CN218215208U - Heating device for aging test of crimping type IGBT device - Google Patents
Heating device for aging test of crimping type IGBT device Download PDFInfo
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- CN218215208U CN218215208U CN202123300331.1U CN202123300331U CN218215208U CN 218215208 U CN218215208 U CN 218215208U CN 202123300331 U CN202123300331 U CN 202123300331U CN 218215208 U CN218215208 U CN 218215208U
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Abstract
The utility model relates to a crimping formula IGBT device heating device for aging testing. The compression heating component comprises a compression heating part and a radiating part which is in adaptive connection with the compression heating part; for the compression-joint type IGBT device during aging test, the compression heating part in the compression heating assembly can be in close contact with the corresponding side face of the compression-joint type IGBT device, so that the compression heating part is utilized to compress the compression-joint type IGBT device and simultaneously heat the compression heating part, and meanwhile, the compression heating part in adaptive connection is utilized to dissipate heat, so that the compression-joint type IGBT device is stabilized in a required temperature state after being heated. The utility model discloses can effectively satisfy the control by temperature change demand of crimping formula IGBT device, improve the stability and the reliability of crimping formula IGBT device when aging testing.
Description
Technical Field
The utility model relates to a heating device, especially a crimping formula IGBT device heating device for aging testing.
Background
At present, a crimping type IGBT device becomes a key core device of an extra-high voltage flexible direct current transmission (HVDC), a static var generator (VSG), a static synchronous compensator (STATCOM) and the like. Because the reliability of the power grid is very high due to the unique application condition, the power grid must reliably present the short-circuit characteristic even if the power grid fails, otherwise the power grid is paralyzed, and serious economic loss is caused.
Compared with the traditional welding type IGBT device, the crimping type IGBT device has the following main characteristics: 1) The current and voltage capacity is large, the maximum voltage and current capacity of the existing Hitachi ABB crimping product are 5200V and 3000A respectively, and the short-circuit current of the product reaches 18000A; 2) The pressure of 130kN is required to be applied when the chip-packaging-radiator is used, because the compression joint type device has no bonding lead, and the external pressure is required to realize good electrical contact and thermal contact among the chip, the packaging and the radiator; 3) And a short circuit condition after failure, due to the need to have the failed device in short circuit conditions in certain applications, HVDC, VSG and STATCOM.
Burn-in is a type of testing method used for semiconductor device quality evaluation, and generally involves placing the device under test in a harsh environment in which the device's useful life is evaluated. For example, HTGB, HTRB, H commonly used for reliability test of power semiconductor module 3 TRB test.
When burn-in testing power semiconductor devices, it is often necessary to keep the devices at a constant higher temperature. At present, the known heating forms include high temperature test box heating of finished products, heating plate heating (high temperature liquid is circulated inside or a heating rod is placed inside) or high temperature radiation heating; these heating methods have been used in a wide variety of applications in the industry and are not described in detail herein. As for the crimping type IGBT device, because the power of the crimping type IGBT device is very high, the self heating power is also very high when the crimping type IGBT device is subjected to an aging test, and when the crimping type IGBT device is tested by using a traditional temperature control mode, the temperature of the aging test of the crimping type IGBT device cannot be constant, because the crimping type IGBT device generates heat seriously and the heat dissipation capability of the traditional temperature control is limited, thermal runaway is finally caused, and the test requirement on the crimping type IGBT device is difficult to meet.
Disclosure of Invention
The utility model aims at overcoming the not enough of existence among the prior art, providing a crimping formula IGBT device is heating device for aging testing, its control by temperature change demand that can effectively satisfy crimping formula IGBT device improves crimping formula IGBT device stability and reliability when aging testing.
According to the technical scheme provided by the utility model, the heating device for the aging test of the crimping type IGBT device comprises compression heating components symmetrically distributed on two sides of the crimping type IGBT device, wherein each compression heating component comprises a compression heating part and a radiating part which is in adaptive connection with the compression heating part;
the compression joint type IGBT device during aging test can be in close contact with the corresponding side face of the compression joint type IGBT device through the compression heating part in the compression heating assembly, so that the compression heating part is utilized to compress the compression joint type IGBT device and heat the compression joint type IGBT device, meanwhile, the compression heating part in adaptive connection is utilized to dissipate heat, and the compression joint type IGBT device is stabilized in a required temperature state after being heated.
