CN110958817B - Heat radiation structure and electronic equipment based on Peltier effect - Google Patents
Heat radiation structure and electronic equipment based on Peltier effect Download PDFInfo
- Publication number
- CN110958817B CN110958817B CN201911265290.1A CN201911265290A CN110958817B CN 110958817 B CN110958817 B CN 110958817B CN 201911265290 A CN201911265290 A CN 201911265290A CN 110958817 B CN110958817 B CN 110958817B
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- flexible semiconductor
- type flexible
- electronic equipment
- semiconductor assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005679 Peltier effect Effects 0.000 title claims abstract description 24
- 230000005855 radiation Effects 0.000 title abstract description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 116
- 230000017525 heat dissipation Effects 0.000 claims abstract description 71
- 238000005057 refrigeration Methods 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical group [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 6
- 229910017629 Sb2Te3 Inorganic materials 0.000 claims description 5
- 239000006258 conductive agent Substances 0.000 claims description 4
- 230000002349 favourable effect Effects 0.000 description 17
- 230000009286 beneficial effect Effects 0.000 description 8
- 230000001737 promoting effect Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides a heat radiation structure and electronic equipment based on Peltier effect. The heat dissipation structure comprises a refrigeration part, a heat dissipation part, an N-type flexible semiconductor assembly and a P-type flexible semiconductor assembly which are connected with a power supply in series; the first end of the N-type flexible semiconductor assembly and the first end of the P-type flexible semiconductor assembly are respectively connected with the refrigerating part through conductors, and the second end of the N-type flexible semiconductor assembly and the second end of the P-type flexible semiconductor assembly are respectively connected with the radiating part through conductors; the refrigeration part is located in or close to a heating area of the electronic equipment and can reduce the temperature of the heating area by using electric energy provided by the power supply. The electronic equipment comprises the heat dissipation structure. The electronic equipment uses the Peltier effect to use electric energy to conduct autonomous heat dissipation, the heat dissipation capacity of the electronic equipment is favorably improved, and due to the arrangement of the flexible semiconductor assembly, the maximum application of a limited space in the electronic equipment is favorably realized.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a heat dissipation structure based on a Peltier effect and an electronic device.
Background
To meet the market demands, the power density of electronic devices is gradually increasing and the volume is gradually decreasing. In order to improve the stability and reliability of electronic equipment and reduce the influence of high temperature on various components on a circuit board, a heat dissipation device becomes an important component of the electronic equipment.
Common heat sinks include heat sinks comprising fins, air-cooled heat sinks, and liquid-cooled heat sinks. Wherein, air-cooled heat abstractor and liquid cooling heat abstractor all dispel the heat through using the refrigerant, dispel the heat through the refrigerant flow promptly, and there is almost no electronic equipment on the market to carry out the independently radiating technical scheme in its area that generates heat.
Disclosure of Invention
To the problem among the above-mentioned prior art, this application has provided a heat radiation structure and electronic equipment based on peltier effect, thereby this heat radiation structure utilizes peltier effect to use the electric energy to reduce the regional temperature that electronic equipment generates heat and independently dispels the heat, is favorable to promoting electronic equipment's heat-sinking capability. And because noise and vibration are not generated in the heat dissipation process, the user experience is favorably improved. The flexible semiconductor assembly can cool the remaining space in the housing of the electronic device, thereby contributing to miniaturization of the electronic device.
In a first aspect, the invention provides a heat dissipation structure based on the peltier effect, which comprises a refrigeration part, a heat dissipation part, an N-type flexible semiconductor component and a P-type flexible semiconductor component, wherein the refrigeration part, the heat dissipation part, the N-type flexible semiconductor component and the P-type flexible semiconductor component are connected with a power supply in series; the first end of the N-type flexible semiconductor assembly and the first end of the P-type flexible semiconductor assembly are respectively connected with the refrigerating part through conductors, and the second end of the N-type flexible semiconductor assembly and the second end of the P-type flexible semiconductor assembly are respectively connected with the radiating part through conductors; the refrigeration part is located in or close to a heating area of the electronic equipment and can reduce the temperature of the heating area by using electric energy provided by the power supply. The heat dissipation structure can use the Peltier effect to reduce the temperature of the heating area of the electronic equipment by using electric energy so as to perform autonomous heat dissipation, is favorable for improving the heat dissipation capacity of the electronic equipment, and is favorable for improving the user experience due to no noise and vibration. The flexible semiconductor assembly can cool the remaining space in the housing of the electronic device, thereby contributing to miniaturization of the electronic device.
