CN115130637A - Packaging method of IC card module - Google Patents
Packaging method of IC card module Download PDFInfo
- Publication number
- CN115130637A CN115130637A CN202210773178.4A CN202210773178A CN115130637A CN 115130637 A CN115130637 A CN 115130637A CN 202210773178 A CN202210773178 A CN 202210773178A CN 115130637 A CN115130637 A CN 115130637A
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- Prior art keywords
- card module
- chip
- carrier plate
- abs
- pcb
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses a packaging method of an IC card module. According to the invention, the graphene fiber powder additive is mixed in the manufacturing process of the PCB carrier plate, and the proportion of the additive is adjusted, so that the proportion of the PCB particles to the graphene fiber powder is 15:1, and the obtained PCB carrier plate has heat dissipation performance; the IC card module uses the heat radiation solder ball to assist heat radiation, the solder ball for heat radiation is the solder ball directly installed under the substrate under the chip, the solder ball can directly transfer heat to the PCB carrier plate, and the heat resistance caused by air is reduced. In order to ensure that the heat dissipation to the ball is quicker, the heat dissipation channel can penetrate through the substrate, so that the heat dissipation capacity of the subsequent IC card module is improved in the using process, meanwhile, as the graphene fiber powder additive is added in the production process of the PCB carrier plate, and the graphene fiber powder additive and the silver metal fiber are mixed in the production process of the ABS carrier plate, the heat conduction and heat dissipation capacity of the chip is improved, and the anti-interference capacity of the chip module is also improved.
Description
Technical Field
The invention belongs to the technical field of IC card packaging, and particularly relates to a packaging method of an IC card module.
Background
The IC card is made by embedding a microelectronic chip into a card base conforming to ISO7816 standard. The communication method between the IC card and the reader/writer may be contact or non-contact. The IC card has the advantages of small size, convenient carrying, large storage capacity, high reliability, long service life, strong confidentiality, high safety and the like.
The IC card module includes a contact IC card module and a noncontact IC card module. The conventional IC card module structure includes a lead frame (or called a carrier tape) and a chip, wherein the chip is disposed on the lead frame, and the lead frame is a lead frame with a width of 35mm, similar to a motion picture film. However, after the common IC card module is packaged, the module has poor heat dissipation due to strong sealing performance, and thus the IC card module is prone to potential safety hazards after being used for a long time.
Disclosure of Invention
The invention aims to: in order to solve the above-mentioned problems, a method for packaging an IC card module is provided.
The technical scheme adopted by the invention is as follows: a packaging method of an IC card module, comprising the steps of:
s1: taking a PCB carrier plate and an IC card module chip to be packaged, selecting a sheet formula firstly, wherein the material splicing mode is as follows: a PCB carrier plate, an ABS carrier plate, an IC card module chip, the ABS carrier plate and the PCB carrier plate are matched,
s2: the distance between the IC card module chip and the ABS carrier plate is reduced; the distance between the IC card module chip and the board is reduced, the thermal resistance of the air gap is reduced,
s3: mounting the heat-dissipating solder balls;
s4: after the heat dissipation solder balls are installed, namely two ABS materials are arranged on two sides of the matched antenna chip, and the laminated middle material is laminated with two outermost PCB fabrics;
s5: after the ABS layer faces the matched IC card module chip, gluing, laminating and compounding the ABS protective layer and the IC card module chip, and laminating and bonding according to the order of lamination; after the stacking is finished, carrying out primary lamination, heating to a high temperature, and obtaining an IC card module with an IC card chip after the lamination is cooled;
s6: mounting salient points of the IC card module are attached to bonding pads of the electronic carrier board in a surface welding technology mode;
s7: connecting the mounting salient points with the bonding pads to form bonding points to form a finished module, and finishing the whole preparation process.
In a preferred embodiment, in the step S2, the distance between the IC card module chip and the board is 30 μm.
In a preferred embodiment, in the step S3, the solder balls for heat dissipation are directly mounted on the solder balls under the substrate directly under the chip, and the solder balls are used to directly transfer heat to the PCB, so as to reduce the thermal resistance caused by air.
In a preferred embodiment, in step S1, the graphene fiber powder additive is mixed in the PCB carrier manufacturing process, and the ratio of the additive is adjusted so that the ratio of the PCB particles to the graphene fiber powder is 15:1, thereby making the resulting PCB carrier have heat dissipation properties.
In a preferred embodiment, in the step S1, the graphene fiber powder additive and the silver metal fiber are mixed in the ABS carrier manufacturing process, and the ratio of the additives is adjusted so that the ratio of the ABS particles, the graphene fiber powder and the silver metal fiber is 20:1: 15-18, thereby making the obtained PCB carrier have heat dissipation.
