TWM622725U - Liquid immersion cooled electronic device - Google Patents

Abstract

A liquid-cooled immersion electronic device is used to solve the problem that the conventional liquid-cooled immersion electronic device is difficult to maintain. The system includes: a sealing groove, which is filled with a non-conductive liquid; a positioning frame, which is located in the sealing groove and has several slots; and at least one electrical unit, which can be detachably inserted in the several In one of the sockets, the electrical unit has at least one heat source, and the electrical unit has at least one fluid driver to guide the non-conductive liquid to flow through the heat source.

Description

Liquid-cooled immersion electronics

This work is about a heat dissipation technology for an electronic device, especially a liquid-cooled immersion electronic device that immerses its electrical modules in a non-conductive liquid to maintain a proper working temperature.

Please refer to FIG. 1, which is a conventional liquid immersion cooling cabinet 9. The conventional liquid immersion cooling cabinet 9 has a cabinet body 91, and the interior of the cabinet body 91 is separated by two partitions 92 arranged side by side. An overflow area 93 , an electrical module installation area 94 and a return area 95 , and the electrical module installation area 94 is located between the overflow area 93 and the return area 95 . Wherein, the lower part of the two partition plates 92 is connected by a connecting plate 96, and several propellers 97 are installed on the connecting plate 96 to push the cooling liquid to flow upward through the electrical module installation area 94, and part of the cooling liquid overflows Entering the overflow area 93 , part of the cooling liquid flows into the return area 95 , and is guided by the propellers 97 to flow into the electrical module installation area 94 again to form a circulation. An embodiment similar to the conventional liquid immersion cooling cabinet 9 has been disclosed in Chinese Patent Publication No. 110290677 .

In the above-mentioned conventional liquid immersion cooling cabinet 9, several electrical modules can be installed in the electrical module installation area 94 and immersed in the continuously circulating cooling liquid, so that the several electrical modules can be operated during operation. The generated high-temperature heat energy can be directly absorbed by the coolant to maintain a proper working temperature, so as to achieve the expected working efficiency and service life.

However, in the above-mentioned conventional liquid immersion cooling cabinet 9, since its propeller 97 is installed on the connecting plate 96, as long as any propeller 97 fails, the entire liquid immersion cooling cabinet 9 must be shut down. And take out the electrical module, the pusher 97 can be replaced. In this way, not only the maintenance steps are complicated and difficult to operate, but also all electrical modules must be stopped during the maintenance, which is also very inconvenient.

In view of this, the conventional liquid immersion cooling cabinet 9 still needs to be improved.

In order to solve the above problems, the purpose of this creation is to provide a liquid-cooled immersion electronic device, each electrical unit of which is configured with at least one fluid driving element, so that when the fluid driving element fails, the corresponding electrical unit can be pulled out for maintenance. , and does not affect the operation of other electrical units.

The secondary purpose of this creation is to provide a liquid-cooled immersion electronic device that can improve the overall heat dissipation efficiency.

The directional or similar terms described in the full text of this creation, such as "front", "back", "left", "right", "up (top)", "down (bottom)", "inside", "outside" , "sideways", etc., mainly refer to the directions of the attached drawings, and each directional or similar terms are only used to assist the description and understanding of the various embodiments of the present creation, and are not intended to limit the present creation.

The use of the quantifier "a" or "an" for the elements and components described in the full text of this creation is only for the convenience of use and to provide the general meaning of the scope of this creation; in this creation, it should be construed as including one or at least one, and a single The concept of also includes the plural case unless it is obvious that it means otherwise.

Similar terms such as "combination", "combination" or "assembly" mentioned in the whole text of this work mainly include the types of components that can be separated without destroying the components after connection, or the components cannot be separated after being connected, which are common knowledge in this field. It can be selected according to the material of the components to be connected or the assembly requirements.

The liquid-cooled immersion electronic device of the present invention includes: a sealing groove filled with a non-conductive liquid; a positioning frame located in the sealing groove and having a plurality of slots; and at least one electrical unit, the electrical unit can The electrical unit has at least one heat source, and the electrical unit has at least one fluid driving element to guide the non-conductive liquid to flow through the heat source.