In one embodiment of the first aspect, the N-type flexible semiconductor component is a first flexible cavity filled with an N-type flexible semiconductor material, and the P-type flexible semiconductor component is a second flexible cavity filled with a P-type flexible semiconductor material. Through the embodiment, the first flexible cavity and the second flexible cavity automatically fill the residual space of the internal structure in the electronic equipment shell, and the residual space in the electronic equipment shell can be cooled, so that the miniaturization of electronic equipment is facilitated; and because the flexible material in the flexible cavity can absorb the impact force when the electronic equipment falls to the ground, the falling resistance of the electronic equipment in the embodiment can be improved.
In an embodiment of the first aspect, a first filling port for filling the N-type flexible semiconductor material is provided on the first flexible cavity, and a sealing one-way valve is provided at the first filling port; and a second filling port for filling the P-type flexible semiconductor material is arranged on the second flexible cavity, and a sealing one-way valve is arranged at the second filling port. Through the implementation mode, the flexible semiconductor material can be prevented from flowing out of the filling port and being dispersed in the electronic equipment shell, so that the stability and the safety performance of the electronic equipment are improved.
In one embodiment of the first aspect, the N-type flexible semiconductor material is Bi2Te3-Bi2Se3Powder, the P-type flexible semiconductor material is Bi2Te3-Sb2Te3And (3) powder.
In one embodiment of the first aspect, the heat dissipation structure comprises a third flexible cavity filled with a liquid metal heat conductive agent, the third flexible cavity being in face contact with the heat dissipation portion. Through the embodiment, the third flexible cavity can conduct heat efficiently and can deform, so that the space is utilized reasonably, and the limited space is applied to the maximum extent; the third flexible cavity is in surface contact with the heat dissipation part, and compared with point contact and line contact, the heat conduction efficiency is improved.
In one embodiment of the first aspect, the liquid metal thermal conductor is a gallium-based alloy.
In an embodiment of the first aspect, the heat dissipation structure further includes a heat sink attached to a surface of the third flexible cavity away from the heat dissipation portion. With this embodiment, since the surface contact is adopted, the heat conduction efficiency is favorably improved as compared with the point contact and the line contact.
In one embodiment of the first aspect, the fins are graphite fins or copper fins.
In one embodiment of the first aspect, the power supply and the heat sink are in communication through a spring and a feed point. By this embodiment, a stable transfer of electrical energy is facilitated.
In one embodiment of the first aspect, the heat dissipation structure includes a controller and a temperature sensor, and the controller controls the power supply to be powered on or off according to the temperature detected by the temperature sensor. Through this embodiment, because the refrigeration portion refrigerates only when the temperature that temperature sensor detected is higher than predetermineeing the threshold value, be favorable to saving the electric energy, also be favorable to avoiding the long-time uninterrupted duty of refrigeration portion to be favorable to improving electronic equipment's life.
In a second aspect, the invention also provides an electronic device comprising the heat dissipation structure based on the peltier effect. Through this embodiment, electronic equipment uses above-mentioned heat radiation structure, uses the Peltier effect, uses the electric energy to reduce its regional temperature that generates heat to independently dispel the heat, be favorable to promoting electronic equipment's heat-sinking capability. And because noise and vibration are not generated in the heat dissipation process, the user experience is favorably improved. The flexible semiconductor assembly can cool the remaining space in the housing of the electronic device, thereby contributing to miniaturization of the electronic device.
