CN205546174U - Circuit board structure - Google Patents

Circuit board structure Download PDF

Info

Publication number
CN205546174U
CN205546174U CN201520923815.7U CN201520923815U CN205546174U CN 205546174 U CN205546174 U CN 205546174U CN 201520923815 U CN201520923815 U CN 201520923815U CN 205546174 U CN205546174 U CN 205546174U
Authority
CN
China
Prior art keywords
layer
copper foil
insulating barrier
ink layer
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201520923815.7U
Other languages
Chinese (zh)
Inventor
吴施荣
陈名炎
文明
李瑶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen OptimumNano Energy Co Ltd
Original Assignee
Shenzhen OptimumNano Energy Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen OptimumNano Energy Co Ltd filed Critical Shenzhen OptimumNano Energy Co Ltd
Priority to CN201520923815.7U priority Critical patent/CN205546174U/en
Application granted granted Critical
Publication of CN205546174U publication Critical patent/CN205546174U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The utility model discloses a circuit board structure, including first printing ink layer, first copper foil layer, the flexible connection structure layer, the first insulation layer that are located first copper foil layer below, the metal substrate that is located first insulation layer below, second insulating layer, on the second printing ink layer of second insulating layer below, the second copper foil layer includes the conductive seat, extends the conductive contact who sets up the electrically conductive shell fragment on the conductive seat and be located the suspension end of electrically conductive shell fragment on the second printing ink layer flexible connection structure layer of second copper foil layer below, the conductive seat with metal substrate electric connection, first copper foil layer have and are used for the first via hole that conductive contact passes through, first printing ink layer have and are used for the second via hole that conductive contact passes through, first via hole with the second via hole forms the passageway stretches out first printing ink layer for conductive contact top. The utility model has the advantages of it is following: through adopting the electrically conductive shell fragment can be so that for the flexonics when connecting, prevent that the contact breaks away from, reliability that improved circuit connects.