In a preferred embodiment, in the step S5, the high temperature is 130 degrees celsius, and the heating time is 250 to 280 seconds.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
in the invention, the heat dissipation solder ball is used for assisting heat dissipation in the IC card module, and the solder ball for heat dissipation is directly arranged under the substrate under the chip, so that the solder ball can be used for directly transferring heat to the PCB carrier plate, thereby reducing the thermal resistance caused by air. In order to ensure that the heat dissipation to the ball is quicker, the heat dissipation channel can penetrate through the substrate, so that the heat dissipation capacity of the subsequent IC card module is improved in the using process, meanwhile, as the graphene fiber powder additive is added in the production process of the PCB carrier plate, and the graphene fiber powder additive and the silver metal fiber are mixed in the production process of the ABS carrier plate, the heat conduction and heat dissipation capacity of the chip is improved, and the anti-interference capacity of the chip module is also improved.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
Example (b):
a packaging method of an IC card module, comprising the steps of:
s1: taking a PCB carrier plate and an IC card module chip to be packaged, selecting a sheet formula firstly, wherein the material blending mode is as follows: the method comprises the steps that a PCB carrier plate, an ABS carrier plate, an IC card module chip, the ABS carrier plate and the PCB carrier plate are well matched, graphene fiber powder additives are mixed in the manufacturing process of the PCB carrier plate, and the proportion of the additives is adjusted, so that the proportion of PCB particles to graphene fiber powder is 15:1, and the obtained PCB carrier plate has heat dissipation performance; in the step S1, graphene fiber powder additive and silver metal fiber are mixed in the manufacturing process of the ABS carrier plate, and the proportion of the additive is adjusted, so that the proportion of ABS particles, graphene fiber powder and silver metal fiber is 20:1:15, and the obtained PCB carrier plate has heat dissipation performance;
s2: the space between the IC card module chip and the ABS carrier plate is reduced. Reducing the distance between the IC card module chip and the board, and reducing the thermal resistance of the air gap, in step S2, reducing the height between the IC card module chip and the ABS carrier board from 140 to 60 μm, wherein for 10 x 10 PQFP, RJA reduces 5.1-5.9 ℃/W, and for 28 x 28mm PQFP, when the distance is reduced from 230 to 110 μm, the thermal resistance can reduce 3.1-3.9 ℃/W; in step S2, the distance between the IC card module chip and the board is 30 μm;
s3: mounting the heat-dissipating solder balls; the heat radiation solder ball is directly arranged on the solder ball under the substrate under the chip, and the solder ball is used for directly transferring heat to the PCB so as to reduce the thermal resistance caused by air;
s4: after the heat dissipation solder balls are installed, namely two ABS materials are arranged on two sides of the matched antenna chip, and the laminated middle material is laminated with two outermost PCB fabrics;
s5: after the ABS layer is coated with glue at the position facing the matched IC card module chip, laminating and compounding the ABS protective layer and the IC card module chip, and laminating according to the sequence of laminating and bonding; after the stacking is finished, carrying out primary lamination, heating to high temperature, and obtaining an IC card module with an IC card chip after the IC card module is cooled; in step S5, heating to a high temperature of 130 ℃ for 250 to 280 seconds;
s6: mounting salient points of the IC card module are attached to bonding pads of the electronic carrier board in a surface welding technology mode;
s7: connecting the mounting salient points with the bonding pads to form bonding points to form a finished module, and finishing the whole preparation process.
In the invention, the heat dissipation solder ball is used for assisting heat dissipation in the IC card module, and the solder ball for heat dissipation is directly arranged under the substrate under the chip, so that the solder ball can be used for directly transferring heat to the PCB carrier plate, thereby reducing the thermal resistance caused by air. In order to ensure that the heat dissipation to the ball is quicker, the heat dissipation channel can penetrate through the substrate, so that the heat dissipation capacity of the subsequent IC card module is improved in the using process, meanwhile, as the graphene fiber powder additive is added in the production process of the PCB carrier plate, and the graphene fiber powder additive and the silver metal fiber are mixed in the production process of the ABS carrier plate, the heat conduction and heat dissipation capacity of the chip is improved, and the anti-interference capacity of the chip module is also improved.
