the window that runs through on the connecting plate, and window one side is provided with the semiconductor refrigeration piece, and the semiconductor refrigeration piece is fixed with the connecting plate relatively; the laser penetrates through the window and abuts against the hot end of the semiconductor refrigerating sheet; the cold end of the semiconductor refrigerating sheet is provided with a cold dissipating unit which is fixedly connected with the semiconductor refrigerating sheet; two sockets are arranged on the connecting plate at the other side of the window; the two sockets are fixedly connected with the connecting plate and are respectively and electrically connected with the two groups of pins of the laser; the socket, the semiconductor refrigerating sheet and the cold dissipating unit are electrically connected with a power supply. The utility model discloses a set up semiconductor refrigeration piece, scattered cold unit and socket in connecting plate both sides, realize efficient electric heat conversion, the socket can reliably be fixed to the laser instrument.
Description
Technical Field
The utility model relates to a laser equipment technical field especially relates to a high-power laser instrument high temperature test anchor clamps.
Background
The high-power semiconductor laser has high reliability and high stability, is widely applied to the fields of optical storage, optical communication, national defense, industry, medical treatment and the like, and has the advantages of 635-1653 nm of output laser wavelength and large power adjustable range. In most application environments, the reliability of high power lasers is a determining factor, and is directly related to the quality of the laser.
In the reliability assessment of the high-power laser, an electrical aging test is usually adopted, that is, the change of the power output of the high-power laser in an aging device is observed under a certain current or the increase condition of the driving current of the laser is observed under a certain output power, and when the output power of the device is reduced to half of an initial value or the driving circuit is increased to 1.5 times of the initial value, the laser is considered to be failed. The service life of the laser at normal temperature is long, and in order to shorten the aging time, an aging acceleration method can be adopted, namely, the working temperature and the input current are increased when the laser works, and the service life of the laser at normal temperature is calculated according to the service life of the laser at high temperature. The existing high-temperature test equipment for the high-power laser is large in size and low in heat efficiency.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a compact structure, high-power laser instrument high temperature test fixture that thermal efficiency is high.
The technical scheme of the utility model is realized like this: the utility model provides a high-power laser high-temperature test fixture, including laser instrument (1), the bilateral symmetry of laser instrument (1) is provided with two sets of pins (11), still includes connecting plate (2), two sockets (3), semiconductor refrigeration piece (4), scattered cold unit (5) and power (6), has seted up the window (21) that runs through on connecting plate (2), and window (21) one side is provided with semiconductor refrigeration piece (4), and semiconductor refrigeration piece (4) and connecting plate (2) are relatively fixed; the laser (1) penetrates through the window (21) and is abutted against the hot end of the semiconductor refrigerating sheet (4); the cold end of the semiconductor refrigeration sheet (4) is provided with a cold dissipating unit (5), and the cold dissipating unit (5) is fixedly connected with the semiconductor refrigeration sheet (4); two sockets (3) are arranged on the connecting plate (2) at the other side of the window (21); the two sockets (3) are fixedly connected with the connecting plate (2), and the two sockets (3) are respectively electrically connected with the two groups of pins (11) of the laser (1) in a one-to-one correspondence manner; the socket (3), the semiconductor refrigerating sheet (4) and the cold dissipating unit (5) are electrically connected with the power supply (6).
On the basis of the technical scheme, preferably, the socket (3) is provided with a plurality of slots (31), each pin (11) penetrates through the slots (31) and is in contact with the inner side surface of each slot (31), electrodes are arranged in the slots (31), and the pins (11) are electrically connected with the electrodes.
Preferably, the socket (3) further comprises a first clamping plate (32) and a second clamping plate (33), the first clamping plate (32) and the second clamping plate (33) are respectively arranged at two ends of the socket (3), one end, close to the socket (3), of the first clamping plate (32) is hinged to the socket (3), and one end, far away from the socket (3), of the first clamping plate (32) presses the pins (11) in the slots (31); one end of the second clamping plate (33) close to the socket (3) is hinged with the socket (3), and one end of the second clamping plate (33) far away from the socket (3) is propped against the surface of the first clamping plate (32).
