CN113840516A - Liquid cooling plate and plate-level liquid cooling system - Google Patents
Liquid cooling plate and plate-level liquid cooling system Download PDFInfo
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- CN113840516A CN113840516A CN202111030385.2A CN202111030385A CN113840516A CN 113840516 A CN113840516 A CN 113840516A CN 202111030385 A CN202111030385 A CN 202111030385A CN 113840516 A CN113840516 A CN 113840516A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- General Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of cooling, and discloses a liquid cooling plate and a plate-level liquid cooling system, wherein the liquid cooling plate comprises: the shell is provided with a liquid inlet and a liquid outlet; the bottom of the accommodating cavity is provided with a first fin group and a second fin group, and the first fin group and the second fin group are spaced along a first direction; a first flow channel is formed between adjacent first fins in the first fin group; a second flow channel is formed between adjacent second fins in the second fin group; the first partition plate is arranged in the accommodating cavity and positioned between the first fin group and the top of the accommodating cavity; a first leading-in channel and a second leading-in channel are arranged on one side, facing the top of the accommodating cavity, of the first partition plate, the first leading-in channel is respectively connected with the liquid inlet and the first flow channel, and the second leading-in channel is respectively connected with the liquid inlet and the second flow channel; the accommodating space is also internally provided with a guide-out channel. The liquid cooling cold plate can improve the cooling capacity of the cold plate and adapt to special chips.
Description
Technical Field
The invention relates to the technical field of cooling, in particular to a liquid cooling plate and a plate-level liquid cooling system.
Background
With the development of 5G communication technology and the continuous evolution of IT/switch equipment performance and service capability, the single-chip power consumption (such as CPU and switch chip) is continuously increased, the power consumption of the switch chip is 500W +, the power consumption of the CPU is 300W +, and the limit of the common air cooling heat dissipation technology is basically reached; the power consumption of the next generation of switch chip is estimated to be 700W + and the CPU is 400W +, and a stronger liquid cooling heat dissipation technology is required to replace an air cooling technology to solve the heat dissipation of the high-power-consumption chip.
In the liquid cooling scheme of the current IT/communication equipment and data center, cold plate type liquid cooling is the main development direction of the liquid cooling technology. The heat of the chip is transferred to the cold plate through the heat-conducting interface material, and the liquid entering the cold plate from the liquid inlet absorbs the heat of the cold plate and then flows out of the liquid outlet.
The middle of the chip is a high power consumption area, the two sides of the chip are low power consumption areas, and the temperature specification defined by the low power consumption areas is lower than that of the high power consumption areas. The application of the traditional cold plate flow channel design can lead to uneven heat dissipation in different areas of the chip and even to over-temperature conditions.
Therefore, how to provide a liquid cooling cold plate which can adapt to a special chip is a problem to be solved urgently.
Disclosure of Invention
The invention provides a liquid cooling plate and a plate-level liquid cooling system, which are used for improving the cooling capacity of the cooling plate and are suitable for special chips.
In order to achieve the purpose, the invention provides the following technical scheme:
in a first aspect, the present application provides a liquid cooling cold plate, comprising:
the device comprises a shell, a liquid inlet and a liquid outlet, wherein the shell is provided with an accommodating cavity; the bottom of the accommodating cavity is provided with a first fin group and a second fin group, the first fin group and the second fin group are oppositely arranged along a first direction, and a gap is reserved between the first fin group and the second fin group; the first fin group comprises a plurality of first fins which are arranged at intervals along a second direction, and a first flow channel is formed between every two adjacent first fins; the second fin group comprises a plurality of second fins which are arranged at intervals along a second direction, and a second flow channel is formed between every two adjacent second fins; the second direction is vertical to the first direction, and the second direction is vertical to the bottom of the accommodating cavity;
the first partition plate is arranged in the accommodating cavity and positioned between the first fin group and the top of the accommodating cavity; a first leading-in channel and a second leading-in channel are arranged on one side, facing the top of the accommodating cavity, of the first partition plate, the first leading-in channel is respectively connected with the liquid inlet and one end, away from the second flow channel, of the first flow channel, and the second leading-in channel is respectively connected with the liquid inlet and one end, away from the first flow channel, of the second flow channel;
still be equipped with in the accommodation space and derive the passageway, derive the passageway respectively with first flow channel's exit end and the liquid outlet is connected, just derive the passageway respectively with second flow channel's exit end and the liquid outlet is connected.
