CN215379644U - Connector with semiconductor cooling device and automobile - Google Patents
Connector with semiconductor cooling device and automobile Download PDFInfo
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- CN215379644U CN215379644U CN202121653578.9U CN202121653578U CN215379644U CN 215379644 U CN215379644 U CN 215379644U CN 202121653578 U CN202121653578 U CN 202121653578U CN 215379644 U CN215379644 U CN 215379644U
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Abstract
The utility model provides a connector with a semiconductor cooling device and an automobile, wherein the connector comprises: a lead, a terminal, and a semiconductor cooling device, the terminal being configured to have one end thereof connected to the lead and the other end thereof for connection to an external electrical structure; the semiconductor cooling device has a cooling portion and a heat radiating portion, and the cooling portion absorbs heat of the terminal. The utility model solves the technical problems that the connection point of the lead and the terminal has larger heat productivity and the connection point is more blown.
Description
Technical Field
The utility model relates to the technical field of electric devices, in particular to a connector with a semiconductor cooling device and an automobile.
Background
The starting current ratio is large when the automobile is started, can reach 150A to 250A, and has higher requirements on the current-carrying capacity of a lead and a connector; the working and charging current of the electric automobile is also larger, and the current-carrying capacity of the lead and the joint is also higher. In general, a wire has a set rated current, the heat generation amount is relatively stable, and the current can be conveyed by using a wire with the rated current meeting the requirement.
However, since the contact resistance of the connection point between the lead and the terminal is high and a large voltage drop occurs between the terminal and the lead, the amount of heat generated at the connection point between the lead and the terminal is generally large, and the connection point is often blown, which may cause a serious safety accident.
Therefore, there is a need in the art of electrical devices for a connector that can alleviate the problems of high heat generation at the connection point between the lead and the terminal and high blowout of the connection point.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a connector with a semiconductor cooling device and an automobile, which are used for solving the technical problems that the connection point of a lead and a terminal has large heat productivity and the connection point is frequently blown.
The above object of the present invention can be achieved by the following technical solutions:
the present invention provides a connector, comprising: a lead, a terminal, and a semiconductor cooling device, the terminal being configured to have one end thereof connected to the lead and the other end thereof for connection to an external electrical structure; the semiconductor cooling device has a cooling portion and a heat radiating portion, and the cooling portion absorbs heat of the terminal.
In a preferred embodiment, the semiconductor cooling device is electrically connected to the lead.
In a preferred embodiment, the connector further comprises a protective structure means, the terminal being disposed within the protective structure means.
In a preferred embodiment, the connector includes a rectifying device, one end of which is electrically connected to the semiconductor cooling device, and the other end of which is electrically connected to the wire.
In a preferred embodiment, the connector comprises a control device connected to the rectifying device for regulating the current flowing through the rectifying device to the semiconductor cooling device.
In a preferred embodiment, the connector comprises a temperature sensor connected to the control device, the temperature sensor being in contact with the terminal and/or the temperature sensor being in contact with the cooling portion.
In a preferred embodiment, the semiconductor cooling device includes a plurality of semiconductor cooling devices, and the plurality of semiconductor cooling devices are electrically connected to the rectifying device.
In a preferred embodiment, the semiconductor cooling device is embedded in a side wall of the protective structure device, the cooling portion is located inside the side wall of the protective structure device, and at least a part of the surface of the heat dissipation portion is exposed outside the protective structure device.
In a preferred embodiment, the cooling portion is connected in contact with the terminal.
In a preferred embodiment, the heat of the terminal is transferred to the cooling portion by radiation.
In a preferred embodiment, the cooling portion is provided with an accommodating groove, and the terminal is at least partially embedded in the accommodating groove.
In a preferred embodiment, the connector includes a heat conduction portion in contact with the terminal, and the cooling portion is in contact with the heat conduction portion; the heat conducting part is made of one or a combination of more of heat conducting silicone grease, heat conducting mica sheets, heat conducting ceramic sheets and heat conducting silica gel sheets.
In a preferred embodiment, the heat conduction portion surrounds the terminal.
In a preferred embodiment, the connector comprises at least two semiconductor cooling devices, which are distributed on both sides of the terminal.
In a preferred embodiment, the cooling portion is provided with a containing hole, and the terminal is arranged in the containing hole in a penetrating manner.
In a preferred embodiment, the semiconductor cooling device includes a plurality of the heat dissipating portions, and the plurality of the heat dissipating portions are distributed around the cooling portion.