Accordingly, in the liquid-cooled immersion electronic device of the present invention, each electrical unit is provided with at least one fluid driving member, and the fluid driving member guides the non-conductive liquid to flow through the heat source of each of the electrical units, not only It can achieve the effect of improving the heat dissipation efficiency, and when the fluid driving part of each electrical unit fails, as long as the electrical unit is pulled out from the positioning frame, its fluid driving part can be replaced independently, without affecting other electrical units. operate. In this way, not only the maintenance steps are simple and easy to operate, but also the maintenance efficiency is improved; other electrical units do not need to be stopped during maintenance, which greatly improves the convenience of use.

Wherein, the electrical unit may have a box body, and the box body may be inserted into the slot in a detachable manner, and the electrical unit may have an electrical module disposed in the box body and having the heat source. In this way, the box body can facilitate the installation of the electrical module and the insertion into the slot, thereby improving the convenience of assembly and operation.

Wherein, the electrical module may have a base plate, the heat source may be located on the base plate, and the fluid driving element may be mounted on the box body or the base plate. In this way, the fluid driving member can be installed according to the needs of use, which has the effect of improving the convenience of assembly.

Therein, the fluid drive member may be located below the heat source. In this way, the fluid driving member can easily draw and drive a relatively low-temperature non-conductive liquid to flow through the heat source, which has the effect of improving the heat dissipation efficiency.

Wherein, the electrical unit may have a flow channel cover, the flow channel cover may be combined with the box body or the substrate, the bottom end of the box body may be open, and the heat source may be located in the flow channel cover. In this way, the flow range of the non-conductive liquid can be restricted by the flow channel cover, so that the non-conductive liquid can be driven by the fluid driving member to flow more concentratedly through the heat source, which has the effect of improving the heat dissipation efficiency.

Wherein, the electrical unit may have at least one auxiliary heat dissipation member, the auxiliary heat dissipation member may be thermally connected to the heat source, and the auxiliary heat dissipation member may be located in the flow channel cover. In this way, it has the effect of further improving the heat dissipation efficiency of the heat source.

Wherein, a flow channel may be formed in the flow channel cover, and the liquid outlet direction of the fluid driving member may be directed toward the flow channel. In this way, it has the effect of improving the smoothness of the diversion.

Wherein, the two ends of the flow channel cover may be open to form a top port and a bottom port respectively, and a liquid outlet of the fluid driving member may be adjacent to the bottom port. In this way, the non-conductive liquid flowing out from the liquid outlet of the fluid driving member can be directly introduced into the flow channel, and flow through the heat source from bottom to top, thereby improving the smoothness of the flow and the heat dissipation efficiency.

Wherein, the top of the box body may have a hook ear. In this way, it is convenient for the user to hook the hook ear and apply force to pull out the box body from the corresponding slot, which has the effect of improving the convenience of operation.

Wherein, the sealing groove can have a groove cover combined with a groove body, the groove cover can have a hollow part, and the sealing groove can have a condensation module combined with the groove cover and covering the hollow part. In this way, part of the gaseous non-conductive liquid can pass through the hollow portion to contact the condensation module to condense back to a liquid state, which has the effect of improving the heat dissipation efficiency.

The liquid-cooled immersion electronic device of the present invention may further comprise a pipe fitting group, one end of the pipe fitting group can be connected to an inflow part of the sealing groove, the other end of the pipe fitting group can be connected to an outflow part of the sealing groove, the pipe fitting group A pump and a heat dissipation unit can be connected in series between the two ends. In this way, the non-conductive liquid can be rapidly cooled by external circulation, which has the effect of improving heat dissipation efficiency.

The liquid-cooled immersion electronic device of the present invention may further include a pipe assembly, the pipe assembly may have a first port and a second port, and the two ends of the pipe assembly may respectively penetrate an inflow portion and an outflow portion of the sealing groove. The first port and the second port are located in the non-conductive liquid and are not connected. In this way, the non-conductive liquid can be rapidly cooled by external circulation, which has the effect of improving heat dissipation efficiency.

