CN108980750A - A kind of LED desk lamp - Google Patents
A kind of LED desk lamp Download PDFInfo
- Publication number
- CN108980750A CN108980750A CN201810617060.6A CN201810617060A CN108980750A CN 108980750 A CN108980750 A CN 108980750A CN 201810617060 A CN201810617060 A CN 201810617060A CN 108980750 A CN108980750 A CN 108980750A
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- China
- Prior art keywords
- metal plate
- plate
- arc groove
- resin
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 118
- 239000002184 metal Substances 0.000 claims abstract description 118
- 239000011347 resin Substances 0.000 claims abstract description 53
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 238000005538 encapsulation Methods 0.000 claims abstract description 17
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 15
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 238000003491 array Methods 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 241000446313 Lamella Species 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 240000007594 Oryza sativa Species 0.000 claims description 2
- 235000007164 Oryza sativa Nutrition 0.000 claims description 2
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 claims description 2
- 235000009566 rice Nutrition 0.000 claims description 2
- 238000013016 damping Methods 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000005457 optimization Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
- F21S9/02—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
- F21S9/03—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator rechargeable by exposure to light
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H01L31/048—
-
- H01L33/641—
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B10/00—Integration of renewable energy sources in buildings
- Y02B10/10—Photovoltaic [PV]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides a kind of LED desk lamps, the LED desk lamp includes pedestal, bracket and illuminatian plate, the illuminatian plate includes the solar cell module stacked gradually, heat radiating type connecting plate and LED encapsulation module, and the heat radiating type connecting plate includes the first stacked resin-bonded layer, the first metal plate, the first wire, the second metal plate, the first rubber strip, the first PET resin plate, the first rubber slab, the second PET resin plate, the second rubber strip, third metal plate, the second wire, the 4th metal plate, the second resin-bonded layer.Solar cell module, heat radiating type connecting plate and LED encapsulation module three are bonded together in the illuminatian plate of LED desk lamp of the invention, so that illuminatian plate has excellent stability, and pass through the specific structure of optimization heat radiating type connecting plate and the design parameter of each layer, so that illuminatian plate has excellent heating conduction and damping performance, to ensure that the LED desk lamp can be used for a long time.
Description
Technical field
The present invention relates to field of illumination lamp technology, and in particular to a kind of LED desk lamp.
Background technique
LED desk lamp is one of most common illuminations in the life office of house.And existing desk lamp is mainly by lamp holder, lamp
Several part compositions such as frame, illuminatian plate, generally use alternating current and are powered, or by adding solar panel as desk lamp
It is powered.In the LED desk lamp of existing solar panel power supply, the sun directly usually is set on the illuminatian plate of desk lamp
Energy solar panel, illuminatian plate are fitted closely with solar panel, cause the heat generated in LED light lighting process to be unfavorable for used
Illuminatian plate distributes, and then influences the service life of LED desk lamp, and how to design a kind of LED desk lamp that heat dissipation performance is excellent is
Industry assistant officer problem to be solved.
Summary of the invention
The purpose of the present invention is overcoming above-mentioned the deficiencies in the prior art, a kind of LED desk lamp is provided.