In a preferred embodiment, the refrigerating portion is provided with a plurality of the accommodating holes; the connector comprises a plurality of terminals, and the terminals penetrate through the accommodating holes in a one-to-one correspondence mode.
In a preferred embodiment, the refrigeration part and the heat dissipation part are both cylindrical, the terminal is arranged in the refrigeration part in a penetrating mode, and the heat dissipation part is sleeved outside the refrigeration part.
In a preferred embodiment, the cooling portion and the heat radiating portion are both cylindrical.
In a preferred embodiment, the terminal is provided with a terminal portion and a connecting portion for connecting with the wire, and the cooling portion is connected with the connecting portion.
In a preferred embodiment, the contact area of the refrigeration part and the connecting part accounts for at least 3% of the surface area of the connecting part.
In a preferred embodiment, the semiconductor cooling device includes: the waterproof structure comprises an alumina substrate, a waterproof protective layer, a semiconductor P/N layer and a power interface; the alumina substrate, the waterproof protective layer and the semiconductor P/N layer are sequentially arranged; the power interface is electrically connected with the semiconductor P/N layer.
In a preferred embodiment, the cooling rate of the semiconductor cooling device is 0.05K/s to 5K/s.
In a preferred embodiment, the connector comprises a heat sink connected to the heat sink.
The present invention provides an automobile, comprising: the connector with the semiconductor cooling device is provided.
The utility model has the characteristics and advantages that:
the external electrical structure is connected with the connector with the semiconductor cooling device through the terminal, and is electrically connected with the conducting wire, so that electric energy is transmitted. There is usually a large contact resistance between the external electrical structure and the terminal, and the connection process continues to generate heat. In this connector, semiconductor cooling device is connected with the wire electricity, can follow the wire and acquire the electric energy, and semiconductor cooling device begins the operation, and the heat is followed refrigeration portion to the transmission of radiating part, and the heat of radiating part scatters and disappears to the outside, and the temperature of refrigeration portion reduces gradually, and consequently, the heat of terminal can be absorbed to refrigeration portion, makes terminal and outside electric structure keep safe and stable's temperature, realizes stabilizing the accuse temperature, reduces incident such as tie point burnout. By using the connector, the problem that the temperature of a connecting point is too high when the charging current of the electric automobile is large can be solved, and the quick charging of the large current of the charging wire harness of the electric automobile is facilitated.
In the connector, the semiconductor cooling device is adopted to cool the terminal, no refrigerant is used, and no moving mechanism is included, so that extra vibration and noise can be avoided, and the connector is safe, stable and long in service life. In this connector, can use the current reposition of redundant personnel in the wire, provide the electric energy for semiconductor cooling device, do not need extra power supply unit, need not set up and change and hold the electricity box, convenient durable is convenient for realize continuous work, reduces the maintenance man-hour.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of a connector with a semiconductor cooling device according to the present invention;
FIG. 2 is a schematic structural diagram of a connector with a semiconductor cooling device according to another embodiment of the present invention;
fig. 3 and 4 are cross-sectional views of a connector with a semiconductor cooling device provided in the present invention;
FIGS. 5-8 are schematic structural views of a connector with a semiconductor cooling device according to another embodiment of the present invention;
fig. 9-17 are schematic views of terminals and wires in a connector with a semiconductor cooling device according to the present invention;
fig. 18-20 are schematic structural views of a connector with a semiconductor cooling device according to another embodiment of the present invention;
fig. 21 is a structural view of a semiconductor cooling device in a connector having the semiconductor cooling device according to the present invention.
The reference numbers illustrate:
10. a protective structure device;
23. a terminal; 231. a terminal portion; 21. a connecting portion;
22. a wire; 221. a conductor; 222. an insulating layer;
30. a semiconductor cooling device; 301. a first cooling device; 302. a second cooling device;
31. a refrigerating section; 311. an accommodating groove; 312. a housing hole; 32. a heat dissipating section;
41. a heat conducting portion; 42. a heat sink; 421. heat dissipating fins;
50. a control unit; 51. a rectifying device; 52. a control device; 53. a temperature sensor; 54. a connecting wire;
1011. an alumina substrate; 1012. a waterproof protective layer; 1013. a semiconductor P/N layer; 1014. and a power interface.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
The present invention provides a connector having a semiconductor cooling device, as shown in fig. 1, the connector comprising: a wire 22, a terminal 23, and a semiconductor cooling device 30, the wire 22 being connected to the terminal 23, the terminal 23 being configured for connection to an external electrical structure; the semiconductor cooling device 30 has a cooling unit 31 and a heat radiating unit 32, and the cooling unit 31 absorbs heat of the terminal 23; the semiconductor cooling device 30 is electrically connected to the lead wire 22.