The compression heating part comprises a compression heating shell and a plurality of heating rods arranged in the compression heating shell;
the heat dissipation part comprises a radiator and a plurality of heat pipes which are in adaptive connection with the radiator, evaporation ends of the heat pipes extend into the compression heating shell, and condensation ends of the heat pipes are in adaptive connection with the radiator.
Set up a plurality of heating rod locating areas and a plurality of heat pipe locating areas with the heat pipe adaptation with the heating rod adaptation in compressing tightly the heating shell, be located the heating rod in heating rod locating area and be located heat pipe locating area heat pipe evenly distributed in compressing tightly the heating shell.
The compression heating shell comprises a lower shell and an upper shell matched with the lower shell, and a rod body groove matched with the heating rod and a heat pipe groove matched with the heat pipe are arranged in the upper shell and the lower shell;
the upper shell is pressed on the lower shell, the rod grooves and the heat pipe grooves in the upper shell are in one-to-one positive correspondence with the rod grooves and the heat pipe grooves in the lower shell respectively, so that the rod grooves in the upper shell and the rod grooves in the lower shell which are in positive correspondence form a heating rod positioning area; meanwhile, a heat pipe positioning area is formed by utilizing the heat pipe grooves in the upper shell and the heat pipe grooves which are right correspondingly in the lower shell.
And a heat conduction connector is filled between the heat pipe and/or the heating rod and the pressing heating shell, and the heat conduction connector comprises heat conduction silica gel or a heat conduction pad.
The radiator comprises a plurality of radiating fins sleeved on the heat pipe, and the radiating fins are uniformly distributed on the heat pipe;
the radiator is also provided with a forced air cooling device which is used for being corresponding to the radiator, and the radiator can be air-cooled by the forced air cooling device.
The device is characterized by further comprising a temperature controller for controlling the working state of the heating rod in the compression heating shell and a device temperature sensor for detecting the temperature state of the compression-joint type IGBT device, wherein the temperature controller is electrically connected with the device temperature sensor and the forced air cooling device.
The compression heating shell is box-shaped.
One or two radiators are arranged in the heat dissipation part, and when two radiators are arranged in the heat dissipation part, the two radiators are distributed on two sides of the compression heating shell.
The utility model has the advantages that: the pressing and heating components are arranged on two sides of the crimping type IGBT device, the pressing and heating parts are in close contact with corresponding side faces of the crimping type IGBT device, so that the pressing and heating parts can be used for pressing the crimping type IGBT device and heating the crimping type IGBT device at the same time, and meanwhile, the heat dissipation parts are used for dissipating heat of the pressing and heating parts which are matched and connected, so that the crimping type IGBT device is stabilized in a required temperature state after being heated; the heat dissipation part can be used for achieving heat dissipation of the pressing and heating part, and after the heat dissipation of the pressing and heating part is achieved, heat balance of the crimping type IGBT device in the aging test can be achieved, so that the crimping type IGBT device is stabilized in a required temperature state after being heated, and stability and reliability of the crimping type IGBT device in the aging test are improved.
Drawings
Fig. 1 is a schematic diagram of the utility model when heating the crimping type IGBT device.
Fig. 2 is an exploded view of the present invention when combined with a crimping IGBT device.
Fig. 3 is an exploded view of the compression heating assembly of the present invention.
Description of the reference numerals: the device comprises a 1-compression joint type IGBT device, a 2-compression heating shell, a 3-heat pipe, a 4-radiator, a 5-upper shell, a 6-lower shell, a 7-heating rod, an 8-rod groove and a 9-heat pipe groove.
Detailed Description
The present invention will be further described with reference to the following specific drawings and examples.
