CN204966533U - High light efficiency COB base plate - Google Patents
High light efficiency COB base plate Download PDFInfo
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- CN204966533U CN204966533U CN201520669199.7U CN201520669199U CN204966533U CN 204966533 U CN204966533 U CN 204966533U CN 201520669199 U CN201520669199 U CN 201520669199U CN 204966533 U CN204966533 U CN 204966533U
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- insulating barrier
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Abstract
The utility model relates to a high -efficient COB base plate, including hindering solder paste china ink layer, line layer, insulating material layer and metal sheet, wherein the insulating material layer includes first insulation layer and second insulating layer, it adheres in proper order to hinder solder paste china ink layer, line layer, first insulation layer and second insulating layer, in proper order the bonding together hinder solder paste china ink layer, line layer and first insulation layer on be equipped with a first through -hole, be equipped with the second through -hole that is linked together with first through -hole on the second insulating layer, the aperture of second through -hole is less than the aperture of first through -hole, the metal sheet bonded is in in the first through -hole, the lower surface of metal sheet still with the bonding of the last surface parts of second insulating layer, the thickness of metal sheet equals to hinder the thickness sum on solder paste china ink layer, line layer and first insulation layer. The utility model discloses thereby can reduce the LED optical loss and improve its light efficiency.
Description
Technical field
The utility model relates to a kind of specular removal COB substrate.
Background technology
COB (ChipOnBoard, COB) substrate is widely used in LED illumination industry, and it has good thermoelectricity separation function and higher luminous reflectanc.Existing COB metal substrate is the metal substrate synthesized with metal laminate after insulating material (FR-4) milling cup.Because the metal plate sections on insulating material all around around insulation material layer, so the light that the LED chip being mounted on metallic plate position sends can be stopped by the insulation material layer of surrounding, and diffuse reflection can be there is and reflect equal loss again, thus LED light effect can be reduced, the needs to specular removal in COB development cannot be met.
Utility model content
For the deficiencies in the prior art, the purpose of this utility model is intended to provide a kind of and can reduces LED light loss thus improve the specular removal COB substrate of its light efficiency.
For achieving the above object, the utility model adopts following technical scheme:
A kind of specular removal COB substrate, comprise solder mask layer, line layer, insulation material layer and metallic plate, wherein said insulation material layer comprises the first insulating barrier and the second insulating barrier; Described solder mask layer, line layer, the first insulating barrier and the second insulating barrier bond successively; The solder mask layer be bonded together successively, line layer and the first insulating barrier are provided with one first through hole, described second insulating barrier is provided with the second through hole be connected with described first through hole, the aperture of described second through hole is less than the aperture of the first through hole, described metallic plate is bonded in described first through hole, the lower surface of described metallic plate also bonds with the upper surface portion of described second insulating barrier, and the thickness of described metallic plate equals the thickness sum of solder mask layer, line layer and the first insulating barrier.
Preferably, the thickness of described second insulating barrier is 0.013-0.035mm.
Preferably, described metallic plate is minute surface aluminium sheet.
Preferably, the axis of described first through hole overlaps with the axis of described second through hole.
The beneficial effects of the utility model are as follows:
The light that this specular removal COB substrate can make the LED chip of attachment on it send is stopped by surrounding insulation material layer, to reduce LED light loss, thus improves light efficiency.
Accompanying drawing explanation
Fig. 1 is the structure chart of the better embodiment of a kind of specular removal COB of the utility model substrate.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the utility model is described further:
Refer to Fig. 1, the utility model relates to a kind of specular removal COB substrate, and its better embodiment comprises solder mask layer 1, line layer 2, insulation material layer and metallic plate 5, and wherein insulation material layer comprises the first insulating barrier 3 and the second insulating barrier 4; Solder mask layer 1, line layer 2, first insulating barrier 3 and the second insulating barrier 4 bond successively; The solder mask layer 1 be bonded together successively, line layer 2 and the first insulating barrier 3 are provided with one first through hole 6, second insulating barrier 4 is provided with the second through hole 7 be connected with the first through hole 6, the aperture of the second through hole 7 is less than the aperture of the first through hole 6, metallic plate 5 is bonded in the first through hole 6, the lower surface of metallic plate 5 also bonds with the upper surface portion of the second insulating barrier 4, and the thickness of metallic plate 5 equals the thickness sum of solder mask layer 1, line layer 2 and the first insulating barrier 3.