To achieve the above object, a kind of LED desk lamp proposed by the present invention, the LED desk lamp include pedestal, bracket and photograph
Isotropic disk, the illuminatian plate include the solar cell module stacked gradually, heat radiating type connecting plate and LED package mould
Block；
The solar cell module includes the transparent glass layer stacked gradually, the first encapsulation glue-line, solar battery lamella, the
Two encapsulation glue-lines, backboard；
The LED encapsulation module includes circuit substrate, is set to multiple LED cores of the lower surface of the circuit substrate
Piece, the fully wrapped around LED chip of resin-encapsulated glue-line, and the resin-encapsulated glue-line wraps up the lower surface of the circuit substrate
And side surface, the upper surface of the circuit substrate are exposed to the resin-encapsulated glue-line；
The heat radiating type connecting plate includes:
First metal plate, the lower surface of first metal plate are provided with multiple first pits arranged in arrays, and described first
The upper surface of metal plate is provided with multiple first arc grooves arranged in parallel；
First resin-bonded layer, the first resin-bonded layer are set to the lower surface of first metal plate, first tree
Rouge adhesive layer fills up first pit；
First wire, a part of first wire are embedded into first arc groove；
Second metal plate, the lower surface of second metal plate are provided with multiple second arc grooves arranged in parallel, and described first
Arc groove and second arc groove correspond, and the upper surface of second metal plate is provided with multiple thirds arranged in parallel
Arc groove, second arc groove and the third arc groove correspond, and another part of first wire is embedded into
In second arc groove, have the of exposure first metal plate and second metal plate between adjacent first wires
One gap；
First rubber strip, a part of first rubber strip are embedded into the third arc groove；
First PET resin plate, the lower surface of the first PET resin plate are provided with multiple 4th arc grooves arranged in parallel, institute
It states third arc groove and the 4th arc groove corresponds, another part of first rubber strip is embedded into the 4th arc
In shape slot, there is the second gap of exposure second metal plate and the first PET resin plate between adjacent first rubber strip；
First rubber slab, first rubber slab are bonded in the upper surface of the first PET resin plate；
Second PET resin plate, the second PET resin plate are bonded in the upper surface of first rubber slab, the 2nd PET tree
The upper surface of rouge plate is provided with multiple 5th arc grooves arranged in parallel；
Second rubber strip, a part of second rubber strip are embedded into the 5th arc groove；
Third metal plate, the lower surface of the third metal plate are provided with multiple 6th arc grooves arranged in parallel, and the described 5th
Arc groove and the 6th arc groove correspond, and the upper surface of the third metal plate is provided with multiple arranged in parallel seven
Arc groove, the 6th arc groove and the 7th arc groove correspond, and another part of second rubber strip is embedded into
In 6th arc groove, there is exposure the second PET resin plate and the third metal plate between adjacent second rubber strip
Third space；
Second wire, a part of second wire are embedded into the 7th arc groove；
4th metal plate, the lower surface of the 4th metal plate are provided with multiple 8th arc grooves arranged in parallel, and the described 4th
The upper surface of metal plate is provided with multiple second dimples arranged in arrays, the 7th arc groove and the 8th arc groove one
One is corresponding, and another part of second wire is embedded into the 8th arc groove, has between adjacent second wire
4th gap of exposure the third metal plate and the 4th metal plate；
Second resin-bonded layer, the second resin-bonded layer are set to the upper surface of the 4th metal plate, second tree
Rouge adhesive layer fills up the second dimple；
Wherein, the first resin-bonded layer bonds the circuit substrate of the LED encapsulation module, second resin
Adhesive layer bonds the backboard of the solar cell module.
Preferably, the material of first, second, third, fourth metal plate is copper or aluminium, described first, second, the
Three, the 4th metal plate with a thickness of 0.5-1.5 millimeters.
Preferably, the material of first wire and second wire is copper or aluminium, first wire
Diameter with second wire is 0.5-1 millimeters, and the spacing of adjacent first wires is 0.5-1 millimeters, adjacent second gold medal
The spacing for belonging to silk is 0.5-1 millimeters.
Preferably, the diameter of first rubber strip and second rubber strip is 0.5-1 millimeters, adjacent first rubber
The spacing of item is 0.5-1 millimeters, and the spacing of adjacent second rubber strip is 0.5-1 millimeters.
Preferably, the material of the first resin-bonded layer and the second resin-bonded layer is epoxy resin, propylene
One of acid resin and silica gel.
Preferably, the thickness of the first PET resin plate, first rubber slab and the second PET resin plate
It is 1-2 millimeters.