As shown in fig. 1 and 2: in order to effectively meet the temperature control requirement of the crimping type IGBT device 1 and improve the stability and reliability of the crimping type IGBT device 1 during aging test, the utility model comprises compression heating components symmetrically distributed on two sides of the crimping type IGBT device 1, wherein each compression heating component comprises a compression heating part and a radiating part which is in adaptive connection with the compression heating part;
to crimping formula IGBT device 1 during aging testing, can be with crimping formula IGBT device 1 corresponding side in close contact with through the portion of compressing tightly the heating of compressing tightly in the heating element to utilize the portion of compressing tightly heating to carry out required heating when crimping formula IGBT device 1 compresses tightly, simultaneously, utilize the radiating part to dispel the heat to the portion of compressing tightly heating of adaptation connection, so that stabilize required temperature state after heating crimping formula IGBT device 1.
Specifically, the crimping IGBT device 1 may specifically adopt a conventional form, which is well known to those skilled in the art and will not be described herein again. In order to meet the requirement of aging test of the crimping type IGBT device 1, two sides of the crimping type IGBT device 1 are respectively provided with a pressing heating component, namely, any side of the crimping type IGBT device 1 is in adaptive connection with one pressing heating component.
In specific implementation, the compression heating assembly comprises a compression heating part and a radiating part, wherein when the compression IGBT device 1 is subjected to aging test, the compression heating part can be in close contact with the corresponding side face of the compression IGBT1, after the corresponding side face of the compression IGBT device 1 is in close contact, compression acting force can be provided for the contacted side face, and the compression IGBT device 1 can be heated at the same time. As can be seen from the above description, the crimping IGBT device 1 also radiates heat during the aging test, in order to meet the temperature control requirement for the crimping IGBT device 1, a heat radiating portion is connected to any one of the compression heating portions, the heat radiation for the compression heating portions can be realized by using the heat radiating portion, after the heat radiation for the compression heating portions, the thermal balance of the crimping IGBT device 1 during the aging test can be realized, so that the crimping IGBT device 1 is stabilized at a desired temperature state after being heated, and the stability and reliability of the crimping IGBT device 1 during the aging test are improved.
Further, the compressing and heating part comprises a compressing and heating shell 2 and a plurality of heating rods 7 arranged in the compressing and heating shell 2;
the heat dissipation part comprises a radiator 4 and a plurality of heat pipes 3 which are in adaptive connection with the radiator 4, evaporation ends of the heat pipes 3 extend into the compression heating shell 2, and condensation ends of the heat pipes 3 are in adaptive connection with the radiator 4.
The embodiment of the utility model provides an in, it is box-like to compress tightly heating shell 2, and of course, compresses tightly heating shell 2 and can also adopt other shapes, and the concrete shape that compresses tightly heating shell 2 can be selected as required, and here is no longer repeated. When the pressing and heating part is in close contact with the corresponding side face of the crimping type IGBT device 1, specifically, the pressing and heating shell 2 is in close contact with the corresponding side face of the crimping type IGBT device 1, therefore, the surface of the pressing and heating shell 2 in contact with the crimping type IGBT device 1 needs to be adapted to the side face of the crimping type IGBT device 1 in contact, and the stability of the pressing and heating shell 2 in contact with the side face of the crimping type IGBT device 1 and the stability and reliability of the crimping type IGBT device 1 in the heating process can be improved.
In order to heat the crimping type IGBT device 1, a plurality of heating rods 7 are arranged in the compression heating housing 2, and the heating rods 7 may specifically adopt a conventional form, and may specifically be selected as needed. For the heat dissipation part, the heat dissipation part comprises a radiator 4, wherein the radiator 4 is in adaptive connection with the compression heating shell 2 through a heat pipe 3, an evaporation end of the heat pipe 3 extends into the compression heating shell 2, and a condensation end of the heat pipe 3 is in adaptive connection with the radiator 4.
