CN216820470U

CN216820470U - Microwave power amplifier with heat radiation structure

Info

Publication number: CN216820470U
Application number: CN202220003653.5U
Authority: CN
Inventors: 潘涛; 李俊华
Original assignee: Yisheng Shenzhen Electronic Equipment Co ltd
Current assignee: Yisheng Shenzhen Electronic Equipment Co ltd
Priority date: 2022-01-04
Filing date: 2022-01-04
Publication date: 2022-06-24
Anticipated expiration: 2032-01-04

Abstract

The utility model discloses a microwave power amplifier with a heat dissipation structure, and relates to the technical field of power amplifiers. The air-cooling fan mounting structure comprises a mounting box, wherein a first frame is mounted on the inner surface of the mounting box, a positioning groove is formed in the inner surface of the first frame, a positioning shaft is mounted on the inner surface of the positioning groove, an air deflector is mounted on the outer surface of the positioning shaft, a second frame is mounted on the inner surface of the mounting box, a mounting frame is mounted on the inner surface of the second frame, a fan is mounted on the outer surface of the mounting frame, a fixing frame is mounted on the lower surface of the mounting plate, a radiating pipe is mounted on the inner surface of the fixing frame, a mounting seat is mounted on the lower surface of the mounting plate, and a radiating plate is mounted on the lower surface of the mounting seat. According to the utility model, through the fan, the air deflector and the heat dissipation plate, air in the mounting box can flow, the heat dissipation efficiency of the electronic component can be improved, the thermal reliability of the electronic component is ensured, the high-efficiency heat dissipation capability of the electronic component is realized, and the yield of the electronic component is greatly improved.

Description

Microwave power amplifier with heat radiation structure

Technical Field

The utility model belongs to the technical field of power amplifiers, and particularly relates to a microwave power amplifier with a heat dissipation structure.

Background

With the continuous development of science and technology, people have higher and higher requirements on heat dissipation of electronic equipment, and particularly in microwave/millimeter wave system equipment, any electronic equipment is stored or works under certain environmental conditions, wherein the influence of the temperature in climate factors on the electronic equipment or the system is particularly important. The high temperature, the low temperature and the circulation thereof can generate important influence on most electronic components, which can cause the failure of the electronic components and further influence the failure of the whole equipment, and the method is particularly remarkable on the high-power amplifier products. There is data showing that in a transmitter, the reliability of a power transistor decreases by 60% for every 10 ℃ increase in junction temperature.

With the miniaturization and microminiaturization of electronic components, the high integration and micro-assembly of integrated circuits, and the like, the heat flux density of components and assemblies is continuously improved, and the thermal design is facing a serious challenge. At present, a plurality of domestic units adopt a traditional single-mode design method of conduction heat dissipation or air cooling heat dissipation and the like to carry out heat dissipation design on microwave equipment, but the microwave equipment has the limitation of low heat dissipation efficiency, can cause the phenomenon that the product fails to work under the normal temperature or high temperature environment, and has low reliability.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a microwave power amplifier with a heat dissipation structure, which solves the existing problems.

In order to solve the technical problems, the utility model is realized by the following technical scheme:

the utility model relates to a microwave power amplifier with a heat dissipation structure, which comprises an installation box, wherein a support is arranged on the inner surface of the installation box, an installation plate is arranged on the upper surface of the support, a fixed framework is arranged on the upper surface of the installation plate, a rubber pad is arranged on the inner surface of the fixed framework, a printed circuit board is arranged on the upper surface of the rubber pad, a power amplifier and a power supply are arranged on the outer surface of the printed circuit board, an installation block is arranged on the outer surface of the fixed framework, an installation groove is formed in the inner surface of the installation block, a rotating rod is arranged on the inner surface of the installation groove, a fixed plate is arranged on the outer surface of the rotating rod, and the outer surface of the fixed plate is connected with the outer surface of the printed circuit board.

