CN107645886A - A kind of high-power high integration signal processing component structure in space - Google Patents
A kind of high-power high integration signal processing component structure in space Download PDFInfo
- Publication number
- CN107645886A CN107645886A CN201710858016.XA CN201710858016A CN107645886A CN 107645886 A CN107645886 A CN 107645886A CN 201710858016 A CN201710858016 A CN 201710858016A CN 107645886 A CN107645886 A CN 107645886A
- Authority
- CN
- China
- Prior art keywords
- signal transacting
- heat
- sequential
- plate
- backboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of space is related to space optical remote field with high-power high integration signal processing component structure, and a base frame plate is set under a signal transacting mainboard of the structure, a signal transacting backboard and a sequential and power panel；Each signal transacting mainboard, signal transacting backboard and sequential and the surrounding of power panel are respectively provided with heat conduction frame；Each signal transacting mainboard, signal transacting backboard and the surface of sequential and power panel are respectively provided with heat-conducting plate, and heat-conducting plate will be radiated by heat conduction frame in heat transmission to the spoke cold drawing being connected with multi-disc CCD upper ends；Multi-disc CCD is fixed as one entirely through the side connecting plate and connecting rod at both ends, is integrally provided on base frame substrate, and pinboard is arranged on CCD, is connected with outer signals.Heat endurance of the present invention is more perfect, and heat dispersion is more excellent；Greatly reduce the volume and weight of signal processing component；Save cost and reduce the difficulty of design.
Description
Technical field
The invention belongs to space optical remote field, and in particular to a kind of high-power high integration signal transacting group in space
Part structure.
Background technology
As space remote sensing field is to space camera high-resolution, the active demand of wide covering, cause focal plane subassembly and preceding
The integrated level and power consumption of end signal processing module constantly expand, and signal processing component is general and focal plane subassembly passes through flexible PCB
One is integrally attached on remote sensor.The increase of signal processing component volume and power consumption can be to the dynamics and heat of whole remote sensing camera
Characteristic is made a big impact, and very big difficulty is brought to structure design.
Traditional Space Remote Sensors signal processing component is formed using square chest type grafting more, and signal transacting and sequential plate are general
It is connected in structural frames, each structural member is connected into by the casing of slideway and outside and is integral.Circuit board passes through structural frames
The mode for once arriving housing of transferring has certain influence for electrical and thermal conductivity, and still further aspect structure switchover frame also increases entirely
The architecture quality of component.The shortcomings that volume that this structure type is brought is big, quality weight, electrical and thermal conductivity difference can influence optical system
The stability of system and the mechanical property of complete machine.
The content of the invention
In order to solve problems of the prior art, the invention provides a kind of space with high-power high integration signal
Processing component structure, solves in the prior art that high-power high integration signal processing component mechanics heat endurance is poor, conductive and heat-conductive
Property difference and structure design difficulty it is big the problem of.
The technical proposal for solving the technical problem of the invention is as follows：
A kind of space is included with high-power high integration signal processing component structure, the structure：Base frame substrate, multiple signals
Processing main plate, multiple signal transacting backboards, multiple sequential and power panel, multiple heat-conducting plates, multiple heat conduction frames, side connecting plate, spoke
Cold drawing, connecting rod, pinboard and multiple base frame plates；One signal transacting mainboard, a signal transacting backboard and a sequential and
Power panel forms a piece of CCD, and a base frame plate is set under every CCD；Each signal transacting mainboard, signal transacting backboard and sequential
And the surrounding of power panel is respectively provided with heat conduction frame；Each signal transacting mainboard, signal transacting backboard and the surface of sequential and power panel
Heat-conducting plate is respectively provided with, the heat-conducting plate will be carried out by heat conduction frame in heat transmission to the spoke cold drawing being connected with multi-disc CCD upper ends
Radiating；Multi-disc CCD fixes as one entirely through the side connecting plate and connecting rod at both ends, is integrally provided on base frame substrate,
Pinboard is arranged on CCD, is connected with outer signals.