Example two:
a method of packaging an IC card module, the method comprising the steps of:
s1: taking a PCB carrier plate and an IC card module chip to be packaged, selecting a sheet formula firstly, wherein the material blending mode is as follows: the method comprises the steps that a PCB carrier plate, an ABS carrier plate, an IC card module chip, the ABS carrier plate and the PCB carrier plate are well matched, graphene fiber powder additives are mixed in the manufacturing process of the PCB carrier plate, and the proportion of the additives is adjusted, so that the proportion of PCB particles to graphene fiber powder is 15:1, and the obtained PCB carrier plate has heat dissipation performance; in the step S1, graphene fiber powder additive and silver metal fiber are mixed in the manufacturing process of the ABS carrier plate, and the proportion of the additive is adjusted, so that the proportion of ABS particles, graphene fiber powder and silver metal fiber is 20:1:16, and the obtained PCB carrier plate has heat dissipation performance;
s2: the space between the IC card module chip and the ABS carrier plate is reduced. Reducing the distance between the IC card module chip and the board, and reducing the thermal resistance of the air gap, in step S2, reducing the height between the IC card module chip and the ABS carrier board from 140 to 60 μm, wherein for 10 x 10 PQFP, RJA reduces 5.1-5.9 ℃/W, and for 28 x 28mm PQFP, when the distance is reduced from 230 to 110 μm, the thermal resistance can reduce 3.1-3.9 ℃/W; in step S2, the distance between the IC card module chip and the board is 30 μm;
s3: mounting the heat-dissipating solder balls; the heat radiation solder ball is directly arranged on the solder ball under the substrate under the chip, and the solder ball is used for directly transferring heat to the PCB so as to reduce the thermal resistance caused by air;
s4: after the heat dissipation solder balls are installed, namely two ABS materials are arranged on two sides of the matched antenna chip, and the laminated middle material is laminated with two outermost PCB fabrics;
s5: after the ABS layer is coated with glue at the position facing the matched IC card module chip, laminating and compounding the ABS protective layer and the IC card module chip, and laminating according to the sequence of laminating and bonding; after the stacking is finished, carrying out primary lamination, heating to a high temperature, and obtaining an IC card module with an IC card chip after the lamination is cooled; in step S5, heating to a high temperature of 130 ℃ for 250 to 280 seconds;
s6: mounting salient points of the IC card module are attached to bonding pads of the electronic carrier board in a surface welding technology mode;
s7: connecting the mounting salient points with the bonding pads to form bonding points to form a finished module, and finishing the whole preparation process.
In the invention, the heat dissipation solder ball is used in the IC card module to assist heat dissipation, and the solder ball for heat dissipation is a solder ball which is directly arranged under a substrate under the chip, and can directly transfer heat to the PCB carrier plate by virtue of the solder ball, thereby reducing the thermal resistance caused by air. In order to ensure that the heat dissipation to the ball is quicker, the heat dissipation channel can penetrate through the substrate, so that the heat dissipation capacity of the subsequent IC card module is improved in the using process, meanwhile, as the graphene fiber powder additive is added in the production process of the PCB carrier plate, and the graphene fiber powder additive and the silver metal fiber are mixed in the production process of the ABS carrier plate, the heat conduction and heat dissipation capacity of the chip is improved, and the anti-interference capacity of the chip module is also improved.
Example three:
a method of packaging an IC card module, the method comprising the steps of:
s1: taking a PCB carrier plate and an IC card module chip to be packaged, selecting a sheet formula firstly, wherein the material blending mode is as follows: the method comprises the steps that a PCB carrier plate, an ABS carrier plate, an IC card module chip, the ABS carrier plate and the PCB carrier plate are well matched, graphene fiber powder additives are mixed in the manufacturing process of the PCB carrier plate, and the proportion of the additives is adjusted, so that the proportion of PCB particles to graphene fiber powder is 15:1, and the obtained PCB carrier plate has heat dissipation performance; in the step S1, graphene fiber powder additive and silver metal fiber are mixed in the manufacturing process of the ABS carrier plate, and the proportion of the additive is adjusted, so that the proportion of ABS particles, graphene fiber powder and silver metal fiber is 20:1:18, and the obtained PCB carrier plate has heat dissipation performance;
s2: the space between the IC card module chip and the ABS carrier plate is reduced. Reducing the distance between the IC card module chip and the board, and reducing the thermal resistance of the air gap, in step S2, reducing the height between the IC card module chip and the ABS carrier board from 140 to 60 μm, wherein for 10 x 10 PQFP, RJA reduces 5.1-5.9 ℃/W, and for 28 x 28mm PQFP, when the distance is reduced from 230 to 110 μm, the thermal resistance can reduce 3.1-3.9 ℃/W; in step S2, the distance between the IC card module chip and the board is 30 μm;
s3: mounting the heat-dissipating solder balls; the heat radiation solder ball is directly arranged on the solder ball under the substrate under the chip, and the solder ball is used for directly transferring heat to the PCB so as to reduce the thermal resistance caused by air;
s4: after the heat dissipation solder balls are installed, namely two ABS materials are arranged on two sides of the matched antenna chip, and the laminated middle material is laminated with two outermost PCB fabrics;
s5: after the ABS layer is coated with glue at the position facing the matched IC card module chip, laminating and compounding the ABS protective layer and the IC card module chip, and laminating according to the sequence of laminating and bonding; after the stacking is finished, carrying out primary lamination, heating to a high temperature, and obtaining an IC card module with an IC card chip after the lamination is cooled; in step S5, heating to a high temperature of 130 ℃ for 250 to 280 seconds;
s6: mounting salient points of the IC card module are attached to bonding pads of the electronic carrier board in a surface welding technology mode;
s7: connecting the mounting salient points with the bonding pads to form bonding points to form a finished module, and finishing the whole preparation process.
In the invention, the heat dissipation solder ball is used for assisting heat dissipation in the IC card module, and the solder ball for heat dissipation is directly arranged under the substrate under the chip, so that the solder ball can be used for directly transferring heat to the PCB carrier plate, thereby reducing the thermal resistance caused by air. In order to enable the heat dissipation to the ball to be quicker, the heat dissipation channel can penetrate through the substrate, so that the heat dissipation capacity of a subsequent IC card module is improved in the using process, meanwhile, the graphene fiber powder additive is added in the production process of the PCB carrier plate, and the graphene fiber powder additive and the silver metal fiber are mixed in the production process of the ABS carrier plate, so that the heat conduction and heat dissipation capacity of the chip is improved, and the anti-interference capacity of the chip module is also improved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above examples are only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (6)
1. A packaging method of an IC card module is characterized in that: the packaging method of the IC card module comprises the following steps:
s1: taking a PCB carrier plate and an IC card module chip to be packaged, selecting a sheet formula firstly, wherein the material blending mode is as follows: a PCB carrier plate, an ABS carrier plate, an IC card module chip, the ABS carrier plate and the PCB carrier plate are matched,
s2: the distance between the IC card module chip and the ABS carrier plate is reduced; the distance between the IC card module chip and the board is reduced, the thermal resistance of the air gap is reduced,
s3: mounting the heat-dissipating solder balls;
s4: after the heat dissipation solder balls are installed, namely two ABS materials are arranged on two sides of the matched antenna chip, and the laminated middle material is laminated with two outermost PCB fabrics;
s5: after the ABS layer is coated with glue at the position facing the matched IC card module chip, laminating and compounding the ABS protective layer and the IC card module chip, and laminating according to the sequence of laminating and bonding; after the stacking is finished, carrying out primary lamination, heating to high temperature, and obtaining an IC card module with an IC card chip after the IC card module is cooled;
s6: mounting salient points of the IC card module are attached to bonding pads of the electronic carrier board in a surface welding technology mode;
s7: connecting the mounting salient points with the bonding pads to form bonding points to form a finished module, and finishing the whole preparation process.
2. The method for packaging an IC card module according to claim 1, wherein: in the step S2, the IC card module chip-to-board distance is 30 μm.
3. The method for packaging an IC card module according to claim 1, wherein: in the step S3, the heat dissipating solder ball is directly mounted on the solder ball under the substrate under the chip, and the solder ball directly transfers heat to the PCB to reduce the thermal resistance caused by air.
4. The method for packaging an IC card module according to claim 1, wherein: in the step S1, graphene fiber powder additive is mixed in the manufacturing process of the PCB carrier, and the ratio of the additive is adjusted so that the ratio of the PCB particles to the graphene fiber powder is 15: 1.
5. A method of packaging an IC card module according to claim 1, characterized in that: in the step S1, graphene fiber powder additives and silver metal fibers are mixed in the manufacturing process of the ABS carrier plate, and the proportion of the additives is adjusted, so that the proportion of ABS particles, graphene fiber powder and silver metal fibers is 20:1: 15-18.
6. The method for packaging an IC card module according to claim 1, wherein: in the step S5, the heating temperature is 130 ℃, and the heating time is 250 to 280 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210773178.4A CN115130637A (en) | 2022-07-01 | 2022-07-01 | Packaging method of IC card module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210773178.4A CN115130637A (en) | 2022-07-01 | 2022-07-01 | Packaging method of IC card module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115130637A true CN115130637A (en) | 2022-09-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210773178.4A Pending CN115130637A (en) | 2022-07-01 | 2022-07-01 | Packaging method of IC card module |
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| CN (1) | CN115130637A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115546172A (en) * | 2022-10-19 | 2022-12-30 | 广州纳动半导体设备有限公司 | Machine vision-based chip carrier plate-substrate near-zero gap measuring method |
-
2022
- 2022-07-01 CN CN202210773178.4A patent/CN115130637A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115546172A (en) * | 2022-10-19 | 2022-12-30 | 广州纳动半导体设备有限公司 | Machine vision-based chip carrier plate-substrate near-zero gap measuring method |
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