In one embodiment of the second aspect, the electronic device is a mobile phone or a tablet computer. Through this embodiment, cell-phone or panel computer use above-mentioned heat radiation structure, use the Peltier effect, use the electric energy to reduce its regional temperature that generates heat to independently dispel the heat, be favorable to promoting cell-phone or panel computer's heat-sinking capability. And because noise and vibration are not generated in the heat dissipation process, the user experience is favorably improved. The flexible semiconductor component can cool the residual space in the shell of the mobile phone or the tablet computer, so that the miniaturization of the mobile phone or the tablet computer is facilitated.
The application provides a heat radiation structure and electronic equipment based on peltier effect compares in prior art, has following beneficial effect:
1. the heat dissipation structure can use the Peltier effect to reduce the temperature of the heating area of the electronic equipment by using electric energy so as to perform autonomous heat dissipation, and is favorable for improving the heat dissipation capacity of the electronic equipment;
2. when the heat dissipation structure is used for dissipating heat, noise and vibration do not exist, and user experience is improved;
3. the flexible cavity can utilize the residual space in the electronic equipment shell and can cool the residual space in the electronic equipment shell, so that the miniaturization of the electronic equipment is facilitated;
4. because the flexible cavity can absorb the impact force when the electronic equipment falls to the ground, the anti-falling performance of the electronic equipment in the embodiment is favorably improved.
The features mentioned above can be combined in various suitable ways or replaced by equivalent features as long as the object of the invention is achieved.
Drawings
The invention will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:
fig. 1 is a partial structural view illustrating a heat dissipation structure according to an embodiment of the present invention;
fig. 2 is a partial structural view illustrating a heat dissipation structure according to another embodiment of the present invention;
FIG. 3 is a schematic side view of a heat dissipation structure according to an embodiment of the invention;
fig. 4 shows an exploded view of a heat dissipation structure according to an embodiment of the present invention.
Reference numerals:
100-a refrigerating part;
200-a heat-dissipating portion;
a 300-N type flexible semiconductor component;
310-a first flexible cavity;
320-a first fill port;
a 400-P type flexible semiconductor component;
410-a second flexible cavity;
420-a second fill port;
500-a third flexible cavity;
600-heat sink.
In the drawings, like parts are provided with like reference numerals. The drawings are not to scale.
Detailed Description
The invention will be further explained with reference to the drawings.
As shown in fig. 1 to 4, the present embodiment provides a heat dissipation structure based on the peltier effect, including a cooling portion 100, a heat dissipation portion 200, an N-type flexible semiconductor assembly 300, and a P-type flexible semiconductor assembly 400 connected in series with a power supply; a first end of the N-type flexible semiconductor assembly 300 and a first end of the P-type flexible semiconductor assembly 400 are respectively connected with the cooling portion 100 through conductors, and a second end of the N-type flexible semiconductor assembly 300 and a second end of the P-type flexible semiconductor assembly 400 are respectively connected with the heat dissipation portion 200 through conductors; the cooling part 100 is located at or near a heat generating area of the electronic device and can reduce the temperature of the heat generating area using power supplied from the power supply.
Under the action of the peltier effect, one end of the N-type flexible semiconductor assembly 300 close to the positive pole of the power supply is a hot end, one end of the N-type flexible semiconductor assembly 300 far away from the positive pole of the power supply is a cold end, one end of the P-type flexible semiconductor assembly 400 close to the negative pole of the power supply is a hot end, and one end of the P-type flexible semiconductor assembly 400 far away from the negative pole of the power supply is a cold end. The hot end is also called a heat dissipation end, and the cold ends are also called a heat absorption end and a refrigerating end.
Specifically, after the direct current power supply is powered on, energy is provided for electron flow, the N-type flexible semiconductor assembly 300 and the P-type flexible semiconductor assembly 400 connected in series form a galvanic couple, and in the N-type flexible semiconductor assembly 300 and the P-type flexible semiconductor assembly 400, the flow energy of electrons is transferred to form a hot end and a cold end. At the hot end, the internal energy increases due to electron-hole pair recombination, the temperature rises, and heat is released to the environment. At the cold end, the internal energy is reduced, the temperature is lowered, and heat is absorbed from the environment due to the generated electron-hole pairs.