The beneficial effects of the invention are as follows：The present invention is directly radiated heat transmission to spoke cold drawing by heat conduction frame, is led to
Heat conduction frame, heat-conducting plate and heat-conducting glue are crossed, makes heat endurance more perfect, heat dispersion is more excellent；By removing casing assembly,
Greatly reduce the volume and weight of signal processing component；Save cost and reduce the difficulty of design.
Brief description of the drawings
A kind of high-power high integration signal processing component structural design drawing in Fig. 1 spaces of the present invention.
Fig. 2 present invention control and signal processing module composition figure
In figure：1st, CCD, 2, spoke cold drawing, 3, connecting rod, 4, pinboard, 5, side connecting plate, 6, loading card, 7, substrate, 8, letter
Number processing main plate heat-conducting plate, 9, trip bolt, 10, auricle, 11, signal transacting mainboard, 12, signal transacting backboard, 13, sequential and
Power panel, 14, signal transacting backboard heat-conducting plate, 15, sequential and power panel heat-conducting plate, 16, signal transacting mainboard frame, 17, signal
Handle backboard frame, 18, sequential and power supply sheet frame and 19, base frame plate.
Embodiment
The present invention is described in further details with reference to the accompanying drawings and examples.
A kind of space is included with high-power high integration signal processing component structure, the structure：CCD1, spoke cold drawing 2, connection
Bar 3, pinboard 4, side connecting plate 5, loading card 6, substrate 7, signal transacting mainboard heat-conducting plate 8, trip bolt 9, auricle 10, signal
Processing main plate 11, signal transacting backboard 12, sequential and power panel 13, signal transacting backboard heat-conducting plate 14, sequential and power panel are led
Hot plate 15, signal transacting mainboard frame 16, signal transacting backboard frame 17, sequential and power supply sheet frame 18, base frame plate 19.
Signal transacting mainboard 11, signal transacting backboard 12, sequential and power panel 13 are respectively fixed to signal transacting mainboard frame
16th, on signal transacting backboard frame 17, sequential and power supply sheet frame 18.Signal transacting mainboard heat-conducting plate 8, signal transacting backboard plate heat conduction
Plate 14, sequential and power panel heat-conducting plate 15 and signal transacting mainboard frame 16, signal transacting backboard frame 17, sequential and power supply sheet frame 18
Between have heat-conducting glue increase heat conductivility.Between heat-conducting plate and signal transacting mainboard 11, signal transacting backboard 12, sequential and power panel 13
The way of contact is soft contact, provided with heat conductive pad.On signal transacting mainboard 11, signal transacting backboard 12, sequential and power panel 13
High-power heat-dissipation device passes through signal transacting mainboard heat-conducting plate 8, signal transacting backboard heat-conducting plate 14, sequential and power panel heat-conducting plate
15 by conduction pattern in heat transfer to sheet frame.A spoke cold drawing 2, spoke cold drawing 2 and sheet frame signal transacting are designed with CCD1
Heat conduction matter is scribbled between mainboard frame 16, signal transacting backboard frame 17, sequential and power supply sheet frame 18, makes up gap and the increasing of joint face
Add heat conductivility.CCD1 is made up of signal transacting mainboard 11, signal transacting backboard 12, sequential and power panel 13.Signal transacting master
Plate 11, signal transacting backboard 12, sequential and power panel 13 are closely joined together by four trip bolts 9, in trip bolt 9
There is matching relationship in heart hole with external connection bar 3, easy disassembly, reduces process complexity and assembly difficulty.A piece of CCS1 is divided into
One block of base frame plate 19 is put, is connected with control and signal processing module 1 by connector, enters row clock synchronously and hard instruction is transferred
Deng.Base frame plate 19 is connected on substrate 7, in the present embodiment, 8 groups of controls and signal processing module 1 by respective auricle 10 with
Substrate 7 is fixed, and is integral by connecting rod 3 and the connection of side connecting plate 5.