Compared with the prior art, the invention has the following advantages:
In LED desk lamp of the invention, by being bonded with heat dissipation between solar cell module and LED encapsulation module
Type connecting plate, to form the illuminatian plate of the LED desk lamp, wherein the presence of heat radiating type connecting plate can be rapidly by solar battery group
The heat derives that part and LED encapsulation module generate during the work time, the heat radiating type connecting plate is close to solar-electricity
The side of pond component or LED encapsulation module is provided with stacked metal plate, and is set between stacked metal plate
Wire directly passes through gap convenient for heat and is transmitted in air with the gap of exposing metal plate between adjacent wire, on
The presence for stating structure can be further improved the heat dissipation performance of heat radiating type connecting plate.Rubber is provided on the side of metal plate simultaneously
Adhesive tape and PET resin plate have the gap of exposure PET resin plate and metal plate, the presence of above structure between adjacent rubber strips
On the one hand it substantially ensures that heat is exported from heat radiating type connecting plate, on the other hand makes heat radiating type connecting plate that there is damping performance,
And it is additionally provided with a rubber slab between adjacent PET resin plate, the damping performance of heat radiating type connecting plate is further increased, so that this
Even if the LED desk lamp of invention collides in use, the presence of rubber strip and rubber slab can play good buffering
Effect, avoids LED desk lamp from being damaged, improves its service life.
Solar cell module, heat radiating type connecting plate and light emitting diode envelope in the illuminatian plate of LED desk lamp of the invention
Die-filling piece of three is bonded together, so that illuminatian plate has excellent stability, and passes through the specific of optimization heat radiating type connecting plate
The design parameter of structure and each layer, so that illuminatian plate has excellent heating conduction and damping performance, to ensure the LED desk lamp
It can be used for a long time.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of illuminatian plate of the invention；
Fig. 2 is the top view of the first metal plate of the invention；
Fig. 3 is the bottom view of the first metal plate of the invention.
Specific embodiment
As shown in Figure 1-3, a kind of LED desk lamp that the specific embodiment of the invention proposes, the LED desk lamp includes pedestal, branch
Frame and illuminatian plate, the illuminatian plate include the solar cell module 1 stacked gradually, heat radiating type connecting plate 2 and luminous two
Pole pipe package module 3, the solar cell module 1 include that the transparent glass layer 11, first that stacks gradually encapsulates glue-line 12, too
Positive energy battery lamella 13, second encapsulates glue-line 14, backboard 15；The LED encapsulation module 3 includes circuit substrate 31, if
It is placed in multiple LED chips 32 of the lower surface of the circuit substrate 31, the fully wrapped around LED chip of resin-encapsulated glue-line 33
32, and the resin-encapsulated glue-line 33 wraps up the lower surface and side surface of the circuit substrate 31, the circuit substrate 31 it is upper
Surface is exposed to the resin-encapsulated glue-line 33.
The heat radiating type connecting plate 2 includes: the first metal plate 21, and the lower surface of first metal plate 21 is provided with multiple
First pit 211 arranged in arrays, the upper surface of first metal plate 21 are provided with multiple first arcs arranged in parallel
Slot 212；First resin-bonded layer 22, the first resin-bonded layer 22 are set to the lower surface of first metal plate 21, institute
It states the first resin-bonded layer 22 and fills up first pit 211；First wire 41, first wire 41 it is a part of embedding
Enter into first arc groove 212；The lower surface of second metal plate 23, second metal plate 23 is provided with multiple parallels
Second arc groove 231 of column, first arc groove 212 are corresponded with second arc groove 231, second metal plate
23 upper surface is provided with multiple third arc grooves 232 arranged in parallel, second arc groove 231 and the third arc groove
232 correspond, and another part of first wire 41 is embedded into second arc groove 231, adjacent first metal
There is the first gap 51 of exposure first metal plate 21 and second metal plate 23 between silk 41；First rubber strip 42,
A part of first rubber strip 42 is embedded into the third arc groove 232；First PET resin plate 24, the first PET
The lower surface of resin plate 24 is provided with multiple 4th arc grooves 241 arranged in parallel, the third arc groove 232 and the described 4th
Arc groove 241 corresponds, and another part of first rubber strip 42 is embedded into the 4th arc groove 241, and adjacent the
There is the second gap 52 of exposure second metal plate 23 and the first PET resin plate 24 between one rubber strip 42.