Among the above-mentioned liquid cooling cold plate, liquid cooling cold plate includes the casing, and the casing has the chamber of holding, and the bottom of holding the chamber is equipped with first fin group and second fin group. Specifically, the first fin group and the second fin group are oppositely arranged at the bottom of the accommodating cavity along the first direction, and a space is formed between the first fin group and the second fin group. Meanwhile, a first partition plate is arranged in the accommodating cavity and is positioned between the first fin group, the second fin group and the top of the accommodating cavity. A plurality of first fins arranged at intervals along the second direction in the first fin group form first flow channels, and a plurality of second fins arranged at intervals along the second direction in the second fin group form second flow channels. When the liquid cooling plate provided by the application is applied, cold fluid enters the accommodating cavity of the shell from the liquid inlet; then, part of cold fluid enters a first introduction channel between the first partition plate and the top of the accommodating cavity, and part of cold fluid enters a second introduction channel between the first partition plate and the top of the accommodating cavity; then, the cold fluid enters the first flow channel connected with the first introduction channel through the first introduction channel, and simultaneously, the cold fluid enters the second flow channel connected with the second introduction channel through the second introduction channel. Because the first leading-in channel is connected with one side of the first flow channel, which is far away from the second flow channel, and the second leading-in channel is connected with one end of the second flow channel, which is far away from the first flow channel, cold fluid in the first flow channel and cold fluid in the second flow channel are converged close to the middle interval between the first fin group and the second fin group. Because the export passageway in the holding chamber connects the exit end and the liquid outlet of first flow path, simultaneously, export passageway connects the exit end and the liquid outlet of second flow path, then the cold fluid is finally exported inside the casing.
The application provides a U type runner is formed with first flow path to first leading-in passageway in the liquid cooling cold plate, simultaneously, and second leading-in passageway forms another U type runner with first flow path. After entering the shell from the liquid inlet, the cold fluid enters the first fin group and the second fin group from two sides along the first partition plate respectively, and then flows out from the liquid outlet after converging in the gap between the first fin group and the second fin group. It is worth noting that the cold fluid in the liquid cooling plate provided by the application cools the low power consumption areas on the left side and the right side of the chip firstly, and then cools the high power consumption area in the middle. Therefore, the low-power consumption area of the chip is not affected by the thermal cascade of the high-power consumption area, and the liquid cooling cold plate provided by the application can realize good heat dissipation of the chip.
Therefore, the liquid cooling cold plate can be provided to this application to promote the cooling capacity of cold plate, adapt to special chip.
Preferably, the liquid outlet is located on the side of the second fin group, which faces away from the first fin group;
the liquid cooling cold plate further comprises a second partition plate, the second partition plate is located on one side, away from the first fin group, of the second fin group and is abutted against the top of the accommodating cavity and the bottom of the accommodating cavity; the second partition board is provided with a main body part and two folding edges positioned on two sides of the main body part; a gap is reserved between the main body part and the second fin group along the first direction, and each of the two folding edges is connected with the main body part and one fin of the second fin group which is positioned on the outermost side in the second direction, so that a flow guide section is formed between the second partition board and the second fin group; the flow guide section is connected with a second leading-in channel and one end, deviating from the first flow channel, of the second flow channel respectively.
Preferably, the first partition plate abuts against the end face, facing the top side of the accommodating cavity, of the first fin group, and the first partition plate abuts against the end face, facing the top side of the accommodating cavity, of the second fin group.
Preferably, the first introduction channel comprises a first main body section and a first flaring section, the first main body section is communicated with the liquid inlet, and the diversion area of the first flaring section is gradually increased along the direction departing from the first main body section; and/or the presence of a gas in the gas,
the second leading-in channel comprises a second main body section and a second flaring section, the second main body section is communicated with the liquid inlet and deviates from the direction of the second main body section, and the flow guide area of the second flaring section is gradually increased.
Preferably, the first partition plate is located between the outermost fin of the first fin group and the side wall of the accommodating cavity along the first direction, and abuts against the top of the accommodating cavity.
Preferably, the first partition plate is located between the outermost fin of the first fin group and the side wall of the accommodating cavity, and abuts against the bottom of the first partition plate.
Preferably, the liquid outlet is arranged at the side part of the accommodating cavity corresponding to the interval.
Preferably, the liquid inlet is positioned at the top of the accommodating cavity.
Preferably, the liquid inlet is positioned at the side part of the accommodating cavity.