In detail, the semiconductor cooling device 30 is, in principle, a heat transfer tool. When a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. The semiconductor cooling device 30 described herein includes a hot side opposite to the cold side in addition to the cold side, and the semiconductor cooling device 30 may be a semiconductor cooling device known in the art and may be customized according to the size of the conductor.
An external electrical structure is connected to the connector through terminals 23 and is electrically connected to the wires 22 to provide for the delivery of electrical energy. There is typically a large contact resistance between the external electrical structure and the terminal 23 and the connection process continues to generate heat. In the connector, the semiconductor cooling device 30 is electrically connected with the lead 22, electric energy can be obtained from the lead 22, the semiconductor cooling device 30 starts to operate, heat is transferred from the cooling part 31 to the radiating part 32, the heat of the radiating part 32 is dissipated to the outside, and the temperature of the cooling part 31 is gradually reduced, so that the cooling part 31 can absorb the heat of the terminal 23, the terminal 23 and an external electric structure can be kept at safe and stable temperatures, stable temperature control is realized, and safety accidents such as connection point burnout are reduced. By using the connector, the problem that the temperature of a connecting point is too high when the charging current of the electric automobile is large can be solved, and the quick charging of the large current of the charging wire harness of the electric automobile is facilitated.
In the connector, the semiconductor cooling device 30 is adopted to cool the terminal 23, no refrigerant is used, no moving mechanism is included, extra vibration and noise can be avoided, and the connector is safe, stable and long in service life. In this connector, the current shunt in the wire 22 can be used to supply electric power to the semiconductor cooling device 30, no additional power supply device is required, no power storage box needs to be provided and replaced, the connector is convenient and durable, continuous work can be realized conveniently, and the maintenance man-hour is reduced.
In one embodiment, the connector further includes a protective structure 10, as shown in fig. 2, with terminals 23 disposed within the protective structure 10. In some high-current environments, the terminal 23 needs to be insulated and protected, and the protection structure device 10 is arranged on the periphery of the terminal 23 to insulate the terminal 23 from the external environment; in addition, when the number of the terminals 23 is large, when the terminals are connected with an external electrical structure, the terminals 23 need to be connected in a one-to-one insertion mode, the operation is complex, time is wasted, the terminals 23 are placed in the protection structure device 10 at intervals, the one-to-one insertion of the internal terminals 23 is realized through the insertion of the protection structure device 10 and the external electrical structure, the operation is simple, the situation of inserting wrong terminals is not easy to occur, and the accuracy and the safety of a circuit can be guaranteed. The protective structure device 10 may be a sheath.
In one embodiment, the connector includes a rectifying device 51, one end of the rectifying device 51 is electrically connected with the semiconductor cooling device 30 through a connecting wire 54, and the other end of the rectifying device 51 is electrically connected with the conducting wire 22 through the connecting wire 54; the rectifying device 51 may be electrically connected to the connecting portion 21 through a connecting wire 54 to achieve electrical connection with the wire 22. The current of the wire 22 is shunted to supply power to the semiconductor cooling device 30, and the current and the voltage are adjusted to be matched with the working current and the voltage of the semiconductor cooling device 30 through the rectifying device 51, so that the stable operation of the semiconductor cooling device 30 is ensured.
Further, the control unit 50 of the connector comprises a control device 52, the control device 52 is connected with the rectifying device 51, and the control device 52 is used for regulating and controlling the current flowing to the semiconductor cooling device 30 through the rectifying device 51. The control device 52 adjusts the current of the semiconductor cooling device 30, thereby adjusting the temperature of the cooling unit 31 of the semiconductor cooling device 30 and adjusting the temperature of the connection unit 21. Specifically, one end of the rectifying device 51 is electrically connected to the wire 22, and the other end of the rectifying device 51 is electrically connected to the control device 52 and the semiconductor cooling device 30, respectively, to supply power to the control device 52 and the semiconductor cooling device 30.
