CN214042245U

CN214042245U - Heat radiator of electronic equipment capable of conducting heat to upper cover

Info

Publication number: CN214042245U
Application number: CN202022950557.5U
Authority: CN
Inventors: 杨强
Original assignee: Suzhou Inplus Electronics Co ltd
Current assignee: Suzhou Inplus Electronics Co ltd
Priority date: 2020-12-08
Filing date: 2020-12-08
Publication date: 2021-08-24
Anticipated expiration: 2030-12-08

Abstract

The utility model relates to a can conduct the heat abstractor of the electronic equipment of upper cover with the heat. The technical scheme adopted is as follows: the heat dissipation device comprises a first heat conduction piece, a second heat conduction piece and a connecting piece, wherein the cross section of an inner cavity of the connecting piece is a round hollow pipe fitting, the connecting piece is installed and fixed in the supporting base plate of the display screen, the evaporation end of the first heat conduction piece is fixedly attached to the heating element, the condensation end of the first heat conduction piece is rotatably connected with one end of the connecting piece, the other end of the connecting piece is fixedly connected with the evaporation end of the second heat conduction piece, the condensation end of the second heat conduction piece extends to the metal upper cover outside the display screen, and the condensation end of the second heat conduction piece is fixedly attached to the inner surface of the metal upper cover. The utility model has the advantages that: the heat generated by the electronic element arranged in the main machine shell is transferred to the upper cover of the display screen through the heat pipe and the connecting piece, and is led out from the upper cover.

Description

Heat radiator of electronic equipment capable of conducting heat to upper cover

Technical Field

The present invention relates to a heat dissipation device for an electronic apparatus, and more particularly to a heat dissipation device for an electronic apparatus, which can conduct heat to an upper cover.

Background

With the continuous development of social economy and the continuous improvement of the living standard of people, electronic equipment (such as notebook computers, flat panels, learning machines and the like) is more and more widely used. Such electronic devices mainly include a display portion and a host portion. The display part and the main machine part are in pivot connection through a rotating shaft. In the existing electronic equipment, heat generated during working is taken away by arranging a heat conducting piece on a heating element of a host part and then matching with a heat radiating fan through the flowing of air. Because the number of heating elements on the host base is large and relatively concentrated, and the heat dissipation space of the host base is small, the heat dissipation effect is still not ideal even if a heat dissipation mechanism is arranged. When the computer is used, no matter the computer is placed on a desktop or legs, the computer can generate heat or be scalded due to poor heat dissipation of the bottom surface of the computer. To solve the above problems, the publication numbers are: CN103984398A, name: the utility model discloses a with radiating notebook computer structure's of upper cover conduction china utility model patent, the circuit board laminating that will integrate and have main heating element (memory, CPU, display card chip) is at the back of display screen is proposed, and install in the upper cover of display screen, this structure though can derive the heat that the computer produced from the upper cover, however, with main component integration behind the upper cover of notebook computer display screen, need adopt complicated winding displacement could with the keyboard on the host computer base, the touch-control board, battery and interface connection, cause notebook computer's structure complicacy, the defect that assembly difficulty and fault rate are high, be an irrecoverable measure. Therefore, a new technical solution should be provided to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at: aiming at the defects existing in the prior art, the heat dissipation device of the electronic equipment is provided, which can conduct heat to the upper cover and lead the heat out of the upper cover, and has reasonable structure and easy realization.

In order to achieve the above object, the utility model adopts the following technical scheme:

a heat dissipating double-fuselage of the electronic device that can conduct the heat to the upper cover, the said electronic device includes display part and host computer part, link through the spindle between host computer part and the said display part, the said display part includes display screen, supporting the bottom plate, supports the lateral plate and coats the metal upper cover outside the display screen, the said host computer part includes the body of the chassis, keyboard and every electric element set up in the body of the chassis on the upper surface of the body of the chassis, the said heat dissipating double-fuselage includes the first heat conduction piece, second heat conduction piece and link, the cross section of the said link is round hollow pipe fittings in the cavity, it is mounted and fixed inside supporting the bottom plate of the display screen, the evaporation end of the said first heat conduction piece is affixed to the heating element set up in the body of the chassis, the condensation end of the first heat conduction piece passes the outer wall of the body of the chassis, extend to the supporting bottom plate of the display screen, the condensation end of the second heat conducting piece extends to the metal upper cover outside the display screen and is fixedly attached to the inner surface of the metal upper cover.

Further:

the connecting piece is made of heat conducting materials.

Preferably:

the connecting piece is of a double-layer structure, the inner pipe of the connecting piece is a hollow pipe with a circular cross section, and the outer pipe of the connecting piece is a heat pipe with an unlimited cross section.

The further technical scheme is as follows:

the condensation end of the first heat-conducting piece is inserted into the hollow ring pipe at one end of the connecting piece and can rotate relative to the hollow ring pipe.

Further:

and a heat dissipation assembly is paved on the inner surface of the metal upper cover.

