CN110408336A - The preparation method of antimagnetic thermally conductive one side glue - Google Patents
The preparation method of antimagnetic thermally conductive one side glue Download PDFInfo
- Publication number
- CN110408336A CN110408336A CN201910841962.2A CN201910841962A CN110408336A CN 110408336 A CN110408336 A CN 110408336A CN 201910841962 A CN201910841962 A CN 201910841962A CN 110408336 A CN110408336 A CN 110408336A
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- China
- Prior art keywords
- antimagnetic
- thermally conductive
- preparation
- mass fraction
- layer
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention discloses a kind of preparation method of antimagnetic thermally conductive one side glue, includes the next steps: metal substrate layer be compounded with antimagnetic heat dissipating layer on one side, the another side of metal base is compounded with piercing types heat-conducting layer.Conductive shield function is played on one side, and another side plays magnetic field and absorbs function of shielding, integrally plays thermally conductive, heat spreading function.Solves the problem of high electromagnetic interference caused by the strong signal transmission of high-frequency process, golf calorific value.
Description
Technical field
The present invention relates to film fabrication techniques field, in particular to a kind of preparation method of antimagnetic thermally conductive one side glue.
Background technique
Used at present antimagnetic or heat-conducting glue band is typically all antimagnetic or thermally conductive using the coating of antimagnetic or heat conducting base material two sides
Glue and be made, still, colloid is polymer electrolyte colloid substantially, since these polymer electrolyte colloidal properties are relatively general, thus
Cause adhesive tape using effect obtained undesirable.
These product functions are single, can not accomplish comprehensive protection, and the lightening electronics that is unable to satisfy of product is set
Standby demand.
Summary of the invention
The main object of the present invention is to provide a kind of preparation method of antimagnetic thermally conductive one side glue, to solve to deposit in technical background
Deficiency.
To achieve the above object, the preparation method of antimagnetic thermally conductive one side glue proposed by the present invention, comprising the following steps:
S1: select copper foil that metal substrate layer is made；
S2: with 50%~90% (mass fraction) pressure sensitive colloid, 5%-30% (mass fraction) conduction powder of arranging in pairs or groups, then with
5%-25% (mass fraction) diluent is coated on the layer upper surface of PET release film, and be compounded in after dispersion grinding is sufficiently stirred
In the one side of metal substrate layer, piercing types heat-conducting layer is formed；
S3: with the composite colloid of 70%~90% (mass fraction), 10%-50% (mass fraction) conduction powder of arranging in pairs or groups,
10%-50% (mass fraction) magnetic conduction powder, then with the diluent of 5%-50% (mass fraction), is sufficiently stirred dispersion, and with
After ball milling, sand milling or colloid mill grinding uniformly, directly it is coated on the metal covering of metal substrate layer, or be coated on PET release film
Layer upper surface, and be compounded on the metal covering of metal substrate layer, form antimagnetic heat dissipating layer.
Preferably, in the S1, metal substrate layer is single layer or MULTILAYER COMPOSITE, can be aluminium foil, silver foil, goldleaf, lead
The one or more of them collocation of electric cloth material, conductive fiber, plastic film metal-coated membrane.
Preferably, in the S2, pressure sensitive colloid is the one of which of esters of acrylic acid, silica type and rubber.
Preferably, in the S2 or S3, conduction powder is aluminium oxide, magnesia, silicon carbide, silicon nitride, aluminium nitride, nitridation
The one or more of them of boron is arranged in pairs or groups.
Preferably, in the S2 or S3, diluent is lipid, the one of which of ketone, alcohols, aromatic solvent.
Preferably, in the S3, composite colloid is epoxies, esters of acrylic acid, polyurethanes, silica type, rubber
It is one of.
Preferably, in the S3, magnetic conduction powder is the independent powder of iron-cobalt-nickel or ferrite or several mixtures.
The beneficial effects of the present invention are:
1, easy to operate, manufacturing process only be coated with and it is compound, adapt to industrialized mass production；
2, heat-conducting layer collocation conductive base can form galvanic circle, good protector in heat-conducting layer and conductive base end
Attached substrate plays the role of shielding and guides interference signal；
3, piercing types structure advantageously reduces conductive and conduction powder dosage, improves the colloidal property of heat-conducting layer, simultaneously
Due to the buffer function of antimagnetic heat-conducting layer, product appearance not will cause because of bad order caused by piercing types structure；
4, antimagnetic heat-conducting layer design, the interference in energy effective protection magnetic field；
5, it can guarantee that the heat dissipation of product steadily carries out, in order to avoid near heating sources is sometimes hot and sometimes cold, avoid claimed first device
Part is damaged.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of antimagnetic thermally conductive one side glue provided in an embodiment of the present invention.
Drawing reference numeral explanation:
| Label | Title | Label | Title |
| 1 | Metal substrate layer | 2 | Antimagnetic heat dissipating layer |
| 3 | Heat-conducting layer |
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if should
When particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being related to " first ", " second " etc. in the present invention is used for description purposes only, and should not be understood as referring to
Show or imply its relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " are defined as a result,
Two " feature can explicitly or implicitly include at least one of the features.In addition, the technical solution between each embodiment can
It to be combined with each other, but must be based on can be realized by those of ordinary skill in the art, when the combination of technical solution occurs
Conflicting or cannot achieve when, will be understood that the combination of this technical solution is not present, also not the present invention claims protection model
Within enclosing.
In embodiments of the present invention, referring to Fig.1, the antimagnetic thermally conductive one side glue, including metal substrate layer 1, metal substrate layer 1
Be compounded with antimagnetic heat dissipating layer 2 on one side, the another side of metal base 1 is compounded with piercing types heat-conducting layer 3.Conductive shield is played on one side
Function, another side play magnetic field and absorb function of shielding, integrally play thermally conductive, heat spreading function；The conductive metal of the collocation of heat-conducting layer 3 simultaneously
Substrate layer 1 can form galvanic circle, the metal substrate layer that protection attaches well in heat-conducting layer 3 and 1 end of conductive metal substrate layer
1, play the role of shielding and guides interference signal.
The preparation method of above-mentioned antimagnetic thermally conductive one side glue, comprising the following steps:
S1: select copper foil that metal substrate layer is made；
S2: with the pressure sensitive colloid (esters of acrylic acid, silica type, rubber etc.) of 50%~90% (mass fraction), collocation
Conduction powder 5%-30% (one or more of collocation such as aluminium oxide, magnesia, silicon carbide, silicon nitride, aluminium nitride, boron nitride),
PET is coated on after dispersion grinding is sufficiently stirred with the diluent of 5%-25% (lipid, ketone, alcohols, aromatic solvent etc.) again
The layer upper surface of release film, and be compounded in the one side of metal substrate layer, to form heat-conducting layer.Heat filling can preferably be played
Conductive force, and conductive shield circuit is formed with intermediate metal layer.
S3: with composite colloid (epoxies, esters of acrylic acid, polyurethanes, the silica gel of 70%~90% (mass fraction)
Class, rubber etc.), arrange in pairs or groups conduction powder 10%-50% (aluminium oxide, magnesia, silicon carbide, silicon nitride, aluminium nitride, boron nitride
Arrange in pairs or groups Deng one or more), it arranges in pairs or groups magnetic conduction powder 10%-50% (the independent powder of iron-cobalt-nickel or ferrite or several mixtures),
Again with the diluent of 5%-50% (lipid, ketone, alcohols, aromatic solvent etc.), dispersion is sufficiently stirred, and with ball milling, be sanded or
After the grinding uniformly of person's colloid mill, directly it is coated on the metal covering of re-glue metal base, or be coated on the layer upper surface of PET release film,
And be compounded on the metal covering of re-glue metal base, to form antimagnetic heat dissipating layer.
In the S2 of the present embodiment, the metal substrate layer 1 is single layer or MULTILAYER COMPOSITE, using conductive thin membrane material
Material.Metal base 1 can lead for copper foil, aluminium foil, silver foil, goldleaf, conductive fabric material, conductive fiber, plastic film metal-coated membrane etc.
Conductive film class material is one such or a variety of collocation.
In the present embodiment, the thickness of the piercing types heat-conducting layer 3, antimagnetic heat dissipating layer 2 and metal substrate layer 1 is 5-
50um.According to thermal storage performance, shielding properties and the suction compact adjustment of the antimagnetic performance of wave.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all at this
Under the inventive concept of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/use indirectly
It is included in other related technical areas in scope of patent protection of the invention.
Claims (7)
1. the preparation method of antimagnetic thermally conductive one side glue, which comprises the following steps:
S1: select copper foil that metal substrate layer is made；
S2: with 50%~90% (mass fraction) pressure sensitive colloid, 5%-30% (mass fraction) conduction powder of arranging in pairs or groups, then with 5%-
25% (mass fraction) diluent is coated on the layer upper surface of PET release film, and be compounded in metal after dispersion grinding is sufficiently stirred
In the one side of substrate layer, piercing types heat-conducting layer is formed；
S3: with the composite colloid of 70%~90% (mass fraction), arrange in pairs or groups 10%-50% (mass fraction) conduction powder, 10%-
50% (mass fraction) magnetic conduction powder, then with the diluent of 5%-50% (mass fraction), is sufficiently stirred dispersion, and with ball milling,
After sand milling or colloid mill grinding uniformly, directly it is coated on the metal covering of metal substrate layer, or be coated on the release of PET release film
Face, and be compounded on the metal covering of metal substrate layer, form antimagnetic heat dissipating layer.