In specific implementation, the heat pipe 3 may adopt an existing common form, and generally, the heat pipe 3 utilizes a phase change process of medium evaporation at an evaporation end and condensation at a cold end (i.e., utilizes evaporation heat absorption and condensation heat dissipation of liquid) to quickly conduct heat. The interior of the heat pipe 3 is pumped into a negative pressure state and filled with proper liquid, and the liquid has a low boiling point and is easy to volatilize. The manner of achieving rapid heat transfer through the heat pipe 3 is consistent with the prior art and is well known to those skilled in the art, and will not be described herein. Compress tightly the heat accessible heat pipe 3 in the heating shell 2 promptly and conduct to radiator 4 in, utilize radiator 4 to dispel the heat fast, avoid the heat at 1 accumulations of crimping formula IGBT device, realize the temperature stability after 1 heats of crimping formula IGBT device.
In specific implementation, one or two heat radiators 4 are arranged in the heat dissipation part, and when two heat radiators 4 are arranged in the heat dissipation part, the two heat radiators 4 are distributed on two sides of the pressing heating shell 2. The specific number of heat sinks 4 can be selected as desired, and will not be described herein. The number of the heat pipes 3 connecting the pressing heating shell 2 and the heat sink 4 can be selected according to the requirement, and will not be described in detail here.
Furthermore, the heat sink 4 comprises a plurality of heat dissipation fins sleeved on the heat pipe 3, and the heat dissipation fins are uniformly distributed on the heat pipe 3;
the radiator also comprises a forced air cooling device which is used for being right corresponding to the radiator 4, and the radiator 4 can be air-cooled through the forced air cooling device.
The embodiment of the utility model provides an in, radiator 4 includes a plurality of radiating fin, and radiating fin specifically can adopt the form commonly used, and the radiating fin cover is at the condensation end of heat pipe 3. In order to accelerate the heat dissipation of the heat sink 4, the air cooling can be performed by a forced air cooling device, which can use a conventional fan, that is, the heat sink 4 is cooled by cold air generated by the fan. Of course, the forced air cooling device may also be in other forms, which may be selected according to the needs and will not be described herein.
Furthermore, set up a plurality of heating rod locating areas and a plurality of heat pipe locating areas with the adaptation of heat pipe 3 with the heating rod 7 adaptation in compressing tightly heating shell 2, be located heating rod 7 in the heating rod locating area and be located heat pipe locating area heat pipe 3 evenly distributed in compressing tightly heating shell 2.
The embodiment of the utility model provides an in, compress tightly heating shell 2 and generally adopt the material of heat conduction to make, the produced heat of 7 work of heating rod conducts the side of crimping formula IGBT device 1 through compressing tightly heating shell 2. In order to realize the uniformity of heating and heat dissipation, the heating rod 7 positioned in the heating rod positioning area and the heat pipes 3 positioned in the heat pipe positioning area are uniformly distributed in the compression heating shell 2
As shown in fig. 3, the pressing heating shell 2 includes a lower shell 6 and an upper shell 5 adapted to the lower shell 6, and a rod groove 8 adapted to the heating rod 7 and a heat pipe groove 9 adapted to the heat pipe 3 are respectively disposed in the upper shell 5 and the lower shell 6;
the upper shell 5 is pressed on the lower shell 6, the rod body grooves 8 and the heat pipe grooves 9 in the upper shell 5 are in one-to-one positive correspondence with the rod body grooves 8 and the heat pipe grooves 9 in the lower shell 6 respectively, so that the rod body grooves 8 in the upper shell 5 and the rod body grooves 8 in the lower shell 6 which are in positive correspondence form a heating rod positioning area; meanwhile, the heat pipe positioning area is formed by the heat pipe grooves 9 in the upper shell 5 and the corresponding heat pipe grooves 9 in the lower shell 6.
The embodiment of the utility model provides a always, lower casing 6 and last casing 5 are platelike, of course, also can be other shapes, specifically can select as required, and here is no longer repeated. The upper shell 5 is pressed on the lower shell 6, and the upper shell 5 and the lower shell 6 can be tightly connected through shell connecting bolts, so that the compression heating shell 2 can be formed.
