CN216387279U - Crimping type IGBT module high temperature reverse bias testing arrangement - Google Patents
Crimping type IGBT module high temperature reverse bias testing arrangement Download PDFInfo
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- CN216387279U CN216387279U CN202122531100.5U CN202122531100U CN216387279U CN 216387279 U CN216387279 U CN 216387279U CN 202122531100 U CN202122531100 U CN 202122531100U CN 216387279 U CN216387279 U CN 216387279U
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- 238000012360 testing method Methods 0.000 title claims abstract description 67
- 238000002788 crimping Methods 0.000 title claims abstract description 54
- 238000010438 heat treatment Methods 0.000 claims abstract description 121
- 238000001816 cooling Methods 0.000 claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 claims description 55
- 238000012544 monitoring process Methods 0.000 claims description 4
- 239000000523 sample Substances 0.000 claims description 3
- 238000009529 body temperature measurement Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000005493 welding type Methods 0.000 description 1
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Abstract
The utility model discloses a high-temperature reverse bias test device for a crimping type IGBT module. Crimping type IGBT module high temperature reverse bias testing arrangement includes: a frame is supported. And the upper heating plate is connected to the supporting frame through an upper pressure assembly. The lower heating plate is connected to the supporting frame through a lower pressure assembly. And the control unit is electrically connected with the upper heating plate and the lower heating plate respectively. The control unit is suitable for controlling the upper heating plate and the lower heating plate to be respectively in pressure joint with the IGBT module to be tested from two sides, and heating or cooling the IGBT module to be tested. And the control unit is suitable for being electrically connected with the IGBT module to be tested. Both the upper and lower heating plates are exposed to the air. The high-temperature reverse bias test device for the crimping type IGBT module directly heats the IGBT module to be tested by using the heating plate, so that the junction temperature is easy to control, and the high-temperature reverse bias test device is suitable for the high-temperature reverse bias test of the crimping type IGBT module.
Description
Technical Field
The utility model relates to the field of power device testing, in particular to a high-temperature reverse bias testing device for a crimping type IGBT module.
Background
One of the necessary items for testing the reliability of the IGBT device, namely a High Temperature Reverse Bias (HTRB) test, is required in the national standard IEC60747-9, and the IGBT is required to bear 80% rated voltage for 1000 hours at the highest working junction temperature. Because the crimping type IGBT module is provided with a plurality of parallel chips, the leakage current is large at high temperature, and the loss of about 180W can be generated in the 3000A module, the oven heating mode used in the conventional high-temperature reverse bias test is mainly aimed at the welding type IGBT module at present, but the oven heating mode is difficult to control the junction temperature of the IGBT module at high temperature aiming at the crimping type IBGT module, so that the IGBT module can be burnt out thermally. And because the crimping type IGBT module is provided with an upper radiating channel and a lower radiating channel which are connected in parallel, the thermal resistances of the upper surface and the lower surface are different due to the packaging difference mode, and the self-heating of the module is adopted for testing, the junction temperature fluctuation of the IGBT module in temperature regulation is large, and the experimental result is easily influenced.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems, the utility model provides a high-temperature reverse bias test device for a crimping type IGBT module, which aims to solve the problem that an oven heating mode is difficult to apply to the high-temperature reverse bias test of the crimping type IGBT module.
The utility model provides a high-temperature reverse bias test device for a crimping type IGBT module, which comprises: a frame is supported. And the upper heating plate is connected to the supporting frame through an upper pressure assembly. The lower heating plate is connected to the supporting frame through a lower pressure assembly. And the control unit is electrically connected with the upper heating plate and the lower heating plate respectively. The control unit is suitable for controlling the upper heating plate and the lower heating plate to be respectively in pressure joint with the IGBT module to be tested from two sides, and heating or cooling the IGBT module to be tested. And the control unit is suitable for being electrically connected with the IGBT module to be tested. Both the upper and lower heating plates are exposed to the air.
Optionally, the upper pressure assembly comprises a pressure sensor and a spring mechanism; the pressure sensor is electrically connected with the control unit. The lower pressure assembly comprises a top pressure mechanism and a pressurizing oil cylinder; the pressurizing oil cylinder is electrically connected with the control unit.
Optionally, the high-temperature reverse bias test device for the crimping type IGBT module further includes: a heat dissipation assembly. The heat dissipation assembly comprises a plurality of groups of heat dissipation fins, a plurality of heat dissipation air channel shells and a plurality of heat dissipation fans. The multiple groups of radiating fins are respectively arranged on the side part of the upper heating plate or the side part of the lower heating plate and are connected with the upper heating plate or the lower heating plate. A plurality of heat dissipation wind channel shells set up respectively in the lateral part of last hot plate or the lateral part of hot plate down to be connected with last hot plate or hot plate down respectively, each heat dissipation wind channel shell forms the enclosure space with the lateral part of last hot plate or the lateral part of hot plate down respectively, holds each group's radiating fin wherein respectively. The plurality of cooling fans are respectively arranged on each cooling air duct shell, and each cooling air duct shell is at least provided with one cooling fan. And each cooling fan is respectively and electrically connected with the control unit.
Optionally, the four groups of radiating fins are respectively arranged on the left side and the right side of the upper heating plate and the left side and the right side of the lower heating plate. The number of the heat dissipation air duct shells is four, and the four heat dissipation air duct shells respectively surround and contain a group of heat dissipation fins. The number of the heat dissipation fans is four, the heat dissipation fans are respectively arranged on the four heat dissipation air duct shells, and each heat dissipation air duct shell is provided with one heat dissipation fan.
Optionally, the high-temperature reverse bias test device for the crimping type IGBT module further includes: and a temperature measuring component. The temperature measuring part is arranged between the upper heating plate and the lower heating plate. The temperature measurement part is suitable for monitoring the temperature of the IGBT module to be measured in real time. The temperature measuring component is electrically connected with the control unit.
Optionally, the temperature measuring component is an infrared temperature measuring probe.
Optionally, the number of the temperature measuring parts is two, and the two temperature measuring parts are respectively arranged on the lower side of the upper heating plate and the upper side of the lower heating plate.
Optionally, the two temperature measuring parts are diagonally arranged with respect to the center of the space between the upper heating plate and the lower heating plate.
Optionally, the high-temperature reverse bias test device for the crimping type IGBT module further includes: the upper adapter plate is a heat-conducting flat plate and is provided with a horizontal lower surface; the upper adapter plate is arranged on the lower side surface of the upper heating plate; the lower adapter plate is a heat-conducting flat plate and is provided with a horizontal upper surface; the lower adapter plate is arranged on the upper side surface of the lower heating plate.
Optionally, the high-temperature reverse bias test device for the crimping type IGBT module further includes: and the upper insulating and heat insulating plate is arranged on the upper side surface of the upper heating plate and is connected with the upper pressure assembly. And the lower insulating and heat insulating plate is arranged on the lower side surface of the lower heating plate and is connected with the lower pressure assembly.
The utility model has the beneficial effects that:
1. according to the high-temperature reverse bias test device for the crimping type IGBT module, the IGBT module to be tested can be heated or cooled through the upper heating plate and the lower heating plate, meanwhile, the pressure can be applied to the IGBT module to be tested through the upper pressure assembly and the lower pressure assembly, the crimping environment is simulated, and therefore the condition for performing high-temperature reverse bias test on the crimping type IGBT module can be achieved. And meanwhile, the upper heating plate and the lower heating plate are exposed in the air, and the temperature is controlled without using an oven. And the heating plate is more even in temperature distribution relative to the oven, and junction temperature of the IGBT module to be tested in the test is easier to control.
2. According to the high-temperature reverse bias test device for the crimping type IGBT module, disclosed by the utility model, a tester can obtain pressure data through the pressure sensor electrically connected with the control unit so as to be convenient for implementation control in a test; applying pressure to the IGBT module to be tested from the upper part through a spring mechanism so as to provide a pressure condition for testing; the IGBT module to be tested is supported through a top pressing mechanism and a pressurizing oil cylinder in the lower pressure assembly, and meanwhile, a proper testing pressure condition is provided.
3. According to the high-temperature reverse bias testing device for the crimping type IGBT module, the heating plate can be cooled through the arrangement of the heat dissipation assembly. Specifically, the multiple groups of radiating fins arranged on the side parts of the upper heating plate and the lower heating plate can radiate and cool the upper heating plate and the lower heating plate on the premise of not influencing the temperature distribution of the heating plates as much as possible; through the setting of heat dissipation wind channel shell and cooling fan, the radiating rate of accessible fan control hot plate to can realize the stable control to the hot plate temperature, make it stably maintain at suitable temperature, or heat up or lower the temperature with suitable rate.
4. According to the high-temperature reverse bias test device for the crimping type IGBT module, the temperature of the IGBT module to be tested can be monitored in real time through the arrangement of the temperature measurement part, so that implementation data can be mastered, and real-time control and adjustment of test conditions are facilitated.
5. According to the high-temperature reverse bias test device for the crimping type IGBT module, the centers of the middle spaces of the upper heating plate and the lower heating plate of the two temperature measurement components are arranged diagonally, and the diagonal temperature data of the crimping type IGBT module to be tested can be monitored simultaneously, so that the real-time temperature can be controlled more comprehensively and specifically, and the real-time control and adjustment of test conditions are facilitated.
6. According to the high-temperature reverse bias test device for the crimping type IGBT module, the upper and lower sides of the IGBT module to be tested are subjected to more uniform pressure distribution through the arrangement of the upper and lower adapter plates.
7. According to the high-temperature reverse bias testing device for the crimping type IGBT module, the heating plate and the pressure assembly can be separated through the arrangement of the upper insulating thermal insulation plate and the lower insulating thermal insulation plate, the pressure assembly is prevented from being heated for a long time and being damaged by fatigue, meanwhile, the exposed part of the heating plate is reduced, and the probability of scalding when a tester operates can be effectively reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a high-temperature reverse bias test device of a crimping type IGBT module according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a partial cross section in a side direction of a crimping type IGBT module high temperature reverse bias test apparatus according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a circuit connection relationship of a part of the assembly when the high temperature reverse bias test device of the crimping type IGBT module according to an embodiment of the utility model is applied.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
Referring to fig. 1 to 3, the present embodiment provides a high temperature reverse bias test apparatus for a crimping type IGBT module, including:
the frame 1 is supported.
An upper heating plate 31. The upper heating plate 31 is connected to the support frame 1 by an upper pressure assembly.
A lower heating plate 32. The lower heating plate 32 is connected to the support frame 1 by a lower pressure assembly.
A control unit (not shown in fig. 1 and 2) electrically connected to the upper and lower heating plates 31 and 32, respectively.
The control unit is suitable for controlling the upper heating plate 31 and the lower heating plate 32 to be respectively in crimping connection with the IGBT module 2 to be tested from two sides, and heating or cooling the IGBT module 2 to be tested. And the control unit is suitable for electrically connecting the IGBT module 2 to be tested.
Wherein both the upper and lower heating plates are exposed to the air.
The crimping type IGBT module high temperature reverse bias testing arrangement of this embodiment can heat or cool down the IGBT module 2 that awaits measuring through last hot plate 31 and lower hot plate 32, can exert pressure, simulation crimping environment to the IGBT module 2 that awaits measuring through last pressure components and lower pressure components simultaneously to can realize carrying out the condition of high temperature reverse bias test to crimping type IGBT module 2. While the upper and lower heating plates 31 and 32 are exposed to the air without using an oven for temperature control. And the heating plate is more even in temperature distribution relative to the oven, and junction temperature of the IGBT module 2 to be tested in the test is easier to control.
Specifically, the upper pressure assembly includes a pressure sensor 42 and a spring mechanism 41. The pressure sensor 42 is electrically connected to the control unit. The down pressure assembly includes a jacking mechanism 51 and a jacking cylinder 52. The pressurizing cylinder 52 is electrically connected to the control unit.
In the high-temperature reverse bias test device for the crimping type IGBT module, a tester can obtain pressure data through the pressure sensor 42 electrically connected with the control unit so as to be convenient for implementation control in the test; applying pressure to the IGBT module 2 to be tested from the upper part through a spring mechanism 41 so as to provide a pressure condition for testing; the IGBT module 2 to be tested is supported by the jacking mechanism 51 and the pressurizing oil cylinder 52 in the lower pressure assembly, and meanwhile, the proper testing pressure condition is provided.
Further, the crimping type IGBT module high-temperature reverse bias test device further comprises a heat dissipation assembly 6. The heat dissipation assembly 6 includes a plurality of sets of heat dissipation fins 62, a plurality of heat dissipation duct cases 63, and a plurality of heat dissipation fans 61.
The plurality of sets of heat dissipation fins 62 are respectively disposed on the side of the upper heating plate 31 or the side of the lower heating plate 32, and are connected to the upper heating plate 31 or the lower heating plate 32.
The plurality of heat dissipation duct cases 63 are respectively disposed at the side of the upper heating plate 31 or the side of the lower heating plate 32, and are respectively connected to the upper heating plate 31 or the lower heating plate 32. Each of the heat dissipation duct cases 63 forms an enclosure space with the side of the upper heating plate 31 or the side of the lower heating plate 32, respectively, and accommodates each set of heat dissipation fins 62 therein, respectively.
The plurality of cooling fans 61 are respectively disposed on the cooling air duct shells 63, and each cooling air duct shell 63 is at least provided with one cooling fan 61. The cooling fans 61 are electrically connected to the control unit.
Specifically, in the present embodiment, the heat dissipation fins 62 are provided in four groups, respectively, on the left and right sides of the upper heating plate 31 and the left and right sides of the lower heating plate 32. The number of the heat dissipation air duct shells 63 is four, and each heat dissipation air duct shell respectively surrounds and accommodates one group of heat dissipation fins 62. The number of the heat dissipation fans 61 is four, and the four heat dissipation air duct shells 63 are respectively arranged, and each heat dissipation air duct shell 63 is provided with one heat dissipation fan 61.
The crimping type IGBT module high temperature reverse bias testing arrangement of this embodiment through radiator unit 6's setting, can cool down to the hot plate. Specifically, the plurality of sets of heat dissipation fins 62 disposed on the side portions of the upper heating plate 31 and the lower heating plate 32 can dissipate heat and cool the upper heating plate 31 and the lower heating plate 32 on the premise that the temperature distribution of the heating plates is not affected as much as possible. Through the setting of heat dissipation wind channel shell 63 and cooling fan 61, the radiating rate of accessible fan control hot plate to can realize the stable control to the hot plate temperature, make it stably maintain at suitable temperature, or heat up or lower the temperature with suitable rate.
Further, crimping type IGBT module high temperature reverse bias testing arrangement still includes: and a temperature measuring part 7. The temperature measuring part 7 is disposed between the upper heating plate 31 and the lower heating plate 32. The temperature measuring part 7 is suitable for monitoring the temperature of the IGBT module 2 to be measured in real time. The temperature measuring component 7 is electrically connected with the control unit.
Specifically, in this embodiment, the temperature measuring component 7 is an infrared temperature measuring probe.
The crimping type IGBT module high temperature reverse bias testing device of this embodiment through the setting of temperature measurement part 7, can carry out real time temperature monitoring to the IGBT module 2 that awaits measuring to grasp implementation data does benefit to real time control and adjustment to the test condition.
In this embodiment, two temperature measuring parts 7 are provided, respectively, on the lower side of the upper heating plate 31 and the upper side of the lower heating plate 32.
Further, the two temperature measuring parts 7 are diagonally disposed with respect to the center of the space between the upper heating plate 31 and the lower heating plate 32 (one is located at the upper right corner and the other is located at the lower left corner in fig. 1).
The crimping type IGBT module high temperature reverse bias testing device of this embodiment becomes diagonal setting with the center of the intermediate space of hot plate 31 above two temperature measurement parts 7 and hot plate 32 down, can monitor the temperature data of the diagonal of crimping IGBT module 2 that awaits measuring simultaneously for the control to real-time temperature is more comprehensive concrete, in order to be favorable to real-time control and adjustment to the test condition.
In this embodiment, the high temperature reverse bias test device for the crimp-type IGBT module further includes:
an upper adapter plate 91. The upper adapter plate 91 is a heat conductive flat plate having a horizontal lower surface. The upper adapter plate 91 is provided on the lower side surface of the upper heating plate 31.
A lower adapter plate 92. The lower adapter plate 92 is a thermally conductive flat plate having a horizontal upper surface. The lower adapter plate 92 is provided on the upper side surface of the lower heating plate 32.
The high-temperature reverse bias test device for the crimping type IGBT module of the embodiment is more uniform in pressure distribution of the upper side and the lower side of the IGBT module 2 to be tested, through the arrangement of the upper adapter plate 91 and the lower adapter plate 92.
In this embodiment, the high temperature reverse bias test device for the crimp-type IGBT module further includes:
and an upper insulating thermal shield 81. An upper insulating adiabatic plate 81 is disposed on the upper side surface of the upper heating plate 31 and connected to the upper pressure assembly.
A lower insulating thermal shield 82. The lower insulating thermal shield 82 is disposed on the lower side surface of the lower heating plate 32 and is connected to the lower pressure assembly.
The crimping type IGBT module high temperature reverse bias testing arrangement of this embodiment through the setting of last insulating thermal baffle 81 and lower insulating thermal baffle 82, can separate hot plate and pressure components, avoids pressure components to be heated for a long time and accelerates fatigue damage, and the hot plate exposes the part outside simultaneously and reduces, also can effectively reduce the probability of scalding when testing personnel operate.
The technical scheme disclosed by the utility model is illustrated by the embodiment. It is believed that one skilled in the art can, using the preceding description of embodiments, appreciate the present invention. It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the utility model.
Claims (10)
1. The utility model provides a crimping type IGBT module high temperature reverse bias testing arrangement which characterized in that includes:
a support frame;
an upper heating plate connected to the support frame by an upper pressure assembly;
a lower heating plate connected to the support frame by a lower pressure assembly;
the control unit is electrically connected with the upper heating plate and the lower heating plate respectively;
the control unit is suitable for controlling the upper heating plate and the lower heating plate to be respectively in pressure joint with the IGBT module to be tested from two sides and heating or cooling the IGBT module to be tested; the control unit is suitable for being electrically connected with the IGBT module to be tested;
the upper heating plate and the lower heating plate are both exposed to air.
2. The crimping type IGBT module high temperature reverse bias test device according to claim 1,
the upper pressure assembly comprises a pressure sensor and a spring mechanism; the pressure sensor is electrically connected with the control unit;
the lower pressure assembly comprises a top pressure mechanism and a pressurizing oil cylinder; the pressurizing oil cylinder is electrically connected with the control unit.
3. The crimping type IGBT module high temperature reverse bias test device of claim 2, characterized by further comprising:
a heat dissipating component;
the heat dissipation assembly comprises a plurality of groups of heat dissipation fins, a plurality of heat dissipation air channel shells and a plurality of heat dissipation fans;
the multiple groups of radiating fins are respectively arranged on the side part of the upper heating plate or the side part of the lower heating plate and are connected with the upper heating plate or the lower heating plate;
the plurality of heat dissipation air channel shells are respectively arranged on the side part of the upper heating plate or the side part of the lower heating plate and are respectively connected with the upper heating plate or the lower heating plate, and each heat dissipation air channel shell forms an enclosed space with the side part of the upper heating plate or the side part of the lower heating plate and respectively accommodates each group of heat dissipation fins therein;
the plurality of heat dissipation fans are respectively arranged on the heat dissipation air channel shells, and each heat dissipation air channel shell is at least provided with one heat dissipation fan; and each heat radiator is electrically connected with the control unit respectively.
4. The crimping type IGBT module high temperature reverse bias test device of claim 3,
the four groups of radiating fins are respectively arranged on the left side and the right side of the upper heating plate and the left side and the right side of the lower heating plate;
the number of the heat dissipation air duct shells is four, and the four heat dissipation air duct shells respectively surround and contain a group of heat dissipation fins;
the number of the heat dissipation fans is four, the heat dissipation fans are respectively arranged on the four heat dissipation air duct shells, and each heat dissipation air duct shell is provided with one heat dissipation fan.
5. The crimping type IGBT module high temperature reverse bias test device of claim 3, characterized by further comprising:
a temperature measuring part;
the temperature measuring component is arranged between the upper heating plate and the lower heating plate; the temperature measuring component is suitable for monitoring the temperature of the IGBT module to be measured in real time; the temperature measuring component is electrically connected with the control unit.
6. The crimping type IGBT module high temperature reverse bias test device of claim 5,
the temperature measuring component is an infrared temperature measuring probe.
7. The crimping type IGBT module high temperature reverse bias test device of claim 5,
the two temperature measuring parts are respectively arranged on the lower side of the upper heating plate and the upper side of the lower heating plate.
8. The crimping type IGBT module high temperature reverse bias test device of claim 7,
the two temperature measuring components are arranged diagonally relative to the center of the space between the upper heating plate and the lower heating plate.
9. The crimping type IGBT module high temperature reverse bias test device of claim 3, characterized by further comprising:
the upper adapter plate is a heat-conducting flat plate and is provided with a horizontal lower surface; the upper adapter plate is arranged on the lower side surface of the upper heating plate;
the lower adapter plate is a heat conduction flat plate and is provided with a horizontal upper surface; the lower adapter plate is arranged on the upper side surface of the lower heating plate.
10. The crimping type IGBT module high temperature reverse bias test device of claim 3, characterized by further comprising:
the upper insulating and heat insulating plate is arranged on the upper side surface of the upper heating plate and is connected with the upper pressure assembly;
and the lower insulating and heat insulating plate is arranged on the lower side surface of the lower heating plate and is connected with the lower pressure assembly.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122531100.5U CN216387279U (en) | 2021-10-20 | 2021-10-20 | Crimping type IGBT module high temperature reverse bias testing arrangement |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122531100.5U CN216387279U (en) | 2021-10-20 | 2021-10-20 | Crimping type IGBT module high temperature reverse bias testing arrangement |
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| CN216387279U true CN216387279U (en) | 2022-04-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114675119A (en) * | 2022-05-31 | 2022-06-28 | 陕西半导体先导技术中心有限公司 | Semiconductor power device reliability detection box and detection method |
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2021
- 2021-10-20 CN CN202122531100.5U patent/CN216387279U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114675119A (en) * | 2022-05-31 | 2022-06-28 | 陕西半导体先导技术中心有限公司 | Semiconductor power device reliability detection box and detection method |
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