2. the preparation method of antimagnetic thermally conductive one side glue as described in claim 1, which is characterized in that in the S1, metal base
Layer is single layer or MULTILAYER COMPOSITE, can be aluminium foil, silver foil, goldleaf, conductive fabric material, conductive fiber, plastic film metal-coated membrane
One or more of them collocation.
3. the preparation method of antimagnetic thermally conductive one side glue as described in claim 1, which is characterized in that in the S2, pressure sensitive colloid
For the one of which of esters of acrylic acid, silica type and rubber.
4. the preparation method of antimagnetic thermally conductive one side glue as described in claim 1, which is characterized in that thermally conductive in the S2 and S3
Powder is the one or more of them collocation of aluminium oxide, magnesia, silicon carbide, silicon nitride, aluminium nitride, boron nitride.
5. the preparation method of antimagnetic thermally conductive one side glue as described in claim 1, which is characterized in that in the S2 and S3, dilution
Agent is lipid, the one of which of ketone, alcohols, aromatic solvent.
6. the preparation method of antimagnetic thermally conductive one side glue as described in claim 1, which is characterized in that in the S3, composite colloid
For epoxies, esters of acrylic acid, polyurethanes, silica type, rubber one of which.
7. the preparation method of antimagnetic thermally conductive one side glue as described in claim 1, which is characterized in that in the S3, magnetic conduction powder
For the independent powder of iron-cobalt-nickel or ferrite or several mixtures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910841962.2A CN110408336A (en) | 2019-09-06 | 2019-09-06 | The preparation method of antimagnetic thermally conductive one side glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910841962.2A CN110408336A (en) | 2019-09-06 | 2019-09-06 | The preparation method of antimagnetic thermally conductive one side glue |
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| Publication Number | Publication Date |
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| CN110408336A true CN110408336A (en) | 2019-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910841962.2A Pending CN110408336A (en) | 2019-09-06 | 2019-09-06 | The preparation method of antimagnetic thermally conductive one side glue |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113072886A (en) * | 2021-03-26 | 2021-07-06 | 江苏伊诺尔新材料科技有限公司 | High-performance magnetic-conductive double-sided adhesive tape and manufacturing method thereof |
| CN114736630A (en) * | 2021-08-23 | 2022-07-12 | 常州威斯双联科技有限公司 | Magnetic isolation adhesive film with bonding function and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140113226A (en) * | 2013-03-15 | 2014-09-24 | 주식회사 아모그린텍 | A pressure-sensitive adhesive tape and manufacturing method thereof |
| CN107760217A (en) * | 2017-10-30 | 2018-03-06 | 东莞市大忠电子有限公司 | A kind of high heat conduction isolation strip for transformer |
| CN207294673U (en) * | 2017-09-18 | 2018-05-01 | 深圳市中森胶带制品有限公司 | A kind of heat conduction and heat radiation adhesive tape |
-
2019
- 2019-09-06 CN CN201910841962.2A patent/CN110408336A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140113226A (en) * | 2013-03-15 | 2014-09-24 | 주식회사 아모그린텍 | A pressure-sensitive adhesive tape and manufacturing method thereof |
| CN207294673U (en) * | 2017-09-18 | 2018-05-01 | 深圳市中森胶带制品有限公司 | A kind of heat conduction and heat radiation adhesive tape |
| CN107760217A (en) * | 2017-10-30 | 2018-03-06 | 东莞市大忠电子有限公司 | A kind of high heat conduction isolation strip for transformer |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113072886A (en) * | 2021-03-26 | 2021-07-06 | 江苏伊诺尔新材料科技有限公司 | High-performance magnetic-conductive double-sided adhesive tape and manufacturing method thereof |
| CN114736630A (en) * | 2021-08-23 | 2022-07-12 | 常州威斯双联科技有限公司 | Magnetic isolation adhesive film with bonding function and preparation method and application thereof |
| CN114736630B (en) * | 2021-08-23 | 2023-08-01 | 常州威斯双联科技有限公司 | Magnetism isolating adhesive film with bonding function and preparation method and application thereof |
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| CB02 | Change of applicant information |
Address after: 516000 No.19, Shunda District 3, Yongping village, Tonghu Town, Zhongkai high tech Zone, Huizhou City, Guangdong Province Applicant after: GUANGDONG YALONGXING NEW MATERIAL Co.,Ltd. Address before: 516000 No.19, Shunda District 3, Yongping village, Zhanghu Town, Zhongkai high tech Zone, Huizhou City, Guangdong Province Applicant before: GUANGDONG YALONGXING NEW MATERIAL Co.,Ltd. |
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Application publication date: 20191105 |
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