Preferably:

the heat dissipation component is a temperature equalization plate, a heat conduction pipe or a heat dissipation fin.

The further technical scheme is as follows:

the contact gaps of the first heat-conducting piece, the second heat-conducting piece and the connecting piece and the hollow inner cavity of the connecting piece are filled with heat-conducting media.

Due to the adoption of the technical scheme, compared with the prior art, the utility model have the following advantage:

1. the utility model discloses an electronic equipment's heat abstractor, the heat that will install the inside electronic component of host computer casing and produce covers on through heat pipe and connecting piece transmission display screen to derive the heat from the upper cover, because the upper cover has great outside surface area, can increase radiation and heat convection with the heat in giving off the surrounding air faster, be favorable to improving electronic equipment's life and use experience.

2. The utility model discloses a can compare the heat abstractor of the electronic equipment of heat conduction upper cover with current heat abstractor through with the heating element circuit board integration upper cover, rational in infrastructure, the assembly is simple and convenient, and the fault rate is low.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

Fig. 1 is a schematic structural diagram of an electronic device with a conventional structure.

Fig. 2 is a schematic view of the structure and the installation position of the heat dissipation device of the present invention.

Fig. 3 is a schematic diagram of a third structure according to an embodiment of the present invention.

Wherein: 1. the display device comprises a display part 1-1, a display screen 1-2, a supporting bottom plate 1-3, supporting side plates 2, a host part 2-1, a case body 3, a first heat conducting piece 4, a second heat conducting piece 5, a connecting piece 6, a heat radiating assembly 7 and a rotating shaft.

Detailed Description

As shown in the drawings, as a first embodiment of the present invention, the present invention provides a heat dissipating device of an electronic device capable of conducting heat to an upper cover, in this embodiment, the electronic device is a notebook computer, which mainly includes a display portion 1 and a host portion 2, the display portion 1 and the host portion 2 are connected through a rotating shaft 7, the display portion 1 includes a display screen 1-1, a supporting bottom plate 1-2, a supporting side plate 1-3 and a metal upper cover covering the outside of the display screen, the host portion 2 includes a housing main body 2-1, a keyboard disposed on the upper surface of the housing main body 2-1 and various electrical elements disposed inside the housing main body 2-1, the above electrical elements mainly include a memory, a display memory, a CPU and a chip, etc., and are all integrated on a circuit board, and is placed inside the casing main body 2-1, the heat dissipating means includes a first heat conductive member 3, a second heat conductive member 4, and a connecting member 5. In the present embodiment, the connecting member 5 is made of a material having thermal conductivity, such as copper, aluminum, stainless steel or other alloy material, preferably copper. In the present embodiment, the first heat conduction member 3 and the second heat conduction member 4 are preferably heat pipes, because they have high heat conduction performance, and can quickly conduct and dissipate heat generated by the heat generating components of the notebook computer. As an improvement point of the utility model: in order to conduct heat generated from the heating element provided inside the casing main body 2-1 to the upper cover outside the display screen, the connecting piece 5 is arranged in the supporting bottom plate 1-2, the connecting piece 5 is designed to be a hollow pipe fitting with a circular cross section of an inner cavity, meanwhile, the cross section of the first heat conducting piece 3 is also designed to be circular, when in use, the evaporation end of the first heat conducting piece 3 is fixedly attached to the heating element arranged in the casing main body 2-1, the condensation end of the first heat conducting piece 3 passes through the outer wall of the casing main body 2-1 and the rotating shaft shell and extends into the supporting bottom plate 1-2 of the display screen, since the first heat-conducting member 3 is circular in cross-section, and the inner cavity of the connecting member 5 is also circular in cross-section, the first heat-conducting assembly 3 can be inserted into the hollow cavity of the connecting member 5 and can rotate relative to the hollow cavity. When the user is at the switching display screen, the display screen is rotated for the computer host under the drive of pivot, stretches into the inside condensation end of first heat-conducting component 3 of connecting piece 5 simultaneously here and also rotates for this end of connecting piece 5, so can not influence opening and shutting of arbitrary angle between display screen and the host computer. The other end of the connecting piece 5 is fixedly connected with the evaporation end of the second heat conducting piece 4, and the condensation end of the second heat conducting piece 4 extends to the metal upper cover outside the display screen and is fixedly attached to the inner surface of the metal upper cover. The cross-sectional shape of the second heat-conducting member 4 and the manner of connection with the connecting member 5 are not limited. Through above-mentioned structural design, just can transmit the upper cover of display screen through first heat-conducting piece 3, second heat-conducting piece 4 and connecting piece 5 with the heat that heating element produced in the casing main part, derive electronic equipment's heat from the upper cover, because the display screen upper cover has great external surface area, can increase radiation and thermal convection with the heat in the fast surrounding air that gives off of heat. The utility model discloses a radiating mode combines together with the air-cooled mode of adoption radiator fan, and the radiating effect is better, and is favorable to energy-conservation to fall and makes an uproar, is worth utilizing widely.