The first end of the N-type flexible semiconductor device 300 is the end away from the positive electrode of the power supply, and after the power supply is turned on, the first end of the N-type flexible semiconductor device 300 is the cold end of the N-type flexible semiconductor device 300. The first end of the P-type flexible semiconductor assembly 400 is the end away from the negative pole of the power supply, and after being electrified, the first end of the P-type flexible semiconductor assembly 400 is the cold end of the P-type flexible semiconductor assembly 400.
The second end of the N-type flexible semiconductor device 300 is the end close to the positive terminal of the power supply, and after the power supply is turned on, the second end of the N-type flexible semiconductor device 300 is the hot end of the N-type flexible semiconductor device 300. The second end of the P-type flexible semiconductor device 400 is the end close to the negative terminal of the power supply, and after being powered on, the second end of the P-type flexible semiconductor device 400 is the hot end of the P-type flexible semiconductor device 400.
Optionally, the cooling portion 100 includes a copper sheet connecting the first end of the N-type flexible semiconductor assembly 300 and the first end of the P-type flexible semiconductor assembly 400. Similarly, the heat sink member 200 includes a copper sheet connecting the second end of the N-type flexible semiconductor assembly 300 and the second end of the P-type flexible semiconductor assembly 400. The copper sheet is a good conductor of heat and electricity, is economical and practical, and is favorable for popularization and application of electronic equipment due to the use of the copper sheet.
The flexible semiconductor assembly can cool the residual space in the shell of the electronic equipment, thereby being beneficial to the miniaturization of the electronic equipment; and because the flexible semiconductor component can absorb the impact force when the electronic equipment falls down, the falling-resistant performance of the electronic equipment in the embodiment is favorably improved.
The refrigerating part 100 is located or close to the heating area of the electronic device, and is beneficial to the rapid heat dissipation of the heating area of the electronic device, so that the electronic device is beneficial to efficiently utilizing electric energy to reduce the temperature of the heating area.
The Peltier effect is used for refrigeration, noise is not generated, vibration is not caused, a refrigerant is not needed, and the cold quantity can be adjusted by adjusting the current. Thereby electronic equipment uses the Peltier effect to use the electric energy to reduce its regional temperature that generates heat and independently dispels the heat, is favorable to promoting electronic equipment's heat-sinking capability, owing to do not have noise and vibration again, is favorable to promoting user experience. Meanwhile, the flexible semiconductor assembly can cool the residual space in the shell of the electronic equipment, so that the miniaturization of the electronic equipment is facilitated.
As shown in fig. 1, optionally, the N-type flexible semiconductor assembly 300 of the present embodiment is a first flexible cavity 310 filled with an N-type flexible semiconductor material, and the P-type flexible semiconductor assembly 400 is a second flexible cavity 410 filled with a P-type flexible semiconductor material.
The flexible cavity can efficiently utilize the residual space in the electronic equipment, and is favorable for the miniaturization of the electronic equipment.
Optionally, when the electronic device is assembled, the first flexible cavity 310 and the second flexible cavity 410 are in an empty state, and after the electronic device is assembled, the N-type flexible semiconductor material and the P-type flexible semiconductor material are respectively injected into the first flexible cavity 310 and the second flexible cavity 410, so that the first flexible cavity 310 and the second flexible cavity 410 automatically fill the remaining space of the internal structure in the electronic device shell and cool the remaining space in the electronic device shell, thereby facilitating miniaturization of the electronic device.
The first flexible cavity 310 and the second flexible cavity 410 should be made of a non-conductive material. Alternatively, the first flexible cavity 310 and the second flexible cavity 410 may be made of rubber, silicone, and polyamide fabric, but not limited to the above materials, wherein the polyamide fabric is widely applied to an airbag of an automobile, which is beneficial to prolonging the service life of the first flexible cavity 310 and the second flexible cavity 410.
And because the flexible material in the flexible cavity can absorb the impact force when the electronic equipment falls to the ground, the falling resistance of the electronic equipment in the embodiment can be improved.