As shown in fig. 3, the connector comprises a temperature sensor 53 connected to the control device 52, the temperature sensor 53 being in contact connection with the terminal 23 and/or the temperature sensor 53 being in contact connection with the cooling portion 31. The temperature sensor 53 detects the temperature of the connector and transmits a temperature signal to the control device 52, and the control device 52 controls the rectifying device 51 to adjust the supply current of the semiconductor cooling device 30 based on the detected temperature, thereby adjusting the temperature of the cooling unit 31 of the semiconductor cooling device 30 and ensuring a stable operating temperature of the connection unit 21. For example, when a temperature increase is detected, the control device 52 controls the rectifying device 51 to increase the power supply current, so as to increase the efficiency of heat dissipation from the semiconductor cooling device 30; when a temperature decrease is detected, the control device 52 controls the rectifying device 51 to decrease the supply current, and slows down the efficiency of the heat dissipation from the semiconductor cooling device 30. The temperature sensor 53 and the control device 52 are matched with the rectifying device 51 to adjust the current of the semiconductor cooling device 30, so that the constant temperature of the connector can be realized, and the temperature change of the connector caused by the current change of the lead 22 is avoided. Preferably, the temperature sensor 53 is connected in contact with the connection portion 21, and the temperature sensor 53 is used for detecting the temperature of the connection portion 21.
The control device 52 may be a mechanical control device, and the mechanical control device includes at least two alloy sheets with different temperature expansion coefficients, and the alloy sheets may be bent and deformed after the temperature changes to push the contacts to be closed and opened, so as to implement power on and power off of the mechanical control device. The control device 52 may be an electronic control device that receives an electric signal from the temperature sensor 53 and controls the semiconductor cooling device 30 to be powered on and off after the chip analysis.
The rectifier 51 combines an unstable large current in the wire 22 into a stable small current that can be used by the control 52 and the temperature sensor 53 through a combination of a resistor, a diode, and other electronic components, thereby enabling a continuous and stable power supply.
The temperature sensor 53 may be a contact temperature sensor, and may be a bimetal thermometer, a pressure thermometer, a resistance thermometer, a thermistor, or a thermocouple, and the temperature sensor 53 may convert the real-time temperature of the connection portion 21 or the refrigeration portion 31 into an electrical signal and transmit the electrical signal to the control device 52.
In one embodiment, the semiconductor cooling device 30 comprises a plurality of semiconductor cooling devices 30, and in order to accurately control the temperature of each semiconductor cooling device 30, the plurality of semiconductor cooling devices 30 are electrically connected to the rectifying device 51 in parallel, so that the power supply current of each semiconductor cooling device 30 can be individually controlled.
Further, when the models and powers of the plurality of semiconductor cooling devices 30 are completely identical, the plurality of semiconductor cooling devices 30 are electrically connected to the rectifying device 51 in series, so that the supply current of each semiconductor cooling device 30 is identical.
Further, the semiconductor cooling device 30 is embedded in the sidewall of the protective structure device 10, the cooling portion 31 is located inside the sidewall of the protective structure device 10, and at least a part of the surface of the heat dissipating portion 32 is exposed outside the protective structure device 10, so that the cooling portion 31 of the semiconductor cooling device 30 can absorb heat from the terminal 23 and dissipate heat outwards through the heat dissipating portion 32.
In one embodiment, the heat of the terminal 23 is transferred to the cooling portion 31 by radiation. In another embodiment, the cooling portion 31 is connected to the terminal 23 to absorb heat of the terminal.
As shown in fig. 2-5, the cooling portion 31 is in contact connection with the terminal 23, which is beneficial to quickly transferring heat on the terminal 23 to the cooling portion 31, so that the heat is timely dissipated outwards, the heat generated by the terminal 23 can be fully carried away, the temperature is reduced, and the purpose of quickly cooling is achieved.
Further, the cooling portion 31 is provided with an accommodating groove 311, the terminal 23 is at least partially embedded in the accommodating groove 311, the shape of the accommodating groove 311 is matched with the shape of the outer contour of the terminal 23, and the terminal 23 is in contact with the inner wall of the accommodating groove 311, so that the cooling portion 31 and the terminal 23 are kept close to each other, the contact area is increased, and the heat of the terminal 23 is favorably transferred to the cooling portion 31. Preferably, as shown in fig. 4, the receiving recess 311 has a semi-cylindrical shape.
As shown in fig. 6, 7 and 18, the connector includes a heat conduction portion 41, the heat conduction portion 41 is connected to the terminal 23 in contact therewith, the cooling portion 31 is connected to the heat conduction portion 41 in contact therewith, and the heat of the connection portion 21 is transmitted to the cooling portion 31 through the heat conduction portion 41. Through heat conduction portion 41, be favorable to terminal 23, heat conduction portion 41 and refrigeration portion 31 to keep hugging closely, the heat that the terminal 23 of being convenient for produced transmits for refrigeration portion 31 fast, and the cooling performance is improved to the lowering temperature, realizes rapid cooling's purpose, guarantees the constancy of temperature of terminal 23. The heat conducting portion 41 may be made of a heat conducting and electrically non-conducting material; the heat conduction portion 41 may be formed by filling a heat conductive and nonconductive material between the terminal 23 and the cooling portion 31. The material of the heat conducting portion 41 may be one or a combination of several of heat conducting silicone grease, heat conducting mica sheet, heat conducting ceramic sheet and heat conducting silicone sheet.