Description

A kind of board structure of circuit
[technical field]
This utility model relates to printed circuit board field, particularly to a kind of board structure of circuit.
[background technology]
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed substrate, is important electronic unit, is the supporter of electronic devices and components, is the carrier of electronic devices and components electrical connection.Owing to it is to use electronic printing to be referred to as " printing " circuit board.
Current existing PCB has the disadvantage that:
1, current battery core both positive and negative polarity needs to weld screw, nut;
2, battery in groups in battery core problematic, it is not easy to be replaced;
3, PCB composite plate fastening means, belongs to Hard link.
[utility model content]
In view of this, this utility model embodiment provides a kind of board structure of circuit.
nullThis utility model provides a kind of board structure of circuit,Including the first ink layer that order sets gradually from top to bottom,It is positioned at the first copper foil layer below described first ink layer、It is positioned at the flexible connecting structure layer below described first copper foil layer、It is positioned at the first insulating barrier below described flexible connecting structure layer、It is positioned at the metal basal board below described first insulating barrier、The second insulating barrier arranged below described metal basal board、The second ink layer below described second insulating barrier,The second copper foil layer below described second ink layer,Flexible connecting structure layer described in the second ink layer below described second copper foil layer includes conductive seat、It is extended on the electroconductive elastic sheet on described conductive seat and is positioned at the conductive contact suspending end of described electroconductive elastic sheet,Described conductive seat is electrically connected with described metal basal board,Described first copper foil layer has the first via passed through for described conductive contact,Described first ink layer has the second via passed through for described conductive contact,Described first via forms passage with described second via and stretches out the top of described first ink layer for described conductive contact.
Optionally, have between described flexible connecting structure layer with described first insulating barrier for having for the second bonding adhesive linkage between the first bonding adhesive linkage, described metal basal board with described second copper foil layer.
Optionally, described first copper foil layer includes the mounting seat of multiple installation electric elements, and described mounting seat includes the second component electrically connected for the first component of safety effect and the 3rd parts being connected with described first component with described first component.
Optionally, described mounting seat is copper corrosion block.
Optionally, described first insulating barrier and described second insulating barrier are PP glue-line.
Optionally, described first adhesive linkage and described second adhesive linkage are epoxy resin layer.
Optionally, described conductive contact is conductive pole.
As can be seen from the above technical solutions, this utility model embodiment has the advantage that
By using electroconductive elastic sheet so that for flexibly connecting when connecting, prevent contact from departing from, improve the reliability that circuit connects.
[accompanying drawing explanation]
Fig. 1 is the structure chart of a kind of embodiment of circuit structure of the present utility model;
Fig. 2 is the structure chart of the another kind of embodiment of circuit structure of the present utility model;
Fig. 3 is the structure chart of the another embodiment of circuit structure of the present utility model;
Fig. 4 is the structure chart of the another embodiment of circuit structure of the present utility model.
[detailed description of the invention]
In order to make those skilled in the art be more fully understood that this utility model scheme, below in conjunction with the accompanying drawing in this utility model embodiment, technical scheme in this utility model embodiment is clearly and completely described, obviously, described embodiment is only the embodiment of this utility model part rather than whole embodiments.Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, all should belong to the scope of this utility model protection.
Term " first " in specification and claims of the present utility model and above-mentioned accompanying drawing, " second ", " the 3rd " " the 4th " etc. are for distinguishing similar object, without being used for describing specific order or precedence.Should be appreciated that the data of so use can be exchanged in the appropriate case, in order to the embodiments described herein can be implemented with the order in addition to the content except here illustrating or describe.In addition, term " includes " and " having " and their any deformation, it is intended to cover non-exclusive comprising, such as, contain series of steps or the process of unit, method, system, product or equipment be not necessarily limited to those steps or the unit clearly listed, but can include the most clearly listing or for intrinsic other step of these processes, method, product or equipment or unit.
nullIn conjunction with shown in Fig. 1 to Fig. 4,This utility model provides a kind of board structure of circuit,Including the first ink layer 1 that order sets gradually from top to bottom,It is positioned at the first copper foil layer 2 below described first ink layer 1、It is positioned at the flexible connecting structure layer 3 below described first copper foil layer 2、It is positioned at the first insulating barrier 4 below described flexible connecting structure layer 3、It is positioned at the metal basal board 5 below described first insulating barrier 4、The second insulating barrier 6 arranged below described metal basal board 5、The second copper foil layer below described second insulating barrier 6,The second ink layer below described second copper foil layer,Described flexible connecting structure layer 3 includes conductive seat、The electroconductive elastic sheet 301 being extended on described conductive seat and the conductive contact 302 of the suspension end being positioned at described electroconductive elastic sheet,Described conductive seat is electrically connected with described metal basal board,Described first copper foil layer 2 has the first via passed through for described conductive contact,Described first ink layer 1 has the second via passed through for described conductive contact,Described first via forms passage with described second via and stretches out the top of described first ink layer 1 for described conductive contact.
Said structure is laminated after stacking according to order from top to bottom, metal basal board 5 is used for realizing the conduction effect of confluxing, flexible connecting structure layer 3 can realize circuit board and external contact when contacting for flexibly connecting, utilize the elastic force effect of electroconductive elastic sheet so that keep abutting state between contact, time circuit is connected, contact not readily disengages from, and improves the reliability that circuit connects.
Optionally, have between described flexible connecting structure layer 3 with described first insulating barrier 4 for the first bonding adhesive linkage 7, have between described metal basal board 5 with described second copper foil layer for the second bonding adhesive linkage, first adhesive linkage and the second adhesive linkage are prepreg, i.e. epoxy resin layer, when being laminated, circuit board is carried out bonding by prepreg.
Shown in Fig. 2 and Fig. 3, optionally, described first copper foil layer 2 includes the mounting seat 20 of multiple installation electric elements, described mounting seat 20 includes the second component 202 electrically connected for the first component 201 of safety effect and the 3rd parts 203 being connected with described first component 201 with described first component 201, these three parts are used for installing device, concrete structure can select the most flexibly, does not limits.
Optionally, described mounting seat is copper corrosion block.
Optionally, described first insulating barrier and described second insulating barrier are PP glue-line, electrically isolate by using dielectric layers to realize.
Optionally, described conductive contact is conductive pole, when the shape of conductive pole can use cylinder, cube or irregular column, it is possible to achieve contact external contact realizes conducting function, does not limits.
nullA kind of board structure of circuit that this utility model provides,Including the first ink layer that order sets gradually from top to bottom、First copper foil layer、Flexible connecting structure layer、First insulating barrier metal basal board、Second insulating barrier、Second copper foil layer and the second ink layer,Described flexible connecting structure layer includes conductive seat、It is extended on the electroconductive elastic sheet on described conductive seat and is positioned at the conductive contact suspending end of described electroconductive elastic sheet,Described conductive seat is electrically connected with described metal basal board,Described first copper foil layer has the first via passed through for described conductive contact,Described first ink layer has the second via passed through for described conductive contact,Described first via forms passage with described second via and stretches out the top of described first ink layer for described conductive contact,By use electroconductive elastic sheet so that connect time for flexibly connecting,Prevent contact from departing from,Improve the reliability that circuit connects.
Those skilled in the art is it can be understood that arrive, for convenience and simplicity of description, the system of foregoing description, the specific works process of device and unit, it is referred to the corresponding process in preceding method embodiment, does not repeats them here.
Above a kind of board structure of circuit provided by the utility model is described in detail, for one of ordinary skill in the art, thought according to this utility model embodiment, the most all will change, in sum, this specification content should not be construed as restriction of the present utility model.