Total is full-closed structure, in signal transacting mainboard frame 16, signal transacting backboard frame 17, sequential and power panel
Connecting link between frame 18 is designed with seam and slideway, to prevent electromagnetic exposure or interference.Pinboard 4 is arranged on CCD1, and outer
Sector signal is connected.
For convenience of being noted on software and falling weldering, set of circuits plate corresponding to a piece of CCD1 is designed with loading card 6.
Claims (3)
1. the high-power high integration signal processing component structure in a kind of space, it is characterised in that the structure includes：Base frame base
Plate, multiple signal transacting mainboards, multiple signal transacting backboards, multiple sequential and power panel, multiple heat-conducting plates, multiple heat conduction frames,
Side connecting plate, spoke cold drawing, connecting rod, pinboard and multiple base frame plates；One signal transacting mainboard, a signal transacting backboard and
One sequential and power panel form a piece of CCD, and a base frame plate is set under every CCD；Each signal transacting mainboard, signal transacting
Backboard and sequential and the surrounding of power panel are respectively provided with heat conduction frame；Each signal transacting mainboard, signal transacting backboard and sequential and electricity
The surface of source plate is respectively provided with heat-conducting plate, the spoke that heat transmission is extremely connected by the heat-conducting plate by heat conduction frame with multi-disc CCD upper ends
Radiated on cold drawing；Multi-disc CCD fixes as one entirely through the side connecting plate and connecting rod at both ends, is integrally provided in bottom
On stylobate plate, pinboard is arranged on CCD, is connected with outer signals.
A kind of 2. high-power high integration signal processing component structure in space according to claim 1, it is characterised in that
Circuit board in the every CCD is fixed by screw.
A kind of 3. high-power high integration signal processing component structure in space according to claim 2, it is characterised in that
One loading card is all set on each circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710858016.XA CN107645886B (en) | 2017-09-21 | 2017-09-21 | A kind of high-power high integration signal processing component structure in space |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710858016.XA CN107645886B (en) | 2017-09-21 | 2017-09-21 | A kind of high-power high integration signal processing component structure in space |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107645886A true CN107645886A (en) | 2018-01-30 |
| CN107645886B CN107645886B (en) | 2019-05-14 |
Family
ID=61111767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710858016.XA Expired - Fee Related CN107645886B (en) | 2017-09-21 | 2017-09-21 | A kind of high-power high integration signal processing component structure in space |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107645886B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4730232A (en) * | 1986-06-25 | 1988-03-08 | Westinghouse Electric Corp. | High density microelectronic packaging module for high speed chips |
| WO1998005058A2 (en) * | 1996-07-15 | 1998-02-05 | The Regents Of The University Of California | A vacuum compatible miniature ccd camera head |
| CN2694339Y (en) * | 2003-11-28 | 2005-04-20 | 中国科学院空间科学与应用研究中心 | Embedded computer system adapted for aerospaceplane |
| US6944022B1 (en) * | 2002-08-30 | 2005-09-13 | Themis Computer | Ruggedized electronics enclosure |
| CN104241224A (en) * | 2014-07-30 | 2014-12-24 | 中国科学院长春光学精密机械与物理研究所 | Enhancement heat conduction structure for high-power CCD of space optical remote sensor |
| CN204350519U (en) * | 2014-11-30 | 2015-05-20 | 上海航空电器有限公司 | A kind of printed board assembly structure |
| CN204377320U (en) * | 2015-02-09 | 2015-06-03 | 英属维京群岛商百崴宇智股份有限公司台湾分公司 | The computer heat radiation module assembly of stacking-type printed circuit board (PCB) |