More preferably, the outer surface of the first clamping plate (32) is provided with a limiting groove (34), the second clamping plate (33) is correspondingly provided with a limiting part (35), the limiting part (35) is matched with the limiting groove (34) in shape, and the limiting part (35) is buckled in the limiting groove (34).
On the basis of the technical scheme, preferably, the hot end of the semiconductor refrigerating piece (4) is further provided with a first heat conducting plate (7), the first heat conducting plate (7) is fixedly connected with the connecting plate (2) and the semiconductor refrigerating piece (4) respectively, and the first heat conducting plate (7) is further abutted to the surface of the laser (1).
Further preferably, the cold end of the semiconductor refrigeration piece (4) is further provided with a second heat conduction plate (8), and the second heat conduction plate (8) is fixedly connected with the semiconductor refrigeration piece (4) and the cold dissipation unit (5) respectively.
Further preferably, the heat-insulating plate comprises a heat-insulating plate (9), the heat-insulating plate (9) is arranged between the first heat-conducting plate (7) and the second heat-conducting plate (8), and two end faces of the heat-insulating plate (9) respectively abut against the adjacent surfaces of the first heat-conducting plate (7) and the second heat-conducting plate (8).
More preferably, the first heat-conducting plate (7) and the second heat-conducting plate (8) are made of red copper.
On the basis of the technical scheme, preferably, the cold dissipation unit (5) comprises a cold dissipation seat (51) and a fan (52), and the cold dissipation seat (51) is fixedly connected with the cold end of the semiconductor refrigeration sheet (4); a plurality of fins (53) are equidistantly arranged on the cooling dissipation seat (51), a fan (52) is fixedly arranged on the side surface of the cooling dissipation seat (51), and the air outlet direction of the fan (52) is perpendicular to the extending direction of the fins (53).
The utility model provides a pair of high-power laser instrument high temperature test fixture for prior art, has following beneficial effect:
(1) the utility model realizes high-efficiency electric heat conversion by arranging the semiconductor refrigeration sheet, the cooling unit and the socket on two sides of the connecting plate, the socket can reliably fix the laser, and the volume and the power consumption of the clamp are lower than those of the existing equipment;
(2) the first clamping plate and the second clamping plate can accurately position the laser and the pins thereof, so that the bottom surface of the laser can be in full contact with the hot end of the semiconductor refrigerating sheet and is fixed in position;
(3) the first heat-conducting plate and the second heat-conducting plate can further improve the heat exchange efficiency;
(4) the heat insulating plate between the first heat conducting plate and the second heat conducting plate can play a heat insulating role on one hand, and can limit the distance between the first heat conducting plate and the second heat conducting plate on the other hand, so that the semiconductor refrigerating piece is prevented from being crushed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a perspective view of a high-power laser high-temperature testing fixture according to the present invention;
FIG. 2 is a front view of the high temperature testing fixture for high power laser of the present invention;
FIG. 3 is a perspective view showing the combination state of the laser, the connecting plate, the socket, the semiconductor cooling plate, the first heat-conducting plate, the second heat-conducting plate and the heat-insulating plate of the high-power laser high-temperature testing fixture of the present invention;
FIG. 4 is a top view of FIG. 3;
FIG. 5 is a perspective view of FIG. 3 in an exploded state;
fig. 6 is a right side view of fig. 5.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.