Wherein, a heat dissipation unit can be connected in series between the first port and the second port of the pipe assembly. In this way, the non-conductive liquid flowing in the tube assembly can quickly dissipate heat when flowing through the heat dissipation unit, which has the effect of further improving the heat dissipation efficiency.

Wherein, the first port can be relatively close to the bottom end in the sealing groove, and the second port can be relatively close to the liquid level of the non-conductive liquid. In this way, the higher temperature non-conductive liquid can flow into the pipe assembly from the upper layer, and the lower temperature non-conductive liquid can be directly replenished to the lower layer when it flows back to the sealing groove, which has the effects of improving the smoothness of the flow and the heat dissipation efficiency.

In order to make the above-mentioned and other purposes, features and advantages of this creation more obvious and easy to understand, the preferred embodiments of this creation are given below, and are described in detail with the accompanying drawings; in addition, the same symbols are marked in different drawings. are considered to be the same, and their descriptions will be omitted.

Please refer to FIG. 2 , which is the first embodiment of the liquid-cooled immersion electronic device E of the present invention, which includes a sealing groove 1 , a positioning frame 2 and at least one electrical unit 3 . The positioning frame 2 and the electrical The units 3 are all located in this sealing groove 1 .

Referring to Figures 2 and 5, the sealing groove 1 is filled with a non-conductive liquid L. The non-conductive liquid L can be, for example, an electronic engineering liquid or other liquid with good fluidity but no conductivity. The present invention does not limit the shape of the sealing groove 1 . For example, the sealing groove 1 of this embodiment may have a groove body 11 , and an opening 111 may be formed at the top of the groove body 11 ; the sealing groove 1 may further have a groove body 11 . The tank cover 12 can be airtightly combined with the tank body 11 and cover the opening 111 to ensure that the non-conductive liquid L in the sealed tank 1 will not leak to the outside. In addition, the sealing groove 1 of the present embodiment may further have an inflow portion 13 and an outflow portion 14. The inflow portion 13 and the outflow portion 14 are respectively connected to the interior of the sealing groove 1 for guiding the non-conductive liquid L to flow into and out of the sealing groove 1. out of the sealing groove 1 . Wherein, the inflow portion 13 and the outflow portion 14 of the present embodiment can be arranged on the tank body 11 , and the inflow portion 13 and the outflow portion 14 can be selected to be arranged on the same side of the tank body 11 or different depending on the piping configuration requirements. Preferably, the inflow portion 13 can be located closer to the bottom end of the tank body 11 , and the outflow portion 14 can be located closer to the top end of the tank body 11 .

The positioning frame 2 is located in the sealing groove 1, and the positioning frame 2 has a plurality of slots 21 for the electrical unit 3 to be inserted and positioned, so that when the slot cover 12 is opened, any electrical unit 3 can be removed from the It is pulled out from the slot 21 and taken out from the inside of the sealing groove 1 through the opening 111 . Wherein, the type of the positioning frame 2 can be adjusted by those with ordinary knowledge in the art according to the type of the sealing groove 1 and the quantity of the electrical units 3 to be positioned and other factors, so it is not shown in the drawings. The type of disclosure is limited.

Please refer to Figures 2 and 3, the electrical unit 3 can be, for example, a server unit, a network communication host, or a network communication relay station, which is not limited in this creation. In this embodiment, the number of the electrical units 3 may be several, and each of the electrical units 3 may have a box body 31, and the box body 31 can be detachably inserted into one of the plurality of slots 21; In other embodiments without the box body 31 , other parts of the electrical unit 3 can also be inserted into the slot 21 . In addition, the present invention does not limit the shape of the box body 31. For example, the box body 31 in this embodiment may be substantially rectangular, and the bottom end of the box body 31 may be open. Each of the electrical units 3 may further have an electrical connection portion 32 , the electrical connection portion 32 may be located at the top of the box body 31 , and the electrical connection portion 32 may include, for example, an unlimited number of connection ports. The top of the box body 31 may also have a hook lug 311 , so that the user can hook the hook lug 311 and apply force to pull out the box body 31 from the corresponding slot 21 .