In a second aspect, the present application provides a board-level liquid cooling system, including a circuit board, a chip on one side of the circuit board, a heat conductive material on one side of the circuit board and a liquid cooling plate on one side of the circuit board, wherein the heat conductive material deviates from the liquid cooling plate in any technical scheme provided by the first aspect.
Drawings
Fig. 1 is a schematic structural diagram of a board-level liquid cooling system according to an embodiment of the present disclosure;
FIG. 2 is a top view of the chip of FIG. 1;
fig. 3 is a schematic structural diagram of a liquid cooling plate according to an embodiment of the present disclosure;
FIG. 4 is a cross-sectional view taken at E-E of FIG. 3;
FIG. 5 is a view showing a structure of the first separator of FIG. 3;
fig. 6 is a schematic perspective view of a liquid cold plate according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to the structure shown in fig. 1, an embodiment of the present application provides a board-level liquid cooling system, in which a liquid cooling plate 1 is located on one side of a chip 2 to dissipate heat of the chip 2. It should be noted that a heat conducting interface material 3 as shown in fig. 1 may be further disposed between the chip 2 and the liquid cooling plate to improve the heat dissipation effect; and one side of the chip 2 departing from the liquid cooling plate 1 is connected to a Printed Circuit Board (PCB) 4, or the chip 2 is disposed on the PCB 4.
The chip 2 has different functional areas. Fig. 2 is a top view structural diagram of the chip 2 in fig. 1, and as shown in the structure of fig. 2, along the first direction, the middle of the chip 2 is a high power consumption region H, two sides of the high power consumption region H are respectively a low power consumption region L, and a temperature specification defined by the low power consumption region L is lower than that of the high power consumption region H.
Fig. 3 is a schematic structural diagram of a liquid cold plate 1 according to an embodiment of the present disclosure, and fig. 4 is a cross-sectional view taken along line E-E in fig. 3. As shown in fig. 3 and 4, the present embodiment provides a liquid-cooled cold plate 1, including:
the device comprises a shell 11, a liquid inlet A and a liquid outlet B, wherein the shell is provided with an accommodating cavity; the bottom of the accommodating cavity is provided with a first fin group 12 and a second fin group 13, the first fin group 12 and the second fin group 13 are oppositely arranged along a first direction, and a gap is formed between the first fin group 12 and the second fin group 13; the first fin group 12 includes a plurality of first fins arranged at intervals in the second direction, and a first flow channel C1 is formed between adjacent first fins; the second fin group 13 includes a plurality of second fins arranged at intervals in the second direction, and a second flow channel C2 is formed between adjacent second fins; the second direction is vertical to the first direction and is vertical to the bottom of the accommodating cavity;
the first partition plate 14 is arranged in the accommodating cavity and positioned between the first fin group 12 and the top of the accommodating cavity; a first lead-in channel D1 and a second lead-in channel D2 are arranged on one side of the first partition plate 14 facing the top of the containing cavity, the first lead-in channel D1 is respectively connected with the liquid inlet A and one end, away from the second flow channel C2, of the first flow channel C1, and the second lead-in channel D2 is respectively connected with the liquid inlet A and one end, away from the first flow channel C1, of the second flow channel C2;
the containing space is also provided with a leading-out channel, the leading-out channel is respectively connected with the outlet end of the first flow channel C1 and the liquid outlet B, and the leading-out channel is respectively connected with the outlet end of the second flow channel C2 and the liquid outlet B.
In the above liquid cooling plate 1, the liquid cooling plate 1 includes a housing 11, the housing 11 has an accommodating cavity, and a first fin group 12 and a second fin group 13 are disposed at the bottom of the accommodating cavity. Specifically, the first fin group 11 and the second fin group 12 are disposed opposite to each other in the first direction at the bottom of the accommodation chamber with a space therebetween. Meanwhile, a first partition plate 14 is arranged in the accommodating cavity, and the first partition plate 14 is positioned between the first fin group 12, the second fin group 13 and the top of the accommodating cavity. The first fin group 12 has a plurality of first fins arranged at intervals in the second direction to form first flow channels C1 therebetween, and the second fin group 14 has a plurality of second fins arranged at intervals in the second direction to form second flow channels C2 therebetween. When the liquid cooling plate 1 provided by the embodiment of the application is applied, cold fluid enters the accommodating cavity of the shell 11 from the liquid inlet A; then, part of the cold fluid enters a first introduction channel D1 between the first partition plate 14 and the top of the accommodating chamber, and part of the cold fluid enters a second introduction channel D2 between the first partition plate 14 and the top of the accommodating chamber; then, the cold fluid enters the first flow channel C1 connected thereto through the first introduction passage D1, and at the same time, the cold fluid enters the second flow channel C2 connected to the second introduction passage D2 through the second introduction passage D2. Since the first introduction channel D1 is connected to the side of the first flow channel C1 away from the second flow channel C2, and the second introduction channel D2 is connected to the end of the second flow channel C2 away from the first flow channel C1, the cold fluid in the first flow channel C1 and the cold fluid in the second flow channel C2 converge toward the space between the first fin group 12 and the second fin group 13. Since the outlet passage in the accommodating chamber connects the outlet end of the first flow passage C1 with the outlet B, and at the same time, the outlet passage connects the outlet end of the second flow passage C2 with the outlet B, the cold fluid is finally led out of the interior of the housing 11.