Further, the heat conduction portion 41 surrounds the terminal 23, the cooling portion 31 is in contact with the terminal 23 through the heat conduction portion 41, and the heat conduction portion 41 may be provided in a cylindrical shape so as to absorb heat generated at different positions of the terminal 23. In some cases, the connector includes a plurality of terminals 23, a plurality of heat conduction portions 41 may be respectively provided, the heat conduction portions 41 and the terminals 23 are sleeved outside the terminals 23 in a one-to-one correspondence, and the plurality of heat conduction portions 41 are connected in contact with the cooling portion 31 of one semiconductor cooling device 30; one heat conduction portion 41 may surround the plurality of terminals 23, and the heat of the plurality of terminals 23 may be transmitted to the cooling portion 31 through the heat conduction portion 41.
In an embodiment of the present invention, the connector includes at least two semiconductor cooling devices 30, the at least two semiconductor cooling devices 30 are distributed on two sides of the terminal 23, and the two semiconductor cooling devices 30 absorb heat from two sides of the terminal 23, so as to improve the cooling efficiency. As shown in fig. 5 and 7, two semiconductor cooling devices 30 may be distributed on opposite sides of the terminal 23.
As shown in fig. 8, the connector includes a plurality of terminals 23, and the connecting portions 21 of the terminals 23 are connected with wires 22, respectively. The connector includes a plurality of semiconductor cooling devices 30, the plurality of semiconductor cooling devices 30 include a first cooling device 301 and a second cooling device 302, and the first cooling device 301, the plurality of connection portions 21, and the second cooling device 302 are distributed in this order. In one embodiment, the plurality of terminals 23 are distributed in the left-right direction, the first cooling device 301 is disposed at the left end, and the second cooling device 302 is disposed at the right end; further, the upper and lower sides of the terminal 23 are provided with semiconductor cooling devices 30, respectively.
In one embodiment, the cooling portion 31 is provided with a housing hole 312, and the terminal 23 is inserted into the housing hole 312. The terminal 23 is accommodated through the accommodating hole 312, so that the refrigeration part 31 is in contact connection with the terminal 23, the space arrangement mode of the terminal 23 and the lead 22 is improved, the contact area is increased, the heat transfer from the terminal 23 to the refrigeration part 31 is facilitated, particularly, the terminal 23 is convenient to arrange in a small space under the condition that the connector comprises a plurality of terminals 23 and leads 22, and the heat dissipation of each terminal 23 is guaranteed.
Further, the semiconductor cooling device 30 includes a plurality of heat dissipation portions 32, the plurality of heat dissipation portions 32 are distributed around the cooling portion 31, which is beneficial for heat to be dissipated outwards, as shown in fig. 19, the cooling portion 31 is provided with a plurality of accommodating holes 312; the connector includes a plurality of terminals 23, and the terminals 23 are inserted into the receiving holes 312 in a one-to-one correspondence. Preferably, the cooling part 31 is square as a whole, and the heat radiating parts 32 are distributed on 4 sides of the cooling part 31.
In one embodiment, the cooling part 31 is provided with a plurality of receiving holes 312; the connector includes a plurality of terminals 23, and the terminals 23 are worn to locate the accommodation hole 312 in a one-to-one correspondence manner, as shown in fig. 19, the terminals 23 are worn to locate in the refrigeration portion 31, and the heat dissipation portion 32 is sleeved outside the refrigeration portion 31, which is beneficial for the refrigeration portion 31 to fully contact with the terminals 23, so that heat on the terminals 23 is transferred to the heat dissipation portion 32 through the refrigeration portion 31 with higher efficiency, the compactness of the structure is improved, and the terminals 23 and the semiconductor cooling device 30 are conveniently arranged.
In one embodiment, the cooling unit 31 and the heat radiating unit 32 are both cylindrical, and as shown in fig. 20, the terminal 23 is inserted into the cooling unit 31, and the heat radiating unit 32 is fitted outside the cooling unit 31. The tubular cooling portion 31 and the heat radiating portion 32 are both easy to process, have a large contact area, and easily transfer heat from the terminals 23 to the heat radiating portion. Further, the cooling portion 31 and the heat radiating portion 32 are both cylindrical.