Optionally, the N-type flexible semiconductor assembly 300 may also be a first flexible cavity 310 filled with an N-type liquid semiconductor, an N-type glue semiconductor, or other flexible N-type semiconductors; the P-type flexible semiconductor device 400 may also be a second flexible cavity 410 filled with a P-type liquid semiconductor, a P-type glue semiconductor, or other flexible P-type semiconductors.
This embodiment is owing to adopted the first flexible cavity 310 that is filled with the flexible semiconductor material of N type and the flexible cavity 410 of second that is filled with the flexible semiconductor material of P type, and flexible semiconductor component can cool off the remaining space in the electronic equipment casing to be favorable to electronic equipment's miniaturization, and the impact force when the flexible material in the flexible cavity can absorb electronic equipment falls to the ground, thereby be favorable to promoting electronic equipment's anti performance of falling.
As shown in fig. 1 to 4, optionally, a first filling port 320 for filling the N-type flexible semiconductor material is disposed on the first flexible cavity 310 of the present embodiment, and a sealing one-way valve is disposed at the first filling port 320; a second filling port 420 for filling the P-type flexible semiconductor material is arranged on the second flexible cavity 410, and a sealing one-way valve is arranged at the second filling port 420.
The N-type flexible semiconductor material enters the first flexible cavity 310 through the first filling port 320, and in order to prevent the N-type flexible semiconductor material from flowing out of the first filling port 320, a sealing one-way valve is arranged at the first filling port 320, so that the N-type flexible semiconductor material can only enter the first flexible cavity 310 through the first filling port 320 and cannot flow out of the first filling port 320, the N-type flexible semiconductor material is limited in the first flexible cavity 310, the N-type flexible semiconductor material which flows out is prevented from being dispersed in the electronic device shell, and the stability and the safety of the electronic device are improved.
Similarly, the P-type flexible semiconductor material enters the second flexible cavity 410 through the second filling port 420, and in order to prevent the P-type flexible semiconductor material from flowing out from the second filling port 420, a sealing one-way valve is disposed at the second filling port 420, so as to ensure that the P-type flexible semiconductor material can only enter the second flexible cavity 410 through the second filling port 420 and cannot flow out from the second filling port 420, which is beneficial to limiting the P-type flexible semiconductor material in the second flexible cavity 410 and avoiding the P-type flexible semiconductor material flowing out from dispersing in the electronic device housing, thereby being beneficial to improving the stability and safety performance of the electronic device.
Optionally, the N-type flexible semiconductor material of this embodiment is Bi2Te3-Bi2Se3Powder, P-type flexible semiconductor material is Bi2Te3-Sb2Te3And (3) powder.
Bi2Te3-Bi2Se3Being a common N-type semiconductor material, Bi2Te3-Sb2Te3As a common P-type semiconductor material, Bi is used2Te3-Bi2Se3And Bi2Te3-Sb2Te3The manufacturing cost of the electronic equipment is reduced, and the popularization and the application of the electronic equipment are facilitated.
As shown in fig. 2 to 4, optionally, the heat dissipation structure of the present embodiment includes a third flexible cavity 500 filled with a liquid metal heat conductive agent, and the third flexible cavity 500 is in surface contact with the heat dissipation portion 200.
The liquid metal heat-conducting agent is a heat-conducting medium composed of low-melting-point alkali metal and low-melting-point alloy, has high heat conductivity, and has fluidity at normal temperature. Therefore, after the liquid metal heat-conducting agent is filled into the third flexible cavity 500, the third flexible cavity 500 can efficiently conduct heat and can deform, so that the space can be reasonably utilized, and the limited space can be maximally applied.
The third flexible cavity 500 should be made of a non-conductive material to ensure that the heat dissipation part 200 of the electronic device works normally; meanwhile, the material of the third flexible cavity 500 should also be a good conductor of heat, so as to be beneficial to improving the heat dissipation efficiency of the heat dissipation part 200.
Alternatively, the third flexible cavity 500 may be made of, but not limited to, a thermally conductive insulating elastic rubber. The heat-conducting insulating elastic rubber can adopt a silicon rubber substrate and is added with ceramic particle fillers such as boron nitride, alumina and the like, so that the heat-conducting insulating elastic rubber has good heat-conducting property while being non-conducting.