As shown in fig. 4, in the liquid cold plate 1 provided in the embodiment of the present invention, the first introduction passage D1 and the first flow passage C1 form a U-shaped flow passage, and the second introduction passage D2 and the first flow passage C2 form another U-shaped flow passage. Specifically, after entering the housing 11 from the liquid inlet a, the cold fluid enters the first fin group 12 and the second fin group 13 from both sides along the first partition plate 14, and then flows out from the liquid outlet B after the cold fluid merges in the gap between the first fin group 12 and the second fin group 13. It should be noted that, in the liquid cooling plate 1 provided in the embodiment of the present application, the cold fluid first cools the low power consumption regions L on the left and right sides of the chip 2, and then cools the middle high power consumption region H. Like this the low power consumption region L of chip does not receive the influence of the regional H thermal cascade of high power consumption, therefore the liquid cooling cold plate 1 that this application embodiment provided can realize the good heat dissipation to chip 2.
Therefore, the embodiment of the application can provide a liquid cooling cold plate 1 to improve the cooling capacity of the cold plate and adapt to a special chip 2.
It should be noted that there are many possible positions for the outlet B, and when the outlet B is arranged at different positions, the arrangement form of the guiding channel is different, and is at least one of the following arrangement forms:
in one possible embodiment, with continued reference to the structure shown in fig. 3 and 4, the liquid outlet B is located on the side of the second fin group 13 facing away from the first fin group 12, and the liquid outlet B is located on the top of the housing 11.
Referring to the structure shown in fig. 3 and fig. 4, the liquid-cooled cold plate 1 further includes a second partition plate 15, and the second partition plate 15 is located on a side of the second fin group 13 away from the first fin group 11 and abuts against the top of the accommodating cavity and the bottom of the accommodating cavity to prevent cold fluid from leaking out of the second partition plate 15 and the top or the bottom of the accommodating cavity. Specifically, the second separator 15 has a main body 151 and two folded edges 152 located on both sides of the main body 151; the main body 151 and the second fin group 13 have a gap therebetween in the first direction, and each of the two bent edges 152 connects the main body 151 and the outermost one of the fins of the second fin group 13 in the second direction to form a flow guide section between the second separator 15 and the second fin group 13. The guide section is respectively connected with one end of the second leading-in channel D2 and one end of the second flow channel C2, which faces away from the first flow channel.
Note that the second partition 15 separates the liquid outlet B from the second flow path C2 and the second introduction path D2. Specifically, after the cold fluid flows out from the first introduction passage D1, the second partition 15 blocks the cold fluid, so that the cold fluid is introduced into the second flow passage C2 along the guide section formed by the second partition 15.
It should be noted that, with continuing reference to the structure shown in fig. 3, the lead-out channel includes a first lead-out section S1 between the first fin group 12 and the second fin group 13, a second lead-out section S2 between the second fin of the second fin group 13 located on the outermost side in the second direction and the inner wall of the accommodating cavity, and a third lead-out section S3 located on the side of the second partition 15 facing away from the second fin group 13.
On the basis of the above technical solution, please refer to the structure shown in fig. 4, which may be configured as follows: the first partition plate 14 is abutted to the end surface of the first fin group 12 on one side of the top of the accommodating cavity, and the first partition plate 14 is abutted to the end surface of the second fin group 13 on one side of the top of the accommodating cavity.
It should be noted that, since the first partition plate 14 abuts against the tops of the first fin group 12 and the second fin group 13, when the cold fluid enters the first flow channel C1 and the second flow channel C2, the cold fluid can only flow along the first flow channel C1 and the second flow channel C2, and the cold fluid can be prevented from diffusing without passing through the first flow channel C1 and the second flow channel C2, so that the cooling efficiency can be improved.