In one embodiment, the terminal 23 is provided with a terminal portion 231 and a connecting portion 21, the terminal portion 231 is configured for connection with an external electrical structure, and the connecting portion 21 is for connection with the conductive line 22. The shape of the connection portion 21 is not limited to one, for example: as shown in fig. 9, the connecting portion 21 is formed in a U shape having a U-shaped groove in which the wire 22 is disposed, and as shown in fig. 10, the side wall of the U-shaped groove is bent inward, whereby the wire 22 is pressed, thereby connecting the terminal 23 and the wire 22; as shown in fig. 11-14, the connecting portion 21 may be a cylinder, and the wire 22 is disposed in a hole of the cylinder; as shown in fig. 15 to 17, the connection part 21 may have a plate shape, and the wire 22 is disposed at one side of the connection part 21. The wire 22 and the connecting portion 21 can be fixed by welding or crimping. The terminal portion 231 and the connecting portion 21 may be integrally or separately formed, and they may be fixed together by welding. Preferably, the position where the terminal 23 is connected to the cooling portion 31 is the connecting portion 21, which is beneficial for the cooling portion 31 to absorb heat of the terminal 23.
Further, the contact area of the cooling portion 31 and the connecting portion 21 occupies at least 3% of the surface area of the connecting portion 21, so as to ensure the heat absorption efficiency.
In order to verify the contact area between the cooling portion 31 and the connecting portion 21, the proportion range of the contact area to the surface area of the connecting portion 21, and the influence on the temperature rise of the terminal 23, the inventor selects 11 sets of the conducting wires 22 with the same cross section area, the same material and the same length, and the same terminal 23, and applies the same current, adopts different contact areas between the cooling portion 31 and the connecting portion 21 to account for the proportion of the contact area to the surface area of the connecting portion 21, reads the corresponding temperature rise value, and records the value in table 1.
Table 1: the influence of the contact area between the different refrigerating parts 31 and the connecting part 21 and the proportion of the surface area of the connecting part 21 on the temperature rise of the connector
In the experimental method, in a closed environment, the same current is conducted through connectors with different proportions of the contact area of the refrigerating part 31 and the connecting part 21 in the surface area of the connecting part 21, the temperature before electrifying and the temperature after electrifying are recorded when the temperature is stable, and the absolute value is obtained by taking the difference. In this embodiment, a temperature rise of less than 50K is a qualified value.
As can be seen from table 1, when the ratio of the contact area of the cooling portion 31 and the connection portion 21 to the surface area of the connection portion 21 is less than 3%, the temperature rise value of the connector is less than the acceptable value. The larger the ratio of the covered area, the smaller the temperature rise value, and therefore, the inventors set the ratio of the contact area of the cooling portion 31 and the connecting portion 21 to the surface area of the connecting portion 21 to be at least 3%.
The wire 22 includes an inner conductor 221 and an insulating layer 222 covering the conductor 221, and the terminal of the conductor 221 is connected to the terminal 23. The semiconductor cooling device 30 is fixed to the protective structure device 10, the cooling portion 31 faces inward, the heat radiating portion 32 faces outward, and the surface of the cooling portion 31 is provided on the surface of the protective structure device 10 or outside the protective structure device 10. The external electrical structure may be a wire harness cable or terminal that is compatible with the terminal 23.
In one embodiment of the present invention, as shown in fig. 21, a semiconductor cooling device 30 includes: an alumina substrate 1011, a waterproof protective layer 1012, a semiconductor P/N layer 1013, and a power interface 1014.
The alumina substrate 1011, the waterproof protective layer 1012, and the semiconductor P/N layer 1013 are sequentially provided. Power interface 1014 electrically connects semiconductor P/N layer 1013.
The alumina substrate 1011 constitutes the hot end of the semiconductor cooling device 30, i.e., the heat dissipation portion 32. The semiconductor P/N layer 1013 constitutes a cooling end of the semiconductor cooling device 30, i.e., the cooling portion 31.
The surface of the semiconductor cooling device 30 is made of the aluminum oxide substrate 1011, so that the thermal conductivity can be improved, the heat transfer speed is higher, the refrigeration time is shorter, the bearable strength is high, the flexible connection can be realized, the conductor can be better attached to the surface of the conductor, the surface stress at the bent part of the conductor can be effectively absorbed, and the conductor is not easy to break in the installation and use processes. The core of the semiconductor cooling device 30 is a P-N junction made of a special semiconductor material, when a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end, namely, refrigeration control can be realized by controlling direct current.
In one embodiment of the present invention, the cooling rate of the semiconductor cooling device 30 is 0.05K/s to 5K/s.