The heat dissipation part 200 is in surface contact with the third flexible cavity 500, and can improve heat conduction efficiency compared to point contact and line contact.
Optionally, the liquid metal heat conducting agent of the present embodiment is a gallium-based alloy. Since the gallium-based alloy is metal, the thermal conductivity is much higher than that of non-metallic materials. The melting point of gallium in the atmospheric environment is about 30 ℃, and the gallium-based alloy is in a liquid state at normal temperature, so that the gallium-based alloy has fluidity at normal temperature. Therefore, after the gallium-based alloy is filled into the third flexible cavity 500, the third flexible cavity 500 can efficiently conduct heat and can deform, so that the space can be reasonably utilized, and the limited space can be maximally applied.
As shown in fig. 2 to 4, optionally, the heat dissipation structure of this embodiment further includes a heat sink 600, and the heat sink 600 is attached to a surface of the third flexible cavity 500 away from the heat dissipation portion 200.
The heat sink 600 functions to enhance the heat dissipation capability of the third flexible cavity 500, thereby facilitating the improvement of the heat dissipation efficiency of the heat dissipation portion 200, and enabling the refrigeration portion 100 to refrigerate better. The heat sink 600 is attached to the surface of the third flexible cavity 500 away from the heat sink 200, and since surface contact is adopted, heat conduction efficiency can be improved compared to point contact and line contact.
Alternatively, the heat sink 600 may be attached to the surface of the third flexible cavity 500 away from the heat sink portion 200, so that when the third flexible cavity 500 is deformed, the heat sink 600 is deformed along with the third flexible cavity 500, so that the heat sink 600 and the third flexible cavity 500 are in surface contact.
Alternatively, the heat sink 600 of the present embodiment is a graphite heat sink or a copper heat sink.
The graphite radiating fin is light in weight, light in weight design of electronic equipment is facilitated, and heat conducting performance is good. In addition, the lamellar structure of the graphite heat sink can be well adapted to any surface, and when the third flexible cavity 500 deforms, the graphite heat sink can deform along with the third flexible cavity 500, so that the graphite heat sink can be in surface contact with the third flexible cavity 500.
The copper radiating fin has good heat conductivity, high heat conduction speed and strong heat absorption capacity, so the copper radiating fin is widely applied to the heat dissipation of electronic equipment, can reduce the research and development cost due to mature technology, and is favorable for the popularization and the application of the electronic equipment in the embodiment.
Optionally, the power supply of this embodiment is communicated with the heat dissipation portion 200 through the spring piece and the feed point.
Alternatively, the spring plate may be disposed at the power end, and the feeding point may be disposed on the heat dissipating portion 200, and the spring plate and the feeding point are in contact, so as to supply power to the N-type flexible semiconductor device 300 and the P-type flexible semiconductor device 400 connected in series. Similarly, the spring plate may be disposed on the heat dissipation portion 200, and correspondingly, the feeding point may be disposed on the power end, and the spring plate and the feeding point are in contact, so as to supply power to the N-type flexible semiconductor assembly 300 and the P-type flexible semiconductor assembly 400 connected in series. The contact power transmission of the spring plate and the feed point is a mature power transmission technology, and the technology is adopted for power supply, so that stable power transmission is facilitated.
Optionally, the heat dissipation structure of this embodiment includes a controller and a temperature sensor, and the controller controls power on or off of the power supply according to the temperature detected by the temperature sensor.
Alternatively, the temperature sensor may be located at or near a heat generating region of the electronic device. When the temperature sensor detects that the temperature is higher than the preset threshold value, the power supply is electrified, and the refrigerating part 100 refrigerates; when the temperature sensor detects that the temperature is lower than the preset threshold, the power supply is not powered on, and the refrigerating unit 100 does not work. Because the refrigeration part 100 only refrigerates when the temperature is higher than the preset threshold value, the electric energy is saved, the long-time uninterrupted operation of the refrigeration part 100 is avoided, and the service life of the electronic equipment is prolonged.