Referring to Figures 3 and 5, each of the electrical units 3 may further have an electrical module 33 and at least one fluid driving member 34, and the electrical module 33 and the at least one fluid driving member 34 may be respectively disposed in the box The body 31 is inserted into the slot 21 together with the box body 31 or pulled out. Specifically, the electrical module 33 may have a substrate 331 (eg, a motherboard), the substrate 331 has at least one heat source 332 (eg, a CPU), and has a memory R, a graphics card, or a solid-state hard drive for inserting on the substrate 331 . Several slots for objects such as discs. When the electrical unit 3 is located in the slot 21, the heat source 332 can be soaked by the non-conductive liquid L, and the positioning frame 2 can maintain a proper distance between two adjacent boxes 31, so that the non-conductive liquid L can flow into between two adjacent boxes 31 .

The fluid driving member 34 can be mounted on the box body 31 or the substrate 331 and soaked in the non-conductive liquid L to guide the non-conductive liquid L to flow smoothly through the heat source 332; for example, but not limited to, the The fluid driver 34 may be a pump or an impeller. The fluid driving element 34 can be located at any position above or below the heat source 332 , and is preferably located near the bottom end of the electrical module 33 , that is, below the heat source 332 , so as to draw and drive the relative The low-temperature non-conductive liquid L flows through the heat source 332, which has the effect of improving the heat dissipation efficiency.

In addition, each of the electrical units 3 in this embodiment may also have at least one auxiliary heat sink 35 and a flow channel cover 36 . The auxiliary heat sink 35 can be, for example, a set of heat dissipation fins, and can be thermally connected to the heat source 332 . The flow channel cover 36 can be used to limit the flow range of the non-conductive liquid L, so that the non-conductive liquid L can be driven by the fluid driving member 34 to flow more concentratedly through the auxiliary heat dissipation member 35 and the heat source 332 . The flow channel cover 36 can be combined with the box body 31 or the base plate 331 , and the auxiliary heat sink 35 and the heat source 332 can be located in the flow channel cover 36 . The two ends of the flow channel cover 36 may be open to form a top port 361 and a bottom port 362 respectively, and a flow channel F is formed in the flow channel cover 36 in an up-down direction. The liquid outlet direction of the fluid driving member 34 may be directed toward the flow channel F, preferably, the liquid outlet direction of the fluid driving member 34 may be substantially parallel to the flow channel F. As shown in FIG. For example, the fluid driving member 34 can be selected to be located inside or outside the flow channel cover 36, and a liquid outlet 341 of the fluid driving member 34 faces the top port 361 of the flow channel cover 36, so that the The non-conductive liquid L is driven upward; wherein, preferably, the liquid outlet 341 of the fluid driving member 34 is adjacent to the bottom port 362 of the flow channel cover 36, so that the liquid outlet 341 of the fluid driving member 34 The outflowing non-conductive liquid L can be directly introduced into the flow channel F, and flows through the auxiliary heat sink 35 and the heat source 332 from bottom to top. In other embodiments, the electrical unit 3 with the auxiliary heat dissipation member 35 may not be provided with the flow channel cover 36 , or the electrical unit 3 with the flow channel cover 36 may not be provided with the auxiliary heat dissipation member 35 . It is not limited to the type disclosed in the drawings of this embodiment.