In order to verify the influence of the cooling rate of the semiconductor cooling device 30 on the temperature rise of the connector, the inventors selected 10 wires 22 with the same cross-sectional area, the same material and the same length and the same terminal 23, and applied the same current, cooled the connector using the semiconductor cooling devices 30 with different cooling rates, and read the corresponding temperature rise values, which are recorded in table 2.
In the experimental method, in a closed environment, connectors with different cooling rates of the semiconductor cooling device 30 are conducted with the same current, the temperature before energization and the temperature after energization are recorded when the temperature is stable, and the absolute value is obtained by taking the difference. In this embodiment, a temperature rise of less than 50K is a qualified value.
Table 2: effect of different Cooling rates of the semiconductor Cooling device 30 on connector temperature rise
As can be seen from table 2, when the cooling rate of the semiconductor cooling device 30 is less than 0.05K/s, the temperature rise value of the connector is less than the acceptable value, and the larger the cooling rate of the semiconductor cooling device 30, the smaller the temperature rise value. However, when the cooling rate of the semiconductor cooling device 30 is more than 5K/s, the temperature rise value is not significantly reduced due to the heat generation of the connector itself and the power of the semiconductor cooling device 30 itself, but the power of the semiconductor cooling device 30 is increased, which is not economical. Therefore, the inventors set the cooling rate of the semiconductor cooling device 30 to 0.05K/s to 5K/s.
In an embodiment of the present invention, the connector includes a heat dissipation device 42 connected to the heat dissipation portion 32 to improve the heat dissipation effect, so as to facilitate the heat dissipation from the heat dissipation portion 32 of the semiconductor cooling device 30 to the outside, and ensure rapid cooling. Specifically, the heat sink 42 may be a fan or a heat exchanger or a liquid cooling device; as shown in fig. 3 and 4, the heat dissipating device 42 may also be a heat dissipating fin 421, and the heat dissipating fin 421 is preferably made of metal.
The connector comprises the following advantages: (1) the cooling time is short, and when the temperature of the connecting part 21 is increased, the connecting part 21 can be cooled in a short time; (2) the temperature of the connector can be stably controlled, the connection point is prevented from being blown due to overload, and safety accidents are reduced; (3) by reducing the temperature of the connecting point, the design that the wire diameter of the cable is not required to be increased is realized, the wire diameter of the cable in a rated heating curve can be used when the cable is designed, and the wire diameter of the cable is not required to be increased for reducing the resistance of the connecting part when the cable is designed, so that the wire diameter of the cable is reduced, and the cost of the cable is reduced; (4) by using the connector, the problem that the temperature of a connecting point is overhigh when the charging current of the electric automobile is large can be solved, and the quick charging of the large current of the charging wire bundle of the electric automobile is facilitated; (5) the heat dissipation part 32 of the semiconductor cooling device 30 can be connected to other components that need to be heated, thereby improving the utilization rate of energy.
Example two
The utility model provides an automobile comprising the connector with the semiconductor cooling device, and the connector in the automobile has the structure, the function and the beneficial effects, which are not described in detail herein.
The above description is only a few embodiments of the present invention, and those skilled in the art can make various changes or modifications to the embodiments of the present invention according to the disclosure of the application document without departing from the spirit and scope of the present invention.
Claims (25)
1. A connector having a semiconductor cooling device, comprising: a lead, a terminal, and a semiconductor cooling device, the terminal being configured to have one end thereof connected to the lead and the other end thereof for connection to an external electrical structure;
the semiconductor cooling device has a cooling portion and a heat radiating portion, and the cooling portion absorbs heat of the terminal.
2. The connector of claim 1, wherein the semiconductor cooling device is electrically connected to the wire.
3. The connector of claim 1, comprising: a protective structure device, the terminal disposed within the protective structure device.
4. The connector of claim 1, wherein the connector comprises a rectifying device, one end of the rectifying device is electrically connected to the semiconductor cooling device, and the other end of the rectifying device is electrically connected to the wire.
5. The connector of claim 4, comprising a control device coupled to the rectifying device, the control device configured to regulate current flowing through the rectifying device to the semiconductor cooling device.
6. Connector according to claim 5, characterized in that it comprises a temperature sensor connected to said control means, said temperature sensor being in contact with said terminals and/or said temperature sensor being in contact with said refrigeration portion.
7. The connector of claim 4, wherein the semiconductor cooling device comprises a plurality of semiconductor cooling devices, and the plurality of semiconductor cooling devices are electrically connected to the rectifying device.
