CN101510533A - Novel microelectronic device radiator - Google Patents
Novel microelectronic device radiator Download PDFInfo
- Publication number
- CN101510533A CN101510533A CNA2009100801795A CN200910080179A CN101510533A CN 101510533 A CN101510533 A CN 101510533A CN A2009100801795 A CNA2009100801795 A CN A2009100801795A CN 200910080179 A CN200910080179 A CN 200910080179A CN 101510533 A CN101510533 A CN 101510533A
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- CN
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- Prior art keywords
- heat pipe
- microelectronic device
- flat
- device radiator
- plate heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004377 microelectronic Methods 0.000 title claims abstract description 57
- 238000009833 condensation Methods 0.000 claims abstract description 27
- 230000005494 condensation Effects 0.000 claims abstract description 27
- 238000001704 evaporation Methods 0.000 claims abstract description 21
- 230000008020 evaporation Effects 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 239000007769 metal material Substances 0.000 claims abstract description 5
- 238000001125 extrusion Methods 0.000 claims abstract description 4
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 230000000694 effects Effects 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 230000003416 augmentation Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000008030 elimination Effects 0.000 abstract 2
- 238000003379 elimination reaction Methods 0.000 abstract 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000004080 punching Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100801795A CN101510533B (en) | 2009-03-24 | 2009-03-24 | Novel microelectronic device radiator |
PCT/CN2009/072362 WO2010060302A1 (en) | 2008-11-03 | 2009-06-19 | A heat pipe with arranged micro-pore tubes, its fabricating method and a heat exchanging system |
JP2011533524A JP2012507680A (en) | 2008-11-03 | 2009-11-03 | MICRO HEAT PIPE ARRAY HAVING FINE TUBE ARRAY, ITS MANUFACTURING METHOD, AND HEAT EXCHANGE SYSTEM |
EP09828602.4A EP2357440B1 (en) | 2008-11-03 | 2009-11-03 | Heat pipe with micro tubes array and making method thereof and heat exchanging system |
US13/127,444 US11022380B2 (en) | 2008-11-03 | 2009-11-03 | Heat pipe with micro-pore tube array and heat exchange system employing the heat pipe |
PCT/CN2009/074775 WO2010060342A1 (en) | 2008-11-03 | 2009-11-03 | Heat pipe with micro-pore tubes array and making method thereof and heat exchanging system |
HUE09828602A HUE029949T2 (en) | 2008-11-03 | 2009-11-03 | Heat pipe with micro tubes array and making method thereof and heat exchanging system |
ES09828602.4T ES2578291T3 (en) | 2008-11-03 | 2009-11-03 | Heat duct with microtube matrix and procedure for manufacturing it and heat exchange system |
US17/246,597 US11852421B2 (en) | 2008-11-03 | 2021-05-01 | Heat pipe with micro-pore tubes array and making method thereof and heat exchanging system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100801795A CN101510533B (en) | 2009-03-24 | 2009-03-24 | Novel microelectronic device radiator |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101510533A true CN101510533A (en) | 2009-08-19 |
CN101510533B CN101510533B (en) | 2011-06-15 |
Family
ID=41002870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009100801795A Active CN101510533B (en) | 2008-11-03 | 2009-03-24 | Novel microelectronic device radiator |
Country Status (1)
Country | Link |
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CN (1) | CN101510533B (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102270769A (en) * | 2010-06-07 | 2011-12-07 | 广东德豪润达电气股份有限公司 | Battery apparatus |
CN102270768A (en) * | 2010-06-07 | 2011-12-07 | 广东德豪润达电气股份有限公司 | Cell device |
CN102843897A (en) * | 2012-09-17 | 2012-12-26 | 夏侯南希 | Array cold-end plane heat pipe |