The heat radiating type connecting plate 2 further includes the first rubber slab 25, and first rubber slab 25 is bonded in the first PET
The upper surface of resin plate 24；Second PET resin plate 26, the second PET resin plate 26 are bonded in first rubber slab 25
Upper surface, the upper surface of the second PET resin plate 26 are provided with multiple 5th arc grooves 261 arranged in parallel；Second rubber
Item 43, a part of second rubber strip 43 are embedded into the 5th arc groove 261；Third metal plate 27, the third
The lower surface of metal plate 27 is provided with multiple 6th arc grooves 271 arranged in parallel, the 5th arc groove 261 and the described 6th
Arc groove 271 corresponds, and the upper surface of the third metal plate 27 is provided with multiple 7th arc grooves 272 arranged in parallel,
6th arc groove 271 is corresponded with the 7th arc groove 272, and another part of second rubber strip 43 is embedded into
In 6th arc groove 271, there is exposure the second PET resin plate 26 and the third between adjacent second rubber strip 43
The third space 53 of metal plate 27；Second wire 44, a part of second wire 44 are embedded into the 7th arc
In slot 272；4th metal plate 28, the lower surface of the 4th metal plate 28 are provided with multiple 8th arc grooves arranged in parallel
281, the upper surface of the 4th metal plate 28 is provided with multiple second dimples 282 arranged in arrays, the 7th arc groove
272 correspond with the 8th arc groove 281, and another part of second wire 44 is embedded into the 8th arc groove
In 281, between adjacent second wire 44 have exposure the third metal plate 27 and the 4th metal plate 28 the 4th between
Gap；Second resin-bonded layer 29, the second resin-bonded layer 29 are set to the upper surface of the 4th metal plate 28, and described
Two resin-bonded layers 29 fill up the second dimple 282, wherein the first resin-bonded layer 22 bonds the LED package
The circuit substrate 31 of module 3, the second resin-bonded layer 29 bond the backboard of the solar cell module 1
15。
In the heat radiating type connecting plate 2, first metal plate 21 is identical as the structure of the 4th metal plate 28, institute
It is identical as the structure of the third metal plate 27 to state the second metal plate 23, the first PET resin plate 24 and the 2nd PET tree
The structure of rouge plate 26 is identical, the structure of the first arc groove 212 of the upper surface of first metal plate 21 and second metal
The structure of the arc groove on the surface of substrate is identical, the structure of the first arc groove 212 of the upper surface of first metal plate 21 with
The structure of the arc groove on the surface of the 24 or described second PET resin plate 26 of the first PET resin plate is identical.
Wherein, the material of first, second, third, fourth metal plate (21,23,27,28) is copper or aluminium, described the
One, second, third, the 4th metal plate (21,23,27,28) with a thickness of 0.5-1.5 millimeters.First wire 41 and institute
The material of the second wire 44 is stated as copper or aluminium, the diameter of first wire 41 and second wire 44 is 0.5-1
Millimeter, the spacing of adjacent first wires 41 are 0.5-1 millimeters, and the spacing of adjacent second wire 44 is 0.5-1 millimeters.It is described
The diameter of first rubber strip 42 and second rubber strip 43 is 0.5-1 millimeters, and the spacing of adjacent first rubber strip 42 is 0.5-1
Millimeter, the spacing of adjacent second rubber strip 43 are 0.5-1 millimeters.The first resin-bonded layer 22 and described second resin-bonded
The material of layer 29 is one of epoxy resin, acrylic resin and silica gel.The first PET resin plate 24, first rubber
Offset plate 25 and the second PET resin plate 26 with a thickness of 1-2 millimeters.