Of course, in order to improve the cooling effect of the cold fluid on the first fin group 12 and/or the second fin group 13, please refer to the structure diagram of the first partition plate 14 shown in fig. 5, it can also be provided that:
the first lead-in channel D1 comprises a first main body section D11 and a first flaring section D12, the first main body section D11 is communicated with the liquid inlet A, and the flow guide area of the first flaring section D12 is gradually increased along the direction departing from the first main body section D11 so as to increase the heat exchange area with the low power consumption area L and further improve the heat exchange effect; and/or the presence of a gas in the gas,
the second leading-in channel D2 includes second main part section D21 and second flaring section D22, and second main part section D21 and inlet A intercommunication, and along deviating from second main part section D21 direction, the water conservancy diversion area of second flaring section D22 crescent to increase with the heat transfer area of low-power consumption region L, thereby promote the heat transfer effect.
It should be understood that the division is schematically illustrated by a dotted line plane in fig. 5, but the division plane is not limited thereto. Fig. 6 is a schematic perspective view of a liquid cold plate 1 according to an embodiment of the present disclosure. As shown in fig. 6, the first partition 14 is installed inside the housing 11.
Referring to the structure shown in fig. 4 in conjunction with fig. 6, in order to avoid the cold fluid from flowing reversely through the gap between the outermost first fin and the side wall of the accommodating chamber when flowing from the first lead-out section S1 to the second lead-out section S2, the liquid cold plate 1 provided in the embodiment of the present application may further include a third partition plate 16, and in the second direction, the third partition plate is located between the outermost fin of the first fin group and the side wall of the accommodating chamber, and the third partition plate 16 abuts against the top of the accommodating chamber. Of course, the third partition 16 may be disposed to abut against the bottom of the first partition 14, which will not be described herein.
In another possible embodiment, the liquid outlet B is disposed at a side portion of the accommodating cavity corresponding to the interval.
In another possible embodiment, the loading port A is located at the top of the receiving chamber.
In another possible embodiment, the loading port A is located at the side of the receiving chamber.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A liquid cold plate, comprising:
the device comprises a shell, a liquid inlet and a liquid outlet, wherein the shell is provided with an accommodating cavity; the bottom of the accommodating cavity is provided with a first fin group and a second fin group, the first fin group and the second fin group are oppositely arranged along a first direction, and a gap is reserved between the first fin group and the second fin group; the first fin group comprises a plurality of first fins which are arranged at intervals along a second direction, and a first flow channel is formed between every two adjacent first fins; the second fin group comprises a plurality of second fins which are arranged at intervals along a second direction, and a second flow channel is formed between every two adjacent second fins; the second direction is vertical to the first direction, and the second direction is vertical to the bottom of the accommodating cavity;
the first partition plate is arranged in the accommodating cavity and positioned between the first fin group and the top of the accommodating cavity; a first leading-in channel and a second leading-in channel are arranged on one side, facing the top of the accommodating cavity, of the first partition plate, the first leading-in channel is respectively connected with the liquid inlet and one end, away from the second flow channel, of the first flow channel, and the second leading-in channel is respectively connected with the liquid inlet and one end, away from the first flow channel, of the second flow channel;
still be equipped with in the accommodation space and derive the passageway, derive the passageway respectively with first flow channel's exit end and the liquid outlet is connected, just derive the passageway respectively with second flow channel's exit end and the liquid outlet is connected.
2. The liquid cold plate of claim 1, wherein the liquid outlet is located on a side of the second fin group facing away from the first fin group;
the liquid cooling cold plate further comprises a second partition plate, the second partition plate is located on one side, away from the first fin group, of the second fin group and is abutted against the top of the accommodating cavity and the bottom of the accommodating cavity; the second partition board is provided with a main body part and two folding edges positioned on two sides of the main body part; a gap is reserved between the main body part and the second fin group along the first direction, and each of the two folding edges is connected with the main body part and one fin of the second fin group which is positioned on the outermost side in the second direction, so that a flow guide section is formed between the second partition board and the second fin group; the flow guide section is connected with a second leading-in channel and one end, deviating from the first flow channel, of the second flow channel respectively.
3. The liquid cooling cold plate of claim 2, wherein the first partition abuts against a side of the first set of fins facing the top of the receiving cavity, and the first partition abuts against a side of the second set of fins facing the top of the receiving cavity.