CN103038596A (en) * | 2010-09-01 | 2013-04-10 | 三菱重工业株式会社 | Heat exchanger and vehicle air conditioner with same |
CN103336565A (en) * | 2013-07-12 | 2013-10-02 | 凝辉(天津)科技有限责任公司 | Notebook computer battery bin heat dissipating expanding device |
CN103399623A (en) * | 2013-07-12 | 2013-11-20 | 凝辉(天津)科技有限责任公司 | Laptop drive bay radiation extended device |
CN104567499A (en) * | 2015-01-20 | 2015-04-29 | 北京建筑大学 | Pulse heat pipe heat radiation device used for electronic device and heat radiation device thereof |
CN105135921A (en) * | 2015-08-17 | 2015-12-09 | 吴德坚 | Superconductive temperature-even type structural-heat-resistance-free cooler |
CN105633037A (en) * | 2016-01-08 | 2016-06-01 | 西安交通大学 | Pulsation heat pipe radiating apparatus for cooling chips |
CN106558563A (en) * | 2015-09-29 | 2017-04-05 | 比亚迪股份有限公司 | Power model and the vehicle with which |
CN106659090A (en) * | 2017-01-16 | 2017-05-10 | 深圳市迈安热控科技有限公司 | Heat pipe conduction heat sink |
CN107677155A (en) * | 2017-11-03 | 2018-02-09 | 中国科学院理化技术研究所 | Flat-plate heat pipe radiator |
WO2019015283A1 (en) * | 2017-07-20 | 2019-01-24 | 京东方科技集团股份有限公司 | Chip-on-film heat dissipation structure, manufacturing method thereof, and display device |
CN110726318A (en) * | 2019-10-18 | 2020-01-24 | 大连大学 | Miniature MIMO antenna heat pipe radiator |
CN112492437A (en) * | 2020-11-16 | 2021-03-12 | 中航华东光电(上海)有限公司 | Liquid cooling heat abstractor and high heat dissipation headphone of headphone |
CN113138521A (en) * | 2021-04-29 | 2021-07-20 | 深圳市火乐科技发展有限公司 | Heat dissipation assembly and projector |
CN115483172A (en) * | 2022-09-15 | 2022-12-16 | 湖南大学 | Device for high-power-density heat dissipation of wind power converter |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07147358A (en) * | 1993-05-14 | 1995-06-06 | Furukawa Electric Co Ltd:The | Heat pipe type heat radiating unit and its manufacture |
CN1655347A (en) * | 2004-02-12 | 2005-08-17 | 鸿富锦精密工业(深圳)有限公司 | Heat pipe and manufacturing method therefor |
CN101068008A (en) * | 2007-05-25 | 2007-11-07 | 秦彪 | CPU radiator |
CN200979139Y (en) * | 2006-09-28 | 2007-11-21 | 超众科技股份有限公司 | LED lamp heat-irradiation module |
-
2009
- 2009-03-24 CN CN2009100801795A patent/CN101510533B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07147358A (en) * | 1993-05-14 | 1995-06-06 | Furukawa Electric Co Ltd:The | Heat pipe type heat radiating unit and its manufacture |
CN1655347A (en) * | 2004-02-12 | 2005-08-17 | 鸿富锦精密工业(深圳)有限公司 | Heat pipe and manufacturing method therefor |
CN200979139Y (en) * | 2006-09-28 | 2007-11-21 | 超众科技股份有限公司 | LED lamp heat-irradiation module |
CN101068008A (en) * | 2007-05-25 | 2007-11-07 | 秦彪 | CPU radiator |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102270768A (en) * | 2010-06-07 | 2011-12-07 | 广东德豪润达电气股份有限公司 | Cell device |
CN102270769A (en) * | 2010-06-07 | 2011-12-07 | 广东德豪润达电气股份有限公司 | Battery apparatus |
CN103038596B (en) * | 2010-09-01 | 2015-03-25 | 三菱重工业株式会社 | Heat exchanger and vehicle air conditioner with same |
CN103038596A (en) * | 2010-09-01 | 2013-04-10 | 三菱重工业株式会社 | Heat exchanger and vehicle air conditioner with same |
CN102843897A (en) * | 2012-09-17 | 2012-12-26 | 夏侯南希 | Array cold-end plane heat pipe |
CN103336565A (en) * | 2013-07-12 | 2013-10-02 | 凝辉(天津)科技有限责任公司 | Notebook computer battery bin heat dissipating expanding device |
CN103399623A (en) * | 2013-07-12 | 2013-11-20 | 凝辉(天津)科技有限责任公司 | Laptop drive bay radiation extended device |
CN104567499A (en) * | 2015-01-20 | 2015-04-29 | 北京建筑大学 | Pulse heat pipe heat radiation device used for electronic device and heat radiation device thereof |
CN105135921A (en) * | 2015-08-17 | 2015-12-09 | 吴德坚 | Superconductive temperature-even type structural-heat-resistance-free cooler |
CN106558563A (en) * | 2015-09-29 | 2017-04-05 | 比亚迪股份有限公司 | Power model and the vehicle with which |
CN106558563B (en) * | 2015-09-29 | 2020-03-31 | 比亚迪股份有限公司 | Power module and vehicle with same |