Preferably, a first frame is mounted on the inner surface of the mounting box, a positioning groove is formed in the inner surface of the first frame, a positioning shaft is mounted on the inner surface of the positioning groove, an air deflector is mounted on the outer surface of the positioning shaft, a second frame is mounted on the inner surface of the mounting box, a mounting frame is mounted on the inner surface of the second frame, a fan is mounted on the outer surface of the mounting frame, air in the mounting box can flow through the fan, the air deflector and a heat dissipation plate, the heat dissipation efficiency of electronic components can be improved, the thermal reliability of the electronic components is guaranteed, the efficient heat dissipation capacity of the electronic components is realized, the yield of the electronic components is greatly improved, a protective net is mounted on the inner surface of the second frame, a third frame is mounted on the inner surface of the mounting box, a dust screen is mounted on the inner surface of the third frame, and a plurality of mounting bolts are mounted on the outer surface of the dust screen, surface mounting has the mount under the mounting panel, mount internal surface mounting has the cooling tube, surface mounting has the mount pad under the mounting panel, surface mounting has the heating panel under the mount pad, through with the even installation of cooling tube at the mounting panel lower surface, can make heat and product external environment carry out the heat exchange in the short time, plays the radiating action, avoids the heat to concentrate on local position and leads to the heat source device to burn out, has solved the uneven problem of product temperature field distribution.

The utility model has the following beneficial effects:

according to the utility model, the radiating pipes are uniformly arranged on the lower surface of the mounting plate, so that heat exchange can be carried out between heat and the external environment of the product in a short time, a radiating effect is achieved, the heat is prevented from being concentrated at a local position to cause burning of a heat source device, and the problem of uneven distribution of a temperature field of the product is solved; then, through the fan, the air deflector and the heat dissipation plate, air in the mounting box can flow, the heat dissipation efficiency of the electronic component can be improved, the thermal reliability of the electronic component is ensured, the high-efficiency heat dissipation capacity of the electronic component is realized, and the yield of the electronic component is greatly improved.

Of course, it is not necessary for any product in which the utility model is practiced to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic front view of the present invention;

FIG. 3 is a left side view of the present invention;

FIG. 4 is a schematic view of the cross-sectional structure A-A of FIG. 3;

fig. 5 is a schematic top view of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. mounting a box; 2. a support; 3. mounting a plate; 4. a fixed frame; 5. mounting blocks; 6. mounting grooves; 7. rotating the rod; 8. a fixing plate; 9. a rubber pad; 10. a printed circuit board; 11. a power amplifier; 12. a power source; 13. a first frame; 14. positioning a groove; 15. positioning the shaft; 16. an air deflector; 17. a second frame; 18. a protective net; 19. a mounting frame; 20. a fan; 21. a third frame; 22. a dust screen; 23. installing a bolt; 24. a fixed mount; 25. a radiating pipe; 26. a mounting seat; 27. a heat sink.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "middle", "outer", "inner", and the like, indicate orientations or positional relationships, are used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

As shown in the figure, the microwave power amplifier with the heat dissipation structure comprises a mounting box 1, wherein a support 2 is mounted on the inner surface of the mounting box 1, a mounting plate 3 is mounted on the upper surface of the support 2, a fixing frame 4 is mounted on the upper surface of the mounting plate 3, a rubber pad 9 is mounted on the inner surface of the fixing frame 4, a printed circuit board 10 is mounted on the upper surface of the rubber pad 9, a power amplifier 11 and a power supply 12 are mounted on the outer surface of the printed circuit board 10, a mounting block 5 is mounted on the outer surface of the fixing frame 4, a mounting groove 6 is formed in the inner surface of the mounting block 5, a rotating rod 7 is mounted on the inner surface of the mounting groove 6, a fixing plate 8 is mounted on the outer surface of the rotating rod 7, and the outer surface of the fixing plate 8 is connected with the outer surface of the printed circuit board 10.

