CN207382767U - Mobile phone radiator structure - Google Patents
Mobile phone radiator structure Download PDFInfo
- Publication number
- CN207382767U CN207382767U CN201721004121.9U CN201721004121U CN207382767U CN 207382767 U CN207382767 U CN 207382767U CN 201721004121 U CN201721004121 U CN 201721004121U CN 207382767 U CN207382767 U CN 207382767U
- Authority
- CN
- China
- Prior art keywords
- radiator structure
- mobile phone
- heat
- glue frame
- hollow glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of mobile phone radiator structure, the radiator structure is arranged on former mobile phone cooling fin position；The radiator structure includes hollow glue frame and the heat dissipation packing material in hollow glue frame, and the heat dissipation packing material includes liquid metal heat radiation piece and heat conduction film layer from the inside to the outside, and the thickness for the packing material that radiates is identical with hollow glue frame thickness；The hollow glue frame edge width is 1 1.5mm, and edge height is 1.2 1.5 with liquid metal heat radiation piece height ratio:1.The radiator structure not only has excellent heat conductivility, the silica gel heat conductive pad of the remote ultra-traditional of the capacity of heat transmission, and has extraordinary filling effect, and the security performance for filling sealing structure accesses good guarantee.
Description
Technical field
The utility model belongs to technical field of heat dissipation, and in particular to a kind of radiator structure applied on mobile phone.
Background technology
In recent decades, the appearance of large scale integrated circuit has promoted prosperity and the development of smart mobile phone industry.Meanwhile electricity
Sub- component power density is continuously increased, and encapsulation technology is more compact to cause effective heat management to become extremely difficult.In intelligent hand
In the typical cooling system of machine, CPU and cooling fin can not completely attach to, this is because all surfaces are all non-ideal and thick
Rough.Due to the limitation of manufacturing process, even surface-to-surface contact very smooth between CPU and cooling fin is also inevitably
There are a fixed gaps, and up to 90% interfacial area is caused to be filled with air gap and is separated.Obviously, using with high thermal conductivity
Thermal interfacial material filling contact surface between gap will be solution heat transfer problem most efficient scheme be provided.
Use in the prior art be thermal conductive silicon rubber cushion as fin material, mainly by polymer and inorganic filler（Example
Such as metal nanoparticle, BN, AlN, nanoclay, carbon nanotubes etc.）Composition.Although filler particles have very high heat conduction
Rate, such as AlN ＞ 300W/mK, but since high heat conduction particle is still separated by the polymer of very low heat conduction, they lead
Heating rate is less than 5W/mK mostly.Heat conductivility is generally poor, can not meet the needs of high-performance electronic component.In recent years by
For the liquid metal gradually developed because of the thermal conductivity with remote ultra-traditional heat conductive silica gel material, heat-transfer effect is notable, has been increasingly becoming and has replaced
For the novel heat-conducting material of heat conductive silica gel.But since the mobility of liquid metal is big, easily go out during long-time service
Existing liquid metal leakage, which either penetrates into radiator or the material internal two of electronic component, causes the problem of failing of trickling,
This is also the problem that serious obstruction liquid metal is used widely in the electronic device at present.Preventing Heat Conduction Material leakage side
In the prior art largely using silicone grease peripheral seal, largely occupying the effective area of liquid metal material reduces heat conduction in face
Effect.What is used on a small quantity encloses glue scheme and immature, does not have unified standard on optimal scale.Enclose the wide too thin nothing in edge of glue
Method effectively prevents liquid metal from revealing, too thick, and occupying effective heat-dissipating space causes efficiency to decline；The edge height for enclosing glue is too low
Make its can not effective adhesive interface, it is excessively high cause waste of material and introduce air dielectric reduce heat dissipation effect.
The content of the invention
In order to solve the deficiencies in the prior art, the utility model provides a kind of mobile phone based on liquid metal material
Radiator structure, which not only has excellent heat conductivility, the silica gel heat conductive pad of the remote ultra-traditional of the capacity of heat transmission, and has
There is extraordinary filling effect, and the security performance for filling sealing structure accesses good guarantee.
The utility model institute technique effect to be achieved is realized by following scheme：
A kind of mobile phone radiator structure provided in the utility model, arranged on former mobile phone cooling fin position；The radiator structure
Heat dissipation packing material including hollow glue frame and in hollow glue frame, the heat dissipation packing material include liquid from the inside to the outside
Metal fin and heat conduction film layer, the thickness for the packing material that radiates are identical with hollow glue frame thickness；The hollow glue frame edge is wide
It is 1.2-1.5 to spend for 1-1.5mm, edge height and liquid metal heat radiation piece height ratio:1.
Further, the mobile phone radiator structure is irregular shape.
Further, the heat conduction film layer for heat dissipation graphite film, graphene heat conducting film or include heat dissipation graphite film and/
Or the composite membrane of graphene heat conducting film.
Further, the liquid metal heat radiation piece be pure gallium cooling fin, molecular formula Ga0.97[(Ga2O3)]0.03.It is excellent
Selection of land, the pure gallium fin thickness are 0.5-1mm.
Further, the gap between the heat dissipation packing material and hollow glue frame is filled by heat conduction adhesive.
Further, the radiator structure bottom is equipped with filling slot.Preferably, the filling slot is uniformly distributed in heat dissipation knot
Structure bottom, depth 0.01-0.05mm.
Further, the heat conduction film surface is equipped with isolated protective layer.Preferably, the isolated protective layer is release film
Layer.
The utility model has the following advantages：The utility model provides a kind of mobile phone heat dissipation based on liquid metal material
Structure, which not only has excellent heat conductivility, the silica gel heat conductive pad of the remote ultra-traditional of the capacity of heat transmission, and has non-
Often good filling effect, and the security performance for filling sealing structure accesses good guarantee.
Description of the drawings
Fig. 1 is the structure diagram of mobile phone radiator structure in the utility model；
Fig. 2 is the side structure schematic diagram of mobile phone radiator structure use state in the utility model.
Specific embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples.
As shown in Figure 1, radiator structure includes hollow glue frame 101 and sets the mobile phone radiator structure provided in the present embodiment
In the heat dissipation packing material 102 in hollow glue frame, as shown in Figure 2, which is arranged on mobile phone 104, heat dissipation filling material
Material includes liquid metal heat radiation piece 1021 and heat conduction film layer 1022 from the inside to the outside, to ensure the assembly performance of mobile phone, heat dissipation filling
The thickness of material is identical with the thickness of hollow glue frame.As shown in Figure 1, hollow glue frame edge width m is preferably 1-1.5mm, such as
Shown in attached drawing 2, hollow glue frame edge height n is 1.2-1.5 with liquid metal heat radiation piece height ratio:1.Above-mentioned hollow glue frame size
For optimal size, it can effectively prevent the liquid metal after phase transformation from overflowing.Above-mentioned radiator structure is prepared by a large amount of reality to draw, on
Liquid metal heat radiation can utmostly be played on the premise of saving cost and ensureing minimum level leakage probability by stating peripheral frame size
The heat dissipation effect of piece.
Hollow glue frame can be made in dispensing in process, and thermally conductive sheet institute is adhered directly to after heat conduction gum forming can also be used
Position.On the one hand heat conduction film layer plays the role of promoting heat conduction, on the other hand playing prevents liquid metal for conducting heat piece from leaking
Effect, play the role of blocking well.Heat conduction film layer is preferably heat dissipation graphite film, graphene heat conducting film or includes heat dissipation
The composite membrane of graphite film and/or graphene heat conducting film.To be further ensured that liquid metal for conducting heat piece is not revealed in use,
The gap radiated between packing material and hollow glue frame is filled by heat conduction adhesive.If radiator structure as mobile phone among
Manufacturing procedure can also add isolated protective layer in heat conduction film surface, to prevent radiator structure from changing, the insulation blocking
Layer is release film layer.
Square or rectangular overall structure can be not only made in radiator structure in the utility model, due to liquid
Form is freer after metal conducting strip phase transformation, it is easier to meet the requirement of assembling, therefore the radiator structure in the utility model is more suitable
It closes and irregular shape or the overall structure with globoidal structure is made.Liquid metal heat radiation piece during filling, due to
Surface tension, bottom are not bonded easily with the filling cavity bottom that hollow glue frame is formed, so in actual use, heat dissipation
The filling cavity bottom that structural base, that is, hollow glue frame is formed is equipped with filling slot 103, it is preferable that as shown in Figure 1, filling slot is equal
Even to be distributed in radiator structure bottom, depth 0.01-0.05mm can make liquid metal for conducting heat piece close during filling
Bottom is fitted in, avoids generating gap.
To ensure heat transfer efficiency, liquid metal heat radiation piece selects pure gallium cooling fin, molecular formula Ga0.97
[(Ga2O3)]0.03, pure gallium fin thickness is preferably 0.5-1mm.
A kind of processing method of mobile phone radiator structure in the present embodiment presented below, includes the following steps：
S01：The preparation of liquid metal for conducting heat piece：Ga base fluid state metal fins are prepared by pure Ga, the liquid after heating thawing
State Ga is poured into beaker.Sample stirred at 36 DEG C 24 it is small when, make its complete oxidation generate silvery white liquid form product（Main matter
For Ga0.97 [(Ga2O3)]0.03）.Ga base liquid metals are higher than fusing point（32℃）In the state of show bright metal light
Pool shows larger surface tension.At a temperature lower than its melting point, it is prepared into certain thickness thin slice.In mobile phone
The thickness of radiating silica gel sheet is generally 0.5mm, can be accurately pressed into solid-state Ga Base Metals after cooling by roller mill
The thin slice of 0.5mm thickness, i.e. thermally conductive sheet；
S02：It tears mobile phone open machine, takes out former cooling fin, be packed into the liquid metal for conducting heat piece being of moderate size after cutting, and at it
Surrounding encloses glue sealing against leakage with hollow, forms hollow glue frame；
S03：Liquid metal for conducting heat on piece is positioned over after heat conduction film layer is cut out, is compressed the two using stamping equipment, so
The gap radiated between packing material and hollow glue frame is filled by heat conduction adhesive again afterwards.
Radiator structure in the present embodiment not only has excellent heat conductivility, the silica gel heat conduction of the remote ultra-traditional of the capacity of heat transmission
Pad, and with extraordinary filling effect, and the security performance for filling sealing structure accesses good guarantee.
It is last it should be noted that above example be only to illustrate the embodiment of the present invention technical solution rather than to its into
Row limitation, although the embodiment of the present invention is described in detail with reference to preferred embodiment, those of ordinary skill in the art
It should be understood that the technical solution of the embodiment of the present invention can be still modified or replaced equivalently, and these are changed or wait
The scope of amended technical solution disengaging technical solution of the embodiment of the present invention cannot also be made with replacement.
Claims (10)
1. a kind of mobile phone radiator structure, it is characterised in that：
The radiator structure is arranged on former mobile phone cooling fin position；
The radiator structure includes hollow glue frame and the heat dissipation packing material in hollow glue frame, the heat dissipation packing material
Include liquid metal heat radiation piece and heat conduction film layer from the inside to the outside, the thickness for the packing material that radiates is identical with hollow glue frame thickness；
The hollow glue frame edge width is 1-1.5mm, and edge height is 1.2-1.5 with liquid metal heat radiation piece height ratio:
1。
2. mobile phone radiator structure as described in claim 1, it is characterised in that：The mobile phone radiator structure is irregular shape.
3. mobile phone radiator structure as described in claim 1, it is characterised in that：The heat conduction film layer is heat dissipation graphite film, graphene
Heat conducting film or the composite membrane for including heat dissipation graphite film and/or graphene heat conducting film.
4. mobile phone radiator structure as described in claim 1, it is characterised in that：The liquid metal heat radiation piece is pure gallium cooling fin,
Its molecular formula is Ga0.97[(Ga2O3)]0.03。
5. mobile phone radiator structure as claimed in claim 4, it is characterised in that：The pure gallium fin thickness is 0.5-1mm.
6. mobile phone radiator structure as described in claim 1, it is characterised in that：Between the heat dissipation packing material and hollow glue frame
Gap is filled by heat conduction adhesive.
7. mobile phone radiator structure as described in claim 1, it is characterised in that：The radiator structure bottom is equipped with filling slot.
8. mobile phone radiator structure as claimed in claim 7, it is characterised in that：The filling slot is uniformly distributed in radiator structure bottom
Portion, depth 0.01-0.05mm.
9. mobile phone radiator structure as described in claim 1, it is characterised in that：The heat conduction film surface is equipped with isolated protective layer.
10. mobile phone radiator structure as claimed in claim 9, it is characterised in that：The isolated protective layer is release film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721004121.9U CN207382767U (en) | 2017-08-11 | 2017-08-11 | Mobile phone radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721004121.9U CN207382767U (en) | 2017-08-11 | 2017-08-11 | Mobile phone radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207382767U true CN207382767U (en) | 2018-05-18 |
Family
ID=62342537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721004121.9U Active CN207382767U (en) | 2017-08-11 | 2017-08-11 | Mobile phone radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207382767U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958817A (en) * | 2019-12-11 | 2020-04-03 | 珠海格力电器股份有限公司 | Heat radiation structure and electronic equipment based on Peltier effect |
| CN116033703A (en) * | 2021-10-27 | 2023-04-28 | 荣耀终端有限公司 | Heat conduction pad, heat dissipation module and electronic equipment |
-
2017
- 2017-08-11 CN CN201721004121.9U patent/CN207382767U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958817A (en) * | 2019-12-11 | 2020-04-03 | 珠海格力电器股份有限公司 | Heat radiation structure and electronic equipment based on Peltier effect |
| CN110958817B (en) * | 2019-12-11 | 2020-12-25 | 珠海格力电器股份有限公司 | Heat radiation structure and electronic equipment based on Peltier effect |
| CN116033703A (en) * | 2021-10-27 | 2023-04-28 | 荣耀终端有限公司 | Heat conduction pad, heat dissipation module and electronic equipment |
| WO2023071485A1 (en) * | 2021-10-27 | 2023-05-04 | 荣耀终端有限公司 | Heat conduction pad, heat dissipation module and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104031600B (en) | A kind of heat-conducting metal glue of insulation and manufacture method thereof | |
| TW200301814A (en) | Optimised use of PCMS in cooling devices | |
| CN207382767U (en) | Mobile phone radiator structure | |
| CN210781834U (en) | High-heat-conductivity silicon-carbon composite buffering radiating fin | |
| CN207321431U (en) | A kind of vehicle-mounted hard disk videocorder Fanless radiation structure | |
| CN107522899A (en) | Liquid metal for conducting heat piece and preparation method thereof | |
| CN106929733A (en) | A kind of compound liquid metal thermal interface material of foamed aluminium | |
| CN105633259B (en) | High-power LED light source based on heat pipe principle | |
| CN107052308B (en) | A kind of liquid metal thermal interface material that foam copper is compound | |
| CN209328886U (en) | The Advanced Packaging structure of graphene-based IPM module | |
| CN103871975B (en) | Chip packaging and radiating method | |
| CN102263185A (en) | Thermal radiation light emitting diode structure and manufacturing method thereof | |
| CN113690206B (en) | Integrated magnetic fluid heat dissipation chip device | |
| CN115572581A (en) | Phase change-graphene foam composite heat conduction material with low thermal resistance and preparation method thereof | |
| CN203659934U (en) | Microgroove group heat radiating device of high-power LED (light emitting diode) | |
| CN210671097U (en) | Radiating gasket and electronic component | |
| CN209515738U (en) | The radiator structure of high-power GaN-based LED | |
| CN203934231U (en) | A kind of large thickness heat-conducting interface material of composition metal heat-conducting layer | |
| CN209794770U (en) | Low-melting-point alloy composite heat conduction material | |
| CN203642131U (en) | LED heat sink with high-heat dissipation performance and LED lamp provided with LED heat sink | |
| TW201117428A (en) | Method of manufacturing light emitting diode packaging | |
| CN201845809U (en) | Heat conducting substrate for integral type large-power LED (light-emitting diode) light source module | |
| CN203659935U (en) | Liquid cooling heat radiating device for high-power LED (light emitting diode) | |
| CN109786345A (en) | The Advanced Packaging structure and processing technology of graphene-based IPM module | |
| CN211654811U (en) | Radiating structure of chip packaging |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220401 Address after: 518105 2104, building 1, hegushan Huicheng, No. 35, Guangtian Road, Luotian community, Yanluo street, Bao'an District, Shenzhen, Guangdong Patentee after: Shenzhen Xuyang New Material Technology Co.,Ltd. Address before: 518049 4th floor, xiangtaining taxi terminal building, 7026 CaiTian north, Meilin street, Futian District, Shenzhen, Guangdong Province Patentee before: SHENZHEN DACAI LIQUID METAL TECHNOLOGY CO.,LTD. |