Preferably, as a second embodiment of the present invention, this embodiment is a further improvement of the first embodiment, and in order to further improve the heat dissipation effect, the connecting member 5 adopts a heat pipe structure. Simultaneously in order to realize being connected with the rotation of first heat-conducting member 3, design connecting piece 5 is the bilayer structure of inside and outside pipe, specifically is: the inner pipe is a hollow pipe with a circular cross section, and the outer pipe is a heat pipe structure with an unlimited cross section.

As a third embodiment of the present invention, the present embodiment is a further improvement to the first embodiment, when the heat on the notebook computer host is conducted to the metal upper cover, in order to improve the heat dissipation capability of the metal upper cover, the heat dissipation assembly 6 is laid on the inner surface of the metal upper cover, and the heat dissipation assembly 6 is a temperature equalization plate, a heat conduction pipe or a heat dissipation fin, preferably a temperature equalization plate.

As the utility model discloses a fourth embodiment, this embodiment is also to implementing a further improvement, for better improvement radiating effect, the contact gap of first heat-conducting piece, second heat-conducting piece and connecting piece and the cavity inner chamber of connecting piece all fill the heat-conducting medium, the heat-conducting medium is preferably liquid oil, and it is in order to make things convenient for effective supplementary heat dissipation, and on the other hand also can make the rotation between first heat-conducting piece 3 and the connecting piece 5 more smooth and easy.

Above embodiment has mainly introduced the utility model discloses can be with the heat conduction to the heat abstractor of upper cover application on notebook computer, except notebook computer of course, other anything have display part and host computer part to display part accessible rotation axis can all adopt for the electronic equipment of host computer part rotation the utility model discloses a heat abstractor carries out the efficient heat dissipation on conducting the heat of host computer part to display part's shell, all falls into above the utility model discloses a protection scope.

The general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipating double-fuselage of the electronic device that can conduct the heat to the upper cover, the said electronic device includes display part (1) and host computer part (2), link through the spindle (7) between said display part (1) and host computer part (2), the said display part (1) includes the display screen (1-1), supports the bottom plate (1-2), supports the lateral plate (1-3) and coats the metal upper cover outside the display screen, the said host computer part (2) includes the body of the chassis (2-1), sets up the keyboard and every electric element set up inside body of chassis on the upper surface of body of chassis (2-1), characterized by that: the heat dissipation device comprises a first heat conduction piece (3), a second heat conduction piece (4) and a connecting piece (5), wherein the connecting piece (5) is a hollow pipe fitting with a circular cross section of an inner cavity, the heat-conducting device is fixedly arranged in a supporting bottom plate (1-2) of a display screen, an evaporation end of a first heat-conducting piece (3) is fixedly attached to a heating element arranged in a machine shell main body (2-1), a condensation end of the first heat-conducting piece (3) penetrates through the outer wall of the machine shell main body (2-1) and extends into the supporting bottom plate (1-2) of the display screen, and is rotatably connected with one end of the connecting piece (5), the other end of the connecting piece (5) is fixedly connected with the evaporation end of the second heat conducting piece (4), and the condensation end of the second heat-conducting piece (4) extends to the metal upper cover outside the display screen and is fixedly attached to the inner surface of the metal upper cover.

2. The heat dissipating device of an electronic apparatus capable of transferring heat to a cover as set forth in claim 1, wherein: the connecting piece (5) is made of heat conducting materials.

3. The heat dissipating device of an electronic apparatus capable of transferring heat to a cover as set forth in claim 1, wherein: the condensation end of the first heat conducting piece (3) is inserted into the hollow ring pipe at one end of the connecting piece (5) and can rotate relative to the hollow ring pipe.

4. The heat dissipating device of an electronic apparatus capable of transferring heat to a cover as set forth in claim 1, wherein: and a heat dissipation assembly (6) is paved on the inner surface of the metal upper cover.

5. A heat dissipating apparatus for an electronic device capable of transferring heat to a cover as claimed in claim 1 or 3, wherein: the first heat conducting piece (3) and the second heat conducting piece (4) are heat pipes.

6. A heat dissipating device of an electronic apparatus capable of transferring heat to a cover as claimed in claim 2, wherein: the connecting piece is of a double-layer structure, the inner pipe of the connecting piece is a hollow pipe with a circular cross section, and the outer pipe of the connecting piece is a heat pipe with an unlimited cross section.

7. The heat dissipating device for an electronic apparatus capable of transferring heat to a cover as claimed in claim 2, 3, 4 or 6, wherein: the contact gaps of the first heat-conducting piece (3), the second heat-conducting piece (4) and the connecting piece (5) and the hollow inner cavity of the connecting piece (5) are filled with heat-conducting media.

8. The heat dissipating device for an electronic apparatus capable of transferring heat to a cover as set forth in claim 4, wherein: the heat dissipation component (6) is a temperature equalization plate, a heat conduction pipe or a heat dissipation fin.