8. The connector of claim 3, wherein the semiconductor cooling device is embedded in a sidewall of the protective structure device, and the cooling portion is located inside the sidewall of the protective structure device, and at least a part of a surface of the heat dissipating portion is exposed outside the protective structure device.
9. The connector according to claim 1, wherein the cooling portion is in contact connection with the terminal.
10. The connector according to claim 1, wherein heat of the terminal is transferred to the cooling portion by radiation.
11. The connector of claim 9, wherein the cooling portion is provided with a receiving groove, and the terminal is at least partially embedded in the receiving groove.
12. The connector according to claim 1, wherein the connector includes a heat conduction portion, the heat conduction portion being in contact connection with the terminal, the cooling portion being in contact connection with the heat conduction portion; the heat conducting part is made of one or a combination of more of heat conducting silicone grease, heat conducting mica sheets, heat conducting ceramic sheets and heat conducting silica gel sheets.
13. The connector of claim 12, wherein the thermal conductor portion surrounds the terminal.
14. The connector of claim 1, wherein the connector includes at least two of the semiconductor cooling devices, at least two of the semiconductor cooling devices being distributed on both sides of the terminal.
15. The connector of claim 1, wherein the cooling portion is provided with a receiving hole, and the terminal is inserted into the receiving hole.
16. The connector of claim 1, wherein the semiconductor cooling device comprises a plurality of the heat dissipating portions distributed around the cooling portion.
17. The connector according to claim 15, wherein the refrigerating portion is provided with a plurality of the receiving holes; the connector comprises a plurality of terminals, and the terminals penetrate through the accommodating holes in a one-to-one correspondence mode.
18. The connector of claim 1, wherein the refrigeration portion and the heat dissipation portion are both cylindrical, the terminal is inserted into the refrigeration portion, and the heat dissipation portion is sleeved outside the refrigeration portion.
19. The connector of claim 18, wherein the cooling portion and the heat dissipating portion are each cylindrical.
20. The connector according to claim 1, wherein the terminal is provided with a terminal portion and a connecting portion for connecting with the wire, and the cooling portion is connected with the connecting portion.
21. The connector of claim 20, wherein the contact area of the cooling portion and the connecting portion is at least 3% of the surface area of the connecting portion.
22. The connector of claim 1, wherein the semiconductor cooling device comprises: the waterproof structure comprises an alumina substrate, a waterproof protective layer, a semiconductor P/N layer and a power interface;
the alumina substrate, the waterproof protective layer and the semiconductor P/N layer are sequentially arranged;
the power interface is electrically connected with the semiconductor P/N layer.
23. The connector of claim 22, wherein the semiconductor cooling device has a cooling rate of 0.05K/s to 5K/s.
24. The connector of claim 1, wherein the connector includes a heat sink coupled to the heat sink.
25. An automobile, comprising: a connector having a semiconductor cooling device as claimed in any one of claims 1 to 24.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121653578.9U CN215379644U (en) | 2021-07-20 | 2021-07-20 | Connector with semiconductor cooling device and automobile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121653578.9U CN215379644U (en) | 2021-07-20 | 2021-07-20 | Connector with semiconductor cooling device and automobile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215379644U true CN215379644U (en) | 2021-12-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121653578.9U Active CN215379644U (en) | 2021-07-20 | 2021-07-20 | Connector with semiconductor cooling device and automobile |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215379644U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113490397A (en) * | 2021-07-20 | 2021-10-08 | 长春捷翼汽车零部件有限公司 | Connector with semiconductor cooling device and automobile |
| WO2023174275A1 (en) * | 2022-03-14 | 2023-09-21 | 吉林省中赢高科技有限公司 | Connector assembly having solid-state cooling medium, and vehicle |
-
2021
- 2021-07-20 CN CN202121653578.9U patent/CN215379644U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113490397A (en) * | 2021-07-20 | 2021-10-08 | 长春捷翼汽车零部件有限公司 | Connector with semiconductor cooling device and automobile |
| WO2023174275A1 (en) * | 2022-03-14 | 2023-09-21 | 吉林省中赢高科技有限公司 | Connector assembly having solid-state cooling medium, and vehicle |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 957, Shunda Road, Gaoxin District, Changchun City, Jilin Province, 130000 Patentee after: Changchun Jieyi Automobile Technology Co.,Ltd. Address before: 130000, 1st floor, 957 Shunda Road, high tech Development Zone, Chaoyang District, Changchun City, Jilin Province Patentee before: CHANGCHUN JIEYI AUTO PARTS CO.,LTD. |
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| CP03 | Change of name, title or address |