| TWI576039B (en) * | 2015-02-04 | 2017-03-21 | Wei xiao-wei | Stacked printed circuit board computer cooling module assembly |
| US20170231104A1 (en) * | 2014-08-28 | 2017-08-10 | Diehl Aerospace Gmbh | Modular assembly |
| CN107124854A (en) * | 2017-05-26 | 2017-09-01 | 航天东方红卫星有限公司 | A kind of storehouse assembly thermal controls apparatus |
-
2017
- 2017-09-21 CN CN201710858016.XA patent/CN107645886B/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4730232A (en) * | 1986-06-25 | 1988-03-08 | Westinghouse Electric Corp. | High density microelectronic packaging module for high speed chips |
| WO1998005058A2 (en) * | 1996-07-15 | 1998-02-05 | The Regents Of The University Of California | A vacuum compatible miniature ccd camera head |
| US6944022B1 (en) * | 2002-08-30 | 2005-09-13 | Themis Computer | Ruggedized electronics enclosure |
| CN2694339Y (en) * | 2003-11-28 | 2005-04-20 | 中国科学院空间科学与应用研究中心 | Embedded computer system adapted for aerospaceplane |
| CN104241224A (en) * | 2014-07-30 | 2014-12-24 | 中国科学院长春光学精密机械与物理研究所 | Enhancement heat conduction structure for high-power CCD of space optical remote sensor |
| US20170231104A1 (en) * | 2014-08-28 | 2017-08-10 | Diehl Aerospace Gmbh | Modular assembly |
| CN204350519U (en) * | 2014-11-30 | 2015-05-20 | 上海航空电器有限公司 | A kind of printed board assembly structure |
| TWI576039B (en) * | 2015-02-04 | 2017-03-21 | Wei xiao-wei | Stacked printed circuit board computer cooling module assembly |
| CN204377320U (en) * | 2015-02-09 | 2015-06-03 | 英属维京群岛商百崴宇智股份有限公司台湾分公司 | The computer heat radiation module assembly of stacking-type printed circuit board (PCB) |
| CN107124854A (en) * | 2017-05-26 | 2017-09-01 | 航天东方红卫星有限公司 | A kind of storehouse assembly thermal controls apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107645886B (en) | 2019-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201078873Y (en) | Electronic device | |
| CN203551846U (en) | Optical connector packaging structure | |
| WO2017202254A1 (en) | Apparatus for mounting and fixing computer cpu heat sink and dedicated cpu heat sink | |
| JP5797329B2 (en) | Electronic computer with cooling system | |
| CN202549845U (en) | Image sensor radiating structure and photographing device | |
| CN102026496A (en) | Method for preparing printed circuit board with insulated micro radiator | |
| JPH05145208A (en) | Circuit unit | |
| CN102056418A (en) | Preparation method for printed circuit board with insulating miniature radiators | |
| CN201601889U (en) | Circuit board combination | |
| CN106714517A (en) | Liquid-cooled board card module for multipoint temperature monitoring | |
| CN201821591U (en) | Radiator shell and communication terminal device | |
| CN204887856U (en) | Double -deck optical module heat radiation structure | |
| CN206743393U (en) | Imaging device, imaging device component and electronic installation | |
| CN102202459A (en) | PCB (printed circuit board) with metal micro radiator | |
| CN107645886A (en) | A kind of high-power high integration signal processing component structure in space | |
| CN105338737B (en) | Circuit board assemblies and mobile phone camera mould group | |
| CN202103943U (en) | Printed circuit board with metal micro-radiator | |
| CN103019353A (en) | Bus and connector combined server power supply system | |
| CN201119248Y (en) | Heat radiation device | |
| CN205539814U (en) | Display module and display equipment | |
| CN207067440U (en) | A kind of high intensity anti-deformation light guide plate of exhibition | |
| CN207249351U (en) | A kind of quick heat radiating twin-lens panorama camera | |
| US8558946B2 (en) | PCB and camera module having the same | |
| CN208283938U (en) | A kind of hard disk backboard, mainboard and electronic equipment | |
| CN101115366B (en) | Heat radiating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Liu Xiaofeng Inventor after: He Xin Inventor before: Liu Xiaofeng Inventor before: He Cuan |
|
| CB03 | Change of inventor or designer information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190514 Termination date: 20200921 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |