CN211352916U - Microelectronic device radiator structure - Google Patents
Microelectronic device radiator structure Download PDFInfo
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- CN211352916U CN211352916U CN202020015229.3U CN202020015229U CN211352916U CN 211352916 U CN211352916 U CN 211352916U CN 202020015229 U CN202020015229 U CN 202020015229U CN 211352916 U CN211352916 U CN 211352916U
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- heat dissipation
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- radiating
- fins
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Abstract
The utility model relates to a microelectronic device radiator structure, including heat-conducting plate, radiator unit and heat dissipation mechanism, radiator unit installs the lower extreme of heat-conducting plate, radiator unit sets up the heat dissipation frame in both sides and installs including the slope a plurality of fin between the heat dissipation frame, the width of fin reduces gradually at its extending direction the bilateral symmetry of fin is provided with radiating fin, on same fin radiating fin's width along the length direction of fin is cascaded change, and is adjacent radiating fin staggered arrangement on the fin, radiating fin pegs graft with rivet connection's mode on the fin. The width is the cooperation of the fin that the slope changes and the width is a plurality of radiating fins of stairstepping change, with heat transfer to heating panel on the heat-conducting plate, when reducing the space and taking up, guarantee to have enough big radiating surface area, improve the radiating efficiency to electron device.
Description
Technical Field
The utility model relates to an electron device heat dissipation technical field, concretely relates to microelectronic device radiator structure.
Background
With the development of integration technology and microelectronic packaging technology, the total power density of electronic components is increasing, the physical size of electronic components and electronic equipment tends to be small and miniaturized, and the generated heat is rapidly accumulated, so that the heat flux density around the integrated components is also increasing, and therefore, the performance of electronic components and equipment is influenced by high-temperature environment, and especially for small and miniature electronic components, a more efficient heat control scheme is required. Therefore, the problem of heat dissipation of electronic components has evolved into a large focus of current electronic component and electronic device manufacturing.
Along with the rapid development of science and technology, electronic devices become more and more integrated and miniaturized, so that the heat dissipation area is smaller and smaller, the electronic devices are easy to damage due to unsmooth heat dissipation, and therefore, an electronic device heat dissipation assembly which is convenient to mount with the electronic devices and good in heat dissipation needs to be designed.
SUMMERY OF THE UTILITY MODEL
To the problem in the above-mentioned technical background, the utility model aims at providing a microelectronic device radiator structure realizes the recovery to unqualified product.
In order to realize the above purpose, the utility model discloses a technical scheme be:
the utility model provides a microelectronic device radiator structure, includes heat-conducting plate, radiator unit and heat dissipation mechanism, radiator unit installs the lower extreme of heat-conducting plate, radiator unit sets up the heat dissipation frame in both sides and installs including the slope a plurality of fin between the heat dissipation frame, the width of fin reduces gradually at its extending direction the bilateral symmetry of fin is provided with radiating fin, on same fin radiating fin's width along the length direction of fin is cascaded change, and is adjacent radiating fin staggered arrangement on the fin, radiating fin pegs graft with rivet connection's mode on the fin.
Furthermore, the upper end of the radiating fin is connected with the lower end of the heat conducting plate, and the lower end of the radiating fin is connected with the upper end of the radiating mechanism through a radiating plate.
Furthermore, a plurality of heat dissipation channels are arranged on the heat dissipation plate, and the heat dissipation channels are arranged between the adjacent heat dissipation fins and the heat dissipation frame.
Further, a heat dissipation fan is installed inside the heat dissipation mechanism.
Further, the heat radiating fins are arranged in parallel to the heat conducting plate.
Furthermore, the radiating fins are obliquely connected to the radiating fins in a tree shape.
The technical effects of the utility model reside in that:
1. the utility model discloses be provided with the width among the radiator structure and be the fin structure of slope change, set up the width simultaneously and be the radiating fin that the stairstepping changes on the multichannel fin, utilize both to cooperate the heat convection and the heat-conduction mode that form to heat transfer to heating panel on with the heat-conducting plate, when reducing the space and occuping, guarantee to have enough big heat radiating surface area, improve the radiating efficiency to electron device.
2. The utility model discloses peg graft through the rivet between well fin and the radiating fin, whole structure simple to operate, and can design the radiating fin of different size specifications according to the heat dissipation needs, be favorable to improving the radiating efficiency.
Drawings
Fig. 1 is a schematic perspective view of the heat sink structure of the microelectronic device of the present invention;
fig. 2 is a schematic structural diagram of the heat sink structure of the microelectronic device of the present invention.
Reference numerals: 1-a heat-conducting plate; 2-a heat dissipation assembly; 3-a heat dissipation mechanism; 4-a heat dissipation frame; 5-a heat sink; 6-radiating fins; 7-a heat sink; 8-heat dissipation channels; 9-radiator fan.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.
Referring to the attached drawings 1 and 2, the microelectronic device radiator structure comprises a heat conduction plate 1, a heat dissipation assembly 2 and a heat dissipation mechanism 3, wherein the heat dissipation assembly 2 is installed at the lower end of the heat conduction plate 1, the heat dissipation assembly 2 comprises heat dissipation frames 4 which are obliquely arranged on two sides and a plurality of heat dissipation fins 5 which are installed between the heat dissipation frames 4, the width of each heat dissipation fin 5 is gradually reduced in the extending direction of the heat dissipation fin, heat dissipation fins 6 are symmetrically arranged on two sides of each heat dissipation fin 5, the width of each heat dissipation fin 6 on the same heat dissipation fin 5 is changed in a stepped mode along the length direction of each heat dissipation fin 5, the adjacent heat dissipation fins 6 on the heat dissipation fins 5 are arranged in a staggered mode, and the heat dissipation fins 6 are inserted into.