In specific implementation, a rod groove 8 matched with the heating rod 7 and a heat pipe groove 9 matched with the heat pipe 3 are arranged in the upper shell 5 and the lower shell 6, the rod groove 8 and the heat pipe groove 9 are generally arc-shaped, and the specific shapes are matched with the specific shapes of the heating rod 7 and the heat pipe 3. The upper shell 5 is pressed on the lower shell 6, the rod body grooves 8 and the heat pipe grooves 9 in the upper shell 5 are in one-to-one positive correspondence with the rod body grooves 8 and the heat pipe grooves 9 in the lower shell 6 respectively, so that the rod body grooves 8 in the upper shell 5 and the rod body grooves 8 in the lower shell 6 which are in positive correspondence form a heating rod positioning area; meanwhile, the heat pipe positioning area is formed by the heat pipe grooves 9 in the upper shell 5 and the corresponding heat pipe grooves 9 in the lower shell 6. In fig. 3, one situation that the heating rod 7 and the heat pipe 3 are uniformly distributed in the pressing heating shell 2 is shown, but of course, other distribution situations can be adopted, and details are not described here.
Further, a heat conduction connector is filled between the heat pipe 3 and/or the heating rod 7 and the pressing heating shell 2, and the heat conduction connector comprises heat conduction silica gel or a heat conduction pad. The embodiment of the utility model provides an in, improve heat pipe 3 and heating rod 7 through heat conduction connection physical stamina and compressing tightly the stability in heating shell 2, also can improve hot-conductive effect.
Further, the device also comprises a temperature controller for controlling the working state of the heating rod 7 in the pressing heating shell 2 and a device temperature sensor for detecting the temperature state of the crimping type IGBT device 1, wherein the temperature controller is electrically connected with the device temperature sensor and the forced air cooling device.
The embodiment of the utility model provides an in, temperature controller and device temperature sensor all can adopt the current form commonly used, specifically can select as required. The device temperature sensor can acquire the temperature of the crimping type IGBT device 1 in the test. The temperature controller can be connected with heating rod 7 through switch etc. when the temperature in the test of crimping formula IGBT device 1 that device temperature sensor gathered and predetermined test temperature mismatch, the temperature controller can be through the operating condition of adjusting heating rod 7 and forced air cooling device's work, can make the operating temperature of crimping formula IGBT device keep unanimous with predetermined test temperature. If the temperature of the test of the crimping type IGBT device 1 is greater than the preset test temperature, the temperature controller can reduce the heating power of the heating rods 7 or reduce the number of the heating rods 7 in the working state, and meanwhile, the forced air cooling device can be started or the power of the forced air cooling device can be increased, so that the temperature of the crimping type IGBT device 1 can be matched with the preset test temperature.
The preset test temperature can be selected according to the requirement, and is well known to those skilled in the art, and will not be described herein again. The temperature in the test of the crimping type IGBT device 1 is matched with the preset test temperature, specifically, the difference between the temperature in the test of the crimping type IGBT device and the preset test temperature is within an allowable range, and the specific allowable difference range may be selected according to actual needs, which is not described herein again.
Claims (9)
1. The utility model provides a heating device is used in ageing test of crimping formula IGBT device which characterized by: the pressing and heating device comprises pressing and heating components symmetrically distributed on two sides of a pressing and connecting type IGBT device (1), wherein each pressing and heating component comprises a pressing and heating part and a radiating part in adaptive connection with the pressing and heating part;
the compression joint type IGBT device (1) during aging test can be in close contact with the corresponding side face of the compression joint type IGBT device (1) through the compression heating part in the compression heating assembly, so that the compression heating part is utilized to compress the compression joint type IGBT device (1) and simultaneously heat, and meanwhile, the compression heating part in adaptive connection is utilized to dissipate heat, so that the compression joint type IGBT device (1) is stabilized in a required temperature state after being heated.
2. The heating device for the aging test of the crimp type IGBT device as claimed in claim 1, wherein: the compressing and heating part comprises a compressing and heating shell (2) and a plurality of heating rods (7) arranged in the compressing and heating shell (2);
the heat dissipation part comprises a radiator (4) and a plurality of heat pipes (3) which are connected with the radiator (4) in an adaptive mode, the evaporation ends of the heat pipes (3) extend into the compression heating shell (2), and the condensation ends of the heat pipes (3) are connected with the radiator (4) in an adaptive mode.