Referring to Figures 4 and 5, when the liquid-cooled immersion electronic device E of this embodiment is used, one end of a pipe assembly 4 can be connected to the inflow portion 13 of the sealing groove 1, and the other end of the pipe assembly 4 can be connected to the inflow portion 13 of the sealing groove 1. One end is connected to the outflow portion 14 of the sealing groove 1 . The pipe assembly 4 is also connected in series with a pump 5 and a heat dissipation unit 6, so that the liquid-cooled immersion electronic device E, the pump 5 and the heat dissipation unit 6 can form a circulation loop. Accordingly, the pump 5 can drive the non-conductive liquid L to flow in the tube assembly 4 , and the relatively low-temperature liquid non-conductive liquid L can flow into the sealing groove 1 from the inflow portion 13 , and pass through the electrical units 3 . The fluid driving member 34 guides the relatively low temperature liquid non-conductive liquid L from bottom to top to flow through the heat source 332 of the electrical modules 33 of the electrical units 3; at this time, the non-conductive liquid L will absorb the heat source 332 from the electrical unit 3 The heat energy is heated up, and the liquid is converted into a gas to form upward-flowing bubbles, so that the electrical module 33 can be maintained at a proper working temperature.

Among them, the gaseous non-conductive liquid L will exchange heat with the surrounding relatively low-temperature liquid non-conductive liquid L during the upward flow, thereby cooling down and condensing back to the liquid state again. The temperature of the liquid non-conductive liquid L in the upper layer is relatively high, and can flow out of the sealing groove 1 from the outflow portion 14 and enter the pipe assembly 4 , and then flow through the heat dissipation unit 6 along the guidance of the pipe assembly 4 , and When passing through the heat dissipation unit 6, the temperature is further cooled, so that the relatively low temperature non-conductive liquid L can flow into the sealing groove 1 through the inflow portion 13 again; The electrical modules 33 of the plurality of electrical units 3 can be maintained at a proper working temperature, so as to effectively avoid problems such as overheating.

Please refer to Fig. 6, which is the second embodiment of the liquid-cooled immersion electronic device E of the present creation. The second embodiment of the present creation is substantially the same as the first embodiment described above, and the main difference is: the present creation The non-conductive liquid L of the second embodiment is not cooled by external circulation, but is directly cooled in the sealing groove 1 .

Specifically, in the sealing groove 1 of the present embodiment, the groove cover 12 may have a hollow portion 121 . The sealing tank 1 may further have a condensation module 15 , and the condensation module 15 is combined with the tank cover 12 and covers the hollow portion 121 . The present invention does not limit the type of the condensation module 15. For example, the condensation module 15 can have at least one heat dissipation fin set 15a and at least one heat dissipation fan 15b, and the heat dissipation fin set 15a can be combined with the slot cover 12. The cooling fan 15b can be installed at any position outside the sealing groove 1, and is used to blow or draw air flow toward the cooling fin set 15a. Accordingly, the gaseous non-conductive liquid L will exchange heat with the surrounding relatively low-temperature liquid non-conductive liquid L during the upward flow to cool down and condense back to the liquid state. After leaving the surface layer of the liquid non-conductive liquid L, it contacts the condensing module 15 through the basket 121, and after transferring heat energy to the condensing module 15, it condenses back to the liquid state again and drips downward.

Please refer to FIG. 7, which is the third embodiment of the liquid-cooled immersion electronic device E of the present creation. The third embodiment of the present creation is substantially the same as the first embodiment described above, and the main difference is: the present creation The third embodiment adopts a different structure to allow the non-conductive liquid L to be cooled by external circulation.

Specifically, in the sealing groove 1 of the present embodiment, the inflow part 13 and the outflow part 14 of the inflow part 13 and the outflow part 14 can respectively be holes passing through the groove cover 12 , and a pipe element set 4 has a first port 4a and a second port 4b. The pipe element The two ends of the group 4 respectively penetrate the inflow portion 13 and the outflow portion 14 of the sealing groove 1 and protrude into the sealing groove 1, so that the first port 4a and the second port 4b are both located in the non-conductive liquid L and Not connected to form a non-closed loop. The pipe assembly 4 can also be connected in series with a heat dissipation unit 6 located outside the sealing groove 1 between the first port 4a and the second port 4b, so that the heat dissipation unit 6 flowing from the second port 4b to the first port 4a is not The conductive liquid L can quickly dissipate heat when flowing through the heat dissipation unit 6 .