The utility model discloses radiator structure is when using, and the electron device structure can be installed in heat-conducting plate 1 top through the support plate the utility model discloses in set up the width and be the 5 structures of fin that the gradient changes, set up the width simultaneously and be the radiating fin 6 that the stairstepping changes on multichannel fin 5, utilize both to cooperate the heat convection that forms and heat conduction mode to go up heat transfer to heating panel with the heat-conducting plate, when reducing the space and occuping, guarantee to have sufficient big heat radiating surface area, improve the radiating efficiency to electron device. In addition, the radiating fins 6 on the adjacent radiating fins 5 are arranged in a staggered mode, so that the radiating is quicker and more thorough.
The utility model discloses peg graft through the rivet between well fin 5 and the radiating fin 6, whole structure simple to operate, and can design the radiating fin of different dimensions according to the heat dissipation needs, be favorable to improving the radiating efficiency.
Further, the upper end of the heat dissipation plate 5 is connected with the lower end of the heat conduction plate 1, and the lower end of the heat dissipation plate 5 is connected with the upper end of the heat dissipation mechanism 3 through a heat dissipation plate 7.
Furthermore, a plurality of heat dissipation channels 8 are disposed on the heat dissipation plate 7, and the heat dissipation channels 8 are disposed between the adjacent heat dissipation fins 5 and the heat dissipation frame 4 and between the adjacent heat dissipation fins 5. The heat dissipation effect is improved.
Further, a heat dissipation fan 9 is installed inside the heat dissipation mechanism 3.
In an embodiment of the present invention, the heat dissipating fins 6 are disposed in parallel with the heat conducting plate 1.
In another embodiment of the present invention, the heat dissipation fins 6 are obliquely connected to the heat dissipation plate 5 in a tree-like shape.
The user can adjust the position relation between the radiating fins 6 and the radiating fins 5 according to the radiating requirement, and the radiating effect is ensured.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the principles of the present invention may be applied to any other embodiment without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a microelectronic device radiator structure, includes heat-conducting plate (1), radiator unit (2) and heat dissipation mechanism (3), its characterized in that: the heat dissipation assembly (2) is installed at the lower end of the heat conduction plate (1), the heat dissipation assembly (2) comprises heat dissipation frames (4) which are obliquely arranged on two sides and a plurality of heat dissipation sheets (5) which are installed between the heat dissipation frames (4), the width of each heat dissipation sheet (5) is gradually reduced in the extending direction of the heat dissipation sheet, heat dissipation fins (6) are symmetrically arranged on two sides of each heat dissipation sheet (5), the width of each heat dissipation fin (6) on the same heat dissipation sheet (5) is changed in a stepped mode along the length direction of the heat dissipation sheet (5), the adjacent heat dissipation fins (6) on the heat dissipation sheets (5) are arranged in a staggered mode, and the heat dissipation fins (6) are connected in a rivet mode in an inserting mode on the heat dissipation sheets (.
2. A microelectronic device heat sink structure according to claim 1, characterized in that the upper end of the heat sink (5) is connected to the lower end of the thermally conductive plate (1), and the lower end of the heat sink (5) is connected to the upper end of the heat dissipating means (3) through a heat dissipating plate (7).
3. A microelectronic device heat sink structure according to claim 2, characterized in that a plurality of heat dissipation channels (8) are provided on the heat dissipation plate (7), said heat dissipation channels (8) being provided between adjacent heat dissipation fins (5) and heat dissipation frame (4).
4. A microelectronic device heat sink structure according to claim 1, characterized in that the heat dissipating mechanism (3) has a heat dissipating fan (9) mounted inside.
5. The microelectronic device heat sink structure according to claim 1, characterized in that the heat dissipating fins (6) are arranged parallel to the thermally conductive plate (1).
6. The microelectronic device heat sink structure according to claim 1, characterized in that the heat dissipating fins (6) are connected obliquely to the heat dissipating fins (5) in a tree-like shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020015229.3U CN211352916U (en) | 2020-01-04 | 2020-01-04 | Microelectronic device radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020015229.3U CN211352916U (en) | 2020-01-04 | 2020-01-04 | Microelectronic device radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211352916U true CN211352916U (en) | 2020-08-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020015229.3U Active CN211352916U (en) | 2020-01-04 | 2020-01-04 | Microelectronic device radiator structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN211352916U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112235998A (en) * | 2020-09-04 | 2021-01-15 | 株洲中车时代电气股份有限公司 | Fin radiator and electric screen cabinet with same |
-
2020
- 2020-01-04 CN CN202020015229.3U patent/CN211352916U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112235998A (en) * | 2020-09-04 | 2021-01-15 | 株洲中车时代电气股份有限公司 | Fin radiator and electric screen cabinet with same |
| CN112235998B (en) * | 2020-09-04 | 2021-12-07 | 株洲中车时代电气股份有限公司 | Fin radiator and electric screen cabinet with same |
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