Concrete, the upper surface of the second insulating barrier 4 bonds with the lower surface of the first insulating barrier 3 and the lower surface of metallic plate 5 respectively.As preferably, the thickness of the second insulating barrier can be 0.013-0.035mm.The upper surface of the first insulating barrier 3 and the lower surface of line layer 2 bond, and the upper surface of line layer 2 and the lower surface of solder mask layer 1 bond.
Meanwhile, the shape of metallic plate 5 is consistent with the shape of the first through hole 6, so that metallic plate 5 is bonded in the first through hole 6.As preferably, the axis of the first through hole 6 can overlap with the axis of the second through hole 7.
And the thickness of metallic plate 5 equals the thickness sum of solder mask layer 1, line layer 2 and the first insulating barrier 3, this just makes the upper surface of metallic plate 5 and the upper surface flush of solder mask layer 1.When LED chip mounts on a metal plate, the light that LED sends would not be subject to insulation material layer to be stopped, also namely decreases LED light loss, improves its light efficiency.As preferably, metallic plate 5 can be specular aluminium plate.
For a person skilled in the art, according to technical scheme described above and design, other various corresponding change and distortion can be made, and all these change and distortion all should belong within the protection range of the utility model claim.
Claims (4)
1. a specular removal COB substrate, is characterized in that, comprises solder mask layer, line layer, insulation material layer and metallic plate, and wherein said insulation material layer comprises the first insulating barrier and the second insulating barrier; Described solder mask layer, line layer, the first insulating barrier and the second insulating barrier bond successively; The solder mask layer be bonded together successively, line layer and the first insulating barrier are provided with one first through hole, described second insulating barrier is provided with the second through hole be connected with described first through hole, the aperture of described second through hole is less than the aperture of the first through hole, described metallic plate is bonded in described first through hole, the lower surface of described metallic plate also bonds with the upper surface portion of described second insulating barrier, and the thickness of described metallic plate equals the thickness sum of solder mask layer, line layer and the first insulating barrier.
2. specular removal COB substrate as claimed in claim 1, is characterized in that: the thickness of described second insulating barrier is 0.013-0.035mm.
3. specular removal COB substrate as claimed in claim 1, is characterized in that: described metallic plate is minute surface aluminium sheet.
4. specular removal COB substrate as claimed in claim 1, is characterized in that: the axis of described first through hole overlaps with the axis of described second through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520669199.7U CN204966533U (en) | 2015-08-31 | 2015-08-31 | High light efficiency COB base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520669199.7U CN204966533U (en) | 2015-08-31 | 2015-08-31 | High light efficiency COB base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204966533U true CN204966533U (en) | 2016-01-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520669199.7U Active CN204966533U (en) | 2015-08-31 | 2015-08-31 | High light efficiency COB base plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN204966533U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609615A (en) * | 2016-03-03 | 2016-05-25 | 深圳市新月光电有限公司 | Copper-aluminum composite base heat-conduction surface light source |
-
2015
- 2015-08-31 CN CN201520669199.7U patent/CN204966533U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609615A (en) * | 2016-03-03 | 2016-05-25 | 深圳市新月光电有限公司 | Copper-aluminum composite base heat-conduction surface light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Fuyong Town, Shenzhen city of Guangdong province and 518000 new HUAFA Industrial Park building A5 Patentee after: Shenzhen hi tech materials Limited by Share Ltd Address before: Baoan District Fuyong Town, Shenzhen city of Guangdong province and 518000 new HUAFA Industrial Park building A5 Patentee before: Shenzhen Kerui Electronic Industrial Co.,Ltd. |