Wherein, the inner surface of the mounting box 1 is provided with a first frame 13, the inner surface of the first frame 13 is provided with a positioning groove 14, the inner surface of the positioning groove 14 is provided with a positioning shaft 15, the outer surface of the positioning shaft 15 is provided with an air deflector 16, the inner surface of the mounting box 1 is provided with a second frame 17, the inner surface of the second frame 17 is provided with a mounting rack 19, the outer surface of the mounting rack 19 is provided with a fan 20, the air in the mounting box 1 can flow through the fan 20, the air deflector 16 and a heat dissipation plate 27, the heat dissipation efficiency of the electronic components can be improved, the thermal reliability of the electronic components can be ensured, the high-efficiency heat dissipation capability of the electronic components can be realized at the same time, the yield of the electronic components can be greatly improved, the inner surface of the second frame 17 is provided with a protective net 18, the inner surface of the mounting box 1 is provided with a third frame 21, and the inner surface of the third frame 21 is provided with a dust screen 22, the outer surface of the dustproof net 22 is provided with a plurality of mounting bolts 23, the lower surface of the mounting plate 3 is provided with a fixing frame 24, the inner surface of the fixing frame 24 is provided with a radiating pipe 25, the lower surface of the mounting plate 3 is provided with a mounting seat 26, and the lower surface of the mounting seat 26 is provided with a radiating plate 27.

The utility model is a microwave power amplifier with a heat dissipation structure, heat exchange can be carried out between heat and the external environment of an electronic component in a short time by uniformly installing the heat dissipation pipes 25 on the lower surface of the installation plate 3, so that the heat dissipation effect is achieved, the heat source component burnout caused by heat concentration at a local position is avoided, and the problem of uneven temperature field distribution of the electronic component is solved; then, through the fan 20, the air deflector 16 and the heat dissipation plate 27, the air in the mounting box 1 can flow, the heat dissipation efficiency of the electronic component can be improved, the thermal reliability of the electronic component is ensured, meanwhile, the high-efficiency heat dissipation capability of the electronic component is realized, and the yield of the electronic component is greatly improved.

In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the utility model disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. Microwave power amplifier with heat radiation structure, including mounting box (1), its characterized in that: mounting box (1) interior surface mounting has support (2), surface mounting has mounting panel (3) on support (2), surface mounting has fixed frame (4) on mounting panel (3), fixed frame (4) interior surface mounting has rubber pad (9), surface mounting has printed circuit board (10) on rubber pad (9), printed circuit board (10) exterior surface mounting has power amplifier (11) and power (12), fixed frame (4) exterior surface mounting has installation piece (5), installation piece (5) internal surface is provided with mounting groove (6), mounting groove (6) interior surface mounting has dwang (7), dwang (7) exterior surface mounting has fixed plate (8), fixed plate (8) surface and printed circuit board (10) exterior surface connection.

2. The microwave power amplifier with the heat dissipation structure as recited in claim 1, wherein a first frame (13) is mounted on an inner surface of the mounting box (1), a positioning groove (14) is disposed on an inner surface of the first frame (13), a positioning shaft (15) is mounted on an inner surface of the positioning groove (14), and an air deflector (16) is mounted on an outer surface of the positioning shaft (15).

3. The microwave power amplifier with the heat dissipation structure according to claim 1, wherein a second frame (17) is mounted on an inner surface of the mounting box (1), a mounting frame (19) is mounted on an inner surface of the second frame (17), and a fan (20) is mounted on an outer surface of the mounting frame (19).

4. The microwave power amplifier with a heat dissipation structure according to claim 3, wherein a protective mesh (18) is installed on an inner surface of the second frame (17).

5. The microwave power amplifier with the heat dissipation structure according to claim 1, wherein a third frame (21) is installed on an inner surface of the mounting box (1), a dust screen (22) is installed on an inner surface of the third frame (21), and a plurality of mounting bolts (23) are installed on an outer surface of the dust screen (22).

6. The microwave power amplifier with heat dissipation structure of claim 1, wherein a fixing frame (24) is installed on a lower surface of the mounting plate (3), and a heat dissipation pipe (25) is installed on an inner surface of the fixing frame (24).

7. The microwave power amplifier with heat dissipation structure according to claim 1, wherein a mounting seat (26) is mounted on a lower surface of the mounting plate (3), and a heat dissipation plate (27) is mounted on a lower surface of the mounting seat (26).