CN105633037A (en) * | 2016-01-08 | 2016-06-01 | 西安交通大学 | Pulsation heat pipe radiating apparatus for cooling chips |
CN106659090A (en) * | 2017-01-16 | 2017-05-10 | 深圳市迈安热控科技有限公司 | Heat pipe conduction heat sink |
EP3657540A4 (en) * | 2017-07-20 | 2021-04-28 | BOE Technology Group Co., Ltd. | Chip-on-film heat dissipation structure, manufacturing method thereof, and display device |
WO2019015283A1 (en) * | 2017-07-20 | 2019-01-24 | 京东方科技集团股份有限公司 | Chip-on-film heat dissipation structure, manufacturing method thereof, and display device |
CN109285820A (en) * | 2017-07-20 | 2019-01-29 | 京东方科技集团股份有限公司 | Radiator structure and preparation method thereof, display device |
US11362015B2 (en) | 2017-07-20 | 2022-06-14 | Beijing Boe Display Technology Co., Ltd. | Heat dissipation structure for chip-on-film, manufacturing method thereof, and display device |
CN109285820B (en) * | 2017-07-20 | 2021-01-22 | 京东方科技集团股份有限公司 | Heat dissipation structure, manufacturing method thereof and display device |
CN107677155A (en) * | 2017-11-03 | 2018-02-09 | 中国科学院理化技术研究所 | Flat-plate heat pipe radiator |
CN110726318A (en) * | 2019-10-18 | 2020-01-24 | 大连大学 | Miniature MIMO antenna heat pipe radiator |
CN112492437A (en) * | 2020-11-16 | 2021-03-12 | 中航华东光电(上海)有限公司 | Liquid cooling heat abstractor and high heat dissipation headphone of headphone |
CN112492437B (en) * | 2020-11-16 | 2022-11-11 | 中航华东光电(上海)有限公司 | Liquid cooling heat abstractor and high heat dissipation headphone of headphone |
CN113138521A (en) * | 2021-04-29 | 2021-07-20 | 深圳市火乐科技发展有限公司 | Heat dissipation assembly and projector |
CN115483172A (en) * | 2022-09-15 | 2022-12-16 | 湖南大学 | Device for high-power-density heat dissipation of wind power converter |
Also Published As
Publication number | Publication date |
---|---|
CN101510533B (en) | 2011-06-15 |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20090819 Assignee: Hunan Guangwei Energy Technology Co.,Ltd. Assignor: Zhao Yaohua Contract record no.: 2012430000202 Denomination of invention: Novel microelectronic device radiator Granted publication date: 20110615 License type: Exclusive License Record date: 20120824 |
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Owner name: GUANGWEI HETONG ENERGY TECHNOLOGY (BEIJING) CO., L Free format text: FORMER OWNER: ZHAO YAOHUA Effective date: 20140314 |
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Free format text: CORRECT: ADDRESS; FROM: 100020 CHAOYANG, BEIJING TO: 100015 CHAOYANG, BEIJING |
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Effective date of registration: 20140314 Address after: 100015, Beijing Road, Jiuxianqiao, Chaoyang District, No. 10, 107 building, 2 floor, 2D District Patentee after: GUANGWEI HETONG ENERGY TECHNOLOGY (BEIJING) CO.,LTD. Address before: 100020 Beijing, Wangjing, East Garden, building A, block 210, block, 701 Patentee before: Zhao Yaohua |
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Effective date of registration: 20230824 Address after: No. 20, Qinhuai Road, Jiangning Economic and Technological Development Zone, Nanjing, Jiangsu 211100 Patentee after: NANJING ECOWAY ENERGY TECHNOLOGY Co.,Ltd. Address before: 2D area, 2nd floor, 107th floor, No.10 Courtyard, Jiuxianqiao North Road, Chaoyang District, Beijing, 100015 Patentee before: GUANGWEI HETONG ENERGY TECHNOLOGY (BEIJING) CO.,LTD. |
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Effective date of registration: 20230922 Address after: No. 103, Building 4, No. 5 Huahua Road (East Yard), Chaoyang District, Beijing, 100020 Patentee after: GUANGWEI HETONG ENERGY TECHNOLOGY (BEIJING) CO.,LTD. Address before: No. 20, Qinhuai Road, Jiangning Economic and Technological Development Zone, Nanjing, Jiangsu 211100 Patentee before: NANJING ECOWAY ENERGY TECHNOLOGY Co.,Ltd. |
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