Embodiment 1:
As shown in Figure 1-3, a kind of LED desk lamp, the LED desk lamp includes pedestal, bracket and illuminatian plate, and the illuminatian plate includes
Solar cell module 1, heat radiating type connecting plate 2 and the LED encapsulation module 3 stacked gradually, the solar battery
Component 1 includes that the transparent glass layer 11, first stacked gradually encapsulates glue-line 12, solar battery lamella 13, second encapsulates glue-line
14, backboard 15；The LED encapsulation module 3 includes circuit substrate 31, is set to the lower surface of the circuit substrate 31
Multiple LED chips 32, the fully wrapped around LED chip 32 of resin-encapsulated glue-line 33, and the resin-encapsulated glue-line 33 wrap up
The lower surface and side surface of the circuit substrate 31, the upper surface of the circuit substrate 31 are exposed to the resin-encapsulated glue-line
33。
The heat radiating type connecting plate 2 includes: the first metal plate 21, and the lower surface of first metal plate 21 is provided with multiple
First pit 211 arranged in arrays, the upper surface of first metal plate 21 are provided with multiple first arcs arranged in parallel
Slot 212；First resin-bonded layer 22, the first resin-bonded layer 22 are set to the lower surface of first metal plate 21, institute
It states the first resin-bonded layer 22 and fills up first pit 211；First wire 41, first wire 41 it is a part of embedding
Enter into first arc groove 212；The lower surface of second metal plate 23, second metal plate 23 is provided with multiple parallels
Second arc groove 231 of column, first arc groove 212 are corresponded with second arc groove 231, second metal plate
23 upper surface is provided with multiple third arc grooves 232 arranged in parallel, second arc groove 231 and the third arc groove
232 correspond, and another part of first wire 41 is embedded into second arc groove 231, adjacent first metal
There is the first gap 51 of exposure first metal plate 21 and second metal plate 23 between silk 41；First rubber strip 42,
A part of first rubber strip 42 is embedded into the third arc groove 232；First PET resin plate 24, the first PET
The lower surface of resin plate 24 is provided with multiple 4th arc grooves 241 arranged in parallel, the third arc groove 232 and the described 4th
Arc groove 241 corresponds, and another part of first rubber strip 42 is embedded into the 4th arc groove 241, and adjacent the
There is the second gap 52 of exposure second metal plate 23 and the first PET resin plate 24 between one rubber strip 42.
The heat radiating type connecting plate 2 further includes the first rubber slab 25, and first rubber slab 25 is bonded in the first PET
The upper surface of resin plate 24；Second PET resin plate 26, the second PET resin plate 26 are bonded in first rubber slab 25
Upper surface, the upper surface of the second PET resin plate 26 are provided with multiple 5th arc grooves 261 arranged in parallel；Second rubber
Item 43, a part of second rubber strip 43 are embedded into the 5th arc groove 261；Third metal plate 27, the third
The lower surface of metal plate 27 is provided with multiple 6th arc grooves 271 arranged in parallel, the 5th arc groove 261 and the described 6th
Arc groove 271 corresponds, and the upper surface of the third metal plate 27 is provided with multiple 7th arc grooves 272 arranged in parallel,
6th arc groove 271 is corresponded with the 7th arc groove 272, and another part of second rubber strip 43 is embedded into
In 6th arc groove 271, there is exposure the second PET resin plate 26 and the third between adjacent second rubber strip 43
The third space 53 of metal plate 27；Second wire 44, a part of second wire 44 are embedded into the 7th arc
In slot 272；4th metal plate 28, the lower surface of the 4th metal plate 28 are provided with multiple 8th arc grooves arranged in parallel
281, the upper surface of the 4th metal plate 28 is provided with multiple second dimples 282 arranged in arrays, the 7th arc groove
272 correspond with the 8th arc groove 281, and another part of second wire 44 is embedded into the 8th arc groove
In 281, between adjacent second wire 44 have exposure the third metal plate 27 and the 4th metal plate 28 the 4th between
Gap；Second resin-bonded layer 29, the second resin-bonded layer 29 are set to the upper surface of the 4th metal plate 28, and described
Two resin-bonded layers 29 fill up the second dimple 282, wherein the first resin-bonded layer 22 bonds the LED package
The circuit substrate 31 of module 3, the second resin-bonded layer 29 bond the backboard of the solar cell module 1
15。
In the heat radiating type connecting plate 2, first metal plate 21 is identical as the structure of the 4th metal plate 28, institute
It is identical as the structure of the third metal plate 27 to state the second metal plate 23, the first PET resin plate 24 and the 2nd PET tree
The structure of rouge plate 26 is identical, the structure of the first arc groove 212 of the upper surface of first metal plate 21 and second metal
The structure of the arc groove on the surface of substrate is identical, the structure of the first arc groove 212 of the upper surface of first metal plate 21 with
The structure of the arc groove on the surface of the 24 or described second PET resin plate 26 of the first PET resin plate is identical.
