CN108980750A - A kind of LED desk lamp - Google Patents
A kind of LED desk lamp Download PDFInfo
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- CN108980750A CN108980750A CN201810617060.6A CN201810617060A CN108980750A CN 108980750 A CN108980750 A CN 108980750A CN 201810617060 A CN201810617060 A CN 201810617060A CN 108980750 A CN108980750 A CN 108980750A
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 170
- 239000002184 metal Substances 0.000 claims abstract description 170
- 239000011347 resin Substances 0.000 claims abstract description 96
- 229920005989 resin Polymers 0.000 claims abstract description 96
- 238000005538 encapsulation Methods 0.000 claims abstract description 20
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 3
- 239000004411 aluminium Substances 0.000 claims 2
- 238000003491 array Methods 0.000 claims 2
- 241000446313 Lamella Species 0.000 claims 1
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 238000013016 damping Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000005457 optimization Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 14
- 238000004806 packaging method and process Methods 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 6
- 239000008393 encapsulating agent Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
- F21S9/02—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
- F21S9/03—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator rechargeable by exposure to light
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8581—Means for heat extraction or cooling characterised by their material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B10/00—Integration of renewable energy sources in buildings
- Y02B10/10—Photovoltaic [PV]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
Description
技术领域technical field
本发明涉及照明灯具技术领域，具体涉及一种LED台灯。The invention relates to the technical field of lighting fixtures, in particular to an LED desk lamp.
背景技术Background technique
LED台灯是居家生活办公中最常用的照明工具之一。而现有的台灯主要由灯座、灯架、照明板等几个部分组成，通常采用交流电进行供电，或者通过加设太阳能电池板为台灯进行供电。现有的太阳能电池板供电的LED台灯中，通常是直接在台灯的照明板上设置太阳能电池板，照明板与太阳能电池板紧密贴合，导致LED灯照明过程中产生的热量不利于用过照明板散发出去，进而影响LED台灯的使用寿命，如何设计一种散热性能优异的LED台灯是业界丞待解决的问题。LED desk lamp is one of the most commonly used lighting tools in home life and office. And existing desk lamp mainly is made up of several parts such as lamp holder, lamp stand, lighting board, adopts alternating current to supply power usually, or provides power supply for desk lamp by adding solar panels. In the existing LED desk lamps powered by solar panels, the solar panel is usually directly installed on the lighting panel of the desk lamp, and the lighting panel is closely attached to the solar panel, which causes the heat generated during the lighting process of the LED lamp to be unfavorable for lighting. Board emits, and then affects the service life of LED desk lamp, how to design a kind of LED desk lamp with excellent heat dissipation performance is the problem to be solved in the industry.
发明内容Contents of the invention
本发明的目的是克服上述现有技术的不足，提供一种LED台灯。The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art and provide an LED desk lamp.
为实现上述目的，本发明提出的一种LED台灯，所述LED台灯包括基座、支架以及照明板，所述照明板包括依次层叠的太阳能电池组件、散热型连接板以及发光二极管封装模块；In order to achieve the above object, the present invention proposes an LED desk lamp, the LED desk lamp includes a base, a bracket, and a lighting board, and the lighting board includes sequentially stacked solar cell assemblies, a heat dissipation connection plate, and a light emitting diode packaging module;
所述太阳能电池组件包括依次层叠的透明玻璃层、第一封装胶层、太阳能电池片层、第二封装胶层、背板；The solar cell module includes a transparent glass layer, a first encapsulant layer, a solar cell sheet layer, a second encapsulant layer, and a back sheet sequentially stacked;
所述发光二极管封装模块包括电路基板，设置于所述电路基板的下表面的多个LED芯片，树脂封装胶层完全包裹所述LED芯片，且所述树脂封装胶层包裹所述电路基板的下表面和侧表面，所述电路基板的上表面暴露于所述树脂封装胶层；The light emitting diode packaging module includes a circuit substrate, a plurality of LED chips arranged on the lower surface of the circuit substrate, the resin encapsulation adhesive layer completely wraps the LED chips, and the resin encapsulation adhesive layer wraps the lower surface of the circuit substrate. surface and side surfaces, the upper surface of the circuit substrate is exposed to the resin encapsulation layer;
所述散热型连接板包括：The heat dissipation connecting plate includes:
第一金属板，所述第一金属板的下表面设置有多个呈矩阵排列的第一凹坑，所述第一金属板的上表面设置有多个平行排列的第一弧形槽；A first metal plate, the lower surface of the first metal plate is provided with a plurality of first pits arranged in a matrix, and the upper surface of the first metal plate is provided with a plurality of first arc-shaped grooves arranged in parallel;
