CN202565570U - Novel circuit board - Google Patents
Novel circuit board Download PDFInfo
- Publication number
- CN202565570U CN202565570U CN201220228368XU CN201220228368U CN202565570U CN 202565570 U CN202565570 U CN 202565570U CN 201220228368X U CN201220228368X U CN 201220228368XU CN 201220228368 U CN201220228368 U CN 201220228368U CN 202565570 U CN202565570 U CN 202565570U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- wiring board
- solder mask
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model relates to a circuit board and in particular to a novel circuit board carrying electronic components. The traditional circuit board usually comprises a printed layer, a solder mask layer, a copper cortex, an insulation layer and an aluminum board layer. The traditional circuit board not only has many manufacturing process steps and uses many kinds of materials, but also has high production cost. The novel circuit board provided by the utility model comprises a board body. The board body comprises the printed layer, the solder mask layer and the copper cortex, wherein the printed layer, the solder mask layer and the copper cortex are compounded in order. One side of the copper cortex is compounded with a heat conduction and insulation layer, and the thickness of the heat conduction and insulation layer is 0.6 to 2.0mm. The novel circuit board has the advantages that the forming process is simple; various shapes are easily formed; the processing equipment is simple; the heat conduction coefficient is over five times higher than that of the traditional aluminum substrate; and the insulation strength is high and can easily reach 5000VAC.
Description
Technical field
The utility model relates to a kind of wiring board, refers in particular to a kind of novel wiring board that carries electronic devices and components.
Background technology
Traditional wiring board generally includes printed layers, solder mask, copper sheet layer, insulating barrier and aluminum layer, and not only manufacturing technology steps is more, and the materials used kind is more, and production cost is also high.
Existing wiring board adopts aluminum layer to dispel the heat, but the coefficient of heat transfer of aluminum layer is lower, is generally 1～2w/m.k, and for wiring board, like distribute heat rapidly not, can produce adverse influence to wiring board, and even can the damaged line plate.
And in the use of existing wiring board, breakage takes place in existing insulating barrier easily, causes being in electriferous state, easy damaged line plate not only, and potential safety hazard such as initiation personnel electric shock easily.
The utility model content
The technical problem that one, will solve
The purpose of the utility model is that it is a kind of simple in structure that the spy provides, good heat conduction effect, the novel wiring board that insulation effect is good to existing in prior technology the problems referred to above.
Two, technical scheme
For solving the problems of the technologies described above, the novel wiring board of the utility model includes plate body; Above-mentioned plate body includes compound successively printed layers, solder mask and copper sheet layer; Wherein, above-mentioned copper sheet layer one side is compounded with the heat conductive insulating layer, and the thickness of this heat conductive insulating layer is 0.6～2.0mm.
As optimization, above-mentioned heat conductive insulating layer is processed by heat-conducting plastic.
As optimization, the thickness of above-mentioned heat conductive insulating layer is 1mm.
As optimization, the thickness of above-mentioned heat conductive insulating layer is 1.3mm.
Three, the beneficial effect of the utility model
1, this novel wiring board moulding process is simple, does different shape easily, and process equipment is simple;
2, the conductive coefficient height is more than 5 times of conventional aluminum substrate;
3, dielectric strength is high, can easily reach 5000VAC.
Novel aluminum substrate conductive coefficient can reach 10w/m.k, even higher, has excellent heat conduction and heat radiation effect.
Description of drawings
Fig. 1 is the sectional view of the novel wiring board of the utility model.
Among the figure, 1 is printed layers, and 2 is solder mask, and 3 is the copper sheet layer, and 4 is the heat conductive insulating layer.
Embodiment
Below in conjunction with accompanying drawing the novel wiring board of the utility model is described further:
Execution mode one: as shown in Figure 1, the novel wiring board of the utility model includes plate body; Above-mentioned plate body includes compound successively printed layers 1, solder mask 2 and copper sheet layer 3; Wherein, above-mentioned copper sheet layer 3 one side are compounded with heat conductive insulating layer 4, and the thickness of this heat conductive insulating layer 4 is 0.6～2.0mm; Above-mentioned heat conductive insulating layer 4 is processed by heat-conducting plastic; The thickness of above-mentioned heat conductive insulating layer 4 is 1mm.
Execution mode two: present embodiment and execution mode one are basic identical, and the thickness of different is above-mentioned heat conductive insulating layer 4 is 1.3mm.Certainly, the thickness of heat conductive insulating plate can be set according to client's needs.
Figure slightly.
The above only is the preferred implementation of the utility model; Should be understood that; For those skilled in the art; Under the prerequisite that does not break away from the utility model know-why, can also make some improvement and retouching, these improvement and retouching also should be regarded as the protection range of the utility model.
Claims (4)
1. a novel wiring board includes plate body, and said plate body includes compound successively printed layers, solder mask and copper sheet layer, it is characterized in that: said copper sheet layer one side is compounded with the heat conductive insulating layer, and the thickness of this heat conductive insulating layer is 0.6～2.0mm.
2. novel wiring board according to claim 1 is characterized in that: said heat conductive insulating layer is processed by heat-conducting plastic.
3. novel wiring board according to claim 1 is characterized in that: the thickness of said heat conductive insulating layer is 1mm.
4. novel wiring board according to claim 1 is characterized in that: the thickness of said heat conductive insulating layer is 1.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220228368XU CN202565570U (en) | 2012-05-17 | 2012-05-17 | Novel circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220228368XU CN202565570U (en) | 2012-05-17 | 2012-05-17 | Novel circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202565570U true CN202565570U (en) | 2012-11-28 |
Family
ID=47215164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220228368XU Expired - Fee Related CN202565570U (en) | 2012-05-17 | 2012-05-17 | Novel circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202565570U (en) |
-
2012
- 2012-05-17 CN CN201220228368XU patent/CN202565570U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121128 Termination date: 20130517 |