Wherein, the material of first, second, third, fourth metal plate (21,23,27,28) is copper, described first, the
Two, third, the 4th metal plate (21,23,27,28) with a thickness of 1 millimeter.First wire 41 and second wire
44 material is copper, and the diameter of first wire 41 and second wire 44 is 0.8 millimeter, adjacent first wires
41 spacing is 0.8 millimeter, and the spacing of adjacent second wire 44 is 0.8 millimeter.First rubber strip 42 and described second
The diameter of rubber strip 43 is 0.8 millimeter, and the spacing of adjacent first rubber strip 42 is 0.8 millimeter, between adjacent second rubber strip 43
Away from being 0.8 millimeter.The material of the first resin-bonded layer 22 and the second resin-bonded layer 29 is epoxy resin.Described
One PET resin plate 24, first rubber slab 25 and the second PET resin plate 26 with a thickness of 1.5 millimeters.
Embodiment 2
The present embodiment provides another LED desk lamps, and identical as the structure of the LED desk lamp of embodiment 1, difference is only that, embodiment 2
In the material of first, second, third, fourth metal plate (21,23,27,28) of LED desk lamp be aluminium, described first, the
Two, third, the 4th metal plate (21,23,27,28) with a thickness of 1.5 millimeters.First wire 41 and second metal
The material of silk 44 is aluminium, and the diameter of first wire 41 and second wire 44 is 1 millimeter, adjacent first wires
41 spacing is 1 millimeter, and the spacing of adjacent second wire 44 is 1 millimeter.First rubber strip 42 and second rubber
The diameter of item 43 is 1 millimeter, and the spacing of adjacent first rubber strip 42 is 1 millimeter, and the spacing of adjacent second rubber strip 43 is 1 milli
Rice.The material of the first resin-bonded layer 22 and the second resin-bonded layer 29 is acrylic resin.The first PET tree
Rouge plate 24, first rubber slab 25 and the second PET resin plate 26 with a thickness of 2 millimeters.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (6)
1. a kind of LED desk lamp, the LED desk lamp includes pedestal, bracket and illuminatian plate, it is characterised in that: the illuminatian plate packet
Include the solar cell module stacked gradually, heat radiating type connecting plate and LED encapsulation module；
The solar cell module includes the transparent glass layer stacked gradually, the first encapsulation glue-line, solar battery lamella, the
Two encapsulation glue-lines, backboard；
The LED encapsulation module includes circuit substrate, is set to multiple LED cores of the lower surface of the circuit substrate
Piece, the fully wrapped around LED chip of resin-encapsulated glue-line, and the resin-encapsulated glue-line wraps up the lower surface of the circuit substrate
And side surface, the upper surface of the circuit substrate are exposed to the resin-encapsulated glue-line；
The heat radiating type connecting plate includes:
First metal plate, the lower surface of first metal plate are provided with multiple first pits arranged in arrays, and described first
The upper surface of metal plate is provided with multiple first arc grooves arranged in parallel；
First resin-bonded layer, the first resin-bonded layer are set to the lower surface of first metal plate, first tree
Rouge adhesive layer fills up first pit；
First wire, a part of first wire are embedded into first arc groove；
Second metal plate, the lower surface of second metal plate are provided with multiple second arc grooves arranged in parallel, and described first
Arc groove and second arc groove correspond, and the upper surface of second metal plate is provided with multiple thirds arranged in parallel
Arc groove, second arc groove and the third arc groove correspond, and another part of first wire is embedded into
In second arc groove, have the of exposure first metal plate and second metal plate between adjacent first wires
One gap；
First rubber strip, a part of first rubber strip are embedded into the third arc groove；
First PET resin plate, the lower surface of the first PET resin plate are provided with multiple 4th arc grooves arranged in parallel, institute