第一树脂粘结层，所述第一树脂粘结层设置于所述第一金属板的下表面，所述第一树脂粘结层填满所述第一凹坑；a first resin bonding layer, the first resin bonding layer is disposed on the lower surface of the first metal plate, and the first resin bonding layer fills the first recess;
第一金属丝，所述第一金属丝的一部分嵌入到所述第一弧形槽中；a first metal wire, a part of the first metal wire is embedded in the first arc-shaped groove;
第二金属板，所述第二金属板的下表面设置有多个平行排列的第二弧形槽，所述第一弧形槽与所述第二弧形槽一一对应，所述第二金属板的上表面设置有多个平行排列的第三弧形槽，所述第二弧形槽与所述第三弧形槽一一对应，所述第一金属丝的另一部分嵌入到所述第二弧形槽中，相邻第一金属丝之间具有暴露所述第一金属板和所述第二金属板的第一间隙；The second metal plate, the lower surface of the second metal plate is provided with a plurality of second arc-shaped grooves arranged in parallel, the first arc-shaped grooves correspond to the second arc-shaped grooves one by one, and the second arc-shaped grooves correspond to each other. The upper surface of the metal plate is provided with a plurality of third arc-shaped grooves arranged in parallel, the second arc-shaped grooves correspond to the third arc-shaped grooves one by one, and the other part of the first metal wire is embedded in the In the second arc-shaped groove, there is a first gap exposing the first metal plate and the second metal plate between adjacent first metal wires;
第一橡胶条，所述第一橡胶条的一部分嵌入到所述第三弧形槽中；a first rubber strip, a part of the first rubber strip is embedded in the third arc-shaped groove;
第一PET树脂板，所述第一PET树脂板的下表面设置有多个平行排列的第四弧形槽，所述第三弧形槽与所述第四弧形槽一一对应，所述第一橡胶条的另一部分嵌入到所述第四弧形槽中，相邻第一橡胶条之间具有暴露所述第二金属板和所述第一PET树脂板的第二间隙；The first PET resin plate, the lower surface of the first PET resin plate is provided with a plurality of fourth arc-shaped grooves arranged in parallel, the third arc-shaped grooves correspond to the fourth arc-shaped grooves one by one, the Another part of the first rubber strip is embedded in the fourth arc-shaped groove, and there is a second gap exposing the second metal plate and the first PET resin plate between adjacent first rubber strips;
第一橡胶板，所述第一橡胶板粘结于所述第一PET树脂板的上表面；a first rubber sheet, the first rubber sheet is bonded to the upper surface of the first PET resin sheet;
第二PET树脂板，所述第二PET树脂板粘结于所述第一橡胶板的上表面，所述第二PET树脂板的上表面设置有多个平行排列的第五弧形槽；A second PET resin plate, the second PET resin plate is bonded to the upper surface of the first rubber plate, and the upper surface of the second PET resin plate is provided with a plurality of fifth arc-shaped grooves arranged in parallel;
第二橡胶条，所述第二橡胶条的一部分嵌入到所述第五弧形槽中；a second rubber strip, a part of the second rubber strip is embedded in the fifth arc-shaped groove;
第三金属板，所述第三金属板的下表面设置有多个平行排列的第六弧形槽，所述第五弧形槽与所述第六弧形槽一一对应，所述第三金属板的上表面设置有多个平行排列的第七弧形槽，所述第六弧形槽与所述第七弧形槽一一对应，所述第二橡胶条的另一部分嵌入到所述第六弧形槽中，相邻第二橡胶条之间具有暴露所述第二PET树脂板和所述第三金属板的第三间隙；The third metal plate, the lower surface of the third metal plate is provided with a plurality of sixth arc-shaped grooves arranged in parallel, the fifth arc-shaped grooves correspond to the sixth arc-shaped grooves one by one, and the third The upper surface of the metal plate is provided with a plurality of seventh arc-shaped grooves arranged in parallel, the sixth arc-shaped grooves correspond to the seventh arc-shaped grooves, and another part of the second rubber strip is embedded in the In the sixth arc-shaped groove, there is a third gap exposing the second PET resin plate and the third metal plate between adjacent second rubber strips;
第二金属丝，所述第二金属丝的一部分嵌入到所述第七弧形槽中；a second metal wire, a part of the second metal wire is embedded in the seventh arc-shaped groove;
第四金属板，所述第四金属板的下表面设置有多个平行排列的第八弧形槽，所述第四金属板的上表面设置有多个呈矩阵排列的第二凹坑，所述第七弧形槽与所述第八弧形槽一一对应，所述第二金属丝的另一部分嵌入到所述第八弧形槽中，相邻第二金属丝之间具有暴露所述第三金属板和所述第四金属板的第四间隙；The fourth metal plate, the lower surface of the fourth metal plate is provided with a plurality of eighth arc-shaped grooves arranged in parallel, and the upper surface of the fourth metal plate is provided with a plurality of second pits arranged in a matrix, so The seventh arc-shaped groove corresponds to the eighth arc-shaped groove one by one, another part of the second metal wire is embedded in the eighth arc-shaped groove, and the adjacent second metal wire has exposed a fourth gap between the third metal plate and the fourth metal plate;
第二树脂粘结层，所述第二树脂粘结层设置于所述第四金属板的上表面，所述第二树脂粘结层填满所述第二凹坑；a second resin bonding layer, the second resin bonding layer is disposed on the upper surface of the fourth metal plate, and the second resin bonding layer fills the second recess;
其中，第一树脂粘结层粘结所述发光二极管封装模块的所述电路基板，所述第二树脂粘结层粘结所述太阳能电池组件的所述背板。Wherein, the first resin adhesive layer is bonded to the circuit substrate of the LED packaging module, and the second resin bond layer is bonded to the back sheet of the solar cell module.