3. The heating device for the aging test of the crimp-type IGBT device as claimed in claim 2, wherein: set up a plurality of heating rod locating areas and a plurality of heat pipe locating areas with heat pipe (3) adaptation with heating rod (7) adaptation in compressing tightly heating shell (2), be located heating rod (7) in the heating rod locating area and be located heat pipe locating area heat pipe (3) evenly distributed in compressing tightly heating shell (2).
4. The heating device for the aging test of the crimp-type IGBT device as claimed in claim 3, wherein: the pressing heating shell (2) comprises a lower shell (6) and an upper shell (5) matched with the lower shell (6), and a rod body groove (8) matched with the heating rod (7) and a heat pipe groove (9) matched with the heat pipe (3) are arranged in the upper shell (5) and the lower shell (6);
the upper shell (5) is pressed on the lower shell (6), the rod grooves (8) and the heat pipe grooves (9) in the upper shell (5) are respectively in one-to-one positive correspondence with the rod grooves (8) and the heat pipe grooves (9) in the lower shell (6), so that the rod grooves (8) in the upper shell (5) and the rod grooves (8) in the lower shell (6) which are in positive correspondence form a heating rod positioning area; meanwhile, the heat pipe positioning area is formed by the heat pipe grooves (9) in the upper shell (5) and the corresponding heat pipe grooves (9) in the lower shell (6).
5. The heating device for the aging test of the crimp type IGBT device as claimed in any one of claims 2 to 4, wherein: and a heat conduction connector is filled between the heat pipe (3) and/or the heating rod (7) and the compression heating shell (2), and the heat conduction connector comprises heat conduction silica gel or a heat conduction pad.
6. The heating device for the aging test of the crimp type IGBT device as claimed in any one of claims 2 to 4, wherein: the radiator (4) comprises a plurality of radiating fins sleeved on the heat pipe (3), and the radiating fins are uniformly distributed on the heat pipe (3);
the radiator is characterized by also comprising a forced air cooling device which is used for being in positive correspondence with the radiator (4), and the radiator (4) can be air-cooled through the forced air cooling device.
7. The heating device for the aging test of the crimp type IGBT device as claimed in claim 6, wherein: the temperature controller is used for controlling the working state of the heating rod (7) in the compression heating shell (2) and is used for detecting the temperature state of the compression IGBT device (1), and the temperature controller is electrically connected with the device temperature sensor and the forced air cooling device.
8. The heating device for the aging test of the crimp type IGBT device as claimed in any one of claims 2 to 4, wherein: the compressing and heating shell (2) is box-shaped.
9. The heating device for the aging test of the crimp type IGBT device as claimed in any one of claims 2 to 4, wherein: one or two radiators (4) are arranged in the heat dissipation part, and when two radiators (4) are arranged in the heat dissipation part, the two radiators (4) are distributed on two sides of the pressing heating shell (2).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123300331.1U CN218215208U (en) | 2021-12-24 | 2021-12-24 | Heating device for aging test of crimping type IGBT device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202123300331.1U CN218215208U (en) | 2021-12-24 | 2021-12-24 | Heating device for aging test of crimping type IGBT device |
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| CN218215208U true CN218215208U (en) | 2023-01-03 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115856584A (en) * | 2023-01-05 | 2023-03-28 | 法特迪精密科技（苏州）有限公司 | Chip high-temperature aging test socket |
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2021
- 2021-12-24 CN CN202123300331.1U patent/CN218215208U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115856584A (en) * | 2023-01-05 | 2023-03-28 | 法特迪精密科技（苏州）有限公司 | Chip high-temperature aging test socket |
| CN115856584B (en) * | 2023-01-05 | 2023-11-14 | 法特迪精密科技（苏州）有限公司 | Chip-on-chip high-temperature aging test socket |
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