Accordingly, after absorbing the heat source 332 of the electrical modules 33 of the plurality of electrical units 3, the temperature of the non-conductive liquid L in the upper layer will be higher than that of the non-conductive liquid L in the lower layer, so that the non-conductive liquid L in the sealing groove 1 is non-conductive. The liquid L naturally forms convection, so the non-conductive liquid L in the upper layer can flow into the pipe assembly 4 from the second port 4b, cool down during the external circulation, and flow back to the sealing groove through the first port 4a 1 in. Wherein, it is preferable to make the first port 4a closer to the bottom end in the sealing groove 1, and the second port 4b to be closer to the liquid level of the non-conductive liquid L; When the lower temperature non-conductive liquid L flows back into the sealing groove 1, it can also be directly replenished to the lower layer, so that the lower temperature non-conductive liquid L can be directly driven by the fluid driving member 34 of each electrical unit 3. Guide and flow through the corresponding heat source 332 to improve the heat dissipation efficiency.

It is worth mentioning that the tank cover 12 and the condensing module 15 disclosed in the second embodiment, or the tank cover 12, the pipe assembly 4 and the heat dissipation unit 6 disclosed in the third embodiment can be substituted for the first embodiment. Slot cover 12 is disclosed. In other words, the tank cover 12 and the condensing module 15 disclosed in the second embodiment can also be applied to the sealed tank 1 type in which the non-conductive liquid L is cooled by external circulation; and the closed circulation disclosed in the first embodiment The loop and the non-closed circulation loop disclosed in the third embodiment can be used alone or in combination according to the needs of use, so the type disclosed in the drawings of each embodiment is not limited.

In addition, please refer to FIG. 8 , in the case of use with low heat dissipation requirements, the electrical unit 3 of the foregoing embodiments may not have the auxiliary heat dissipation member 35 and/or the flow channel cover 36 (both marked in Figure 3). In addition, the fluid driving member 34 in Fig. 8 is selected to be presented in the form of a pump, and can also be applied to the aforementioned embodiments.

To sum up, in the liquid-cooled immersion electronic device of the present invention, each electrical unit is provided with at least one fluid driving member, and the fluid driving member guides the non-conductive liquid to flow through the heat source of each of the electrical units , not only can achieve the effect of improving the heat dissipation efficiency, but also can replace the fluid driving part of the electrical unit by pulling out the electrical unit from the positioning frame when the fluid driving part of each electrical unit fails, without affecting other electrical components. operation of the unit. In this way, not only the maintenance steps are simple and easy to operate, but also the maintenance efficiency is improved; other electrical units do not need to be stopped during maintenance, which greatly improves the convenience of use.

Although the present creation has been disclosed by the above-mentioned preferred embodiments, it is not intended to limit the present creation. Any person skilled in the art can make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of the present creation. Therefore, the protection scope of this creation shall include all changes within the meaning and equivalent scope recorded in the appended patent application scope.

﹝This creation﹞ 1: sealing groove 11: Slot body 111: Opening 12: Slot cover 121: Basket Empty Department 13: Inflow Department 14: Outflow 15: Condensation module 15a: Cooling fin group 15b: cooling fan 2: Positioning frame 21: Slot 3: Electrical unit 31: Box 311: Hook Ears 32: Electrical connection part 33: Electrical module 331: Substrate 332: Heat Source 34: Fluid Drive 341: Liquid outlet 35: Auxiliary heat sink 36: runner cover 361: top port 362: Bottom port 4: Pipe fitting group 4a: first port 4b:s second port 5: Pump 6: Cooling unit E: Liquid-cooled immersion electronics F: runner L: non-conductive liquid ﹝Accustomed ﹞ 9: Liquid Immersion Cooling Cabinets 91: Cabinet body 92: Separator 93: Overflow area 94: Electrical module installation area 95: Reflow zone 96: Connection board 97: Thruster

[Figure 1] A side sectional view of a conventional liquid-cooled immersion electronic device. [Fig. 2] An exploded perspective view of the first embodiment of the present invention, wherein the groove body and the groove cover of the sealing groove are both shown in partial cross-section. [FIG. 3] An exploded perspective view of the electrical unit of the first embodiment of the present invention. [Fig. 4] A schematic top view of the first embodiment of the present invention, the pipe assembly, the pump and the heat dissipation unit in series. [Fig. 5] A cross-sectional view taken along the line A-A in Fig. 4. [Picture 6] A side sectional view of the second embodiment of the present invention. [Figure 7] A side sectional view of the third embodiment of the present invention. [Picture 8] An exploded perspective view of another electrical unit in this creation.

