CN206469078U - A kind of high-power LED composite aluminum substrate - Google Patents
A kind of high-power LED composite aluminum substrate Download PDFInfo
- Publication number
- CN206469078U CN206469078U CN201720128983.6U CN201720128983U CN206469078U CN 206469078 U CN206469078 U CN 206469078U CN 201720128983 U CN201720128983 U CN 201720128983U CN 206469078 U CN206469078 U CN 206469078U
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- Prior art keywords
- aluminium base
- insulating barrier
- copper foil
- aluminum substrate
- composite aluminum
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Abstract
The utility model discloses a kind of high-power LED composite aluminum substrate, including LED chip and aluminium base, the lower surface of aluminium base is provided with silicon substrate, aluminium base is internally provided with several through holes, it is raised that the upper surface of aluminium base is provided with several, the upper end of aluminium base is provided with insulating barrier, the lower surface of insulating barrier is provided with several grooves, it is raised equal with the number of groove corresponding to inlay, insulating barrier upper end is provided with heat-conducting glue layer, the upper end of heat-conducting glue layer is provided with copper foil layer, welded by scolding tin and chip carrier the upper end of copper foil layer, the upper end of chip carrier is provided with LED chip.Connected between the utility model insulating barrier and aluminium base by concavo-convex surface inserting, increase contact area, it is effective to enhance the overall heat dispersion of aluminium base, the through hole set inside aluminium base is increased and external contact area, reach further radiating, overall structure is simple, and heat dispersion is high, it is ensured that the stability and durability of high-power state.
Description
Technical field
The utility model is related to LED aluminum base plate technical field, specially a kind of high-power LED composite aluminum substrate.
Background technology
The product item of high-power LED aluminium base covers the whole industry of illuminating product.From the point of view of overall condition, led aluminium bases
Plate still keeps high speed development, export amount of money meeting steady-state growth, but increase magnitude of export to decline in the coming years.Domestic aspect is due to warp
The sustainable development of Ji, then welcome rapid growth period.But the led aluminium base board industry fast developments of nearly 5 years of China, to today
It also result in keen competition situation.Because of reasons such as led illumination correlation techniques and heat dispersions, make led market developments at home
Slowly, and major part led is illuminated for exporting.In the case where following country instructs to capture energetically, led aluminium base plate techniques can be more and more completeer
Kind, domestic demand can be increasing.
High-power LED composite aluminum substrate of the prior art, uses relatively thin copper foil, it is impossible to meets circuit layer and carries big work(
The requirement of rate, while high-power LED composite aluminum substrate can produce substantial amounts of heat, traditional high-power LED composite aluminum substrate
Structure is single, and heat dispersion is not good, it is impossible to play good radiating effect, and aluminium base causes service efficiency bottom because of poor heat radiation,
Short life, so as to improve the cost of production.
Utility model content
The purpose of this utility model is to provide a kind of high-power LED composite aluminum substrate, to solve in above-mentioned background technology
The problem of proposition.
To achieve the above object, the utility model provides following technical scheme：A kind of high-power LED composite aluminum substrate, bag
Include LED chip and aluminium base, the lower surface of the aluminium base is provided with silicon substrate, aluminium base is internally provided with several and led to
Hole, the upper surface of aluminium base is provided with several projections, and the upper end of aluminium base is provided with insulating barrier, and the lower surface of insulating barrier is set
Have several grooves, it is raised equal with the number of groove and it is corresponding inlay, insulating barrier upper end is provided with heat-conducting glue layer, heat-conducting glue layer
Upper end be provided with copper foil layer, the upper end of copper foil layer is welded by scolding tin and chip carrier, and the upper end of chip carrier is provided with LED
Chip, the input pin and output pin at LED chip two ends are welded by the upper surface of scolding tin and copper foil layer respectively, copper foil layer
Upper surface is not provided with scolding tin scribbling one layer of solder mask.
Further, four side centers of the aluminium base are provided with semicircle locating slot, and locating slot is erected successively
Directly run through solder mask, heat-conducting glue layer, insulating barrier, aluminium base and silicon substrate.
Further, the through hole and raised position are corresponding vertically.
Further, the scolding tin and the flush of solder mask.
Further, the LED chip is provided with several, and is uniformly distributed between each LED chip.
Compared with prior art, the beneficial effects of the utility model are：Conductive layer, LED core are used as using thicker copper foil
Connected between the leads ends and copper foil of piece using scolding tin, it is ensured that the stability of connection and good electric conductivity, it is ensured that high-power
The normal operation of state, while being connected between insulating barrier and aluminium base by concavo-convex surface inserting, increases contact area, from
And the overall heat dispersion of aluminium base is effectively enhanced, the through hole set inside aluminium base is increased and external contact surface
Product, reaches further radiating, and the silicon substrate that orlop is set has good anti-static electrification, and overall structure is simple, thermal diffusivity
Can be high, it is ensured that the stability and durability of high-power state.
Brief description of the drawings
Fig. 1 is overall structure diagram of the present utility model；
Fig. 2 is overall top view of the present utility model.
In reference：1- input pins；2-LED chips；3- chip carriers；4- output pins；5- scolding tin；6- is anti-welding
Paint；7- heat-conducting glue layers；8- insulating barrier grooves；9- aluminium bases are raised；10- silicon substrates；11- aluminium bases；12- through holes；13- insulate
Layer；14- copper foil layers；15- locating slots.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Fig. 1-2 is referred to, the utility model provides a kind of technical scheme：A kind of high-power LED composite aluminum substrate, including
LED chip 2 and aluminium base 11, the lower surface of the aluminium base 11 is provided with silicon substrate 10, if aluminium base 11 is internally provided with
Dry through hole 12, the upper surface of aluminium base 11 is provided with several projections 9, and the upper end of aluminium base 11 is provided with insulating barrier 13, absolutely
The lower surface of edge layer 13 is provided with several grooves 8, projection 9 it is equal with the number of groove 8 and it is corresponding inlay, the upper end of insulating barrier 13
Heat-conducting glue layer 7 is provided with, the upper end of heat-conducting glue layer 7 is provided with copper foil layer 14, and the upper end of copper foil layer 14 is carried by scolding tin 5 and chip
Body 3 is welded, and the upper end of chip carrier 3 is provided with LED chip 2, and the input pin 1 and output pin 4 at the two ends of LED chip 2 are distinguished
Welded by the upper surface of scolding tin 5 and copper foil layer 14, the upper surface of copper foil layer 14 be not provided with scribbling at scolding tin 5 one layer it is anti-welding
Paint 6.
Further, four side centers of the aluminium base 11 are provided with semicircle locating slot 15, and locating slot 15
Successively vertically run through solder mask 6, heat-conducting glue layer 7, insulating barrier 13, aluminium base 11 and silicon substrate 10, it is ensured that the installation of aluminium base and
The stability of positioning.
Further, the through hole 12 and the position of projection 9 are corresponding vertically, are easy to radiating.
Further, the scolding tin 5 and the flush of solder mask 6, are easy to protect the electric connection of conductor.
Further, the LED chip 2 is provided with several, and is uniformly distributed between each LED chip 2, Homogeneouslly-radiating,
Ensure radiating effect.
The insulating barrier 13 that the utility model is mentioned is a kind of polymerization by high heat conduction, the ceramic powder filled of high insulation
The component that thing is made.
Operation principle：This high-power LED composite aluminum substrate using thicker copper foil layer 14 as conductor, LED chip 2 it is defeated
Enter pin 1 and output pin 4 to be connected using scolding tin 5 between copper foil, outside scribbles one layer of solder mask 6 and is used as protection, it is ensured that
The stability and good electric conductivity of connection, it is ensured that the normal operation of high-power state, while insulating barrier 13 and aluminium base 11
Between connected by concavo-convex surface inserting, contact area is increased, so as to effectively enhance the overall thermal diffusivity of aluminium base
Can, the through hole 12 that the inside of aluminium base 11 is set increase with external contact area, reach the effect further radiated, orlop
The silicon substrate 10 of setting has good anti-static electrification, and overall structure is simple, and heat dispersion is high, it is ensured that high-power state
Stability and durability.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out in the case where not departing from principle of the present utility model and spirit a variety of changes, repaiies
Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of high-power LED composite aluminum substrate, including LED chip (2) and aluminium base (11), it is characterised in that：The aluminium base
The lower surface of plate (11) is provided with silicon substrate (10), and aluminium base (11) is internally provided with several through holes (12), aluminium base
(11) upper surface is provided with several raised (9), and the upper end of aluminium base (11) is provided with insulating barrier (13), insulating barrier (13)
Lower surface is provided with several grooves (8), raised (9) it is equal with the number of groove (8) and it is corresponding inlay, insulating barrier (13) upper end
Heat-conducting glue layer (7) is provided with, the upper end of heat-conducting glue layer (7) is provided with copper foil layer (14), and the upper end of copper foil layer (14) passes through scolding tin
(5) welded with chip carrier (3), the upper end of chip carrier (3) is provided with LED chip (2), and the input at LED chip (2) two ends is drawn
Pin (1) and output pin (4) are welded by the upper surface of scolding tin (5) and copper foil layer (14) respectively, the upper surface of copper foil layer (14)
It is not provided with scolding tin (5) place and scribbles one layer of solder mask (6).
2. a kind of high-power LED composite aluminum substrate according to claim 1, it is characterised in that：The aluminium base (11)
Four sides center are provided with semicircle locating slot (15), and locating slot (15) runs through solder mask (6), heat-conducting glue vertically successively
Layer (7), insulating barrier (13), aluminium base (11) and silicon substrate (10).
3. a kind of high-power LED composite aluminum substrate according to claim 1, it is characterised in that：The through hole (12) with it is convex
The position for playing (9) is corresponded to vertically.
4. a kind of high-power LED composite aluminum substrate according to claim 1, it is characterised in that：The scolding tin (5) with it is anti-welding
Paint the flush of (6).
5. a kind of high-power LED composite aluminum substrate according to claim 1, it is characterised in that：The LED chip (2) sets
Several are equipped with, and is uniformly distributed between each LED chip (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720128983.6U CN206469078U (en) | 2017-02-13 | 2017-02-13 | A kind of high-power LED composite aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720128983.6U CN206469078U (en) | 2017-02-13 | 2017-02-13 | A kind of high-power LED composite aluminum substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206469078U true CN206469078U (en) | 2017-09-05 |
Family
ID=59708224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720128983.6U Expired - Fee Related CN206469078U (en) | 2017-02-13 | 2017-02-13 | A kind of high-power LED composite aluminum substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206469078U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108980750A (en) * | 2018-06-15 | 2018-12-11 | 陆伯阳 | A kind of LED desk lamp |
-
2017
- 2017-02-13 CN CN201720128983.6U patent/CN206469078U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108980750A (en) * | 2018-06-15 | 2018-12-11 | 陆伯阳 | A kind of LED desk lamp |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170905 Termination date: 20180213 |
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| CF01 | Termination of patent right due to non-payment of annual fee |