Claims (7)

  1. null1. a board structure of circuit,It is characterized in that,Including the first ink layer that order sets gradually from top to bottom,It is positioned at the first copper foil layer below described first ink layer、It is positioned at the flexible connecting structure layer below described first copper foil layer、It is positioned at the first insulating barrier below described flexible connecting structure layer、It is positioned at the metal basal board below described first insulating barrier、The second insulating barrier arranged below described metal basal board、The second ink layer below described second insulating barrier,The second copper foil layer below described second ink layer,Flexible connecting structure layer described in the second ink layer below described second copper foil layer includes conductive seat、It is extended on the electroconductive elastic sheet on described conductive seat and is positioned at the conductive contact suspending end of described electroconductive elastic sheet,Described conductive seat is electrically connected with described metal basal board,Described first copper foil layer has the first via passed through for described conductive contact,Described first ink layer has the second via passed through for described conductive contact,Described first via forms passage with described second via and stretches out the top of described first ink layer for described conductive contact.
  2. Board structure of circuit the most according to claim 1, it is characterized in that, have between described flexible connecting structure layer with described first insulating barrier for having for the second bonding adhesive linkage between the first bonding adhesive linkage, described metal basal board with described second copper foil layer.
  3. Board structure of circuit the most according to claim 1, it is characterized in that, described first copper foil layer includes the mounting seat of multiple installation electric elements, and described mounting seat includes the second component electrically connected for the first component of safety effect and the 3rd parts being connected with described first component with described first component.
  4. Board structure of circuit the most according to claim 3, it is characterised in that described mounting seat is copper corrosion block.
  5. Board structure of circuit the most according to claim 1, it is characterised in that described first insulating barrier and described second insulating barrier are PP glue-line.
  6. Board structure of circuit the most according to claim 2, it is characterised in that described first adhesive linkage and described second adhesive linkage are epoxy resin layer.
  7. Board structure of circuit the most according to claim 1, it is characterised in that described conductive contact is conductive pole.
CN201520923815.7U 2015-11-18 2015-11-18 Circuit board structure Active CN205546174U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520923815.7U CN205546174U (en) 2015-11-18 2015-11-18 Circuit board structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520923815.7U CN205546174U (en) 2015-11-18 2015-11-18 Circuit board structure

Publications (1)

Publication Number Publication Date
CN205546174U true CN205546174U (en) 2016-08-31

Family

ID=56761537

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520923815.7U Active CN205546174U (en) 2015-11-18 2015-11-18 Circuit board structure

Country Status (1)

Country Link
CN (1) CN205546174U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109935910A (en) * 2017-12-19 2019-06-25 成都亦道科技合伙企业(有限合伙) A kind of lithium battery electric core, lithium battery and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109935910A (en) * 2017-12-19 2019-06-25 成都亦道科技合伙企业(有限合伙) A kind of lithium battery electric core, lithium battery and preparation method thereof
CN109935910B (en) * 2017-12-19 2024-04-02 成都大超科技有限公司 Lithium battery cell, lithium battery and preparation method of lithium battery cell

Similar Documents

Publication Publication Date Title
CN104349575B (en) Flexible PCB and preparation method thereof
TW200727438A (en) Multi-layered anisotropic conductive film
CN107785526A (en) Electrokinetic cell integration module
WO2012092092A3 (en) A method and apparatus for mounting electronic components on an antenna structure
CN205546174U (en) Circuit board structure
CN202663639U (en) Electrostatic discharge device for floating metal, printed circuit board and substrate
CN105682341B (en) Rigid Flex and mobile terminal
CN202650619U (en) A reflexed PIN grounding flexible flat cable
CN202772278U (en) Connector for connecting high-current cable
CN205596440U (en) Guard aperture type printed wiring board
WO2008117645A1 (en) Sheet-like probe and method for manufacturing the same
CN203788548U (en) Flexible circuit board
CN206282996U (en) A kind of attachment structure of printed circuit board
CN207118068U (en) A kind of multi-layer flexible circuit board
CN105789938B (en) Rack internal power supply method, bus type power supply board and communication equipment
CN205265995U (en) Anti type circuit board that falls
CN202118644U (en) LED (Light Emitting Diode) lamp string
CN105390318A (en) Thin-film switch
CN202210904U (en) Power supply printed wiring board
CN104640343B (en) A kind of power supply changeover device pcb board and its manufacturing method
CN205452117U (en) Membrane switch
CN209608936U (en) A kind of New-type instant dismounting PCB circuit board structure
CN209170722U (en) A kind of pcb board that safety and reliability is high
CN203134923U (en) Aluminum-copper combined electrode flexible circuit board for battery monitor
CN204206610U (en) aluminum foil circuit board

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
PP01 Preservation of patent right
PP01 Preservation of patent right

Effective date of registration: 20180428

Granted publication date: 20160831

PD01 Discharge of preservation of patent
PD01 Discharge of preservation of patent

Date of cancellation: 20210428

Granted publication date: 20160831

PP01 Preservation of patent right
PP01 Preservation of patent right

Effective date of registration: 20210428

Granted publication date: 20160831