CN211671161U

CN211671161U - High-performance integrated circuit board

Info

Publication number: CN211671161U
Application number: CN201922067463.0U
Authority: CN
Inventors: 洪朝满
Original assignee: Guizhou Xizhi Technology Co Ltd
Current assignee: Guizhou Xizhi Technology Co Ltd
Priority date: 2019-11-26
Filing date: 2019-11-26
Publication date: 2020-10-13
Anticipated expiration: 2029-11-26

Abstract

The utility model discloses a high performance integrated circuit board, which comprises an outer shell, the top and the bottom of shell inner wall are provided with fixing device, two be provided with integrated circuit board between the relative one side of fixing device, the top and the equal fixedly connected with dead lever in bottom of shell inner wall one side, two the equal fixedly connected with mounting panel of one end of shell inner wall is kept away from to the dead lever, two fixedly connected with water tank between the relative one side of mounting panel, the utility model relates to an integrated circuit board technical field. This high performance integrated circuit board through the setting of U type pipe and water tank, adopts water tank and U type pipe to make the cooling water increase, has increased heat-sinking capability, again because the water tank side is the cockscomb structure, can increase the surface area of the lower air contact of cooling water and ambient temperature in the water tank, can be more rapid for the cooling water cooling to integrated circuit board cooling has increased integrated circuit board's heat dispersion.

Description

High-performance integrated circuit board

Technical Field

The utility model relates to an integrated circuit board technical field specifically is a high performance integrated circuit board.

Background

The integrated circuit board is a carrier for loading integrated circuit, but usually the integrated circuit board is also carried on, and the integrated circuit board is mainly formed from silica gel, so that it is green, and is made up by adopting semiconductor production process, on a small single crystal silicon chip several transistors, resistors and capacitors are made, and according to the multilayer wiring or tunnel wiring method the components are combined into a complete electronic circuit, and said integrated circuit is represented by using letter "IC" (also using character symbol "N" etc.).

The performance of the existing integrated circuit board is good, but the heat dissipation mode of the general integrated circuit board is air cooling or copper pipe water cooling, the air cooling is poorer than the water cooling heat dissipation capability, and the copper pipe water cooling cannot play the whole performance of the integrated circuit board due to the structural limitation of the copper pipe water cooling, so that the integrated circuit board is excessive in performance and cannot be used at high frequency.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a high performance integrated circuit board has solved current high performance integrated circuit board and has received the problem that the unable performance of radiating mode restriction.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a high performance integrated circuit board, includes the shell, the top and the bottom of shell inner wall are provided with fixing device, two be provided with integrated circuit board between the relative one side of fixing device, the equal fixedly connected with dead lever in top and the bottom of shell inner wall one side, two the equal fixedly connected with mounting panel in one end that shell inner wall was kept away from to the dead lever, two fixedly connected with water tank between the relative one side of mounting panel, one side intercommunication that shell inner wall was kept away from to the water tank has U type pipe to U type pipe and one side laminating of integrated circuit board.

Furthermore, the both sides at shell inner wall top are all fixedly connected with connecting rod, two the bottom fixedly connected with radiator fan of connecting rod.

Further, fixing device includes two spring telescopic links, two the top of spring telescopic link all with the top fixed connection of shell inner wall, two the bottom fixed connection of spring telescopic link has the stripper plate, the bottom and the top swing joint of integrated circuit board of stripper plate.

Furthermore, two one side that the connecting rod is relative all is through fixed screw fixed connection fixed plate, two fixedly connected with filter between the relative one side of fixed plate.

Further, the number of the heat radiation fans is two, and the connecting parts and the connecting mode are the same.

Furthermore, air inlets are formed in the top and the bottom of the shell, and one side of the shell is communicated with a ventilation pipe.

Compared with the prior art, the beneficial effects of the utility model are that:

the high-performance integrated circuit board has the advantages that through the arrangement of the U-shaped pipe and the water tank, heat is conducted into cooling water inside the U-shaped pipe through the surface of the U-shaped pipe, the heat in the cooling water of the U-shaped pipe is conducted into the cooling water with lower temperature in the water tank according to the heat conduction effect, so that the temperature of the cooling water in the U-shaped pipe is reduced, the heat dissipation is completed, compared with the traditional copper pipe water cooling, the cooling water is increased by adopting the water tank and the U-shaped pipe, the heat dissipation capability is improved, the surface area of the cooling water in the water tank, which is in contact with air with lower external temperature, can be increased due to the fact that the side surface of the water tank is in a sawtooth shape, the cooling water can be rapidly cooled, so that the integrated circuit board is cooled, the heat dissipation performance of the integrated circuit board is improved, thereby preventing performance from being excessive.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of a portion of the enlarged structure of FIG. 1;

fig. 3 is a schematic structural view of the fixing device of the present invention.

In the figure: 1. a housing; 2. a fixing device; 201. a spring telescopic rod; 202. a pressing plate; 3. an integrated circuit board; 4. a water tank; 5. a U-shaped pipe; 6. a connecting rod; 7. a heat radiation fan; 8. fixing the rod; 9. mounting a plate; 10. a filter plate; 11. a fixing plate; 12. an air inlet; 13. and a ventilation pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a high-performance integrated circuit board comprises a shell 1, wherein an opening is formed in one side of the shell 1, and the opening is matched with an integrated circuit board 3.