作为优选，所述第一、第二、第三、第四金属板的材质为铜或铝，所述第一、第二、第三、第四金属板的厚度为0.5-1.5毫米。Preferably, the material of the first, second, third and fourth metal plates is copper or aluminum, and the thickness of the first, second, third and fourth metal plates is 0.5-1.5 mm.
作为优选，所述第一金属丝和所述第二金属丝的材质为铜或铝，所述第一金属丝和所述第二金属丝的直径为0.5-1毫米，相邻第一金属丝的间距为0.5-1毫米，相邻第二金属丝的间距为0.5-1毫米。Preferably, the material of the first metal wire and the second metal wire is copper or aluminum, the diameter of the first metal wire and the second metal wire is 0.5-1 mm, and the adjacent first metal wire The spacing between the adjacent second metal wires is 0.5-1 mm, and the spacing between adjacent second metal wires is 0.5-1 mm.
作为优选，所述第一橡胶条和所述第二橡胶条的直径为0.5-1毫米，相邻第一橡胶条的间距为0.5-1毫米，相邻第二橡胶条的间距为0.5-1毫米。Preferably, the diameter of the first rubber strip and the second rubber strip is 0.5-1 mm, the distance between adjacent first rubber strips is 0.5-1 mm, and the distance between adjacent second rubber strips is 0.5-1 mm. mm.
作为优选，所述第一树脂粘结层和所述第二树脂粘结层的材料为环氧树脂、丙烯酸树脂和硅胶中的一种。Preferably, the material of the first resin bonding layer and the second resin bonding layer is one of epoxy resin, acrylic resin and silica gel.
作为优选，所述第一PET树脂板、所述第一橡胶板以及所述第二PET树脂板的厚度为1-2毫米。Preferably, the thickness of the first PET resin sheet, the first rubber sheet and the second PET resin sheet is 1-2 mm.
本发明与现有技术相比具有下列优点：Compared with the prior art, the present invention has the following advantages:
本发明的LED台灯中，通过在太阳能电池组件与发光二极管封装模块之间粘结有散热型连接板，以形成该LED台灯的照明板，其中散热型连接板的存在可以迅速将太阳能电池组件和发光二极管封装模块在工作过程中产生的热量导出，该散热型连接板在靠近太阳能电池组件或发光二极管封装模块的一侧设置有叠置的金属板，且在叠置的金属板之间设置于金属丝，相邻金属丝之间具有暴露金属板的间隙，便于热量直接通过间隙传递到空气中，上述结构的存在可以进一步提高散热型连接板的散热性能。同时在金属板的一侧上设置有橡胶条和PET树脂板，相邻橡胶条之间具有暴露PET树脂板和金属板的间隙，上述结构的存在一方面充分确保热量从散热型连接板中导出，另一方面使得散热型连接板具有减震性能，且在相邻PET树脂板之间还设置有一橡胶板，进一步提高散热型连接板的减震性能，使得本发明的LED台灯在使用过程中即使发生碰撞，橡胶条和橡胶板的存在可以起到良好的缓冲作用，避免LED台灯发生损坏，提高其使用寿命。In the LED desk lamp of the present invention, a heat dissipation connecting plate is bonded between the solar cell assembly and the LED packaging module to form the lighting panel of the LED desk lamp, wherein the presence of the heat dissipation connecting plate can quickly connect the solar cell assembly and The heat generated by the light-emitting diode packaging module is exported during the working process. The heat-dissipating connection plate is provided with stacked metal plates on the side close to the solar cell module or the light-emitting diode package module, and is set between the stacked metal plates. The metal wires have gaps between adjacent metal wires that expose the metal plates, so that heat can be directly transferred to the air through the gaps. The existence of the above structure can further improve the heat dissipation performance of the heat dissipation connecting plate. At the same time, a rubber strip and a PET resin plate are arranged on one side of the metal plate, and there is a gap between the adjacent rubber strips exposing the PET resin plate and the metal plate. On the other hand, the heat-dissipating connecting plate has shock-absorbing performance, and a rubber plate is arranged between adjacent PET resin plates, which further improves the shock-absorbing performance of the heat-dissipating connecting plate, so that the LED desk lamp of the present invention can be used during use. Even if there is a collision, the existence of the rubber strip and the rubber plate can play a good buffering role, avoid damage to the LED desk lamp, and improve its service life.
本发明的LED台灯的照明板中太阳能电池组件、散热型连接板以及发光二极管封装模块三者粘结在一起，使得照明板具有优异的稳固性，且通过优化散热型连接板的具体结构以及各层的具体参数，使得照明板具有优异的导热性能和减震性能，以确保该LED台灯可以长期使用。In the lighting board of the LED desk lamp of the present invention, the solar cell assembly, the heat-dissipating connection plate and the LED packaging module are bonded together, so that the lighting board has excellent stability, and by optimizing the specific structure of the heat-dissipating connection board and each The specific parameters of the layer make the lighting board have excellent thermal conductivity and shock absorption performance, so as to ensure that the LED desk lamp can be used for a long time.