1: sealing groove

11: Slot body

111: Opening

12: Slot cover

13: Inflow Department

14: Outflow

2: Positioning frame

21: Slot

3: Electrical unit

31: Box

311: Hook Ears

33: Electrical module

331: Substrate

332: Heat Source

34: Fluid Drive

341: Liquid outlet

35: Auxiliary heat sink

36: runner cover

361: top port

362: Bottom port

4: Pipe fitting group

E: Liquid-cooled immersion electronics

F: runner

L: non-conductive liquid

Claims (14)

A liquid-cooled immersion electronic device comprising: a sealing groove filled with a non-conductive liquid; a spacer located in the sealing groove and having a plurality of slots; and at least one electrical unit, the electrical unit can be removably inserted into one of the plurality of slots, the electrical unit has at least one heat source, the electrical unit has at least one fluid driving element to guide the non-conductive liquid to flow through the heat source. The liquid-cooled immersion electronic equipment of claim 1, wherein the electrical unit has a box body, the box body is detachably inserted into the slot, the electrical unit has an electrical module disposed in the box body and have this heat source. The liquid-cooled immersion electronic device of claim 2, wherein the electrical module has a base plate, the heat source is located on the base plate, and the fluid driving element is mounted on the box body or the base plate. The liquid-cooled immersion electronic device of claim 3, wherein the fluid driving member is located below the heat source. The liquid-cooled immersion electronic equipment of claim 3, wherein the electrical unit has a flow channel cover, the flow channel cover is combined with the box body or the substrate, the bottom end of the box body is open, and the heat source is located in the flow channel inside the hood. The liquid-cooled immersion electronic device of claim 5, wherein the electrical unit has at least one auxiliary heat sink, the auxiliary heat sink is thermally connected to the heat source, and the auxiliary heat sink is located in the flow channel cover. The liquid-cooled immersion electronic device of claim 5, wherein a flow channel is formed in the flow channel cover, and the liquid outlet direction of the fluid driving member faces the flow channel. The liquid-cooled immersion electronic device of claim 7, wherein two ends of the flow channel cover are open to form a top port and a bottom port respectively, and a liquid outlet of the fluid driving member is adjacent to the bottom port. The liquid-cooled immersion electronic device of claim 2, wherein the top of the box body has a hook ear. The liquid-cooled immersion electronic device of claim 1, wherein the sealing groove has a groove cover combined with a groove body, the groove cover has a hollow portion, and the sealing groove has a condensation module combined with the groove cover and covering The basket is empty. The liquid-cooled immersion electronic equipment according to any one of claims 1 to 10, further comprising a pipe assembly, one end of the pipe assembly is connected to an inflow portion of the sealing groove, and the other end of the pipe assembly is connected to an inflow portion of the sealing groove In the outflow part, a pump and a heat dissipation unit are connected in series between the two ends of the pipe assembly. The liquid-cooled immersion electronic equipment according to any one of claims 1 to 10, further comprising a pipe assembly, the pipe assembly has a first port and a second port, and two ends of the pipe assembly respectively penetrate through the sealing groove. An inflow portion and an outflow portion extend into the sealing groove, and the first port and the second port are located in the non-conductive liquid and are not connected. The liquid-cooled immersion electronic device of claim 12, wherein the pipe assembly is connected in series with a heat dissipation unit between the first port and the second port. The liquid-cooled immersion electronic device of claim 12, wherein the first port is closer to the bottom end in the sealing groove, and the second port is closer to the liquid level of the non-conductive liquid.

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