As shown in fig. 1 combined with fig. 2 and fig. 3, the utility model provides a high-power laser high-temperature test fixture, which comprises a laser 1, a connecting plate 2, two sockets 3, a semiconductor refrigeration piece 4, a cooling unit 5, a power supply 6, a first heat-conducting plate 7, a second heat-conducting plate 8 and a heat-insulating plate 9; two groups of pins 11 are symmetrically arranged on two sides of a laser 1, a penetrating window 21 is formed in a connecting plate 2, a semiconductor refrigerating piece 4 is arranged on one side of the window 21, and the semiconductor refrigerating piece 4 and the connecting plate 2 are relatively fixed; the laser 1 penetrates through the window 21 and is abutted against the hot end of the semiconductor refrigerating sheet 4; the cold end of the semiconductor refrigerating sheet 4 is provided with a cold dissipating unit 5, and the cold dissipating unit 5 is fixedly connected with the semiconductor refrigerating sheet 4; two sockets 3 are arranged on the connecting plate 2 at the other side of the window 21; the two sockets 3 are fixedly connected with the connecting plate 2, and the two sockets 3 are respectively electrically connected with the two groups of pins 11 of the laser 1 in a one-to-one correspondence manner; the socket 3, the semiconductor refrigerating sheet 4 and the cold dissipating unit 5 are electrically connected with a power supply 6. As can be seen from the figure, the semiconductor refrigeration piece 4 is adopted as a heat source, and after voltage is applied to the semiconductor refrigeration piece 4, the hot end of the semiconductor refrigeration piece 4 is in full contact with the surface of the laser 1 for heat transfer; the cold dissipation unit 5 dissipates cold to maintain the temperature difference between the cold end and the hot end, so that the hot end can reach the required temperature. The sockets 3 are respectively connectable to the pins 11 to provide the current required for operation of the laser 1. The power supply 6 supplies electric energy to the socket 3, the semiconductor refrigerating sheet 4 and the cold dissipating unit 5. The semiconductor cooling fin 4 is made of a semiconductor material by the peltier effect, and when a direct current voltage is applied, one end of the fin radiates heat and the other end absorbs heat.
As shown in fig. 1 and fig. 3, the socket 3 is provided with a plurality of slots 31, each pin 11 is inserted into the slot 31 and contacts with an inner side surface of the slot 31, the slots 31 are provided with electrodes, and the pins 11 are electrically connected with the electrodes. The electrodes are not shown and are embedded in the socket 31, and when the pins 11 contact the surface of the socket 31, the electrodes will contact the electrodes to provide driving signals for the pins.
As a further improvement of the present invention, in order to further limit the relative position between the laser 1 and the socket 3, the bottom surface of the laser 1 is in contact with the semiconductor refrigeration sheet 4 more closely; the socket 3 further comprises a first clamping plate 32 and a second clamping plate 33, the first clamping plate 32 and the second clamping plate 33 are respectively arranged at two ends of the socket 3, one end of the first clamping plate 32 close to the socket 3 is hinged with the socket 3, and one end of the first clamping plate 32 far away from the socket 3 presses the pins 11 in the slots 31; one end of the second card board 33 close to the socket 3 is hinged with the socket 3, and one end of the second card board 33 far from the socket 3 is abutted against the surface of the first card board 32. As can be seen in FIG. 3, the surface of the first card 32 will press against the surface of the pins 11, and the second card 33 is used to fix the position of the first card 32.
As a preferable structure of the above-mentioned scheme, the outer surface of the first card board 32 is provided with a limit groove 34, the second card board 33 is correspondingly provided with a limit part 35, the shape of the limit part 35 is matched with that of the limit groove 34, and the limit part 35 is buckled in the limit groove 34.
As shown in fig. 3 and 5, as the utility model discloses a further improvement, for further improving the heat exchange efficiency of semiconductor refrigeration piece 4, the hot junction of semiconductor refrigeration piece 4 still is provided with first heat-conducting plate 7, first heat-conducting plate 7 respectively with connecting plate 2 and semiconductor refrigeration piece 4 fixed connection, first heat-conducting plate 7 still supports with the surface counterbalance of laser instrument 1.
Similarly, the cold end of the semiconductor refrigeration piece 4 is also provided with a second heat conduction plate 8, and the second heat conduction plate 8 is fixedly connected with the semiconductor refrigeration piece 4 and the cold dissipation unit 5 respectively. The material of the first heat-conducting plate 7 and the second heat-conducting plate 8 is preferably red copper.
As shown in fig. 5, the utility model discloses still include heat insulating board 9, heat insulating board 9 sets up between first heat-conducting plate 7 and second heat-conducting plate 8, and the both ends face of heat insulating board 9 supports respectively and holds at the adjacent surface of first heat-conducting plate 7 and second heat-conducting plate 8. As shown in the figure, the second heat-conducting plate 8 is provided with a groove, the heat-insulating plate 9 can be embedded in the groove, the heat-insulating plate 9 can play a heat-insulating role on one hand, and can limit the distance between the first heat-conducting plate 7 and the second heat-conducting plate 8 on the other hand, so that the semiconductor refrigerating plate 4 is prevented from being crushed by external force.
As shown in fig. 1 and fig. 2, the cooling unit 5 of the present invention includes a cooling seat 51 and a fan 52, wherein the cooling seat 51 is fixedly connected to the cold end of the semiconductor cooling plate 4; a plurality of fins 53 are equidistantly arranged on the cooling base 51, a fan 52 is fixedly arranged on the side surface of the cooling base 51, and the air outlet direction of the fan 52 is perpendicular to the extending direction of the fins 53. The cold unit 5 can stabilize the temperature difference between the hot end and the cold end of the semiconductor refrigerating sheet 4, and improve the heating efficiency of the semiconductor refrigerating sheet 4.
The utility model discloses compact structure, heat exchange efficiency is higher, is suitable for long-term steady operation under the environment to the high temperature test of high-power laser instrument.
In addition, as shown in fig. 1, a second heat insulation plate is also arranged above the connection plate 2, the second heat insulation plate is annular, an RS232 interface can be arranged on the second heat insulation plate, and the RS232 interface is electrically connected with the socket 3 after level conversion, so that a control function is realized; an optical fiber interface is arranged on the laser 1, and a notch for passing optical fibers is correspondingly arranged on the second heat insulation plate.
In order to improve the automation level of the utility model, a temperature sensor can be arranged on the first heat-conducting plate 7, a controller is controlled on the second heat-insulating plate, and the controller is electrically connected with the temperature sensor, the semiconductor refrigerating sheet 4 and the cooling unit 5; the temperature sensor is used for detecting real-time temperature, and the controller is used for controlling the semiconductor refrigerating sheet 4 and the cold dissipating unit 5 to be started or closed, so that the temperature control is better realized.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The utility model provides a high-power laser instrument high temperature test fixture, includes laser instrument (1), the bilateral symmetry of laser instrument (1) is provided with two sets of pins (11), its characterized in that: the refrigerator is characterized by further comprising a connecting plate (2), two sockets (3), semiconductor refrigerating pieces (4), a cold dissipating unit (5) and a power supply (6), wherein a penetrating window (21) is formed in the connecting plate (2), the semiconductor refrigerating pieces (4) are arranged on one side of the window (21), and the semiconductor refrigerating pieces (4) are relatively fixed with the connecting plate (2); the laser (1) penetrates through the window (21) and is abutted against the hot end of the semiconductor refrigerating sheet (4); the cold end of the semiconductor refrigeration sheet (4) is provided with a cold dissipating unit (5), and the cold dissipating unit (5) is fixedly connected with the semiconductor refrigeration sheet (4); two sockets (3) are arranged on the connecting plate (2) at the other side of the window (21); the two sockets (3) are fixedly connected with the connecting plate (2), and the two sockets (3) are respectively electrically connected with the two groups of pins (11) of the laser (1) in a one-to-one correspondence manner; the socket (3), the semiconductor refrigerating sheet (4) and the cold dissipating unit (5) are electrically connected with the power supply (6).
2. The high-power laser high-temperature test fixture as claimed in claim 1, wherein: the socket (3) is provided with a plurality of slots (31), each pin (11) penetrates through the slots (31) and is in contact with the inner side face of each slot (31), electrodes are arranged in the slots (31), and the pins (11) are electrically connected with the electrodes.