4. The liquid cold plate of claim 3, wherein the first introduction passage comprises a first body section and a first flared section, the first body section being in communication with the liquid inlet, and the first flared section having a flow area that increases in a direction away from the first body section; and/or the presence of a gas in the gas,
the second leading-in channel comprises a second main body section and a second flaring section, the second main body section is communicated with the liquid inlet and deviates from the direction of the second main body section, and the flow guide area of the second flaring section is gradually increased.
5. The liquid cold plate of claim 4, further comprising a third partition between outermost fins of the first set of fins and the side wall of the receiving cavity in the second direction, the third partition abutting the top of the receiving cavity.
6. The liquid cold plate of claim 4, further comprising a third partition between the outermost fins of the first set of fins and the side wall of the receiving chamber in the second direction, the third partition abutting the bottom of the first partition.
7. The liquid cold plate of claim 1, wherein the liquid outlet is disposed at a side of the receiving cavity corresponding to the space.
8. The liquid cold plate of any one of claims 1 to 7, wherein said liquid inlet is located at a top portion of said receiving cavity.
9. The liquid cold plate of any one of claims 1 to 7, wherein said inlet port is located at a side portion of said receiving cavity.
10. A board-level liquid cooling system comprising a circuit board, a chip disposed on one side of the circuit board, a thermally conductive material disposed on a side of the chip facing away from the circuit board, and the liquid cooling panel of any one of claims 1-9 disposed on a side of the thermally conductive material facing away from the circuit board.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111030385.2A CN113840516B (en) | 2021-09-03 | 2021-09-03 | Liquid cooling cold plate and plate-level liquid cooling system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111030385.2A CN113840516B (en) | 2021-09-03 | 2021-09-03 | Liquid cooling cold plate and plate-level liquid cooling system |
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| CN113840516A true CN113840516A (en) | 2021-12-24 |
| CN113840516B CN113840516B (en) | 2023-07-14 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024036923A1 (en) * | 2022-08-15 | 2024-02-22 | 中兴通讯股份有限公司 | Cold plate and electronic device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060283579A1 (en) * | 2005-06-15 | 2006-12-21 | Debashis Ghosh | Integrated liquid cooled heat sink for electronic components |
| JP2016100456A (en) * | 2014-11-21 | 2016-05-30 | 日本軽金属株式会社 | Manufacturing method for liquid-cooled jacket and liquid-cooled jacket |
| US20180027697A1 (en) * | 2016-07-22 | 2018-01-25 | Johnson Controls Technology Company | Cold plate assembly for electrical cabinet |
| CN109982544A (en) * | 2017-12-27 | 2019-07-05 | 长城汽车股份有限公司 | Liquid cooling heat radiator |
| CN110531571A (en) * | 2018-05-24 | 2019-12-03 | 中强光电股份有限公司 | Liquid cooling radiator |
| CN211745055U (en) * | 2019-08-27 | 2020-10-23 | 昆山品岱电子有限公司 | High-efficiency radiator for electronic component |
| CN112954949A (en) * | 2019-12-10 | 2021-06-11 | 台达电子工业股份有限公司 | Network equipment power supply and heat dissipation system for same |
-
2021
- 2021-09-03 CN CN202111030385.2A patent/CN113840516B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060283579A1 (en) * | 2005-06-15 | 2006-12-21 | Debashis Ghosh | Integrated liquid cooled heat sink for electronic components |
| JP2016100456A (en) * | 2014-11-21 | 2016-05-30 | 日本軽金属株式会社 | Manufacturing method for liquid-cooled jacket and liquid-cooled jacket |
| US20180027697A1 (en) * | 2016-07-22 | 2018-01-25 | Johnson Controls Technology Company | Cold plate assembly for electrical cabinet |
| CN109982544A (en) * | 2017-12-27 | 2019-07-05 | 长城汽车股份有限公司 | Liquid cooling heat radiator |
| CN110531571A (en) * | 2018-05-24 | 2019-12-03 | 中强光电股份有限公司 | Liquid cooling radiator |
| CN211745055U (en) * | 2019-08-27 | 2020-10-23 | 昆山品岱电子有限公司 | High-efficiency radiator for electronic component |
| CN112954949A (en) * | 2019-12-10 | 2021-06-11 | 台达电子工业股份有限公司 | Network equipment power supply and heat dissipation system for same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024036923A1 (en) * | 2022-08-15 | 2024-02-22 | 中兴通讯股份有限公司 | Cold plate and electronic device |
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| CN113840516B (en) | 2023-07-14 |
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