Alternatively, the controller of the heat dissipation structure may be in communication connection with the temperature sensor, and a relay switch is connected in series between the power supply and the refrigeration unit 100, and the relay switch is turned on and off under the command of the controller, so that the refrigeration unit 100 takes a rest or works. Optionally, when the temperature sensor detects that the temperature is higher than a preset threshold, the relay switch is turned on, the power supply supplies power, and the refrigeration part 100 works; when the temperature sensor detects that the temperature is lower than the preset threshold value, the relay switch is turned on, the power supply is cut off, and the refrigerating unit 100 does not work.
The present embodiment provides an electronic device including the above-described heat dissipation structure based on the peltier effect. Electronic equipment uses above-mentioned heat radiation structure, uses the Peltier effect, uses the electric energy to reduce its regional temperature that generates heat to independently dispel the heat, be favorable to promoting electronic equipment's heat-sinking capability. And because noise and vibration are not generated in the heat dissipation process, the user experience is favorably improved.
Optionally, the electronic device of this embodiment is a mobile phone or a tablet computer. The mobile phone or the tablet computer adopts the structure, the Peltier effect is applied, and the temperature of the heating area of the mobile phone or the tablet computer is reduced by using electric energy, so that the autonomous heat dissipation is carried out, and the heat dissipation capability of the mobile phone or the tablet computer is favorably improved. And because noise and vibration are not generated in the heat dissipation process, the user experience is favorably improved.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "bottom", "top", "front", "rear", "inner", "outer", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that features described in different dependent claims and herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.
Claims (10)
1. A heat dissipation structure based on the Peltier effect is characterized by comprising a refrigerating part, a heat dissipation part, an N-type flexible semiconductor assembly and a P-type flexible semiconductor assembly which are connected with a power supply in series; the first end of the N-type flexible semiconductor assembly and the first end of the P-type flexible semiconductor assembly are respectively connected with the refrigerating part through conductors, and the second end of the N-type flexible semiconductor assembly and the second end of the P-type flexible semiconductor assembly are respectively connected with the radiating part through conductors; the refrigeration part is positioned in or close to a heating area of the electronic equipment and can reduce the temperature of the heating area by using the electric energy provided by the power supply; the N-type flexible semiconductor assembly is a first flexible cavity filled with an N-type flexible semiconductor material, and the P-type flexible semiconductor assembly is a second flexible cavity filled with a P-type flexible semiconductor material;
a first filling port for filling the N-type flexible semiconductor material is formed in the first flexible cavity, and a sealing one-way valve is arranged at the first filling port; a second filling port for filling the P-type flexible semiconductor material is formed in the second flexible cavity, and a sealing one-way valve is arranged at the second filling port;
the N-type flexible semiconductor material and the P-type flexible semiconductor material are powder.
2. The peltier effect based heat dissipation structure according to claim 1, wherein the N-type flexible semiconductor material is Bi2Te3-Bi2Se3Powder, the P-type flexible semiconductor material is Bi2Te3-Sb2Te3And (3) powder.
3. The peltier-based heat dissipation structure according to claim 1, comprising a third flexible cavity filled with a liquid metal heat conductive agent, the third flexible cavity being in surface contact with the heat dissipation part.
4. The peltier-based heat dissipation structure according to claim 3, wherein the liquid metal heat conductive agent is a gallium-based alloy.
5. The peltier-based heat dissipation structure of claim 3, further comprising a heat sink that conforms to a surface of the third flexible cavity away from the heat dissipation portion.
6. The peltier-based heat dissipation structure according to claim 5, wherein the heat sink is a graphite heat sink or a copper heat sink.
7. The peltier-based heat dissipation structure according to claim 1, wherein the power supply and the heat dissipation part are communicated through a spring and a feed point.
8. The peltier-based heat dissipation structure according to claim 1, comprising a controller and a temperature sensor, wherein the controller controls the power supply to be powered on or off according to the temperature detected by the temperature sensor.
9. An electronic device comprising the peltier effect based heat dissipation structure as recited in any one of claims 1 to 8.