3. The high-power laser high-temperature test fixture as claimed in claim 2, wherein: the socket (3) further comprises a first clamping plate (32) and a second clamping plate (33), the first clamping plate (32) and the second clamping plate (33) are respectively arranged at two ends of the socket (3), one end, close to the socket (3), of the first clamping plate (32) is hinged with the socket (3), and one end, far away from the socket (3), of the first clamping plate (32) presses the pins (11) in the slots (31); one end of the second clamping plate (33) close to the socket (3) is hinged with the socket (3), and one end of the second clamping plate (33) far away from the socket (3) is propped against the surface of the first clamping plate (32).
4. The high-power laser high-temperature test fixture as claimed in claim 3, wherein: the outer surface of the first clamping plate (32) is provided with a limiting groove (34), the second clamping plate (33) is correspondingly provided with a limiting part (35), the limiting part (35) is matched with the limiting groove (34) in shape, and the limiting part (35) is buckled in the limiting groove (34).
5. The high-power laser high-temperature test fixture as claimed in claim 1, wherein: the hot junction of semiconductor refrigeration piece (4) still is provided with first heat-conducting plate (7), first heat-conducting plate (7) respectively with connecting plate (2) and semiconductor refrigeration piece (4) fixed connection, first heat-conducting plate (7) still with the surperficial counterbalance of laser instrument (1).
6. The high-power laser high-temperature test fixture as claimed in claim 5, wherein: the cold end of semiconductor refrigeration piece (4) still is provided with second heat-conducting plate (8), second heat-conducting plate (8) respectively with semiconductor refrigeration piece (4) and loose cold unit (5) fixed connection.
7. The high-power laser high-temperature test fixture as claimed in claim 6, wherein: the heat-insulating plate is characterized by further comprising a heat-insulating plate (9), wherein the heat-insulating plate (9) is arranged between the first heat-conducting plate (7) and the second heat-conducting plate (8), and two end faces of the heat-insulating plate (9) are respectively abutted against the adjacent surfaces of the first heat-conducting plate (7) and the second heat-conducting plate (8).
8. The high-power laser high-temperature test fixture as claimed in claim 6, wherein: the first heat-conducting plate (7) and the second heat-conducting plate (8) are made of red copper.
9. The high-power laser high-temperature test fixture as claimed in claim 1, wherein: the cold dissipation unit (5) comprises a cold dissipation seat (51) and a fan (52), and the cold dissipation seat (51) is fixedly connected with the cold end of the semiconductor refrigeration sheet (4); a plurality of fins (53) are equidistantly arranged on the cooling dissipation seat (51), a fan (52) is fixedly arranged on the side surface of the cooling dissipation seat (51), and the air outlet direction of the fan (52) is perpendicular to the extending direction of the fins (53).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922135161.2U CN211085626U (en) | 2019-12-03 | 2019-12-03 | High-temperature test fixture for high-power laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922135161.2U CN211085626U (en) | 2019-12-03 | 2019-12-03 | High-temperature test fixture for high-power laser |
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| Publication Number | Publication Date |
|---|---|
| CN211085626U true CN211085626U (en) | 2020-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922135161.2U Active CN211085626U (en) | 2019-12-03 | 2019-12-03 | High-temperature test fixture for high-power laser |
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| CN (1) | CN211085626U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114964726A (en) * | 2022-07-27 | 2022-08-30 | 北京凯普林光电科技股份有限公司 | Laser subassembly high temperature automatic test carrier |
| CN115684675A (en) * | 2022-11-17 | 2023-02-03 | 镭神技术（深圳）有限公司 | Miniature semiconductor refrigerating sheet aging clamp and power-on and temperature acquisition method |
-
2019
- 2019-12-03 CN CN201922135161.2U patent/CN211085626U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114964726A (en) * | 2022-07-27 | 2022-08-30 | 北京凯普林光电科技股份有限公司 | Laser subassembly high temperature automatic test carrier |
| CN114964726B (en) * | 2022-07-27 | 2022-10-21 | 北京凯普林光电科技股份有限公司 | Laser subassembly high temperature automatic test carrier |
| CN115684675A (en) * | 2022-11-17 | 2023-02-03 | 镭神技术（深圳）有限公司 | Miniature semiconductor refrigerating sheet aging clamp and power-on and temperature acquisition method |
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