It states third arc groove and the 4th arc groove corresponds, another part of first rubber strip is embedded into the 4th arc
In shape slot, there is the second gap of exposure second metal plate and the first PET resin plate between adjacent first rubber strip；
First rubber slab, first rubber slab are bonded in the upper surface of the first PET resin plate；
Second PET resin plate, the second PET resin plate are bonded in the upper surface of first rubber slab, the 2nd PET tree
The upper surface of rouge plate is provided with multiple 5th arc grooves arranged in parallel；
Second rubber strip, a part of second rubber strip are embedded into the 5th arc groove；
Third metal plate, the lower surface of the third metal plate are provided with multiple 6th arc grooves arranged in parallel, and the described 5th
Arc groove and the 6th arc groove correspond, and the upper surface of the third metal plate is provided with multiple arranged in parallel seven
Arc groove, the 6th arc groove and the 7th arc groove correspond, and another part of second rubber strip is embedded into
In 6th arc groove, there is exposure the second PET resin plate and the third metal plate between adjacent second rubber strip
Third space；
Second wire, a part of second wire are embedded into the 7th arc groove；
4th metal plate, the lower surface of the 4th metal plate are provided with multiple 8th arc grooves arranged in parallel, and the described 4th
The upper surface of metal plate is provided with multiple second dimples arranged in arrays, the 7th arc groove and the 8th arc groove one
One is corresponding, and another part of second wire is embedded into the 8th arc groove, has between adjacent second wire
4th gap of exposure the third metal plate and the 4th metal plate；
Second resin-bonded layer, the second resin-bonded layer are set to the upper surface of the 4th metal plate, second tree
Rouge adhesive layer fills up the second dimple；
Wherein, the first resin-bonded layer bonds the circuit substrate of the LED encapsulation module, second resin
Adhesive layer bonds the backboard of the solar cell module.
2. LED desk lamp according to claim 1, it is characterised in that: the material of first, second, third, fourth metal plate
Matter be copper or aluminium, first, second, third, fourth metal plate with a thickness of 0.5-1.5 millimeters.
3. LED desk lamp according to claim 1, it is characterised in that: first wire and second wire
Material is copper or aluminium, and the diameter of first wire and second wire is 0.5-1 millimeters, adjacent first wires
Spacing is 0.5-1 millimeters, and the spacing of adjacent second wire is 0.5-1 millimeters.
4. LED desk lamp according to claim 1, it is characterised in that: first rubber strip and second rubber strip
Diameter is 0.5-1 millimeters, and the spacing of adjacent first rubber strip is 0.5-1 millimeters, and the spacing of adjacent second rubber strip is 0.5-1 milli
Rice.
5. desk lamp according to claim 1, it is characterised in that: the first resin-bonded layer and described second resin-bonded
The material of layer is one of epoxy resin, acrylic resin and silica gel.
6. LED desk lamp according to claim 6, it is characterised in that: the first PET resin plate, first rubber slab
And the second PET resin plate with a thickness of 1-2 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810617060.6A CN108980750A (en) | 2018-06-15 | 2018-06-15 | A kind of LED desk lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810617060.6A CN108980750A (en) | 2018-06-15 | 2018-06-15 | A kind of LED desk lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108980750A true CN108980750A (en) | 2018-12-11 |
Family
ID=64541262
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810617060.6A Pending CN108980750A (en) | 2018-06-15 | 2018-06-15 | A kind of LED desk lamp |
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|---|---|
| CN (1) | CN108980750A (en) |
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Application publication date: 20181211 |