附图说明Description of drawings
图1为本发明的照明板的结构示意图；Fig. 1 is a schematic structural view of the lighting panel of the present invention;
图2为本发明的第一金属板的俯视图；Fig. 2 is the top view of the first metal plate of the present invention;
图3为本发明的第一金属板的仰视图。Fig. 3 is a bottom view of the first metal plate of the present invention.
具体实施方式Detailed ways
如图1-3所示，本发明具体实施例提出的一种LED台灯，所述LED台灯包括基座、支架以及照明板，所述照明板包括依次层叠的太阳能电池组件1、散热型连接板2以及发光二极管封装模块3，所述太阳能电池组件1包括依次层叠的透明玻璃层11、第一封装胶层12、太阳能电池片层13、第二封装胶层14、背板15；所述发光二极管封装模块3包括电路基板31，设置于所述电路基板31的下表面的多个LED芯片32，树脂封装胶层33完全包裹所述LED芯片32，且所述树脂封装胶层33包裹所述电路基板31的下表面和侧表面，所述电路基板31的上表面暴露于所述树脂封装胶层33。As shown in Figures 1-3, a specific embodiment of the present invention proposes an LED desk lamp. The LED desk lamp includes a base, a bracket, and a lighting board. 2 and a light-emitting diode encapsulation module 3, the solar cell assembly 1 includes a transparent glass layer 11, a first encapsulation adhesive layer 12, a solar cell sheet layer 13, a second encapsulation adhesive layer 14, and a back plate 15 stacked in sequence; the light emitting The diode packaging module 3 includes a circuit substrate 31, a plurality of LED chips 32 disposed on the lower surface of the circuit substrate 31, a resin encapsulation adhesive layer 33 completely wraps the LED chips 32, and the resin encapsulation adhesive layer 33 wraps the LED chips 32. The lower surface and the side surface of the circuit substrate 31 , and the upper surface of the circuit substrate 31 are exposed to the resin encapsulation layer 33 .
所述散热型连接板2包括：第一金属板21，所述第一金属板21的下表面设置有多个呈矩阵排列的第一凹坑211，所述第一金属板21的上表面设置有多个平行排列的第一弧形槽212；第一树脂粘结层22，所述第一树脂粘结层22设置于所述第一金属板21的下表面，所述第一树脂粘结层22填满所述第一凹坑211；第一金属丝41，所述第一金属丝41的一部分嵌入到所述第一弧形槽212中；第二金属板23，所述第二金属板23的下表面设置有多个平行排列的第二弧形槽231，所述第一弧形槽212与所述第二弧形槽231一一对应，所述第二金属板23的上表面设置有多个平行排列的第三弧形槽232，所述第二弧形槽231与所述第三弧形槽232一一对应，所述第一金属丝41的另一部分嵌入到所述第二弧形槽231中，相邻第一金属丝41之间具有暴露所述第一金属板21和所述第二金属板23的第一间隙51；第一橡胶条42，所述第一橡胶条42的一部分嵌入到所述第三弧形槽232中；第一PET树脂板24，所述第一PET树脂板24的下表面设置有多个平行排列的第四弧形槽241，所述第三弧形槽232与所述第四弧形槽241一一对应，所述第一橡胶条42的另一部分嵌入到所述第四弧形槽241中，相邻第一橡胶条42之间具有暴露所述第二金属板23和所述第一PET树脂板24的第二间隙52。The heat dissipation connecting plate 2 includes: a first metal plate 21, the lower surface of the first metal plate 21 is provided with a plurality of first pits 211 arranged in a matrix, and the upper surface of the first metal plate 21 is provided with There are a plurality of first arc-shaped grooves 212 arranged in parallel; a first resin bonding layer 22, the first resin bonding layer 22 is arranged on the lower surface of the first metal plate 21, and the first resin bonding Layer 22 fills the first recess 211; the first metal wire 41, a part of the first metal wire 41 is embedded in the first arc-shaped groove 212; the second metal plate 23, the second metal The lower surface of the plate 23 is provided with a plurality of second arc-shaped grooves 231 arranged in parallel, the first arc-shaped grooves 212 correspond to the second arc-shaped grooves 231 one by one, and the upper surface of the second metal plate 23 There are a plurality of third arc-shaped slots 232 arranged in parallel, the second arc-shaped slots 231 correspond to the third arc-shaped slots 232 one by one, and the other part of the first metal wire 41 is embedded in the first arc-shaped slots 232. In the two arc-shaped grooves 231, there is a first gap 51 exposing the first metal plate 21 and the second metal plate 23 between adjacent first metal wires 41; the first rubber strip 42, the first rubber A part of the strip 42 is embedded in the third arc-shaped groove 232; the first PET resin plate 24, the lower surface of the first PET resin plate 24 is provided with a plurality of fourth arc-shaped grooves 241 arranged in parallel, the The third arc-shaped groove 232 corresponds to the fourth arc-shaped groove 241 one by one, and the other part of the first rubber strip 42 is embedded in the fourth arc-shaped groove 241, between adjacent first rubber strips 42 There is a second gap 52 exposing the second metal plate 23 and the first PET resin plate 24 .
所述散热型连接板2还包括第一橡胶板25，所述第一橡胶板25粘结于所述第一PET树脂板24的上表面；第二PET树脂板26，所述第二PET树脂板26粘结于所述第一橡胶板25的上表面，所述第二PET树脂板26的上表面设置有多个平行排列的第五弧形槽261；第二橡胶条43，所述第二橡胶条43的一部分嵌入到所述第五弧形槽261中；第三金属板27，所述第三金属板27的下表面设置有多个平行排列的第六弧形槽271，所述第五弧形槽261与所述第六弧形槽271一一对应，所述第三金属板27的上表面设置有多个平行排列的第七弧形槽272，所述第六弧形槽271与所述第七弧形槽272一一对应，所述第二橡胶条43的另一部分嵌入到所述第六弧形槽271中，相邻第二橡胶条43之间具有暴露所述第二PET树脂板26和所述第三金属板27的第三间隙53；第二金属丝44，所述第二金属丝44的一部分嵌入到所述第七弧形槽272中；第四金属板28，所述第四金属板28的下表面设置有多个平行排列的第八弧形槽281，所述第四金属板28的上表面设置有多个呈矩阵排列的第二凹坑282，所述第七弧形槽272与所述第八弧形槽281一一对应，所述第二金属丝44的另一部分嵌入到所述第八弧形槽281中，相邻第二金属丝44之间具有暴露所述第三金属板27和所述第四金属板28的第四间隙；第二树脂粘结层29，所述第二树脂粘结层29设置于所述第四金属板28的上表面，所述第二树脂粘结层29填满所述第二凹坑282，其中，第一树脂粘结层22粘结所述发光二极管封装模块3的所述电路基板31，所述第二树脂粘结层29粘结所述太阳能电池组件1的所述背板15。The heat dissipation connecting plate 2 also includes a first rubber plate 25, the first rubber plate 25 is bonded to the upper surface of the first PET resin plate 24; a second PET resin plate 26, the second PET resin plate The plate 26 is bonded to the upper surface of the first rubber plate 25, and the upper surface of the second PET resin plate 26 is provided with a plurality of fifth arc-shaped grooves 261 arranged in parallel; the second rubber strip 43, the first A part of the second rubber strip 43 is embedded in the fifth arc-shaped groove 261; the third metal plate 27, the lower surface of the third metal plate 27 is provided with a plurality of sixth arc-shaped grooves 271 arranged in parallel, the The fifth arc-shaped groove 261 corresponds to the sixth arc-shaped groove 271 one by one, the upper surface of the third metal plate 27 is provided with a plurality of seventh arc-shaped grooves 272 arranged in parallel, and the sixth arc-shaped groove 271 corresponds to the seventh arc-shaped groove 272 one by one, another part of the second rubber strip 43 is embedded in the sixth arc-shaped groove 271, and the second rubber strip 43 between adjacent second rubber strips 43 exposes the first The third gap 53 between the two PET resin plates 26 and the third metal plate 27; the second metal wire 44, a part of the second metal wire 44 is embedded in the seventh arc-shaped groove 272; the fourth metal plate 28. The lower surface of the fourth metal plate 28 is provided with a plurality of eighth arc-shaped grooves 281 arranged in parallel, and the upper surface of the fourth metal plate 28 is provided with a plurality of second pits 282 arranged in a matrix, The seventh arc-shaped groove 272 corresponds to the eighth arc-shaped groove 281 one by one, and another part of the second metal wire 44 is embedded in the eighth arc-shaped groove 281, adjacent to the second metal wire 44 There is a fourth gap exposing the third metal plate 27 and the fourth metal plate 28; the second resin bonding layer 29, the second resin bonding layer 29 is arranged on the fourth metal plate 28 The upper surface of the upper surface, the second resin bonding layer 29 fills the second recess 282, wherein the first resin bonding layer 22 bonds the circuit substrate 31 of the light emitting diode packaging module 3, the The second resin bonding layer 29 bonds the backsheet 15 of the solar cell module 1 .
在所述散热型连接板2中，所述第一金属板21与所述第四金属板28的结构相同，所述第二金属板23与所述第三金属板27的结构相同，所述第一PET树脂板24与所述第二PET树脂板26的结构相同，所述第一金属板21的上表面的第一弧形槽212的结构与所述第二金属基板的表面的弧形槽的结构相同，所述第一金属板21的上表面的第一弧形槽212的结构与所述第一PET树脂板24或所述第二PET树脂板26的表面的弧形槽的结构相同。In the heat dissipation connecting plate 2, the first metal plate 21 has the same structure as the fourth metal plate 28, the second metal plate 23 has the same structure as the third metal plate 27, and the structure of the second metal plate 23 is the same as that of the third metal plate 27. The first PET resin plate 24 has the same structure as the second PET resin plate 26, and the structure of the first arc groove 212 on the upper surface of the first metal plate 21 is consistent with the arc shape of the surface of the second metal substrate. The structure of the groove is the same, the structure of the first arc-shaped groove 212 on the upper surface of the first metal plate 21 is the same as the structure of the arc-shaped groove on the surface of the first PET resin plate 24 or the second PET resin plate 26 same.
其中，所述第一、第二、第三、第四金属板（21,23,27,28）的材质为铜或铝，所述第一、第二、第三、第四金属板（21,23,27,28）的厚度为0.5-1.5毫米。所述第一金属丝41和所述第二金属丝44的材质为铜或铝，所述第一金属丝41和所述第二金属丝44的直径为0.5-1毫米，相邻第一金属丝41的间距为0.5-1毫米，相邻第二金属丝44的间距为0.5-1毫米。所述第一橡胶条42和所述第二橡胶条43的直径为0.5-1毫米，相邻第一橡胶条42的间距为0.5-1毫米，相邻第二橡胶条43的间距为0.5-1毫米。所述第一树脂粘结层22和所述第二树脂粘结层29的材料为环氧树脂、丙烯酸树脂和硅胶中的一种。所述第一PET树脂板24、所述第一橡胶板25以及所述第二PET树脂板26的厚度为1-2毫米。Wherein, the first, second, third, and fourth metal plates (21, 23, 27, 28) are made of copper or aluminum, and the first, second, third, and fourth metal plates (21 ,23,27,28) with a thickness of 0.5-1.5 mm. The material of the first metal wire 41 and the second metal wire 44 is copper or aluminum, the diameter of the first metal wire 41 and the second metal wire 44 is 0.5-1 mm, adjacent to the first metal wire The distance between the wires 41 is 0.5-1 mm, and the distance between adjacent second metal wires 44 is 0.5-1 mm. The diameter of the first rubber strip 42 and the second rubber strip 43 is 0.5-1 mm, the distance between adjacent first rubber strips 42 is 0.5-1 mm, and the distance between adjacent second rubber strips 43 is 0.5-1 mm. 1 mm. The material of the first resin bonding layer 22 and the second resin bonding layer 29 is one of epoxy resin, acrylic resin and silica gel. The thickness of the first PET resin sheet 24 , the first rubber sheet 25 and the second PET resin sheet 26 is 1-2 mm.
实施例1：Example 1:
如图1-3所示，一种LED台灯，所述LED台灯包括基座、支架以及照明板，所述照明板包括依次层叠的太阳能电池组件1、散热型连接板2以及发光二极管封装模块3，所述太阳能电池组件1包括依次层叠的透明玻璃层11、第一封装胶层12、太阳能电池片层13、第二封装胶层14、背板15；所述发光二极管封装模块3包括电路基板31，设置于所述电路基板31的下表面的多个LED芯片32，树脂封装胶层33完全包裹所述LED芯片32，且所述树脂封装胶层33包裹所述电路基板31的下表面和侧表面，所述电路基板31的上表面暴露于所述树脂封装胶层33。As shown in Figures 1-3, an LED desk lamp, the LED desk lamp includes a base, a bracket, and a lighting board, and the lighting board includes a stacked solar cell assembly 1, a heat dissipation connection plate 2, and a light emitting diode packaging module 3 , the solar cell module 1 includes a transparent glass layer 11, a first encapsulant layer 12, a solar cell sheet layer 13, a second encapsulant layer 14, and a back plate 15 stacked in sequence; the LED encapsulation module 3 includes a circuit substrate 31, a plurality of LED chips 32 arranged on the lower surface of the circuit substrate 31, the resin encapsulation adhesive layer 33 completely wraps the LED chips 32, and the resin encapsulation adhesive layer 33 wraps the lower surface and the lower surface of the circuit substrate 31 On the side surface, the upper surface of the circuit substrate 31 is exposed to the resin encapsulation layer 33 .
所述散热型连接板2包括：第一金属板21，所述第一金属板21的下表面设置有多个呈矩阵排列的第一凹坑211，所述第一金属板21的上表面设置有多个平行排列的第一弧形槽212；第一树脂粘结层22，所述第一树脂粘结层22设置于所述第一金属板21的下表面，所述第一树脂粘结层22填满所述第一凹坑211；第一金属丝41，所述第一金属丝41的一部分嵌入到所述第一弧形槽212中；第二金属板23，所述第二金属板23的下表面设置有多个平行排列的第二弧形槽231，所述第一弧形槽212与所述第二弧形槽231一一对应，所述第二金属板23的上表面设置有多个平行排列的第三弧形槽232，所述第二弧形槽231与所述第三弧形槽232一一对应，所述第一金属丝41的另一部分嵌入到所述第二弧形槽231中，相邻第一金属丝41之间具有暴露所述第一金属板21和所述第二金属板23的第一间隙51；第一橡胶条42，所述第一橡胶条42的一部分嵌入到所述第三弧形槽232中；第一PET树脂板24，所述第一PET树脂板24的下表面设置有多个平行排列的第四弧形槽241，所述第三弧形槽232与所述第四弧形槽241一一对应，所述第一橡胶条42的另一部分嵌入到所述第四弧形槽241中，相邻第一橡胶条42之间具有暴露所述第二金属板23和所述第一PET树脂板24的第二间隙52。The heat dissipation connecting plate 2 includes: a first metal plate 21, the lower surface of the first metal plate 21 is provided with a plurality of first pits 211 arranged in a matrix, and the upper surface of the first metal plate 21 is provided with There are a plurality of first arc-shaped grooves 212 arranged in parallel; a first resin bonding layer 22, the first resin bonding layer 22 is arranged on the lower surface of the first metal plate 21, and the first resin bonding Layer 22 fills the first recess 211; the first metal wire 41, a part of the first metal wire 41 is embedded in the first arc-shaped groove 212; the second metal plate 23, the second metal The lower surface of the plate 23 is provided with a plurality of second arc-shaped grooves 231 arranged in parallel, the first arc-shaped grooves 212 correspond to the second arc-shaped grooves 231 one by one, and the upper surface of the second metal plate 23 There are a plurality of third arc-shaped slots 232 arranged in parallel, the second arc-shaped slots 231 correspond to the third arc-shaped slots 232 one by one, and the other part of the first metal wire 41 is embedded in the first arc-shaped slots 232. In the two arc-shaped grooves 231, there is a first gap 51 exposing the first metal plate 21 and the second metal plate 23 between adjacent first metal wires 41; the first rubber strip 42, the first rubber A part of the strip 42 is embedded in the third arc-shaped groove 232; the first PET resin plate 24, the lower surface of the first PET resin plate 24 is provided with a plurality of fourth arc-shaped grooves 241 arranged in parallel, the The third arc-shaped groove 232 corresponds to the fourth arc-shaped groove 241 one by one, and the other part of the first rubber strip 42 is embedded in the fourth arc-shaped groove 241, between adjacent first rubber strips 42 There is a second gap 52 exposing the second metal plate 23 and the first PET resin plate 24 .
所述散热型连接板2还包括第一橡胶板25，所述第一橡胶板25粘结于所述第一PET树脂板24的上表面；第二PET树脂板26，所述第二PET树脂板26粘结于所述第一橡胶板25的上表面，所述第二PET树脂板26的上表面设置有多个平行排列的第五弧形槽261；第二橡胶条43，所述第二橡胶条43的一部分嵌入到所述第五弧形槽261中；第三金属板27，所述第三金属板27的下表面设置有多个平行排列的第六弧形槽271，所述第五弧形槽261与所述第六弧形槽271一一对应，所述第三金属板27的上表面设置有多个平行排列的第七弧形槽272，所述第六弧形槽271与所述第七弧形槽272一一对应，所述第二橡胶条43的另一部分嵌入到所述第六弧形槽271中，相邻第二橡胶条43之间具有暴露所述第二PET树脂板26和所述第三金属板27的第三间隙53；第二金属丝44，所述第二金属丝44的一部分嵌入到所述第七弧形槽272中；第四金属板28，所述第四金属板28的下表面设置有多个平行排列的第八弧形槽281，所述第四金属板28的上表面设置有多个呈矩阵排列的第二凹坑282，所述第七弧形槽272与所述第八弧形槽281一一对应，所述第二金属丝44的另一部分嵌入到所述第八弧形槽281中，相邻第二金属丝44之间具有暴露所述第三金属板27和所述第四金属板28的第四间隙；第二树脂粘结层29，所述第二树脂粘结层29设置于所述第四金属板28的上表面，所述第二树脂粘结层29填满所述第二凹坑282，其中，第一树脂粘结层22粘结所述发光二极管封装模块3的所述电路基板31，所述第二树脂粘结层29粘结所述太阳能电池组件1的所述背板15。The heat dissipation connecting plate 2 also includes a first rubber plate 25, the first rubber plate 25 is bonded to the upper surface of the first PET resin plate 24; a second PET resin plate 26, the second PET resin plate The plate 26 is bonded to the upper surface of the first rubber plate 25, and the upper surface of the second PET resin plate 26 is provided with a plurality of fifth arc-shaped grooves 261 arranged in parallel; the second rubber strip 43, the first A part of the second rubber strip 43 is embedded in the fifth arc-shaped groove 261; the third metal plate 27, the lower surface of the third metal plate 27 is provided with a plurality of sixth arc-shaped grooves 271 arranged in parallel, the The fifth arc-shaped groove 261 corresponds to the sixth arc-shaped groove 271 one by one, the upper surface of the third metal plate 27 is provided with a plurality of seventh arc-shaped grooves 272 arranged in parallel, and the sixth arc-shaped groove 271 corresponds to the seventh arc-shaped groove 272 one by one, another part of the second rubber strip 43 is embedded in the sixth arc-shaped groove 271, and the second rubber strip 43 between adjacent second rubber strips 43 exposes the first The third gap 53 between the two PET resin plates 26 and the third metal plate 27; the second metal wire 44, a part of the second metal wire 44 is embedded in the seventh arc-shaped groove 272; the fourth metal plate 28. The lower surface of the fourth metal plate 28 is provided with a plurality of eighth arc-shaped grooves 281 arranged in parallel, and the upper surface of the fourth metal plate 28 is provided with a plurality of second pits 282 arranged in a matrix, The seventh arc-shaped groove 272 corresponds to the eighth arc-shaped groove 281 one by one, and another part of the second metal wire 44 is embedded in the eighth arc-shaped groove 281, adjacent to the second metal wire 44 There is a fourth gap exposing the third metal plate 27 and the fourth metal plate 28; the second resin bonding layer 29, the second resin bonding layer 29 is arranged on the fourth metal plate 28 The upper surface of the upper surface, the second resin bonding layer 29 fills the second recess 282, wherein the first resin bonding layer 22 bonds the circuit substrate 31 of the light emitting diode packaging module 3, the The second resin bonding layer 29 bonds the back sheet 15 of the solar cell module 1 .
在所述散热型连接板2中，所述第一金属板21与所述第四金属板28的结构相同，所述第二金属板23与所述第三金属板27的结构相同，所述第一PET树脂板24与所述第二PET树脂板26的结构相同，所述第一金属板21的上表面的第一弧形槽212的结构与所述第二金属基板的表面的弧形槽的结构相同，所述第一金属板21的上表面的第一弧形槽212的结构与所述第一PET树脂板24或所述第二PET树脂板26的表面的弧形槽的结构相同。In the heat dissipation connecting plate 2, the first metal plate 21 has the same structure as the fourth metal plate 28, the second metal plate 23 has the same structure as the third metal plate 27, and the structure of the second metal plate 23 is the same as that of the third metal plate 27. The first PET resin plate 24 has the same structure as the second PET resin plate 26, and the structure of the first arc groove 212 on the upper surface of the first metal plate 21 is consistent with the arc shape of the surface of the second metal substrate. The structure of the groove is the same, the structure of the first arc-shaped groove 212 on the upper surface of the first metal plate 21 is the same as the structure of the arc-shaped groove on the surface of the first PET resin plate 24 or the second PET resin plate 26 same.
其中，所述第一、第二、第三、第四金属板（21,23,27,28）的材质为铜，所述第一、第二、第三、第四金属板（21,23,27,28）的厚度为1毫米。所述第一金属丝41和所述第二金属丝44的材质为铜，所述第一金属丝41和所述第二金属丝44的直径为0.8毫米，相邻第一金属丝41的间距为 0.8毫米，相邻第二金属丝44的间距为0.8毫米。所述第一橡胶条42和所述第二橡胶条43的直径为0.8毫米，相邻第一橡胶条42的间距为0.8毫米，相邻第二橡胶条43的间距为0.8毫米。所述第一树脂粘结层22和所述第二树脂粘结层29的材料为环氧树脂。所述第一PET树脂板24、所述第一橡胶板25以及所述第二PET树脂板26的厚度为1.5毫米。Wherein, the first, second, third, and fourth metal plates (21, 23, 27, 28) are made of copper, and the first, second, third, and fourth metal plates (21, 23 ,27,28) with a thickness of 1 mm. The material of the first metal wire 41 and the second metal wire 44 is copper, the diameter of the first metal wire 41 and the second metal wire 44 is 0.8 mm, and the distance between adjacent first metal wires 41 is 0.8 mm, and the distance between adjacent second metal wires 44 is 0.8 mm. The diameter of the first rubber strip 42 and the second rubber strip 43 is 0.8 mm, the distance between adjacent first rubber strips 42 is 0.8 mm, and the distance between adjacent second rubber strips 43 is 0.8 mm. The material of the first resin bonding layer 22 and the second resin bonding layer 29 is epoxy resin. The thickness of the first PET resin sheet 24 , the first rubber sheet 25 and the second PET resin sheet 26 is 1.5 mm.
实施例2Example 2
本实施例提供另一种LED台灯，与实施例1的LED台灯的结构相同，区别仅在于，实施例2中的LED台灯的所述第一、第二、第三、第四金属板（21,23,27,28）的材质为铝，所述第一、第二、第三、第四金属板（21,23,27,28）的厚度为1.5毫米。所述第一金属丝41和所述第二金属丝44的材质为铝，所述第一金属丝41和所述第二金属丝44的直径为1毫米，相邻第一金属丝41的间距为1毫米，相邻第二金属丝44的间距为1毫米。所述第一橡胶条42和所述第二橡胶条43的直径为1毫米，相邻第一橡胶条42的间距为1毫米，相邻第二橡胶条43的间距为1毫米。所述第一树脂粘结层22和所述第二树脂粘结层29的材料为丙烯酸树脂。所述第一PET树脂板24、所述第一橡胶板25以及所述第二PET树脂板26的厚度为2毫米。This embodiment provides another LED desk lamp, which has the same structure as that of the LED desk lamp in Example 1, the only difference being that the first, second, third, and fourth metal plates (21 , 23, 27, 28) are made of aluminum, and the thickness of the first, second, third and fourth metal plates (21, 23, 27, 28) is 1.5 mm. The material of the first metal wire 41 and the second metal wire 44 is aluminum, the diameter of the first metal wire 41 and the second metal wire 44 is 1 mm, and the distance between adjacent first metal wires 41 is 1 mm, and the distance between adjacent second metal wires 44 is 1 mm. The diameter of the first rubber strip 42 and the second rubber strip 43 is 1 mm, the distance between adjacent first rubber strips 42 is 1 mm, and the distance between adjacent second rubber strips 43 is 1 mm. The material of the first resin bonding layer 22 and the second resin bonding layer 29 is acrylic resin. The thickness of the first PET resin sheet 24 , the first rubber sheet 25 and the second PET resin sheet 26 is 2 mm.
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。The above description is a preferred embodiment of the present invention, and it should be pointed out that for those skilled in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications are also considered Be the protection scope of the present invention.
Claims (6)
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