10. The electronic device of claim 9, wherein the electronic device is a mobile phone or a tablet computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911265290.1A CN110958817B (en) | 2019-12-11 | 2019-12-11 | Heat radiation structure and electronic equipment based on Peltier effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911265290.1A CN110958817B (en) | 2019-12-11 | 2019-12-11 | Heat radiation structure and electronic equipment based on Peltier effect |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110958817A CN110958817A (en) | 2020-04-03 |
| CN110958817B true CN110958817B (en) | 2020-12-25 |
Family
ID=69980912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911265290.1A Active CN110958817B (en) | 2019-12-11 | 2019-12-11 | Heat radiation structure and electronic equipment based on Peltier effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110958817B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111795602A (en) * | 2020-07-14 | 2020-10-20 | 吴奇勋 | Internal thread copper pipe and idle call heat exchanger |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105091399A (en) * | 2014-05-20 | 2015-11-25 | 中兴通讯股份有限公司 | Refrigeration circuit, terminal and terminal refrigeration method |
| CN106524346A (en) * | 2016-10-18 | 2017-03-22 | 深圳大学 | Semiconductor flexible refrigeration cloth |
| CN206745750U (en) * | 2016-11-02 | 2017-12-15 | 北京脑泰科技发展有限公司 | A kind of heat abstractor through cranium stimulation instrument handle |
| CN207382767U (en) * | 2017-08-11 | 2018-05-18 | 深圳市大材液态金属科技有限公司 | Mobile phone radiator structure |
-
2019
- 2019-12-11 CN CN201911265290.1A patent/CN110958817B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105091399A (en) * | 2014-05-20 | 2015-11-25 | 中兴通讯股份有限公司 | Refrigeration circuit, terminal and terminal refrigeration method |
| CN106524346A (en) * | 2016-10-18 | 2017-03-22 | 深圳大学 | Semiconductor flexible refrigeration cloth |
| CN206745750U (en) * | 2016-11-02 | 2017-12-15 | 北京脑泰科技发展有限公司 | A kind of heat abstractor through cranium stimulation instrument handle |
| CN207382767U (en) * | 2017-08-11 | 2018-05-18 | 深圳市大材液态金属科技有限公司 | Mobile phone radiator structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110958817A (en) | 2020-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1316140B1 (en) | Portable electronic device with enhanced battery life and cooling | |
| CN110880803B (en) | Wireless charging device | |
| CN112383153A (en) | Wireless charger with cooling device | |
| CN110958817B (en) | Heat radiation structure and electronic equipment based on Peltier effect | |
| KR101922022B1 (en) | Wireless charging system with heat prevention | |
| CN219660230U (en) | Radiating assembly and electronic equipment | |
| US20230158904A1 (en) | EV Charging Connector with Thermal Inertia and Method | |
| CN217388260U (en) | Charger convenient to heat dissipation | |
| CN217589068U (en) | Battery protection box, battery package and electric automobile | |
| CN207637783U (en) | A kind of high power semiconductor base plate for packaging and semiconductor package | |
| CN216391916U (en) | Adapter and lighting lamp | |
| CN114927485A (en) | Electric conduction, heat storage and heat transfer method for components | |
| CN213754110U (en) | Wireless charger with cooling device | |
| CN213280441U (en) | Thermoelectric refrigerating device for electronic equipment and electronic equipment | |
| CN209785918U (en) | SMD triode | |
| CN110581113A (en) | central processing unit assembly and heat dissipation control method thereof, electronic equipment and mobile phone | |
| CN219514462U (en) | Heat dissipation back splint and electronic equipment subassembly thereof | |
| CN221687625U (en) | Integrated circuit heat radiation structure and battery cell comprising same | |
| CN221928061U (en) | Power module and electronic product comprising same | |
| CN219145229U (en) | Switch power supply | |
| CN220776346U (en) | Heat dissipation device | |
| CN215011276U (en) | Heat dissipation device and electronic equipment assembly | |
| CN218633996U (en) | Smart phone with good heat dissipation performance | |
| CN216083625U (en) | Thermoelectric refrigeration notebook computer air cooling system | |
| CN221927522U (en) | Heat abstractor and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |