CN110536586B - Immersed cooling device - Google Patents
Immersed cooling device Download PDFInfo
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- CN110536586B CN110536586B CN201910512791.9A CN201910512791A CN110536586B CN 110536586 B CN110536586 B CN 110536586B CN 201910512791 A CN201910512791 A CN 201910512791A CN 110536586 B CN110536586 B CN 110536586B
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- circulation
- condenser
- accommodating box
- bottom plate
- electronic
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- 238000001816 cooling Methods 0.000 title claims abstract description 49
- 239000007788 liquid Substances 0.000 claims abstract description 36
- 238000010438 heat treatment Methods 0.000 claims abstract description 25
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 15
- 238000007654 immersion Methods 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 6
- 239000000956 alloy Substances 0.000 claims abstract description 4
- 239000007787 solid Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 10
- OKIYQFLILPKULA-UHFFFAOYSA-N 1,1,1,2,2,3,3,4,4-nonafluoro-4-methoxybutane Chemical compound COC(F)(F)C(F)(F)C(F)(F)C(F)(F)F OKIYQFLILPKULA-UHFFFAOYSA-N 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 5
- 239000004986 Cholesteric liquid crystals (ChLC) Substances 0.000 claims description 5
- 239000002775 capsule Substances 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- 238000004945 emulsification Methods 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 230000008859 change Effects 0.000 abstract description 12
- 238000004880 explosion Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 17
- 239000012071 phase Substances 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides an immersed cooling device, which comprises a containing box, a condenser and a water pump which are sequentially connected through pipelines to form a circulation, wherein the temperature of the liquid state of a circulation medium of the circulation is between 30 and 70 ℃, and the temperature of the solid state of the circulation medium of the circulation is between-110 and-70 ℃; an electronic heating source is fixed in the accommodating box, a semiconductor cooling fin is arranged at the top of the accommodating box, a plurality of heat conducting ribs are arranged in the accommodating box at intervals, a plurality of grooves are formed in the bottom plate of the shell of the electronic heating source, and the heat conducting ribs are clamped in the grooves in a one-to-one correspondence manner; the shell bottom plate and the heat conduction convex edges are all made of aluminum alloy materials. According to the immersion type cooling device provided by the invention, the electronic heating source is immersed in the liquid medium, and the phase change of the liquid medium is utilized to cool, so that the cooling efficiency is greatly improved compared with air convection cooling, and the heating and cooling requirements required in the data explosion era are met.
Description
Technical Field
The invention relates to a cooling technology, in particular to an immersed cooling device.
Background
With the rapid development of information technology, the transmission and processing of data volume are both in geometric progression, for example, the quality of data transmission is improved by a 5G technology relative to a 4G technology, and meanwhile, electronic components are highly integrated, so that the heat productivity of electronic components such as computers, internet of things, various intelligent terminals and the like is synchronously improved.
The traditional cooling mode is air cooling, forced air convection is carried out by adopting a fan, and the fan is assisted by a structural design with extremely high heat conduction efficiency, and the fan and the structural design are combined to realize heat dissipation, but the traditional heat dissipation mode is difficult to meet the heat dissipation requirements in the fields of computers and the like at present.
Disclosure of Invention
The object of the present invention is to provide an immersion cooling device which solves the above-mentioned drawbacks of the prior art.
In order to achieve the above object, the present invention provides the following technical solutions:
an immersion cooling device comprising a holding tank, a condenser and a water pump which are connected in sequence by pipelines to form a circulation, wherein the temperature of the liquid state of a circulation medium of the circulation is between 30 and 70 ℃, and the temperature of the solid state of the circulation medium of the circulation is between-110 and-70 ℃;
an electronic heating source is fixed in the accommodating box, a plurality of heat conducting ribs are arranged in the accommodating box at intervals, a plurality of grooves are formed in the bottom plate of the shell of the electronic heating source, and the heat conducting ribs are clamped in the grooves in a one-to-one correspondence manner;
the shell bottom plate and the heat conduction convex edges are all made of aluminum alloy materials.
In the above immersed cooling device, the circulating medium is a mixed liquid composed of nano-scale capsules, the mixed liquid contains 97% by weight of nonafluorobutyl methyl ether (C4F 9OCH 3) material and 3% by weight of cholesteric liquid crystal thermosensitive material wrapped by phenolic resin, and the mixed liquid is subjected to emulsification treatment to form a phase transition temperature point of 58+/-2 ℃.
In the immersed cooling device, the bottom plate of the shell is V-shaped.
According to the immersed cooling device, the bottom plate is the V-shaped block, each heating element of the electronic heating source is arranged on the top surface of the V-shaped block, and the groove is formed in the V-shaped block.
In the above immersion cooling device, the condenser is connected to the top of the accommodating box, and a semiconductor cooling fin is disposed between the condenser and the accommodating box.
In the immersed cooling device, the bottom of the accommodating box is provided with the moving structure.
In the above submerged cooling device, the condenser includes a heat radiation fin and a fan, and the fan faces the heat radiation fin.
According to the immersed cooling device, the side plate of the shell is made of aluminum alloy, the aluminum alloy protruding piece is arranged in the accommodating box, and the aluminum alloy protruding piece is abutted to the heating piece of the electronic heating source.
In the above submerged cooling device, the electronic heat generating source is one or more of an integrated circuit board, a storage device, an operation device and a detection device.
In the immersed cooling device, the expansion valve is arranged on the pipeline between the accommodating box and the condenser.
In the technical scheme, the immersion type cooling device provided by the invention has the advantages that the electronic heating source is immersed in the liquid medium, and the phase change of the liquid medium is utilized for cooling, so that the cooling efficiency is greatly improved compared with air convection cooling, and the heating and cooling requirements required in the data explosion era are met.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
FIG. 1 is a schematic view of an immersion cooling apparatus according to an embodiment of the present invention;
fig. 2 is a schematic view of an internal structure of a containing box according to an embodiment of the present invention;
FIG. 3 is a top view of the interior of a containment tank provided by an embodiment of the present invention;
FIG. 4 is a schematic view of an immersion cooling apparatus according to another embodiment of the present invention;
FIG. 5 is a schematic view of a portion of a base plate according to an embodiment of the present invention;
fig. 6 is a cross-sectional view A-A of fig. 5.
Reference numerals illustrate:
1. a pipe; 2. a housing box; 3. a condenser; 4. a water pump; 5. an expansion valve; 6. an electronic heat source; 7. a thermally conductive rib; 8. a groove; 9. a semiconductor cooling fin; 10. a fan; 11. an aluminum alloy projection; 12. a bottom plate.
Detailed Description
In order to make the technical scheme of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.
As shown in fig. 1 to 6, an immersion cooling apparatus according to an embodiment of the present invention includes a container tank 2, a condenser 3 and a water pump 4 which are sequentially connected by a pipe 1 to form a circulation, wherein the temperature of the circulation medium of the circulation is between 30 and 70 degrees from a liquid state to a gas state; an electronic heating source 6 is fixed in the accommodating box 2, a plurality of heat conducting ribs 7 are arranged in the accommodating box 2 at intervals, a plurality of grooves 8 are arranged on a bottom plate 12 of a shell of the electronic heating source 6, and the heat conducting ribs 7 are clamped in the grooves 8 in a one-to-one correspondence manner; the shell bottom plate 12 and the heat conduction convex edges 7 are made of aluminum alloy materials.
Specifically, the holding tank 2, the condenser 3 and the water pump 4 are sequentially connected through the pipeline 1, meanwhile, the water pump 4 is connected with the holding tank 2 through the pipeline 1, so that the holding tank 2, the condenser 3 and the water pump 4 are connected into a circulation of an annular structure through the pipeline 1, a circulation medium in the circulation of the annular structure is a liquid-gas phase change material, the temperature of the liquid phase change into a gaseous state is between 30-70 ℃, namely, the phase change temperature is between 30-70 ℃, the liquid pump 4 is suitable for conveying, insulating liquid with stable physicochemical properties can be considered as a circulation medium in the embodiment of the invention, but preferably, the circulation medium is a mixed liquid composed of nano-scale capsules, the mixed liquid contains 97% by weight of nonafluorobutyl methyl ether (C4F 9OCH 3) material and 3% by weight of cholesteric liquid crystal thermosensitive material wrapped by phenolic resin, and the mixed liquid forms a phase change temperature point of 58+/-2 ℃ through emulsification treatment, and the thermodynamic characteristics of the circulation medium are that: high insulating property, excellent heat transfer property and physical and chemical properties, good heat stability and fluidity, and large latent heat, and meets the requirement of environmental protection regulations. The liquid mixed working medium has high insulativity, the breakdown voltage is > (room temperature) kV/2.5mm, and the volume resistivity is more than or equal to 6 multiplied by 10E10 omega-m. So that the electronic component is immersed in the circulating medium without short circuit; the circulating medium has high insulation property, and can be applied to the high-voltage occasion with the voltage of less than 4 kilovolts. The circulating medium has an arc extinguishing function, and can timely extinguish sparks possibly generated by the circuit; the circulating medium has phase change characteristics, and when reaching a set phase change temperature point, the circulating medium can be converted from a liquid state into a gas state, and a large amount of heat is carried away at the moment, and when the circulating medium is lower than the phase change temperature point, the circulating medium is converted into the liquid state again.
In this embodiment, the electronic heat generating source 6 is fixed in the accommodating box 2, where the electronic heat generating source 6 refers to various computers capable of generating heat, electronic components or electronic mechanisms in the communication field, such as a host computer, various servers, and the like, and one or more of an integrated circuit board, a storage device, an operation device, and a detection device are integrated, the accommodating box 2 is filled with a circulating medium, that is, at least part of the electronic heat generating source 6 is immersed in the circulating medium, the electronic heat generating component generates a large amount of heat during use, the heat generated by the electronic heat generating component heats the circulating medium, so that the phase of the circulating medium changes into gas, the gas flows to the condenser 3 along the pipeline 1, the gas cools in the condenser 3 to form a liquid, and the liquid flows back to the accommodating box 2 under the driving force of the water pump 4 to complete the circulation. The electronic heating element is immersed by the circulating medium, and the heat dissipation efficiency is extremely high due to phase change in the heat dissipation process. The immersion type heat dissipation device is in the prior art, and the heat dissipation cycle of this embodiment can refer to various immersion type heat dissipation devices in the prior art, and the innovation of this embodiment is that a plurality of grooves 8 are provided on the bottom plate 12 of the shell of the electronic heat generation source 6, and a plurality of heat conduction ribs 7 are provided in the accommodating box 2, each heat conduction rib 7 is in one-to-one corresponding clamping connection with each groove 8, so that on one hand the electronic heat generation source 6 is more tightly connected to the accommodating box 2, on the other hand, the shell of the electronic heat generation source 6 is more tightly connected to the heat conduction ribs 7, so that the heat dissipation area of the electronic heat generation source 6 is greatly improved, and the bottom plate 12 and the heat conduction ribs 7 are both heat dissipation areas. Further improving the heat dissipation efficiency.
According to the immersion type cooling device provided by the embodiment of the invention, the electronic heating source 6 is immersed in the liquid medium, and the temperature is reduced by utilizing the phase change of the liquid medium, so that the cooling efficiency is greatly improved compared with air convection cooling, and the heating and cooling requirements required by the data explosion age are met.
In another embodiment of the present invention, as shown in fig. 5-6, further, the bottom plate 12 of the housing is V-shaped, and the V-shaped structure can increase the heat exchange area, further, the bottom plate 12 is a V-shaped block, each heat generating element of the electronic heat generating source 6 is disposed on the top surface of the V-shaped block, and the V-shaped block is provided with the groove 8, so that the V-shaped block receives heat generated by each heat generating element, such as an integrated circuit board, a lamp, and an electronic component, and the V-shaped block transfers the heat to the heat conducting rib 7 with its own high thermal conductivity. And the V-shaped block facilitates the opening of the recess 8.
In still another embodiment provided by the invention, as shown in fig. 2-4, further, the side plate of the housing is made of aluminum alloy, an aluminum alloy protruding piece 11 is arranged in the accommodating box 2, and the aluminum alloy protruding piece 11 abuts against a heating piece of the electronic heating source 6, that is, the accommodating box 2 is connected with the housing in a dual manner through the aluminum alloy protruding piece 11 and the heat conducting rib 7, so that the heat dissipation efficiency is improved; the circulating medium is a mixed liquid composed of nanoscale capsules, the mixed liquid comprises 97% by weight of nonafluorobutyl methyl ether (C4F 9OCH 3) material and 3% by weight of cholesteric liquid crystal thermosensitive material wrapped by phenolic resin, the mixed liquid is subjected to emulsification treatment to form a phase transition temperature point of 58+/-2 ℃, the mixed liquid has the characteristics of small specific volume, fast temperature rise and good fluidity, the mixed liquid is fast in heat conduction, an aluminum alloy bulge 11 is wrapped to conduct heat to the box body of the containing box 2, the condenser 3 is connected to the top of the containing box 2, a semiconductor cooling sheet 9 is arranged between the condenser 3 and the containing box 2, and therefore the condenser 3 and the containing box 2 are designed into an integrated structure, and the heat transfer amount between the condenser 3 and the containing box 2 is increased through the semiconductor cooling sheet 9.
In a further embodiment of the invention, the bottom of the housing box 2 is preferably provided with a moving structure such as a roller with brake, which facilitates the overall movement of the submerged cooling apparatus.
In still another embodiment of the present invention, further, the condenser 3 includes a heat dissipation fin and a fan 10, the fan 10 faces the heat dissipation fin, the heat dissipation fin dissipates heat to air to change the gas in the condenser 3 into liquid, and the fan 10 accelerates the flow of the gas to accelerate the heat dissipation effect of the heat dissipation fin.
In still another embodiment of the present invention, further, an expansion valve 5 is disposed on the pipe 1 between the accommodating box 2 and the condenser 3, the expansion valve 5 is used for maintaining the balance of the gas pressure in the accommodating box 2, the accommodating box 2 is provided with liquid and gas at the same time, the different heating values of the electronic heating elements make the phase change of the liquid different, and the balance of the gas pressure in the accommodating box 2 is maintained through the expansion valve 5.
In still another embodiment of the present invention, the circulating medium is a mixed liquid composed of nano-scale capsules, the mixed liquid contains 97% by weight of nonafluorobutyl methyl ether (C4F 9OCH 3) material and 3% by weight of cholesteric liquid crystal thermosensitive material wrapped by phenolic resin, the solid state transition temperature of the circulating medium is between-110 and-70 ℃, and the circulating medium can also be operated in a low-temperature environment.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the invention, which is defined by the appended claims.
Claims (8)
1. An immersion cooling device, characterized by comprising a containing box, a condenser and a water pump which are sequentially connected through pipelines to form a circulation, wherein the temperature of the liquid state of a circulation medium of the circulation is between 30 and 70 ℃, and the temperature of the solid state of the circulation medium of the circulation is between-110 and-70 ℃;
an electronic heating source is fixed in the accommodating box, a plurality of heat conducting ribs are arranged in the accommodating box at intervals, a plurality of grooves are formed in the bottom plate of the shell of the electronic heating source, and the heat conducting ribs are clamped in the grooves in a one-to-one correspondence manner;
the shell bottom plate and the heat conduction convex edges are made of aluminum alloy materials;
the circulating medium is a mixed liquid consisting of nano-scale capsules, the mixed liquid comprises 97% by weight of nonafluorobutyl methyl ether (C4F 9OCH 3) material and 3% by weight of cholesteric liquid crystal thermosensitive material wrapped by phenolic resin, and the mixed liquid is subjected to emulsification treatment to form a phase transition temperature point of 58+/-2 ℃;
the bottom plate of the shell is V-shaped.
2. A submerged cooling apparatus according to claim 1, wherein the bottom plate is a V-shaped block, each heat generating element of the electronic heat generating source is arranged on the top surface of the V-shaped block, and the V-shaped block is provided with the groove.
3. A submerged cooling apparatus according to claim 1, wherein the condenser is connected to the top of the tank, and a semiconductor cooling fin is arranged between the condenser and the tank.
4. A submerged cooling apparatus according to claim 3, wherein the bottom of the containment tank is provided with a moving structure.
5. A submerged cooling apparatus according to claim 1, wherein the condenser comprises a radiator fin and a fan, the fan being directed towards the radiator fin.
6. The submerged cooling apparatus of claim 1, wherein the side plates of the housing are made of aluminum alloy, and aluminum alloy protruding members are arranged in the accommodating box and abut against heating members of the electronic heating source.
7. The immersion cooling apparatus of claim 1, wherein the electronic heat generating source is integrated with one or more of an integrated circuit board, a memory device, a computing device, a detection device.
8. A submerged cooling apparatus according to claim 1, wherein an expansion valve is arranged in the conduit between the holding tank and the condenser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910512791.9A CN110536586B (en) | 2019-06-13 | 2019-06-13 | Immersed cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910512791.9A CN110536586B (en) | 2019-06-13 | 2019-06-13 | Immersed cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110536586A CN110536586A (en) | 2019-12-03 |
| CN110536586B true CN110536586B (en) | 2024-01-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910512791.9A Active CN110536586B (en) | 2019-06-13 | 2019-06-13 | Immersed cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110536586B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113721718B (en) * | 2020-05-26 | 2024-06-25 | 富联精密电子(天津)有限公司 | Heat abstractor and server |
| CN111682410B (en) * | 2020-06-16 | 2021-10-15 | 甘肃华菱电气自动化控制系统有限公司 | Grease circulation accelerating circulation structure for heat dissipation of high-low voltage box type transformer cabinet |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101296600A (en) * | 2007-04-29 | 2008-10-29 | 英业达股份有限公司 | Radiating assembly and electronic device using the same |
| CN101610660A (en) * | 2008-06-20 | 2009-12-23 | 沈国忠 | Compressor cooling type fully sealed high-efficiency radiating electronic cabinet |
| CN106255396A (en) * | 2016-10-18 | 2016-12-21 | 中车大连机车研究所有限公司 | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system |
| CN108347860A (en) * | 2017-01-22 | 2018-07-31 | 中国科学院空间应用工程与技术中心 | Phase transformation cold plate and space heat elimination device based on phase-change material |
-
2019
- 2019-06-13 CN CN201910512791.9A patent/CN110536586B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101296600A (en) * | 2007-04-29 | 2008-10-29 | 英业达股份有限公司 | Radiating assembly and electronic device using the same |
| CN101610660A (en) * | 2008-06-20 | 2009-12-23 | 沈国忠 | Compressor cooling type fully sealed high-efficiency radiating electronic cabinet |
| CN106255396A (en) * | 2016-10-18 | 2016-12-21 | 中车大连机车研究所有限公司 | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system |
| CN108347860A (en) * | 2017-01-22 | 2018-07-31 | 中国科学院空间应用工程与技术中心 | Phase transformation cold plate and space heat elimination device based on phase-change material |
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| Publication number | Publication date |
|---|---|
| CN110536586A (en) | 2019-12-03 |
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Effective date of registration: 20240102 Address after: No. 101, Gate 2, Building 9, Wanliu Wanquan Xinxin Jiayuan, Haidian District, Beijing, 100089 Applicant after: Liu Yihang Address before: 217, 2nd Floor, Building 4, East District, No.10 Northwest Wangdong Road, Haidian District, Beijing, 100193 Applicant before: BEIJING JIULIN INNOVATION TECHNOLOGY CO.,LTD. |
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