Fixing devices 2 are arranged at the top and the bottom of the inner wall of the shell 1, an integrated circuit board 3 is arranged between one sides of the two fixing devices 2, and the back of the integrated circuit board 1 faces the inside of the shell 1 and is attached to the U-shaped pipe 5.

The top and the bottom of shell 1 inner wall one side all fixedly connected with dead lever 8, dead lever 8 plays the fixed action to water tank 4 to furthest's reduction is to the hindrance that radiator fan 7 bloied.

Two dead levers 8 keep away from the equal fixedly connected with mounting panel 9 of one end of 1 inner wall of shell, fixedly connected with water tank 4 between the relative one side of two mounting panels 9, the load capacity of water tank 4 increase cooling water to the one side of keeping away from U type pipe 5 of water tank 4 is the sawtooth strong, can increase with the area of contact of air, improves cooling rate.

One side of the water tank 4, which is far away from the inner wall of the shell 1, is communicated with U-shaped pipes 5, the U-shaped pipes 5 are arranged in multiple groups in sequence along the width direction of the shell 1, and the U-shaped pipes 5 are attached to one side of the integrated circuit board 3.

The equal fixedly connected with connecting rod 6 in both sides at 1 inner wall top of shell, the bottom fixedly connected with radiator fan 7 of two connecting rods 6, the forced air cooling combines the water-cooling, further improves the heat-sinking capability for integrated circuit board 3's high performance can further exert out, thereby prevents that the performance is surplus.

Fixing device 2 includes two spring telescopic links 201, the top of two spring telescopic links 201 all with the top fixed connection of 1 inner wall of shell, the bottom fixedly connected with stripper plate 202 of two spring telescopic links 201, the bottom of stripper plate 202 and integrated circuit board 3's top swing joint for integrated circuit board 3 installs and dismantles more conveniently.

Two connecting rod 6 relative one sides all through fixed screw fixed connection fixed plate 11, fixedly connected with filter 10 between two 11 relative one sides of fixed plate, filters the dust of air inlet 12 through filter 10, prevents that the dust deposit from hindering integrated circuit board 3's heat dispersion.

The number of the heat radiation fans 7 is two, and the connecting parts and the connecting mode are the same and are respectively positioned at the top and the bottom of the inner wall of the shell 1, so that the cooling speed of cooling water in the water tank 4 is accelerated while the heat of the integrated circuit board 3 is radiated.

Air inlet 12 has all been seted up to the top and the bottom of shell 1, and one side intercommunication of shell 1 has scavenge pipe 13, and the convenience carries out the air exchange with the external world, the heat dissipation of being convenient for.

When the cooling structure is used, the heat of the integrated circuit board 3 is conducted into the cooling water in the U-shaped pipe 5 through the surface of the U-shaped pipe 5, the heat in the cooling water of the U-shaped pipe 5 is conducted into the cooling water with lower temperature in the water tank 4 according to the heat conduction effect, so that the temperature of the cooling water in the U-shaped pipe 5 is reduced, the heat dissipation is completed, compared with the traditional copper pipe water cooling, the water tank 4 and the U-shaped pipe 5 are adopted to increase the loaded cooling water and increase the heat dissipation capacity, the surface area of the cooling water in the water tank 4 contacted with the air with lower external temperature can be increased due to the zigzag side surface of the water tank 4, the cooling water can be rapidly cooled, so that the integrated circuit board 3 is cooled, the heat dissipation performance of the integrated circuit board 3 is increased, and the heat dissipation capacity is further improved due to the combination of air cooling and, thereby preventing performance from being excessive.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A high performance integrated circuit board comprising a housing (1), characterized in that: the top and the bottom of shell (1) inner wall are provided with fixing device (2), two be provided with integrated circuit board (3) between the relative one side of fixing device (2), the equal fixedly connected with dead lever (8) in top and the bottom of shell (1) inner wall one side, two the equal fixedly connected with mounting panel (9) of one end that shell (1) inner wall was kept away from in dead lever (8), two fixedly connected with water tank (4) between the relative one side of mounting panel (9), one side intercommunication that shell (1) inner wall was kept away from in water tank (4) has U type pipe (5) to U type pipe (5) and the laminating of one side of integrated circuit board (3).

2. A high performance integrated circuit board in accordance with claim 1, wherein: the heat dissipation device is characterized in that connecting rods (6) are fixedly connected to the two sides of the top of the inner wall of the shell (1), and heat dissipation fans (7) are fixedly connected to the bottoms of the connecting rods (6).

3. A high performance integrated circuit board in accordance with claim 1, wherein: fixing device (2) include two spring telescopic links (201), two the top of spring telescopic link (201) all with the top fixed connection of shell (1) inner wall, two the bottom fixedly connected with stripper plate (202) of spring telescopic link (201), the bottom of stripper plate (202) and the top swing joint of integrated circuit board (3).

4. A high performance integrated circuit board in accordance with claim 2, wherein: two one side that connecting rod (6) are relative all through fixed screw fixed connection fixed plate (11), two fixedly connected with filter (10) between one side that fixed plate (11) are relative.

5. A high performance integrated circuit board in accordance with claim 2, wherein: the number of the heat radiation fans (7) is two, and the connecting parts and the connecting mode are the same.

6. A high performance integrated circuit board in accordance with claim 1, wherein: the top and the bottom of the shell (1) are both provided with air inlets (12), and one side of the shell (1) is communicated with a ventilation pipe (13).